CN2849977Y - LED packaging composite layer structure - Google Patents
LED packaging composite layer structure Download PDFInfo
- Publication number
- CN2849977Y CN2849977Y CNU2005201300014U CN200520130001U CN2849977Y CN 2849977 Y CN2849977 Y CN 2849977Y CN U2005201300014 U CNU2005201300014 U CN U2005201300014U CN 200520130001 U CN200520130001 U CN 200520130001U CN 2849977 Y CN2849977 Y CN 2849977Y
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- CN
- China
- Prior art keywords
- chip
- printed circuit
- hole
- coating
- circuit board
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Led Device Packages (AREA)
Abstract
The utility model relates to a packaging structure of an LED composite layer. In the utility model, a printed circuit layer is arranged on a base board through cooperation; a coating layer with a body size hole is arranged on the printed circuit layer to make a chip positioned in the body size hole to be electrically connected with a circuit layer through a bonding wire. Resins are filled into the body size hole to cover the chip the bonding wire and the surface of the printed circuit layer and an optical lens is arranged on the coating layer; therefore, the packaging structure of an LED composite layer is formed.
Description
Technical field
The utility model is the field about LED, especially about a kind of LED encapsulation cladding structure.
Background technology
In the technology of LED, be to utilize chip to cooperate optical module and ray sees also the 1st figure, it shows existing LED encapsulating structure.In this structure, it comprises substrate 10, conductive layer 11, chip 12, bonding wire 13, packing colloid 14 and optical lens 15.
As shown in Figure 1, on substrate 10, be furnished with a conductive layer 11, this conductive layer 11 electrically connects the two sides of this substrate 10, be provided with a chip 12 in the Shu of substrate face, article one, bonding wire 13 is by being connected to the conductive layer 11 that is positioned at substrate 10 coplanars with it on the chip 12, with so that chip 12 is electrically connected to the outside, one packing colloid 14 is overlying on the substrate 10, the Shu of coating chip 12 and bonding wire 13 and conductive layer 11 partly, optical lens 15 in packing colloid 14 loam cake one moulding in advance, optical lens 15 has a concave surface 151 and a convex surface 152, is seated on the packing colloid 14 with concave surface 151.
Yet in existing LED encapsulating structure, chip is directly to be bonded in the brilliant cup with jelly, encapsulates with packing colloid again.On using, must make up LED out of the ordinary with circuit design separately, its shortcoming is according to establishing area too little and can produce shadow and hot spot.
In view of this, be badly in need of can the compare illumination effect of incandescent lamp bulb or fluorescent tube of a kind of structure in this technical field, and its irradiated area is big, can not produce shadow and hot spot.
Novel content
Main purpose of the present utility model is to provide a kind of LED encapsulation multilayer structure, has the illumination effect of analogy incandescent lamp bulb or fluorescent tube.
Another purpose of the present utility model is to provide a kind of LED encapsulation multilayer structure, and a coating is provided on substrate, uses the utilance of the light that improves the chip emission.
See also Fig. 2 and Fig. 3, above-mentioned and other purpose according to the utility model, it provides a kind of LED encapsulation multilayer structure, comprise pedestal 20, chip 22, bonding wire 23, coating 24, resin 25 and optical lens 26, wherein, pedestal 20 is that a layer printed circuit board 202 with electrode pad 2021 is set on substrate 201, one chip 22 is arranged at the surface 21 of layer printed circuit board 202, establish a coating 24 with through hole 241 again in the surface 21 of layer printed circuit board 202, make chip 22 be arranged in the through hole 241 of this coating 24, one end of bonding wire 23 is arranged on the chip 22, its other end is connected to the electrode pad 211 of layer printed circuit board 202, and insert this through hole 241 covering chip 22 and bonding wire 23, and connect on the surface of coating 24 and to put an optical lens 26 greater than through hole 241 with resin 25.
The described layer that is positioned on the coating that comprises again.
Described layer is one of group of being selected from transparent membrane, optical lens, eyeglass and optical module and forming.
The size of described layer is the through hole greater than coating.
The described bonding wire that comprises again electrically connects chip and layer printed circuit board, and is overlying in the resin.
Described this chip can be arranged at the surface of substrate or the surface of layer printed circuit board.
The beneficial effects of the utility model are: according to LED of the present utility model encapsulation multilayer structure, it is placed in chip in the through hole of coating, utilizes the aperture of through hole and reaches the effect of chip location.
In addition, LED of the present utility model encapsulation multilayer structure, it is placed in a plurality of chips in the through hole of coating separately, utilizes whole coating abutment wall and improves the utilance of the light of chip emission.
Description of drawings
Fig. 1, it shows the encapsulating structure of the LED of prior art;
Fig. 2, it shows the coating stereogram according to LED encapsulation multilayer structure of the present utility model;
Fig. 3, it shows the profile according to the embodiment of LED encapsulation multilayer structure of the present utility model;
Fig. 4, it shows the stereogram of the coat structure of the utility model embodiment;
Fig. 5, its demonstration has the profile of embodiment of the coat structure of Fig. 4;
Fig. 6, its demonstration is used for the coat structure stereogram of the utility model embodiment; And
Fig. 7 is the profile of the embodiment of coat structure with Fig. 6.
[primary clustering symbol description]
10 substrates, 11 conductive layers
12 chips, 13 bonding wires
14 packing colloids, 15 optical lenses
151 concave surfaces, 152 convex surfaces
20 pedestals, 201 substrates
202 layer printed circuit boards, 21 surfaces
22 chips, 23 bonding wires
24 coating, 241 through holes
25 resins, 26 optical lenses
40 pedestals, 401 substrates
402 layer printed circuit boards, 41 surfaces
411A, 411B electrode pad 42 chips
43A, 43B bonding wire 44 coating
441 grooves, 4411 bottoms
4421A, 4421B, 4421C, 4421D, 4421E, 4421F through hole
4422A, 4422B through hole
45 resins, 46 optical lenses
60 pedestals, 601 substrates
602 layer printed circuit boards, 61 surfaces
611A, 611B electrode pad 62 chips
63A, 63B bonding wire 64 coating
641 Shu grooves, 6411 bottoms
642 second grooves, 6421 bottoms
6431A, 6431B, 6432C, 6432D through hole
6432A, 6432B through hole
65 resins, 66 optical lenses
Embodiment
For making LED of the present utility model encapsulation multilayer structure clearer and more definite, below will cooperate and graphic it be done detailed explanation.
See also Fig. 2 and Fig. 3, Fig. 2 is the coating stereogram that shows according to LED encapsulation multilayer structure of the present utility model, and Fig. 3 is the profile that shows according to the embodiment of LED encapsulation multilayer structure of the present utility model.
In this embodiment, LED encapsulation multilayer structure comprises pedestal 20, chip 22, bonding wire 23, coating 24, resin 25 and optical lens 26.
As shown in the figure, pedestal 20 is that a layer printed circuit board 202 with electrode pad 211 is set on substrate 201, one chip 22 is arranged at the surface of layer printed circuit board 202, establish a coating 24 with through hole 241 in addition in the surface 21 of layer printed circuit board 202, make chip 22 be arranged in the through hole 241 of coating 24, and a bonding wire 23 is set on chip 22, and another termination of bonding wire 23 places on the electrode pad 211 of layer printed circuit board 202, and inserts resin 25 to cover chip 22, bonding wire 23 and a part of layer printed circuit board 21 in through hole 241.Connect on the surface of coating 24 put one greater than the optical lens 23 of this through hole 241 with the light of radiation from chip 22.
See also Fig. 4 and Fig. 5, Fig. 4 is the stereogram that shows the coating of the utility model embodiment, and Fig. 5 is the LED encapsulation multilayer structure that shows the embodiment with Fig. 4.Present embodiment is slightly different with embodiment among Fig. 2 and Fig. 3, only it is not existed together at this and does explanation, exists together mutually and seldom gives unnecessary details.
Please consult Fig. 4 earlier, in the coating 44 of present embodiment, it has a groove 441, groove 441 has smooth bottom 4411,4411 are provided with a plurality of through hole 4421A, 4421B, 4421C, 4421D, 4421E, 4421F in the bottom, a plurality of through hole 4421A, 4421B, 4421C, 4421D, 4421E, 4421F are in the central alinement of the bottom 4411 of this groove 441, and a long strip type through hole 4422A, 4422B respectively are set in the both sides of this through hole 4421A, 4421B, 4421C, 4421D, 4421E, 4421F.
As above-mentioned through hole 4422A, 4422B, it is electrode pad 411A, the 411B on the corresponding layer printed circuit board 402 and being provided with, when coating 44 was arranged on the layer printed circuit board 41, electrode pad 411A, 411B can be exposed to respectively among through hole 4422A, the 4422B.
See also Fig. 5, its demonstration has structure and chip 42 and its relation that is provided with that is its coating 44.
In present embodiment, coating 44 is to be arranged on the layer printed circuit board 402, electrode pad 411A, 411B on the layer printed circuit board 402 are exposed to respectively among through hole 4422A, the 4422B, and chip 42 is set in through hole 4421A, end with bonding wire 43A, 43B is connected on the chip 42, and its other end passes through hole 4422A, 4422B respectively and meets electrode pad 411A, the 411B that places on the layer printed circuit board 402.
The structure of aforesaid the utility model embodiment, resin 45 is to riddle among groove 441 in the coating 44 and each through hole 4421A, 4422A, the 4422B, and cover chip 42, electrode pad 411A, 411B and bonding wire 43A, 43B, and an optical lens 46 is set on coating 44.
As the utility model embodiment among Fig. 5, wherein be as example with through hole 4421A, in fact in each through hole 4421A, 4421B, 4421C, 4421D, 4421E, 4421F, respectively be provided with chip 42, and have bonding wire 43A, 43B respectively on each chip 42.
Then, see also Fig. 6 and Fig. 7, it shows according to another embodiment of the present utility model.In Fig. 6, its demonstration is used for the coat structure of the utility model embodiment, and Fig. 7 is the profile of embodiment with coat structure of Fig. 6.Present embodiment is slightly different with the embodiment of second figure, only it is not existed together at this and does explanation, exists together mutually and seldom gives unnecessary details.
As shown in Figure 6, this structure is that the surface by coating 64 is provided with Shu groove 641 with desired depth, and and second groove 642 with desired depth little than first groove 641 be set in the bottom 6411 of first groove 641, be provided with four through hole 6431A, 6431B, 6431C, the 6431D of linear array in the bottom of second groove 642 6421 central authorities, the straight line both sides of arranging in through hole 6431A, 6431B, 6431C, 6431D respectively are provided with a rectangle through hole 6432A, 6432B.
See also Fig. 7, when with the cladding apparatus the utility model embodiment among Fig. 6,61 pairs on the surface of this layer printed circuit board 602 should two rectangle through hole 6432A, 6432B the position be provided with electrode pad 611A, 611B, when making coating 64 be arranged at the surface 61 of layer printed circuit board 602, electrode pad 611A, 611B are exposed among two rectangle through hole 6432A, the 6432B.
Then, chip 62 is to be positioned among the through hole 6431A, be electrically connected to electrode pad 611A, 611B with bonding wire 63A, 63B respectively by chip 62, resin 65 is inserted among second groove 642 and through hole 6431A, 6431B, 6431C, the 6431D, in order to do making resin 65 cover bottom 642, bonding wire 63A, 63B, chip 62, and an optical lens 66 greater than Shu groove 641 is set on this coating, and be LED encapsulation multilayer structure.
According to above-mentioned LED encapsulation multilayer structure of the present utility model, it is being provided with a coating and through hole is being set on coating on pedestal, chip is set respectively in through hole, make in the single LED structure and have a plurality of luminescence chips, and make its brightness that can have analogy incandescent lamp bulb or white light fluorescent tube, and the through hole of coating can help positioning chip to improve
According to above-mentioned LED encapsulation multilayer structure of the present utility model, be made as ramp structure if will set the abutment wall of the through hole of chip, the light that then chip can be sent reflects and the illumination of enhancing chip, more can reach the brightness of analogy incandescent lamp bulb and fluorescent tube.
In sum, the utility model is with coating with through hole keeper as chip, chip is inserted respectively in the through hole to reach the effect of location, and separate each chip with individual other through hole, and reach the purpose of the light of separating each chip, now propose the application of novel patent in accordance with the law, earnestly hope and give examination and grant quasi patent early, the true feeling moral just.
Claims (6)
1. a LED encapsulates multilayer structure, it is characterized in that:
One pedestal is a layer printed circuit board to be set form on a substrate, is provided with at least one electrode pad in layer printed circuit board;
One has the coating of at least one through hole, is arranged on the layer printed circuit board;
At least one chip is arranged on the pedestal, does electric connection with layer printed circuit board; And
Resin is arranged on the layer printed circuit board and is placed in the through hole of coating, covers chip.
2. LED encapsulation multilayer structure according to claim 1 is characterized in that: comprise a layer that is positioned on the coating again.
3. LED according to claim 2 encapsulation multilayer structure is characterized in that: layer is one of group of being selected from transparent membrane, optical lens, eyeglass and optical module and forming.
4. LED encapsulation multilayer structure according to claim 2, it is characterized in that: the size of layer is the through hole greater than coating.
5. LED encapsulation multilayer structure according to claim 1 is characterized in that: comprise bonding wire again, electrically connect chip and layer printed circuit board, and be overlying in the resin.
6. LED encapsulation multilayer structure according to claim 1, it is characterized in that: this chip can be arranged at the surface of substrate or the surface of layer printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2005201300014U CN2849977Y (en) | 2005-10-31 | 2005-10-31 | LED packaging composite layer structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2005201300014U CN2849977Y (en) | 2005-10-31 | 2005-10-31 | LED packaging composite layer structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2849977Y true CN2849977Y (en) | 2006-12-20 |
Family
ID=37522457
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2005201300014U Expired - Fee Related CN2849977Y (en) | 2005-10-31 | 2005-10-31 | LED packaging composite layer structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2849977Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101619812B (en) * | 2009-07-24 | 2011-05-18 | 旭丽电子(广州)有限公司 | Light emitting diode |
| CN107464870A (en) * | 2017-07-27 | 2017-12-12 | 旭宇光电（深圳）股份有限公司 | UV LED encapsulating structure |
-
2005
- 2005-10-31 CN CNU2005201300014U patent/CN2849977Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101619812B (en) * | 2009-07-24 | 2011-05-18 | 旭丽电子(广州)有限公司 | Light emitting diode |
| CN107464870A (en) * | 2017-07-27 | 2017-12-12 | 旭宇光电（深圳）股份有限公司 | UV LED encapsulating structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: ILED PHOTOELECTRONICS INDUSTRIAL CO., LTD. Free format text: FORMER OWNER: GUANGSHUO PHOTOELECTRIC CO., LTD. Effective date: 20101029 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: NO.23, WUGONG ROAD 6, WUGU TOWNSHIP, TAIPEI COUNTY, TAIWAN, CHINA TO: NO.23, WUQUAN ROAD, WUGU TOWNSHIP, TAIPEI COUNTY, TAIWAN, CHINA |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20101029 Address after: Chinese Taiwan Taipei County Road No. 23, Xiang five shares of five power Patentee after: ILEDM PHOTOELECTRONICS INC. Address before: China Taiwan Taipei County five shares of the Township five work six road No. 23 Patentee before: iLED Optotek. Inc. |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20061220 Termination date: 20131031 |