CN2840280Y

CN2840280Y - Biplate welded type plastic packaging thermistor

Info

Publication number: CN2840280Y
Application number: CN 200520077432
Authority: CN
Inventors: 何正安
Original assignee: CHANGSHU LINZHI ELECTRONICS Co Ltd
Current assignee: CHANGSHU LINZHI ELECTRONICS Co Ltd
Priority date: 2005-11-15
Filing date: 2005-11-15
Publication date: 2006-11-22
Anticipated expiration: 2015-11-15

Abstract

A kind of biplate welded type plastic packaging positive temperature coefficient thermistor belongs to the overcurrent protective device in the communications field.It comprises moulds shell, two pieces of PTC chips, is welded on each a pair of pin, chip carrier on the electrode layer of two pieces of PTC chips, the described shell of moulding is formed with latch hook in four bights of openend, and its inner die cavity is separated into two chip carrier chambeies by partition plate, be formed with two chip grooves and four pin holes and hook seat on the described chip carrier, the bottom of described each a pair of pin was exposed to outside the chip carrier after passing through corresponding pin hole, and this exposed end is formed with connector lug; Described chip carrier cap seal is being moulded on the openend of shell, and latch hook and hook seat lock are joined.The utlity model has that contact is reliable, closure is good, bond strength is high, be convenient to assemble and compact conformation, volume are little, applicable to the paster welding procedure in the integrated circuit.

Description

Biplate welded type plastic packaging thermistor

Technical field

The utility model relates to a kind of positive temperature coefficient thermistor, and particularly a kind of biplate welded type plastic packaging positive temperature coefficient thermistor belongs to the overcurrent protective device in the communications field.

Background technology

At present, be applied to play in the communications field positive temperature coefficient thermistor of overcurrent protection effect, its structure mainly contains following two kinds: a kind of is mechanical compression joint type, it is the porcelain shell by the tool openend, be contained in the porcelain shell and both sides be laid with PTC (positive temperature coefficient) chip of electrode layer, the a pair of elastic contact chip and the capping of cap seal on porcelain shell opener end that are inserted in PTC chip both sides constitute, because elastic contact chip is to lean on the mode of mechanical crimping to be connected with contact between the PTC chip, one of defective that this connected mode exists, contact reliability is poor, can occur phenomenons such as contact oxidation after long-term the use; Two, because after being used to seal the housing of PTC chip and adopting the porcelain shell, when combining with the capping that is molded out of plastic, can only realize by the mode of adhesive bonds, and can't adopt other as inlaying or snap close mode etc., the bond strength of this bonding mode a little less than, particularly when being subjected to external impacts, capping is easy to split away off from the porcelain shell, therefore must bond again again, thus the frequency of maintenance height, assemble loaded down with trivial details; Three, be not suitable for the installation of twin-core sheet.Another kind is the wire bonds formula, it generally can extremely go up leg in the directly welding two of PTC chip, simple in structure, easy for installation, advantages such as contact is reliable, good stability that this connected mode has, installation applicable to the twin-core sheet, but because the PTC chip is exposed outside, its protection against the tide, anti-interference and insulation property are all relatively poor, and this structure is not suitable for the paster welding procedure in the integrated circuit.

Summary of the invention

The purpose of this utility model be to provide a kind of contact reliable, closure is good, bond strength is high, be convenient to assemble and compact conformation, volume are little, applicable to the biplate welded type plastic packaging thermistor of the paster welding procedure in the integrated circuit.

The purpose of this utility model reaches like this, a kind of biplate welded type plastic packaging thermistor, what it comprised tool openend 13 moulds shell 1, two pieces of PTC chips 2, be welded on each a pair of pin 3 on the electrode layer of two pieces of PTC chips 2 respectively, chip carrier 4, the described shell 1 of moulding is formed with latch hook 131 respectively in four bights of openend 13, and its inner die cavity is separated into two by partition plate 11 and is used for for the ccontaining chip carrier chamber 12 in it of two pieces of PTC chips 2, be formed with on the described chip carrier 4 two chip grooves 41 being used to install two pieces of PTC chips 2 and for four pin holes 43 of each a pair of pin 3 inserting on two pieces of PTC chips 2 and be located at 4 four bights of chip carrier and with latch hook 131 corresponding hook seats 45, the bottom of described each a pair of pin 3 was exposed to outside the chip carrier 4 after passing through corresponding pin hole 43, and this exposed end is formed with through bending and is used for the connector lug 31 that is connected with circuit; Described chip carrier 4 carry on it two pieces of PTC chips 2 together cap seal on the openend 13 of moulding shell 1, and latch hook 131 and hook seat 45 both locks are joined.

The material of chip carrier 4 described in the utility model is plastics.

41 of two chip grooves described in the utility model are located on the chip carrier 4.

The utility model is formed with wallboard pin holes 44 between two chip grooves 41 of described chip carrier 4, be formed with the partition plate pin 111 that is used for 44 insertings of wallboard pin holes in the bottom of the partition plate 11 of moulding shell 1 correspondingly.

The bottom surface of two chip grooves 41 described in the utility model is arc surface.

The utility model is formed with pin chamber 42 on described chip carrier 4 and corresponding to 43 positions, four pin holes.

After one of advantage of the present utility model, the totally-enclosed plastic encapsulation of employing, have good insulation performance performance, energy protection against the tide, anti-interference; Two, mould between shell 1 and the plastic chip carrier 4 connect by the snap close mode after, bond strength height, assembling are convenient; Three, pin 3 directly is welded on the electrode layer of PTC chip 2, reliable, the good stability of contact; Four, two pieces of PTC chips adopt the cellular-type package assemblies after, two chips are independent each other, do not disturb mutually, and volume is little, compact conformation; Five, can be applicable to the paster welding production technology in the integrated circuit.

Description of drawings

Accompanying drawing is an example structure figure of the present utility model.

Embodiment

Please refer to accompanying drawing, PTC of the present utility model (positive temperature coefficient) chip 2 has two pieces, generally can adopt barium titanate powder to make the thin rounded flakes shape, be coated with one deck electrode layer respectively in the both sides of each PTC chip, each a pair of pin 3 is welded on respectively on the electrode layer of PTC chip 2.The shell 1 of moulding of the present utility model adopts plastic moulding to form, the centre of wherein moulding the inside die cavity of shell 1 is separated by partition plate 11 and is formed with two and is used for for the ccontaining chip carrier chamber 12 in it of two pieces of PTC chips 2, the bottom of moulding shell 1 is formed with openend 13, be formed with respectively in four bights of openend 13 and be used for the latch hook 131 that cooperates with chip carrier 4, narrow the contracting in bottom of partition plate 11 and be formed with partition plate pin 111.Chip carrier 4 of the present utility model also adopts plastic moulding to form, be formed with two chip grooves 41, four pin holes 43 on it and expand and be located at the pin chamber 42 around four pin holes 43 and be opened in being used for the wallboard pin holes 44 of partition plate pin 111 insertings and being located at the hook seat 45 of joining of being used in 4 four bights of chip carrier between two chip grooves 41 with latch hook 131 hooks for the ease of inserting pin 3, wherein the bottom surface of two chip grooves 41 is arc surface, and the radian size of this arc surface should adapt with the radian size of the arc surface of two pieces of PTC chips 2.When mounted, at first with pin hole 43 and insertion downwards in the pin chamber 42 on each a pair of pin 3 difference aligned with core bar 4 on two pieces of PTC chips 2, the bottom of each a pair of pin 3 is exposed to outside the bottom of chip carrier 4, this exposed end is formed with through bending and is used for the connector lug 31 that is connected with integrated circuit, meanwhile, two pieces of PTC chips 2 just are fixed in a pair of chip groove 41 of chip carrier 4, then, 2 insertions of two pieces of PTC chips are moulded in two chip carrier chambeies 12 of shell 1, and the chip carrier 4 of fixedlying connected with two pieces of PTC chips 2 is covered on the openend 13 of moulding shell 1, at last, be locked together on four hook seats 45 of chip carrier 4 by the latch hook 131 of moulding 1 four bights of shell and get final product.

When using the utility model, only need with the connector lug 31 of each a pair of pin 3 of two pieces of PTC chips 2 respectively with integrated circuit board on circuit carry out corresponding welding and get final product, connect very convenient.In actual use, because behind two pieces of PTC chips employing cellular-type all-plastic encapsulating structures, not only bond strength height, assembling are convenient, and compact conformation, volume is little, energy is moistureproof, anti-interference and have the good insulation performance performance, can guarantee the operate as normal of circuit.

Claims

1, a kind of biplate welded type plastic packaging thermistor, what it is characterized in that it comprises tool openend (13) moulds shell (1), two pieces of PTC chips (2), be welded on each a pair of pin (3) on the electrode layer of two pieces of PTC chips (2) respectively, chip carrier (4), the described shell (1) of moulding is formed with latch hook (131) respectively in four bights of openend (13), and its inner die cavity is separated into two by partition plate (11) and is used for for the ccontaining chip carrier chamber (12) in it of two pieces of PTC chips (2), be formed with on the described chip carrier (4) two chip grooves (41) of being used to install two pieces of PTC chips (2) and for four pin holes (43) of each a pair of pin (3) inserting on two pieces of PTC chips (2) and be located at (4) four bights of chip carrier and with the corresponding hook seat of latch hook (131) (45), the bottom of described each a pair of pin (3) is exposed to after passing through corresponding pin hole (43) outside the chip carrier (4), and this exposed end is formed with and is used for the connector lug (31) that is connected with circuit; Described chip carrier (4) carry on it two pieces of PTC chips (2) together cap seal on the openend of moulding shell (1) (13), and latch hook (131) and both locks of hook seat (45) are joined.

2, biplate welded type plastic packaging thermistor according to claim 1, the material that it is characterized in that described chip carrier (4) is plastics.

3, biplate welded type plastic packaging thermistor according to claim 1 is characterized in that being located on the chip carrier (4) between described two chip grooves (41).

4, according to claim 1 or 3 described biplate welded type plastic packaging thermistors, it is characterized in that between two chip grooves (41) of described chip carrier (4), being formed with wallboard pin holes (44), be formed with the partition plate pin (111) that is used for wallboard pin holes (44) inserting correspondingly in the bottom of the partition plate of moulding shell (1) (11).

5, biplate welded type plastic packaging thermistor according to claim 1 is characterized in that the bottom surface of described two chip grooves (41) is arc surface.

6, biplate welded type plastic packaging thermistor according to claim 1 is characterized in that upward and corresponding to position, four pin holes (43) being formed with pin chamber (42) at described chip carrier (4).