CN2849979Y - High heat radiation LED module - Google Patents

High heat radiation LED module Download PDF

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Publication number
CN2849979Y
CN2849979Y CNU2005201454084U CN200520145408U CN2849979Y CN 2849979 Y CN2849979 Y CN 2849979Y CN U2005201454084 U CNU2005201454084 U CN U2005201454084U CN 200520145408 U CN200520145408 U CN 200520145408U CN 2849979 Y CN2849979 Y CN 2849979Y
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CN
China
Prior art keywords
led chip
lens
led
light
emitting diode
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNU2005201454084U
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Chinese (zh)
Inventor
陈兴
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
QUANXING DEVELOPMENT SCIENCE AND TECHNOLOGY Co Ltd
Original Assignee
QUANXING DEVELOPMENT SCIENCE AND TECHNOLOGY Co Ltd
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Priority to CNU2005201454084U priority Critical patent/CN2849979Y/en
Application granted granted Critical
Publication of CN2849979Y publication Critical patent/CN2849979Y/en
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

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Abstract

The utility model relates to a high heat radiation LED module, which comprises a metal base board, a metal light reflecting layer, an LED chip, a first lens, a sleeve body and a second lens, wherein the metal base board is provided with an upper surface and a lower surface, and a positive electrode and a negative electrode are formed at the upper surface; the LED chip is arranged on the upper surface of the metal base board and is electrically connected with the positive electrode and the negative electrode by conducting wires; the metal light reflecting layer which is arranged on the upper surface of the metal base board surrounds the LED chip; the lenses which are arranged above the metal light reflecting layer are used for covering the LED chip, and the second lens is arranged above the sleeve body which surrounds the first lens. Thus, heat generated by the LED chip can be directly given forth by the metal base board and the metal light reflecting layer, and heat radiating fins are unnecessary to be additionally arranged; manufacture is more convenient, production cost can be effectively reduced and the reliability of the utility model is enhanced.

Description

The light-emitting diode (LED) module of high heat radiation
Technical field
The utility model is a kind of light-emitting diode (LED) module of high heat radiation, is meant a kind of simple in structure, manufacturing facility especially, can effectively reduce production costs and improve the light-emitting diode of production reliability.
Background technology
Existing a kind of light-emitting diode is No. 6204523 patent of the U.S. that Lumileds Lighting company is applied for, it is a led chip to be placed in one have in the base of groove, again a pedestal with pin is combined with base, by led chip being electrically connected to the pin of pedestal by lead, again lens are covered on the pedestal at last, and finish the making of light-emitting diode.Its complex structure, manufacturing cost are relatively high, and can't dispel the heat effectively or must add heat-radiating substrate in addition, make its manufacturing more difficult.
Moreover base and pedestal all are to be plastic material, can't effectively the high heat that led chip produced be given out, therefore, the low and easy damage of its reliability.Therefore, it is to add a heat-radiating substrate on this base in addition in the use, and so, not only cost improves, makes and be difficult for, and heat passes when putting heat-radiating substrate via plastic feet again, and its radiating effect is also not satisfactory.And pedestal can't add heat-radiating substrate separately, so, the patented product not only can't dispel the heat effectively and manufacturing cost higher.
In view of this, the present utility model people be this in the spirit of keeping on improving, innovate breakthrough, make great efforts research and development, and create the light-emitting diode (LED) module of the high heat radiation of the utility model in light-emitting diode, its not only designs simplification, make conveniently, can effectively reduce production costs and improve radiating effect.
The utility model content
Main purpose of the present utility model is to provide a kind of light-emitting diode (LED) module of high heat radiation, and it has simplified structure, makes effect easily, to reach the purpose that reduces production costs.
Another purpose of the present utility model is to provide a kind of light-emitting diode (LED) module that is used for high heat radiation, and it has the effect that can apace heat be shed, to reach the purpose that improves production reliability.
In order to achieve the above object, of the present utility model being characterised in that comprises a metal substrate, reflection layer, led chip and lens.This metal substrate is provided with a upper surface and a lower surface, and this upper surface is formed with a positive electrode and a negative electrode; This led chip is to be arranged on the upper surface of this metal substrate, by be electrically connected to this positive electrode and this negative electrode by lead; This reflection layer is the upper surface that is arranged at this metal substrate, with this led chip around living; These lens are to be arranged at this reflection layer top, and in order to this led chip is covered, this body is around living these first lens, being provided with one second lens above it.
A kind of light-emitting diode (LED) module of high heat radiation, it includes:
One substrate, it is provided with a upper surface and a lower surface, and this upper surface is formed with a positive electrode and a negative electrode;
One led chip, it is to be arranged on the upper surface of this substrate, by be electrically connected to this positive electrode and this negative electrode by lead;
One metal reflection layer, it is the upper surface that is arranged at this metal substrate, with led chip around living;
One led chip, it is to be arranged on the upper surface of this substrate, and is positioned at this groove, by be electrically connected to this positive electrode and this negative electrode by lead;
One first lens, it is to be arranged on this metal reflection layer, in order to this led chip is covered;
Body, it is to be arranged on the substrate, covers first lens; And
One second lens, it is to be covered on the body top.
The light-emitting diode (LED) module of described high heat radiation, wherein, this metal reflection layer is aluminium or copper material.
The light-emitting diode (LED) module of described high heat radiation, wherein, the upper surface of this substrate is formed with a groove, in order to ccontaining led chip.
The light-emitting diode (LED) module of described high heat radiation, wherein, this metal reflection layer is formed with a breach, with so that these lens be arranged in this breach.
The light-emitting diode (LED) module of described high heat radiation, wherein, this substrate is a metal substrate.
The light-emitting diode (LED) module of described high heat radiation, comprising there being a pedestal to be provided with internal thread, this body is to be fixed in this pedestal, but makes this pedestal screw lock on the external screw thread of the sleeve of a flashlight.
In this way, the heat that this led chip produced can be by directly being given out by this metal substrate and reflection layer, and needn't set up fin separately, and is more convenient in the manufacturing, can effectively reduce production costs, and improve the reliability of product.
Above-mentioned and other purpose, advantage and characteristic of the present utility model are by the detailed description of following preferred embodiment and with reference to graphic so that more understood in depth.
Description of drawings
Fig. 1 is the cut-away view of first embodiment of the high light-emitting diode that dispels the heat of the utility model;
Fig. 2 is the cut-away view of first embodiment of the high light-emitting diode that dispels the heat of the utility model;
Fig. 3 is the cut-away view of first embodiment of the high light-emitting diode that dispels the heat of the utility model;
Fig. 4 is the cutaway view of the light-emitting diode (LED) module of the high heat radiation of the utility model;
Fig. 5 is the first enforcement figure of the light-emitting diode (LED) module of the high heat radiation of the utility model;
Fig. 6 is the second enforcement figure of the light-emitting diode (LED) module of the high heat radiation of the utility model.
The figure number explanation
The utility model figure number
Metal substrate 10 led chips 12 reflection layers 14
Lens 16 upper surfaces 18 lower surfaces 20
Positive electrode 22 negative electrodes 24 leads 26
Breach 28 grooves 30 convex surfaces 32
Body 17 second lens 19 internal threads 21
Sleeve 23 external screw threads 25 pedestals 27
Embodiment
See also Fig. 1, be the cut-away view of first embodiment of the light-emitting diode of the high heat radiation of the utility model, it includes a metal substrate 10, a led chip 12, a reflection layer 14 and one first lens 16:
Metal substrate 10 is aluminium or copper material, and other plating reflector, alloy material surface, and it is provided with a upper surface 18 and a lower surface 20, and upper surface 18 is formed with a positive electrode 22 and a negative electrode 24.
Led chip 12 is to be arranged on the upper surface 18 of metal substrate 10, by be electrically connected to the positive electrode 22 and the negative electrode 24 of metal substrate 10 by lead 26.
Reflection layer 14 is aluminium or copper material, and it is to be arranged on the upper surface 18 of metal substrate 10, and around living, its end face is formed with breach 28 with led chip 12.
First lens 16 are convex lens, and it is to be arranged on the breach 28 of reflection layer 14 tops, in order to led chip 12 is covered.
See also Fig. 2, be the cut-away view of second embodiment of the light-emitting diode of the high heat radiation of the utility model, it includes a metal substrate 10, a led chip 12, a reflection layer 14 and one first lens 16:
Metal substrate 10 is aluminium or copper material, and it is provided with a upper surface 18 and a lower surface 20, and upper surface 18 is formed with a positive electrode 22, a negative electrode 24 and a groove 30.
Led chip 12 is on being arranged in the groove 30 of upper surface 18 of metal substrate 10, by be electrically connected to the positive electrode 22 and the negative electrode 24 of metal substrate 10 by lead 26.So, can reduce the height of light-emitting diode, reach and gently refute short and small purpose.
Reflection layer 14 is the aluminum material, and it is to be arranged on the upper surface 18 of metal substrate 10, and around living, its end face is formed with breach 28 with led chip 12.
First lens 16 are convex lens, and it is to be arranged on the breach 28 of light transfer layer 14 tops, in order to led chip 12 is covered.
In the present embodiment, metal substrate 10 is provided with a plurality of led chips 12, and a plurality of reflection layers 14 are formed on corresponding each led chip 12, first lens 16 are covered on each reflection layer 14, last, cutting metal substrate 10 is to finish the making of each single light-emitting diode more again, therefore, the utility model utilizes metal as substrate, and is more convenient on making, and can effectively reduce production costs.
See also Fig. 3, be the cut-away view of the 3rd embodiment of the utility model high-radiating light-emitting diode, it includes a metal substrate 10, a led chip 12, a reflection layer 14 and one first lens 16:
Metal substrate 10 is aluminium or copper material, and it is provided with a upper surface 18 and a lower surface 20, and upper surface 18 is formed with a positive electrode 22, a negative electrode 24 and a groove 30.
Led chip 12 is on being arranged in the groove 30 of upper surface 18 of metal substrate 10, by be electrically connected to the positive electrode 22 and the negative electrode 24 of metal substrate 10 by lead 26.So, can reduce the height of light-emitting diode, reach and gently refute short and small purpose.
The reflection layer 14 and first lens 16 are one-body molded, and it is to be arranged on the upper surface 18 of metal substrate 10, and around enveloping, the convex surface 32 of lens 16 is towards led chip 12 with led chip 12.
See also Fig. 4, be the cutaway view of the utility model high-radiating light-emitting diode module, it includes a metal substrate 10, a led chip 12, a reflection layer 14, one first lens 16, a body 17 and one second lens 19:
Metal substrate 10 is aluminium or copper material, and it is provided with a upper surface 18 and a lower surface 20, and upper surface 18 is formed with a positive electrode 22, a negative electrode 24 and a groove 30.
Led chip 12 is on being arranged in the groove 30 of upper surface 18 of metal substrate 10, by be electrically connected to the positive electrode 22 and the negative electrode 24 of metal substrate 10 by lead 26.So, can reduce the height of light-emitting diode, reach and gently refute short and small purpose.
Reflection layer 14 is the aluminum material, and it is to be arranged on the upper surface 18 of metal substrate 10, and around living, its end face is formed with breach 28 with led chip 12.
First lens 16 are convex lens, and it is to be arranged on the breach 28 of light transfer layer 14 tops, in order to led chip 12 is covered.
Body 17 is to be arranged on the substrate 10, and around living led chip 12, it is enveloped.
Second lens 19 are to be covered on body 17 tops, make led chip 12 can see through first lens 16 and second and compete mirror 19 refract light sources thoroughly, make the refraction angle of light source be positioned at the 8-15 degree.
See also Fig. 5 and Fig. 6, be the enforcement figure of the utility model module, wherein body 17 can be placed on the pedestal 27, and pedestal 27 is formed with spiral shell 21 in, but screw lock and is combined into a flashlight easily on the external screw thread 25 of the sleeve 23 of flashlight.
In the present embodiment, similarly metal substrate 10 is provided with a plurality of led chips 12, and a plurality of reflection layers 14 are formed on corresponding each led chip 12, lens 16 are covered on each reflection layer 14, last, cutting metal substrate 10 is to finish the making of each single light-emitting diode more again, therefore, the utility model utilizes metal as substrate, and is more convenient on making, and can effectively reduce production costs.
In this way, the utlity model has following advantage:
1. the utility model directly is placed in led chip 12 on the metal substrate 10, can be effectively the heat of led chip is shed fast and simplifies product structure, can improve the reliability of product and reduces production costs.
2. reflection layer 14 of the present utility model is a metal material, also can increase the radiating effect of product, also can improve the reliability of product.
3. metal substrate 10 is formed with groove 30, in order to ccontaining led chip 12, can effectively reduce the product height, makes product reach compact demand.
4.LED the light source of chip 12 can see through first lens 16 and 19 refractions of second lens, is the light source of 8-15 degree and produce refraction angle.
The specific embodiment that is proposed in the detailed description of preferred embodiment is only in order to be easy to illustrate technology contents of the present utility model, be not with the utility model narrow sense be limited to embodiment, all many variations that situation is done enforcement according to spirit of the present utility model and following claim all belongs to scope of the present utility model.

Claims (6)

1. the light-emitting diode (LED) module of a high heat radiation is characterized in that, includes:
One substrate, it is provided with a upper surface and a lower surface, and this upper surface is formed with a positive electrode and a negative electrode;
One led chip, it is to be arranged on the upper surface of this substrate, by be electrically connected to this positive electrode and this negative electrode by lead;
One metal reflection layer, it is the upper surface that is arranged at this metal substrate, with led chip around living;
One led chip, it is to be arranged on the upper surface of this substrate, and is positioned at this groove, by be electrically connected to this positive electrode and this negative electrode by lead;
One first lens, it is to be arranged on this metal reflection layer, in order to this led chip is covered;
Body, it is to be arranged on the substrate, covers first lens; And
One second lens, it is to be covered on the body top.
2. the light-emitting diode (LED) module of high heat radiation as claimed in claim 1 is characterized in that described this metal reflection layer is aluminium or copper material.
3. the light-emitting diode (LED) module of high heat radiation as claimed in claim 1 is characterized in that the upper surface of described this substrate is formed with a groove, in order to ccontaining led chip.
4. the light-emitting diode (LED) module of high heat radiation as claimed in claim 1 is characterized in that described this metal reflection layer is formed with a breach, with so that these lens be arranged in this breach.
5. the light-emitting diode (LED) module of high heat radiation as claimed in claim 1 is characterized in that described this substrate is a metal substrate.
6. the light-emitting diode (LED) module of high heat radiation as claimed in claim 1 is characterized in that include a pedestal and be provided with internal thread, this body is to be fixed in this pedestal, but makes this pedestal screw lock on the external screw thread of the sleeve of a flashlight.
CNU2005201454084U 2005-11-29 2005-11-29 High heat radiation LED module Expired - Fee Related CN2849979Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2005201454084U CN2849979Y (en) 2005-11-29 2005-11-29 High heat radiation LED module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2005201454084U CN2849979Y (en) 2005-11-29 2005-11-29 High heat radiation LED module

Publications (1)

Publication Number Publication Date
CN2849979Y true CN2849979Y (en) 2006-12-20

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Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2005201454084U Expired - Fee Related CN2849979Y (en) 2005-11-29 2005-11-29 High heat radiation LED module

Country Status (1)

Country Link
CN (1) CN2849979Y (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101276861B (en) * 2007-03-26 2011-08-17 李崇华 Led
CN102456810A (en) * 2010-10-26 2012-05-16 展晶科技(深圳)有限公司 Light-emitting diode packaging structure
CN102918318A (en) * 2010-06-03 2013-02-06 信越化学工业株式会社 Illumination member sealed with silicone rubber and manufacturing method for same
CN103855272A (en) * 2012-11-30 2014-06-11 联京光电股份有限公司 Light emitting diode packaging structure and related manufacturing method
CN113851563A (en) * 2021-08-26 2021-12-28 江苏宜兴德融科技有限公司 Thin film type semiconductor chip structure and photoelectric device using same

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101276861B (en) * 2007-03-26 2011-08-17 李崇华 Led
CN102918318A (en) * 2010-06-03 2013-02-06 信越化学工业株式会社 Illumination member sealed with silicone rubber and manufacturing method for same
CN102918318B (en) * 2010-06-03 2015-04-22 信越化学工业株式会社 Illumination member sealed with silicone rubber and manufacturing method for same
CN102456810A (en) * 2010-10-26 2012-05-16 展晶科技(深圳)有限公司 Light-emitting diode packaging structure
CN102456810B (en) * 2010-10-26 2014-12-10 展晶科技(深圳)有限公司 Light-emitting diode packaging structure
CN103855272A (en) * 2012-11-30 2014-06-11 联京光电股份有限公司 Light emitting diode packaging structure and related manufacturing method
CN113851563A (en) * 2021-08-26 2021-12-28 江苏宜兴德融科技有限公司 Thin film type semiconductor chip structure and photoelectric device using same
CN113851563B (en) * 2021-08-26 2023-11-21 江苏宜兴德融科技有限公司 Thin film type semiconductor chip structure and photoelectric device using same

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20061220

Termination date: 20141129

EXPY Termination of patent right or utility model