CN2843010Y

CN2843010Y - Radiating device for electronic element

Info

Publication number: CN2843010Y
Application number: CN 200520105705
Authority: CN
Inventors: 陈建荣; 陈德聪; 许志聪
Original assignee: Yen Sun Technology Corp
Current assignee: Yen Sun Technology Corp
Priority date: 2005-10-24
Filing date: 2005-10-24
Publication date: 2006-11-29
Anticipated expiration: 2015-10-24

Abstract

The utility model relates to a heat radiating device for an electronic element and comprises a holding groove capable of holding cooling liquid, a guide pipe for the flowing process of the cooling liquid communicated with the holding groove, an extracting unit for extracting and conveying the cooling liquid to cause the cooling liquid to circularly flow in the guide pipe connected with the guide pipe and a temperature reducing unit corresponding to the guide pipe in order to cause the temperature of the cooling liquid to be reduced after the cooling liquid passes through the electronic element. The cooling liquid of the heat radiating device is particularly provided with a liquid carrier and a plurality of heat radiation granules carried and distributed in the carrier, wherein a plurality of heat radiation granules are respectively provided with low specific heat valves and can fast absorb the heat. The heat radiating device can fast carry away the heat generated by the actuation of the electronic element by using the carrier and the heat radiation granules of the cooling liquid and maintain the normal operation of the electronic element.

Description

The heat abstractor that is used for electronic component

[technical field]

The utility model relates to a kind of heat abstractor, is meant a kind of heat abstractor that is used for electronic element radiating especially.

[background technology]

General electronic component when particularly for example core-the central processing unit of desktop computer, notebook computer (CPU) operates, can produce high heat because of quick, a large amount of the moving of electronics; Yet too high working temperature can make electronic component lose efficacy and for example cause when problems such as machine, data damages, and therefore, the heat dissipation problem when how to handle the electronic component running is that the dealer constantly makes great efforts the direction studied.

Consult Fig. 1, be used for the heat abstractor 1 that electronic component 100 dispels the heat at present, but be that heat exchange ground is connected with electronic component 100, the hot type that produces during with electronic component 100 runnings is own from electronic component 100, to keep electronic component 100 normal runnings own.

Heat abstractor 1 comprises a heat absorbing units 11, a refrigerant 12, is pumped unit 13, and a condensing unit 14.

Heat absorbing units 11 has the absorber 111 of a hollow, an and conduit 112 that defines a runner 113, but absorber 111 links with electronic component 100 heat exchanges ground, runner 113 comprises an outflow end that communicates with absorber 111 114, a portion of pumping 116 in contrast to outflow end 114 and inflow end 115, the one adjoining outflow end 114 that communicates with absorber 111, and one holds 115 cooling end 117 between the portion of pumping 116 with flowing into.

Refrigerant 12 is placed in the absorber 111, can again with absorber 111 heat exchanges, and when outflow end 114 is wandered about as a refugee absorber 111 heat be taken from electronic component 100 after absorber 111 and electronic component 100 heat exchanges.

Pump unit 13 and be arranged at the portion of pumping 116, can aspirate, flow toward cooling end 117 directions from outflow end 114 longshore current roads 112 to quicken refrigerant 12 from the wander about as a refugee refrigerant 12 of absorber 111 of outflow end 114.At this, pump unit 13 and be pump.

Condensing unit 14 is arranged at cooling end 117, has a condenser pipe 141 that is continuous bending and is communicated with runner 112, and a plurality of fin 142 that are arranged at intervals on the condenser pipe 141, when the refrigerant 12 that longshore current road 113 flows toward cooling end 117 directions flows in the condenser pipe 141 of condensing units 14, carry out heat exchange and discharge entrained heat with condenser pipe 141 and a plurality of fin 142, by the tube wall of condenser pipe 141 and fin 142 and with hot type to extraneous.

When electronic component 100 starts produce when hot, heat abstractor 1 carries out heat exchange with the absorber 111 of heat absorbing units 11 with electronic component 100, simultaneously, refrigerant 12 carries out heat exchange with absorber 111, the hot type that electronic component 100 starts are produced is from electronic component 100, refrigerant 12 after the heat absorption is by the suction of pumping unit 13, also longshore current road 112 is mobile toward cooling end 117 directions for absorber 111 and acceleration is wandered about as a refugee from outflow end 114, and when refrigerant 12 flows in the condenser pipe 141 of condensing units 14, condenser pipe 141 carries out heat exchange to refrigerant 12 simultaneously with fin 142, and row's discrete heat device and the external world that arrives after making the originally entrained heat of refrigerant 12 via the heat exchange of the tube wall of condenser pipe 141 and fin 142, refrigerant 12 behind the discharge heat injects absorbers 111 by flowing from inflow end 115 behind the cooling end 117 again, and carries out above-mentioned heat exchanging process once more; By the heat exchanging process of circulation, the hot type that produces during with electronic component 100 starts makes electronic component 100 stablize the purpose of normal operation from electronic component 100 and reach.

Above-mentioned heat abstractor 1 mainly is only to carry out heat exchange by refrigerant 12 and absorber 111, condenser pipe 141 and fin 142 etc., and reaches the purpose of auxiliary electron element 100 heat radiations; Yet, because general refrigerant 12 just is the homogenous material (compound) of flow-like, the heat of bringing in/discharging when therefore carrying out heat exchange is limited, so when electronic component 100 starts produced hot more, need immediately, fast with hot type during from electronic component 100, often limit be limited to this and can't increase refrigerant take from heat, and do not meet actual demand.

So present heat abstractor 1 still needs to be improved, to reach the more preferably effect of auxiliary electron element radiating.

[utility model content]

Therefore, the purpose of this utility model provides a kind of heat abstractor that is used for electronic component, and the hot type that produces in the time of can be apace with the electronic component start makes electronic component keep normal operation from electronic component.

For achieving the above object, a kind of heat abstractor that is used for electronic component of the present utility model, comprise a storage tank that defines a Chu Rong space, be placed in the cooling fluid in this Chu Rong space, one defines the conduit of the runner of this coolant flow of confession, one extracting unit, reach a cooling unit, this runner comprises an inflow end that communicates with this Chu Rong space, one in contrast to this inflow end and the outflow end that communicates with this Chu Rong space, the portion of pumping of one adjoining this inflow end, the radiating part of one close relatively this outflow end, and one pump the portion that is provided with between portion and this radiating part between this, but this electronic component heat exchange being arranged at this is provided with portion, this extracting unit is arranged at this and pumps portion, pumping this cooling fluid flows to this outflow end from this inflow end via this Chu Rong space, this cooling unit is corresponding to this radiating part installing, temperature by the cooling fluid behind this radiating part is reduced, it is characterized in that:

This cooling fluid has the carrier of a liquid state, and is distributed in the heat radiation particle that can absorb heat fast in this carrier in a plurality of years, and these a plurality of heat radiation particles have low specific heat of combustion respectively and can absorb heat fast.

The utility model is by the carrier of the liquid state of cooling fluid, and the heat radiation particle that was distributed in this carrier and can absorbs heat fast in a plurality of years, and can absorb heat fast to reach the more preferably effect of auxiliary electron element radiating.

[description of drawings]

Below by most preferred embodiment and accompanying drawing the heat abstractor that the utility model is used for electronic component is elaborated, in the accompanying drawing:

Fig. 1 is a schematic diagram, and the existing heat abstractor that is used for electronic element radiating is described;

Fig. 2 is a schematic diagram, and this novel preferred embodiment that is used for the heat abstractor of electronic element radiating is described.

[embodiment]

Before the utility model is described in detail, be noted that in the following description content similar elements is to represent with identical numbering.

Consult Fig. 2, the utility model is used for a preferred embodiment of the heat abstractor 2 of electronic component 100, but the electronic component 100 that produces a large amount of heat when being heat exchange ground and start is connected, and the hot type that produces during with electronic component 100 running is from electronic component 100 itself, to keep the normal running of electronic component 100 itself.

Heat abstractor 2 comprises a storage tank 21, a cooling fluid 22, a conduit 23, a heat sink 24, an extracting unit 25, and a cooling unit 26.

Storage tank 21 is that material is made with conduit 23 by the little metal of specific heat, so that heat radiation, storage tank 21 defines one for the ccontaining Chu Rong space 211 of cooling fluid 22; Conduit 23 defines a runner 231 that is connected and flows for cooling fluid 22 with Chu Rong space 211, runner 231 comprises an inflow end that communicates with Chu Rong space 211 232, the portion of pumping 234, one a relative radiating part 235 near outflow end 233 in contrast to outflow end 233, the one adjoining inflow end 232 that flows into end 232 and communicate with Chu Rong space 211, and a portion that is provided with 236 between 235 of the portion of pumping 234 and radiating parts.

Cooling fluid 22 storages are dissolved in the Chu Rong space 211, has liquid carrier 221, and be distributed in a plurality of years in the carrier 221 and and heat radiation particle 222 that material that can fast absorb heat constitute minimum with specific heat of combustion, by the mixed configuration of these carriers 221 with heat radiation particle 222, and the comparable cooling fluid (or refrigerant) that constitutes with homogenous material (compound) can be carried out heat exchange more quickly.In this example, carrier 221 promptly is a water; And heat radiation particle 222 is minimum with specific heat of combustion respectively and material that can absorb heat fast, and for example copper, aluminium, albronze etc. are made, and the attritive powder of average grain diameter in the nanoscale scope.

Heat sink 24 is with the low metal of specific heat, and for example copper becomes, and has a plurality of radiating fins 241 that are arranged in the portion of setting 236 spaced apartly, can take away heat fast by the surface of a plurality of radiating fins 241 when cooling fluid stream process is provided with portion 236.

Extracting unit 25 is arranged in the portion of pumping 234, can pump cooling fluid ccontaining in the Chu Rong space 211 22, makes cooling fluid 22 go out to hold 233 to flow via Chu Rong space 211 from flowing into end 232 inflow runners 231 co-current flows; At this, extracting unit 25 is pumps, because the structure of these facility is known by industry, no longer adds explanation at this.

Cooling unit 26 is installed corresponding to radiating part 235, and can make the temperature reduction after cooling fluid 22 flows through radiating part 235; At this, cooling unit 26 comprises the fin 261 that radiating part 235 a plurality of and conduit 23 links, and the fan 262 of corresponding fin 261 settings, fan 262 can blow radiating part 235 and fin 261 gas flow on every side, and then make heat be dissipated to the external world by gas flow row via conduit 23 tube walls and fin 261, make cooling fluid 22 reduce,, no longer add explanation at this because these structures are known by industry by radiating part 235 back temperature.

But the electronic component 100 that can produce heat during start is heat exchange ground to be connected with heat sink 24, and the hot type that electronic component 100 can be produced is from electronic component 100; Cooling fluid 22 flows in runner 231 by flowing into end 232 by pumping of extracting unit 25 and from Chu Rong space 211, via the portion of pumping 234, portion 236, radiating part 235, outflow end 233 are set flow out runners 231 and inject Chu Rong spaces 211 and circulate; And when a plurality of radiating fin 241 by heat sink 24 of cooling fluid 22, mixed configuration by carrier 221 with the heat radiation particle 222 of cooling fluid 22, carry out heat exchange with radiating fin 241 apace, and the torrid zone that is produced during with electronic component 100 starts is walked, and cooling fluid 22 streams of taking away the heat that electronic component 100 produced are during by radiating part 235, the auxiliary heat that cooling fluid 22 is entrained in cooling unit 26 with fin 261 and row is dissipated to the external world, and then makes the temperature reduction after cooling fluid 22 flows through radiating part 235 via conduit 23 tube walls; Cooling fluid 22 after the cooling continues stream and injects Chu Rong space 211, the heat radiation flow process that circulates above-mentioned once more.

As shown in the above description, the utility model is used for the heat abstractor 2 of electronic component 100 and compares with existing heat abstractor 1, more by to comprise the cooling fluid 22 of carrier 221 and a plurality of heat radiation particle 222 mixed configuration, and by heat sink 24 time, can can carry out heat exchange more quickly than the cooling fluid (or refrigerant) that constitutes with homogenous material (compound), and then the torrid zone that is produced during more apace with electronic component 100 starts is walked, reach the purpose of auxiliary electron element 100 heat radiations, really can improve the shortcoming of existing heat abstractor, reach creation purpose of the present utility model.

Claims

1. heat abstractor that is used for electronic component, comprise a storage tank that defines a Chu Rong space, be placed in the cooling fluid in this Chu Rong space, one defines the conduit of the runner of this coolant flow of confession, one extracting unit, reach a cooling unit, this runner comprises an inflow end that communicates with this Chu Rong space, one in contrast to this inflow end and the outflow end that communicates with this Chu Rong space, the portion of pumping of one adjoining this inflow end, the radiating part of one close relatively this outflow end, and one pump the portion that is provided with between portion and this radiating part between this, but this electronic component heat exchange being arranged at this is provided with portion, this extracting unit is arranged at this and pumps portion, pumping this cooling fluid flows to this outflow end from this inflow end via this Chu Rong space, this cooling unit is characterized in that corresponding to this radiating part installing:

This cooling fluid has the carrier of a liquid state, and is distributed in the heat radiation particle that can absorb heat fast in this carrier in a plurality of years, and these a plurality of heat radiation particles have low specific heat of combustion respectively.

2. be used for the heat abstractor of electronic component according to claim 1, it is characterized in that: this carrier is a water.

3. be used for the heat abstractor of electronic component according to claim 1, it is characterized in that: the average grain diameter of these a plurality of heat radiation particles is in the nanoscale scope.

4. as being used for the heat abstractor of electronic component as described in the claim 3, it is characterized in that: these a plurality of heat radiation particles are minimum with specific heat of combustion and material that can absorb heat is fast made.

5. as being used for the heat abstractor of electronic component as described in the claim 4, it is characterized in that: this specific heat of combustion is minimum and material that can absorb heat fast is to be selected from the group that is made of following: copper, aluminium, and these a combination.

6. be used for the heat abstractor of electronic component according to claim 1, it is characterized in that: this conduit is to be that material is made with the little metal of specific heat.

7. be used for the heat abstractor of electronic component according to claim 1, it is characterized in that: this extracting unit is a pump.

8. be used for the heat abstractor of electronic component according to claim 1, it is characterized in that: this cooling unit comprises the fin that radiating part a plurality of and conduit links, and the fan of a corresponding fin setting.

9. be used for the heat abstractor of electronic component according to claim 1, it is characterized in that: this heat abstractor also comprises a heat sink with a plurality of radiating fins, and being connected with this electronic component heat exchange ground is integral.