CN2800699Y - Circuit board and connector assembling structure - Google Patents

Circuit board and connector assembling structure Download PDF

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Publication number
CN2800699Y
CN2800699Y CN 200520018153 CN200520018153U CN2800699Y CN 2800699 Y CN2800699 Y CN 2800699Y CN 200520018153 CN200520018153 CN 200520018153 CN 200520018153 U CN200520018153 U CN 200520018153U CN 2800699 Y CN2800699 Y CN 2800699Y
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CN
China
Prior art keywords
line segment
wiring board
reference planes
connector
signal
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN 200520018153
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Chinese (zh)
Inventor
江信兴
李胜源
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Via Technologies Inc
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Via Technologies Inc
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Priority to CN 200520018153 priority Critical patent/CN2800699Y/en
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Publication of CN2800699Y publication Critical patent/CN2800699Y/en
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Expired - Lifetime legal-status Critical Current

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Abstract

The utility model relates to a circuit board and connector assembling structure which comprises a circuit board and a coaxial cable connector which is assembled on the circuit board, wherein the circuit board is provided with a signal through hole and a plurality of positioning through holes. The circuit board comprises a reference plane, a conductor layer and an insulation layer, wherein the insulation layer is assembled between the reference plane and the conductor layer, and the signal through hole and the positioning through holes penetrate through the reference plane, the conductor layer and the insulation layer. In addition, the conductor layer comprises a signal hole pad, a first line section, a second line section and a compensation pad, wherein the first line section is connected with the signal hole pad and the compensation pad is connected between the first line section and the second line section. In addition, the coaxial cable connector is provided with a signal base pin and a plurality of positioning base pins, the signal base pin is inserted into the signal hole pad and the signal through holes and the positioning base pins are inserted into the positioning through holes.

Description

The package assembly of wiring board and connector
Technical field
The utility model relates to the package assembly of a wiring board and connector, and particularly relevant for a kind of successional wiring board of impedance of signal transmission path and package assembly of connector of promoting.
Background technology
On large-sized print circuit board and base plate for packaging, in order to electrically connect the signal conductor between two element or two end points, its live width all need be consistent, so that electronic signal is when transmitting between signal conductor, the characteristic impedance of signal conductor can remain unchanged, especially transmit at the signal of high speed and high frequency, more need be between the two-end-point by good designing impedance matching, in order to reduce the reflection that impedance does not match and caused, insertion loss (insertion loss) when promptly reducing the signal transmission, and the return loss (return loss) when improving the signal transmission relatively is to avoid influencing the quality that signal transmits.
Figure 1A illustrates the vertical view of the package assembly of known wiring board and connector, and Figure 1B and Fig. 1 C illustrate the cutaway view of A-A ' line and B-B ' line among Figure 1A respectively, and Fig. 1 D and Fig. 1 E illustrate the vertical view of conductor layer and reference planes among Figure 1B respectively.See also shown in Figure 1A to Fig. 1 E, the package assembly 100 of known wiring board and connector comprises a wiring board 20 and a vertical type SMA connector 50, and with vertical type SMA connector 50 be to be connected on the wiring board 20.Wiring board 20 comprises a conductor layer 110 and reference planes (reference plane) 120.Conductor layer 110 is positioned at the superficial layer of this wiring board 20, or says the superiors' conductor that this conductor layer 110 is these wiring boards 20.Wherein, conductor layer 110 has a telltale hole pad 112, a line segment 114, a plurality of location hole pad 116 and reference planes 118.Line segment 114 is to be connected with telltale hole pad 112, is constituted and location hole pad 116 is a plurality of parts by reference planes 118.In addition, reference planes 118,120 are ground plane (ground plane) or power plane (power plane), and reference planes 120 have respectively and these location hole pad 116 corresponding a plurality of location hole pads 122.
Hold above-mentionedly, vertical type SMA connector 50 is to be a kind of coaxial cable connector, and has a signal pins 52 and a plurality of location pins 54.Wherein, signal pins 52 is to insert the signal perforation 22 of the correspondence of wiring board 20, and passes telltale hole pad 112, and contacts with telltale hole pad 112, so that signal is passed to or exports from telltale hole pad 112.In addition, these location pins 54 are to insert the location perforation 24 of the correspondence of wiring board 20, and so that SMA connector 50 is fixed on the wiring board 20, and these location pins 54 more pass corresponding location hole pad 116,122, to electrically connect reference planes 120.(plating through hole, PTH) 24a strengthen the mechanical strength that location pins 54 combines with wiring board 20 can to form a conductive wall on the perforation 24 of location.In addition, reference planes 120 have an insulated hole 124, to avoid contacting with signal pins 52 and cause short circuit.
In the known techniques, the characteristic impedance value of telltale hole pad 112 is less than the characteristic impedance value of line segment 114, and characteristic impedance value between the two differs very big, insertion loss (insertion loss) when this causes the signal transmission raises, thereby influence the quality that signal transmits, especially when signal transmits with high frequency.
Summary of the invention
Therefore, the purpose of this utility model is exactly in the package assembly that a kind of wiring board and connector are provided, with the impedance continuity of the signal transmission path that promotes its wiring board.
Based on above-mentioned and other purposes, the utility model proposes the package assembly of a kind of wiring board and connector, it comprises a wiring board and a coaxial cable connector, and wherein coaxial cable connector is to be assembled on the circuit board, and wiring board has a signal perforation and a plurality of location perforation.This wiring board comprises one first reference planes, a conductor layer and an insulating barrier, and insulating barrier is to be disposed between first reference planes and the conductor layer, and signal perforation and these location perforation is to run through first reference planes, conductor layer and insulating barrier.In addition, conductor layer comprises a telltale hole pad, one first line segment, one second line segment and a compensation pad.First line segment is to be connected with the telltale hole pad, and the compensation pad is to be connected between first line segment and second line segment.In addition, coaxial cable connector has a signal pins and a plurality of location pins, and signal pins is to insert in telltale hole pad and the signal perforation, and these location pins are to insert these to locate in perforations.In addition, the telltale hole spacer has one first characteristic impedance, and second line segment has one second characteristic impedance, and the compensation spacer has one the 3rd characteristic impedance, and wherein second characteristic impedance is greater than the 3rd characteristic impedance, and the 3rd characteristic impedance is greater than first characteristic impedance.
In the above-mentioned wiring board and the package assembly of connector, conductor layer for example more comprises one second reference planes, and it is around telltale hole pad, first line segment, the compensation pad and second line segment, and a plurality of parts of second reference planes for example are to constitute most location hole pads.In addition, second reference planes for example are ground plane or power plane.
In the above-mentioned wiring board and the package assembly of connector, first reference planes for example have a spacious district, and telltale hole pad and first line segment be projection in first reference planes are to be positioned at spacious the district.In addition, the width of compensation pad is the width greater than second line segment, makes second characteristic impedance greater than the 3rd characteristic impedance by this.
In the above-mentioned wiring board and the package assembly of connector, first line segment for example is linearly or non-linear shape.
In the above-mentioned wiring board and the package assembly of connector, first line segment for example is around part signal hole pad.
In the above-mentioned wiring board and the package assembly of connector, first line segment for example has a U-shaped bending part.
In the above-mentioned wiring board and the package assembly of connector, first reference planes for example are power plane or ground plane.
Based on above-mentioned, the utility model is connected between first line segment and second line segment because of adopting a compensation pad, can improve impedance continuity between telltale hole pad to the second line segment by the parasitic capacitance that compensation is filled up and first reference planes are produced.Therefore, the package assembly of wiring board of the present utility model and connector can improve the quality of signal transmission.
In addition, the utility model more can reduce electric capacity between telltale hole pad and first line segment and first reference planes by spaciousness district and compensating basin, with the further impedance continuity of improving between telltale hole pad to the second line segment.In addition, the utility model also can utilize the design of first line segment for non-linear shape, increases the inductance between first line segment and first reference planes, to improve the impedance continuity between telltale hole pad to the second line segment.
For above-mentioned and other purposes, feature and advantage of the present utility model can be become apparent, preferred embodiment cited below particularly, and cooperate appended graphicly, be described in detail below.
Description of drawings
Figure 1A illustrates the vertical view of the package assembly of a known wiring board and connector.
Figure 1B and Fig. 1 C illustrate the cutaway view of A-A ' line and B-B ' line among Figure 1A respectively.
Fig. 1 D and Fig. 1 E illustrate the vertical view of conductor layer and reference planes among Figure 1B respectively.
Fig. 2 illustrates the cutaway view of the package assembly of a kind of wiring board of the utility model first embodiment and connector.
Fig. 3 A illustrates the vertical view of wiring board among Fig. 2.
Fig. 3 B and Fig. 3 C illustrate the vertical view of conductor layer and first reference planes among Fig. 3 A respectively.
Fig. 4 A illustrates the vertical view of a kind of wiring board of the utility model second embodiment.
Fig. 4 B and Fig. 4 C illustrate the vertical view of conductor layer and first reference planes among Fig. 4 A respectively.
Fig. 5 A and Fig. 5 B illustrate the vertical view of two kinds of wiring boards of the utility model the 3rd embodiment respectively.
Fig. 6 A and Fig. 6 B illustrate the vertical view of two kinds of wiring boards of the utility model the 4th embodiment respectively.
20,20a~20f: wiring board
22: the signal perforation
24: the location perforation
The 50:SMA connector
52: signal pins
54: location pins
110,210a~210d: conductor layer
112,212: the telltale hole pad
114: line segment
116,122,216,222: the location hole pad
118,120: reference planes
124,224: insulated hole
213,213a, 213b: first line segment
214: the second line segments
215: the compensation pad
218: the second reference planes
220a, 220b, 220c: first reference planes
226: spacious district
228: the compensating basin
230: insulating barrier
Embodiment
First embodiment
Figure 2 shows that the cutaway view of the package assembly of a kind of wiring board of the utility model first embodiment and connector, Fig. 3 A is depicted as the vertical view of wiring board among Fig. 2, and Fig. 3 B and Fig. 3 C illustrate the vertical view of conductor layer and first reference planes among Fig. 3 A respectively.See also shown in Fig. 2 and 3A to Fig. 3 C, the wiring board of present embodiment and the package assembly of connector 200 comprise a wiring board 20a and a coaxial cable connector, this coaxial cable connector for example is a vertical type SMA connector 50, and it is to be assembled on the wiring board 20a.Wiring board 20a has a signal perforation 22 and a plurality of location perforation 24, this wiring board 20a comprises one first reference planes 220a, a conductor layer 210a and an insulating barrier 230, and insulating barrier 230 is to be disposed between the first reference planes 220a and the conductor layer 210a, and signal perforation 22 is to run through the first reference planes 220a, conductor layer 210a and insulating barrier 230 with these location perforations 24.In addition, conductor layer 210a comprises telltale hole pad 212, one first line segment 213, one second line segment 214 and a compensation pad 215.First line segment 213 is to be connected with telltale hole pad 212, and compensation pad 215 is to be connected between first line segment 213 and second line segment 214.In addition, vertical type SMA connector 50 has a signal pins 52 and a plurality of location pins 54, and signal pins 52 is to insert in telltale hole pad 212 and the signal perforation 22, and these location pins 54 are to insert in these location perforations 24.
In above-mentioned wiring board and the package assembly of connector 200, conductor layer 210a for example more comprises a plurality of location hole pads 216, and the first reference planes 220a for example has respectively a plurality of location hole pads 222 corresponding with these location hole pads 216, and each location pins 54 of SMA connector 50 is to insert in the location perforation 24 of correspondence of wiring board 20a, so that SMA connector 50 is fixed on the wiring board 20a, and these location pins 54 are more passed corresponding location hole pad 216,222, to electrically connect the first reference planes 220a.In addition, in the present embodiment, can on the perforation 24 of location, form a conductive wall 24a, to strengthen the mechanical strength that location pins 54 combines with wiring board 20a.In addition, the first reference planes 220a of present embodiment can be power plane or ground plane, and it for example has more an insulated hole 224, to avoid contacting with signal pins 52 and cause short circuit.
Because the conductor layer 210a of present embodiment has a compensation pad 215, its width (left and right sides width of compensation pad 215 among Fig. 3 A) for example is the width (left and right sides width of second line segment 214 among Fig. 3 A) greater than second line segment 214, therefore the equivalent capacity between compensation the pad 215 and first reference planes 220a is higher, the characteristic impedance that makes compensation pad 215 is between the characteristic impedance of the characteristic impedance of signal bonding pad 212 and second line segment 214, the phase place adjustment that cooperates first line segment 213 to produce again, can improve the continuity of the characteristic impedance value of signal transmission path, and then improve the quality that signal transmits, especially when signal transmits with high frequency.
In the utility model one preferred embodiment, for example dispose an insulating barrier 230 between the conductor layer 210a and the first reference planes 220a, electrically connect to prevent the conductor layer 210a and the first reference planes 220a.Wiring board 20a that it should be noted that present embodiment also can comprise other conductor layers, reference planes and insulating barrier except comprising above-mentioned conductor layer 210a, the first reference planes 220a and insulating barrier 230.
Second embodiment
Fig. 4 A is depicted as the vertical view of a kind of wiring board of the utility model second embodiment, and Fig. 4 B and Fig. 4 C illustrate the vertical view of conductor layer and first reference planes among Fig. 4 A respectively.See also shown in Fig. 4 A to Fig. 4 C, the wiring board 20b of present embodiment is similar to wiring board 20a (as shown in Figure 3A), difference is in the conductor layer 210b of wiring board 20b and more comprises one second reference planes 218, it is around telltale hole pad 212, first line segment 213, compensation pad 215 and second line segment 214, and above-mentioned location hole pad 216 for example is that a plurality of part by second reference planes 218 is constituted.In addition, second reference planes 218 can be ground plane or power plane.
The 3rd embodiment
Fig. 5 A and Fig. 5 B illustrate the vertical view of two kinds of wiring boards of the utility model the 3rd embodiment respectively.Please consult earlier shown in Fig. 5 A, its Fig. 3 A to first embodiment is similar, below only describes at not existing together.The first reference planes 220b of the wiring board 20c of present embodiment for example has a spacious district 226, and this spacious district 226 is the non-conductor district of the first reference planes 220b, and telltale hole pad 212 and first line segment 213 are to be positioned at spaciously to distinguish 226 in the projection of these first reference planes 220b.
In other words, present embodiment can enlarge the insulated hole 224 (shown in Fig. 3 C) of the first reference planes 220b and the spacious district 226 of formation, with the electric capacity between reduction telltale hole pad 212 and first line segment 212 and the first reference planes 220c, and then the characteristic impedance that improves the telltale hole pad 212 and first line segment 212.Therefore, the signal structure 200c of present embodiment can further reduce the poor of characteristic impedance value between telltale hole pad 212 and first line segment 212 and the compensation pad 216, and with the continuity of the characteristic impedance value that improves signal transmission path, the quality that makes signal transmit is better.
See also shown in Fig. 5 B, the maximum differential of itself and Fig. 5 A is first reference planes.In more detail, the first reference planes 220c of the signal structure 200d of present embodiment for example has more a compensating basin 228, itself and spacious district 212 belong to the non-conductor district of the first reference planes 220c together, and the part of first line segment 213 is that another part that is positioned at spacious district 212, the first line segments 213 then is positioned at compensating basin 228 in the projection of the first reference planes 220c with signal bonding pad in the projection of the first reference planes 220c.
The design of this compensating basin 228 is to be used for increasing at first line segment 213 of this compensating basin 228 and the inductance between the first reference planes 220c, to improve the characteristic impedance value.Thus, can further improve the continuity of the characteristic impedance value of signal transmission path, to obtain better signal transmitting quality.
Among above-described each embodiment, first line segment of conductor layer is all linearly, yet in the utility model, first line segment can be designed to non-linear shape, with increase by first line segment and first reference planes between inductance, the characteristic impedance value that improves first line segment improves, and suitably adjusts the phase delay on first line segment simultaneously.Below will describe, precisely because be not in order to limit the utility model for the embodiment that two first line segments are non-linear shape.
The 4th embodiment
Fig. 6 A and Fig. 6 B illustrate the vertical view of two kinds of wiring boards of the utility model the 4th embodiment respectively.See also shown in Fig. 6 A and Fig. 6 B, in wiring board 20e, the first line segment 213a of conductor layer 210c for example is around part signal hole pad 212, and in wiring board 20f, the first line segment 213b for example has a U-shaped bending part.
Because the above-mentioned first line segment 213a, 213b is non-linear shape, make the inductance between itself and the first reference planes 220b increase, so can improve the characteristic impedance value of the first line segment 213a, 213b, and then improve the continuity of the characteristic impedance value of signal transmission path, to obtain better signal transmitting quality.Certainly, first line segment of the present utility model also can be other shapes except above-mentioned shape.
In sum, the package assembly of wiring board of the present utility model and connector has following advantage at least:
1, the utility model is to improve impedance continuity between telltale hole pad to the second line segment by the parasitic capacitance that the compensation pad and first reference planes are produced, and therefore can improve the quality that signal transmits.
2, utilize the spacious electric capacity that reduces between telltale hole pad and first line segment and first reference planes of distinguishing, improve the characteristic impedance value of the telltale hole pad and first line segment, can make the impedance continuity between telltale hole pad to the second line segment better, with the quality of further raising signal transmission.
3, the utility model more can increase by the compensating basin adjacent with the spaciousness district at first line segment of compensating basin and the inductance between first reference planes, to improve the impedance continuity between telltale hole pad to the second line segment, improves signal transmitting quality.
4, in one embodiment, because first line segment is the design of non-linear shape, it can increase the inductance between first line segment and first reference planes, and suitably adjusts phase delay simultaneously, improve the impedance continuity between telltale hole pad to the second line segment, and improve signal transmitting quality.
Though the utility model discloses as above with preferred embodiment; right its is not in order to limit the utility model; anyly have the knack of this skill person; in not breaking away from spirit and scope of the present utility model; when doing a little change and retouching, therefore protection range of the present utility model should be defined with claim and is as the criterion.

Claims (10)

1, the package assembly of a kind of wiring board and connector is characterized in that it comprises:
One wiring board has a signal perforation and most location perforations, and this wiring board comprises:
One first reference planes;
One conductor layer is disposed at a side of these first reference planes, and this conductor layer comprises:
One telltale hole pad has one first characteristic impedance;
One first line segment is connected with this telltale hole pad;
One second line segment has one second characteristic impedance; And
One compensation pad is connected between this first line segment and this second line segment, and has one the 3rd characteristic impedance, and wherein this second characteristic impedance is greater than the 3rd characteristic impedance, and the 3rd characteristic impedance is greater than this first characteristic impedance; And
One insulating barrier is disposed between these first reference planes and this conductor layer, and wherein this signal perforation and those location perforations are to run through these first reference planes, this conductor layer and this insulating barrier; And
One coaxial cable connector has a signal pins and most location pins, and this signal pins is to insert in this telltale hole pad and this signal perforation, and those location pins are to insert those to locate in perforations.
2, the package assembly of wiring board according to claim 1 and connector, it is characterized in that wherein said conductor layer more comprises one second reference planes, around this telltale hole pad, this first line segment, this compensation pad and this second line segment, and a plurality of parts of these second reference planes constitute most location hole pads.
3, the package assembly of wiring board according to claim 2 and connector is characterized in that wherein said second reference planes are ground plane or power plane.
4, the package assembly of wiring board according to claim 1 and connector it is characterized in that wherein said first reference planes have a spacious district, and this telltale hole pad and this first line segment is to be positioned at this spaciousness district in the projection of these first reference planes.
5, the package assembly of wiring board according to claim 4 and connector, the width that it is characterized in that wherein said compensation pad are the width greater than this second line segment, make this second characteristic impedance greater than the 3rd characteristic impedance by this.
6, the package assembly of wiring board according to claim 1 and connector is characterized in that wherein said first line segment is linearly.
7, the package assembly of wiring board according to claim 1 and connector is characterized in that wherein said first line segment is around this telltale hole pad of part.
8, the package assembly of wiring board according to claim 1 and connector is characterized in that wherein said first line segment has a U-shaped bending part.
9, the package assembly of wiring board according to claim 1 and connector is characterized in that wherein said first line segment is to be non-linear shape.
10, the package assembly of wiring board according to claim 1 and connector is characterized in that wherein said first reference planes are power plane or ground plane.
CN 200520018153 2005-05-08 2005-05-08 Circuit board and connector assembling structure Expired - Lifetime CN2800699Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200520018153 CN2800699Y (en) 2005-05-08 2005-05-08 Circuit board and connector assembling structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200520018153 CN2800699Y (en) 2005-05-08 2005-05-08 Circuit board and connector assembling structure

Publications (1)

Publication Number Publication Date
CN2800699Y true CN2800699Y (en) 2006-07-26

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Application Number Title Priority Date Filing Date
CN 200520018153 Expired - Lifetime CN2800699Y (en) 2005-05-08 2005-05-08 Circuit board and connector assembling structure

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102159020A (en) * 2010-02-11 2011-08-17 欣兴电子股份有限公司 Counterpoint structure of circuit board and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102159020A (en) * 2010-02-11 2011-08-17 欣兴电子股份有限公司 Counterpoint structure of circuit board and manufacturing method thereof

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C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CX01 Expiry of patent term

Expiration termination date: 20150508

Granted publication date: 20060726