CN2800488Y

CN2800488Y - Heat pipe radiator

Info

Publication number: CN2800488Y
Application number: CN 200520058171
Authority: CN
Inventors: 陈弘岳
Original assignee: 杨开艳
Priority date: 2005-05-16
Filing date: 2005-05-16
Publication date: 2006-07-26
Anticipated expiration: 2015-05-16

Abstract

The utility model relates to the technical field of the computer technology and discloses a heat conducting pipe radiator. The utility model is provided with a heat absorbing plate and a plurality of heat conducting pipes provided with fins, wherein the heat absorbing plate is in contact with the CPU, the heat absorbing plate is provided with a plurality of circular arc-shaped grooves which are arranged in parallel and have different depths, the groove of the central part is shallow, the grooves of the two side parts are deeper, and the heat absorbing section of each heat conducting pipe is fixed in the circular arc-shaped groove. As the heat absorbing plate is provided with the grooves with different depths, when the heat absorbing section of each heat conducting pipe is fixed in the groove, namely, the heat absorbing section of each heat conducting pipe and the groove are in parallel but are not in the same plane; the distances for that the heat of the central part of the CPU is transferred to the different heat conducting pipe are nearly the same, and the different heat conducting pipes are uniformly heated; thus, the heat can be uniformly transferred to the different positions of the fins, thereby, the radiating efficiency can be improved.

Description

A kind of heat pipe radiator

Technical field:

The utility model relates to field of computer technology, especially relates to a kind of heat pipe radiator that the CPU of computer is dispelled the heat.

Background technology:

Along with the speed of computer CPU (central processing unit) is accelerated gradually, the heat fast rise that CPU produces.In order to solve heat dissipation problem, radiator still is difficult to satisfy the needs that CPU speed promotes after making copper fin-type radiator into from the aluminium extruded type radiator in past.The radiator of the central cpu of desktop computer begins to install additional heat pipe at present, conducts heat to the fin top near fan from the absorber plate that attaches cpu chip.Because of the heat transfer rate of heat pipe greater than aluminium matter or copper fin several times, so can be with heat propagating into the fin top than fin faster speed near the fan place, thereby improve radiating effect.

But installed the radiator behind the heat pipe at present additional, its performance boost is limited, and reason is: general heat pipe radiator, and its heat pipe arrangement mode has two kinds, a kind of is that heat pipe (for example 2～5) more than 2 is arranged in parallel at the absorber plate position, and welds together; A kind of is that 4 heat pipes are the intersection arrangement.

Be arranged in parallel at the absorber plate position and for the heat pipe radiator of base welding for 2 above heat pipes, two kinds of patterns are generally arranged: a kind of is that heat pipe 02 is arranged in parallel at absorber plate 01 position, the one end stretches out outside the absorber plate 01, and through inserting fin 03 (seeing shown in the accompanying drawing 1) after the bending; A kind of is to be arranged in parallel at absorber plate 01 position, and absorber plate 01 outer (seeing shown in accompanying drawing 2A and the accompanying drawing 2B) is stretched out at its two ends.Yet general heat pipe 02 is arranged in parallel the thickness of its welding position absorber plate 01 identical (seeing shown in accompanying drawing 3A and the accompanying drawing 3B) at absorber plate 01 position.Even some absorber plate is offered groove with the sweating heat conduit, but its gash depth is also identical, make heat pipe identical with the distance of CPU.This design can make at the heat of the heat pipe hyperabsorption of central part and loose and do not fall heat, and the heat absorption of the heat pipe at position, both sides is not enough.Especially with reaching 6 heat pipes, consequently the heat pipe at ragged edge position is not on the core of CPU in some design.

In addition, some design makes the thin thickness of absorber plate 01 to 2-3mm (seeing shown in the accompanying drawing 3A), to promote thermal conductivity, but in fact at the heat of heat pipe 02 hyperabsorption of central part, and the heat pipe 02 at position, both sides absorbs less than heat, looses up to the heat pipe 02 at central part and does not fall heat, and heat is just gently prolonging the heat pipe 02 that thin absorber plate 01 passes to the position, both sides, but the temperature of central part is higher, and the horizontal coefficient of overall heat transmission of thin absorber plate is not high.

For improving this problem, also some design increases to 5-6mm (seeing shown in the accompanying drawing 3B) with the thickness of absorber plate, but two adverse consequencess are arranged like this, and the one, gain in weight and cost, the 2nd, the vertical coefficient of overall heat transmission of thick absorber plate is not high.

The utility model content:

The purpose of this utility model is to provide a kind of heat pipe radiator that can overcome above-mentioned shortcoming, the better heat-radiation effect of this heat pipe radiator, and every heat pipe all can play a role.

For achieving the above object, it has an absorber plate that contacts with CPU and the many heat pipes that are inserted with fin, offer a plurality of being arranged in parallel on the described absorber plate and deep mixed arc-shaped groove, the gash depth of its central part is more shallow, and the gash depth at position, both sides is darker, and the endotherm section of heat pipe is fixed in the arc-shaped groove.

At the heat pipe of central part and the distance of CPU is 5～9mm, and the distance of the heat pipe at position, both sides and CPU is 1～4mm.

On same position, can there be the periphery of two heat pipes partly to overlap up and down.The periphery of the heat pipe at close CPU center is in the top, and is in the below every the neighbour from the periphery of CPU center heat pipe far away.

The beneficial effects of the utility model are: owing to offered deep mixed groove on absorber plate, when the endotherm section of heat pipe is fixed in these grooves, promptly be in parallel but the state of coplane not, it is approaching that the heat of CPU central part is sent to the distance of different heat pipes, and different heat pipes is heated evenly.Even it is too late that the heat pipe heat of central part looses, the heat of absorber plate also can be sent to the heat pipe every the neighbour apace.Moreover partly overlap up and down at the periphery that two heat pipes can be arranged on the same position and to make all endotherm section reduction spans to be located on the core cpu.Make heat can be sent to diverse location on the fin equably, thereby improve radiating efficiency.

Description of drawings:

Below in conjunction with accompanying drawing the utility model is described further:

Accompanying drawing 1 is the structural representation of one of existing heat pipe radiator

Accompanying drawing 2A is two structural representation of existing heat pipe radiator

Accompanying drawing 2B is the end view of accompanying drawing 2A

Accompanying drawing 3A is one of the heat pipe in the existing radiator and structural representation of absorber plate

Accompanying drawing 3B is two of the structural representation of heat pipe in the existing radiator and absorber plate

Accompanying drawing 4A is the profile of the absorber plate of one of the utility model embodiment

Accompanying drawing 4B is the structural representation of one of the utility model embodiment

Accompanying drawing 5A is the profile of two the absorber plate of the utility model embodiment

Accompanying drawing 5B is two the structural representation of the utility model embodiment

Accompanying drawing 6A is the profile of three the absorber plate of the utility model embodiment

Accompanying drawing 6B is three the structural representation of the utility model embodiment

Embodiment:

The following stated only is preferred embodiment of the present utility model, does not therefore limit protection range of the present utility model.

Accompanying drawing 4A and accompanying drawing 4B are depicted as one of embodiment of the present utility model: in this embodiment, absorber plate 10 is a copper material, it simultaneously is the plane that contacts with CPU, then offer 3 parallel circle arcuate furrows 11 that (also can be more than 3 certainly) is deep mixed on the another side, the gash depth of its central part is more shallow, and the degree of depth of two grooves 11 of its both sides is darker; The endotherm section of heat pipe 20 is fixedly welded in the groove 11 and is parallel but the arrangement mode of coplane not.The radiating segment of heat pipe 20 then is horizontally, is inserted with the fin (not shown) perpendicular to the heat pipe direction on it.

Accompanying drawing 5A and accompanying drawing 5B are depicted as two of embodiment of the present utility model, in this embodiment, the central part of absorber plate 10 offers two highly identical arc-shaped grooves 11, its both sides then offer the arc-shaped groove 11 of a position symmetry respectively, after the endotherm section of heat pipe 20 is fixedly welded in these grooves 11 respectively, present parallel equally but the arrangement mode of coplane not, it is approaching to make the heat of CPU central part be sent to the distance of different heat pipes, the unlikely heat pipe uneven phenomenon of being heated that occurs.

Accompanying drawing 6A and accompanying drawing 6B are depicted as three of embodiment of the present utility model, in this embodiment, absorber plate 10 is a symmetrical centre with central part arc-shaped groove 11, and its both sides offer the arc-shaped groove 11 of stepped distribution respectively, and all the other are identical with embodiment two with embodiment one.

It should be noted: in above-mentioned each the utility model embodiment, preferably making the heat pipe 20 that is positioned at absorber plate 10 central parts and the distance of CPU is 5～9mm, and the heat pipe 20 at position, both sides and the distance of CPU are 1～4mm, can obtain best heat-conducting effect like this.Because the heat that the position produces under a certain heat pipe 20 of central part, be sent to the distance of this root heat pipe, approaching with the distance that is sent to outer limit every adjacent heat pipe, even it is too late that the heat pipe heat of central part looses, then the heat of absorber plate also can be sent to the heat pipe every the neighbour apace, and different heat pipes is heated evenly.

In addition, the endotherm section that is the heat pipe 20 that is arranged in parallel can have the periphery of two heat pipes partly to overlap up and down on same position.The periphery of the heat pipe at close CPU center is in the top, and is in the below every the neighbour from the periphery of CPU center heat pipe far away, and so design can make all heat pipe endotherm sections 21 as far as possible near the CPU center.The heat pipe endotherm section 21 of 5 6mm for example, arrangement mode according to this, two Edge Distances that are arranged in outside endotherm section 21 can contract to 25mm, and all endotherm sections 21 are positioned on the core cpu.Relatively present general design, the span of the heat pipe endotherm section 21 of 5 6mm is 36-40mm, then the heat of endotherm section 21 absorptions of outer rim is less, does not fall heat and endotherm section 21 heat absorptions in center are too much diffusing, causes central temperature higher.

The execution mode that the endotherm section of heat pipe 20 can have the part periphery of two heat pipes to overlap up and down on same position is to utilize metal abnormity extrusion method, obtains the groove 11 that the part periphery overlaps up and down, and then the endotherm section 21 of stationary heat conduit.

Claims

1. heat pipe radiator, it has an absorber plate that contacts with CPU (10) and the many heat pipes (20) that are inserted with fin, it is characterized in that: described absorber plate offers a plurality of being arranged in parallel and deep mixed arc-shaped groove (11) on (10), the gash depth of its central part is more shallow, and the gash depth at position, both sides is darker, and the endotherm section (21) of heat pipe (20) is fixed in the arc-shaped groove (11).

2. heat pipe radiator according to claim 1 is characterized in that: at the heat pipe of central part and the distance of CPU is 5～9mm, and the distance of the heat pipe at position, both sides and CPU is 1～4mm.

3. heat pipe radiator according to claim 2, it is characterized in that: on same position, can have the periphery of two heat pipes partly to overlap up and down, the periphery of the heat pipe at close CPU center is in the top, and is in the below every the neighbour from the periphery of CPU center heat pipe far away.