CN2758974Y - Fan-stirring type liquid metal core plate radiator - Google Patents
Fan-stirring type liquid metal core plate radiator Download PDFInfo
- Publication number
- CN2758974Y CN2758974Y CN 200420096010 CN200420096010U CN2758974Y CN 2758974 Y CN2758974 Y CN 2758974Y CN 200420096010 CN200420096010 CN 200420096010 CN 200420096010 U CN200420096010 U CN 200420096010U CN 2758974 Y CN2758974 Y CN 2758974Y
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- radiator
- liquid metal
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- heat conduction
- plain film
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Abstract
The utility model relates to a fan-stirring type radiator which has the advantages of compact structure and high efficiency and drives liquid metal to flow by using a micro motor. The heat generated by the heating end of a chip can be transmitted quickly and efficiently by the utility model. The utility model mainly comprises a high heat conducting flat sheet which is in contact with the surface of a chip to be cooled, a ribbed sheet, a stirring leaf blade, a motor, a connecting pipeline with a one way valve, a fan which is used for forcing cooling air to flow, a low-melting point metal which is hermetically encapsulated in a flow passage, and alloy of the low-melting point metal. The utility model is characterized in that the radiator uses the motor to drive the fan to rotate and stirs the liquid metal by stirring leaf blades. The liquid metal in a cycle passage flows in the surrounding structure by a situation that a main radiator passes through a micro flow passage and the one way valve of the connecting pipeline, and the heat is discharged at a proper position. Thereafter, the liquid metal reversely flows in the main radiator through the one way valve of the connecting pipeline and sequentially completes new heat transportation. Thereby, the utility model realizes that the radiator drives the low-melting point metal and the alloy liquid thereof, and achieves the goal of transmitting heat efficiently.
Description
Technical field
The utility model relates to the computer chip heat abstractor, and is particularly a kind of by external or built-in electrical micro-machine driving low-melting-point metal or its alloy flow, thereby realizes the fan-agitating type liquid metal chip radiator of the compact conformation of heat transportation.
Background technology
The normal working temperature of high integration computer chip need maintain under the certain level, so the high power density radiating element becomes the development priority of industry always.At present, the main forced convection air that adopts cools off heater members on the computer, but the heat dissipation capacity of this mode is limited; For this reason, people just progressively attempt adopting water-cooled or other organic liquids to realize heat radiation, but these class methods are owing to exist evaporation to cause device aging, corrosion, even occur to reveal problem such as cause that chip burns, and the phase-change heat-exchange of other radiating mode such as heat pipe is had relatively high expectations to the manufacture craft of device again.
Denomination of invention is the Chinese patent ZL02257291.0 of " a kind of radiating device of chip radiation ", near the liquid metals of fusing point room temperature is expanded to be used for chip cooling first, for the computer chip heat radiation provides new refrigerating mode.This radiating device of chip radiation comprises: an inside has runner, and the main radiator of liquid low-melting-point metal or its alloy flow working medium is housed in the runner, and contacted another surface of this main radiator and chip surface to be cooled is provided with fin; At least one inside has runner, and the secondary radiator of liquid low-melting-point metal or its alloy flow working medium is housed in the runner, and the surface of this secondary radiator is provided with fin; Connecting tube is communicated between the major and minor radiator, and connecting tube is provided with and is used to drive liquid low-melting-point metal or the mobile micropump of its alloy flow working medium; Described flow working medium is is fusible low-melting-point metal gallium or its alloy near room temperature; Its advantage: collecting and distributing hot fin heat radiation and convection current cooling heat dissipation are in one, and volume size is little, and heat-delivery surface is big, the heat transfer efficiency height; Overall structure form is various, is suitable for face width; The cyclic process sealing does not have influence to environment.But exist defective: because driving pump is arranged on the pipeline, make that the entire radiator volume is bigger than normal, the computer that this has relatively high expectations for some compactedness is settled to have very big difficulty.For this reason, the utility model provides a kind of technology especially, miniature rabbling mechanism can be arranged in the main radiator, thereby construct a kind of liquid metals radiator that integrates stirring, dispels the heat.
Summary of the invention
The purpose of this utility model is: more convenient for making based on the control of the chip radiator of liquid metals, and energy consumption is low as far as possible, volume is as far as possible little, and a kind of fan-stirring-type chip heat radiator of compact is provided; Its operation principle is: adopt external or be built in driven by motor stirring vane in the fin, the liquid metals that drives in the radiator substrate runner flows, thus the heat that continuously chip heating end is produced rapidly transmission walk.This heat spreader structures compactness can be made into the radiator of various miniature or bigger slightly sizes at the radiating requirements of different micro-/ nano high power heater elements.
The technical solution of the utility model is as follows:
The fan of the compact conformation that the utility model provides-agitating type liquid metal chip radiator comprises:
One or more heat conduction plain films 1, the inside of described heat conduction plain film 1 has circulation passage, and liquid metals gallium or its alloy are housed in its circulation passage; Be connected by connecting tube 13 between the circulation passage of described heat conduction plain film 1, on the connecting tube 13 unidirectional valve be installed;
Be installed in described heat conduction plain film 1 lip-deep radiated rib 5, it is characterized in that,
Also comprise being installed between the radiated rib 5, perhaps be installed in the interior electrical micro-machine 6 of circulation passage of heat conduction plain film 1 by external power supply 17 drivings;
Be installed in the cross bar bindiny mechanism in the circulation passage of heat conduction plain film 1, described cross bar bindiny mechanism is made up of cross bar 9 and the stirring vane 7 that is installed in cross bar 9 two ends; The take-off (propeller) shaft of described electrical micro-machine 6 is worn and is linked to each other with described cross bar bindiny mechanism 9 and drive its rotation;
Flowing liquid gallium alloy is the alloy that gallium and tin, bismuth or indium are formed in the described circulation passage;
One radiator fan 14 by external motor 17 drivings is installed on described radiated rib 5.
The shape of cross section of described radiated rib 5 is square, rectangle, triangle or circle, and the radiated rib overall dimensions that is constituted is between 10cm * 10cm * 10cm at 1mm * 1mm * 1mm.
The fin that described radiated rib 5 is made for high-thermal conductive metal aluminium, copper, silver or semiconductor silicon material.
The plain film that described heat conduction plain film 1 is made for high-thermal conductive metal aluminium, copper, silver or semiconductor silicon material.
Described supporting pad 11 is the fixing and supporting mechanism between motor and the conducting strip 1, and material can be high-thermal conductive metal aluminium, copper, silver or semiconductor silicon.
Described connecting tube 13 is the pipeline of high-thermal conductive metal materials of aluminum, copper or silver or polymethyl methacrylate material; Also can be the flexible duct of making by plastics.
Described support column 16 is the fixing and supporting mechanism of cooling fin on conducting strip 1, and material can be high-thermal conductive metal aluminium, copper, silver or semiconductor silicon material.
The utility model is to have introduced the driving stirring vane in the liquid metals space, and stirring vane is by driven by motor, and is simple in structure, and liquid metal flows to reach the purpose that efficiently transports chip heat thereby stirring vane rotates driving in liquid metal.The utility model has been installed fan at the top of main radiator, thereby makes the air between fin realize forced-convection heat transfer, has strengthened the effect of radiator heat-dissipation, according to the needs of heat radiation, also can fan be installed with enhanced heat exchange at the top of auxilliary radiator.
Description of drawings
Accompanying drawing 1 is a structural representation of the present utility model;
Accompanying drawing 2 is the A-A schematic cross-section of Fig. 1;
The schematic diagram that accompanying drawing 3 uses for the utility model series connection.
Embodiment
Further describe the utility model below in conjunction with the drawings and specific embodiments:
Accompanying drawing 1 is a structural representation of the present utility model; Accompanying drawing 2 is the A-A schematic cross-section of Fig. 1; The schematic diagram that accompanying drawing 3 uses for the utility model series connection.As seen from the figure, the fan of the compact conformation that the utility model provides-agitating type liquid metal chip radiator comprises:
One or more heat conduction plain films 1, the inside of described heat conduction plain film 1 has circulation passage, and liquid metals gallium or its alloy are housed in its circulation passage; Be connected by connecting tube 13 between the circulation passage of described heat conduction plain film 1, on the connecting tube 13 unidirectional valve be installed;
Be installed in described heat conduction plain film 1 lip-deep radiated rib 5, it is characterized in that,
Also comprise being installed between the radiated rib 5, perhaps be installed in the interior electrical micro-machine 6 of circulation passage of heat conduction plain film 1 by external power supply 17 drivings;
Be installed in the cross bar bindiny mechanism in the circulation passage of heat conduction plain film 1, described cross bar bindiny mechanism is made up of cross bar 9 and the stirring vane 7 that is installed in cross bar 9 two ends; The take-off (propeller) shaft of described electrical micro-machine 6 is worn and is linked to each other with described cross bar bindiny mechanism 9 and drive its rotation;
Described liquid metals gallium alloy is the alloy that gallium and tin, bismuth or indium are formed;
One radiator fan 14 by external motor 17 drivings is installed on described radiated rib 5.
The shape of cross section of described radiated rib 5 is square, rectangle, triangle or circle, and the radiated rib overall dimensions that is constituted is between 10cm * 10cm * 10cm at 1mm * 1mm * 1mm.
The fin that described radiated rib 5 is made for high-thermal conductive metal aluminium, copper, silver or semiconductor silicon material.
The material of described heat conduction plain film 1 is high-thermal conductive metal aluminium, copper, silver or semiconductor silicon material.
Described supporting pad 11 is the fixing and supporting mechanism between motor and the conducting strip 1, and material can be high-thermal conductive metal aluminium, copper, silver or semiconductor silicon material.
The material of described connecting tube 13 is high-thermal conductive metal materials of aluminum, copper or silver or polymethyl methacrylate; Also can be the flexible duct of making by plastics.
Described support column 16 is the fixing and supporting mechanism of cooling fin on conducting strip 1, and material can be high-thermal conductive metal aluminium, copper, silver or semiconductor silicon material.
The utility model can use separately, circulation passage at heat conduction plain film 1 is equipped with gallium, during use, the bottom of heat conduction plain film is attached at the euthermic chip surface, and fixed, after then opening miniature mixer power supply, the liquid metals that mixer drives in the cooling fin flows, so this radiator can be exercised heat sinking function efficiently.
The utility model use that can be cascaded, as described in Figure 3, be cascaded by 3 liquid metal chip radiators of the present utility model, middle radiator is as main radiator, two radiators in addition are equipped with unidirectional valve as secondary radiator on the connecting tube 13 between its heat conduction plain film 1, and electrical micro-machine 6 is between radiated rib 5, the take-off (propeller) shaft of electrical micro-machine 6 penetrates heat conduction plain film 1 and links to each other with the cross bar 9 of described cross bar bindiny mechanism, and drives its rotation; Heat conduction plain film 1 is equipped with the alloy (can certainly be the alloy that gallium and tin or bismuth are formed) of gallium and indium composition, during use, the bottom of leading hot plain film is attached at the euthermic chip surface, and fixed, after then opening miniature mixer power supply, the liquid metals that mixer promptly drives in the leading hot plain film flows in the runner in the auxiliary heat dissipation sheet towards periphery, so heat sinking function efficiently can be exercised by the entire radiator system.In whole system, described supporting pad 11 is the fixing and supporting mechanism between motor and the conducting strip 1, and material can be high-thermal conductive metal aluminium, copper, silver or semiconductor silicon material.Described support column 16 is the fixing and supporting mechanism of cooling fin on conducting strip 1, and material can be high-thermal conductive metal aluminium, copper, silver or semiconductor silicon material.
The power resources that stirring vane stirs in flow duct are in motor 6, heat conduction plain film 1 absorbs the heat of chip operation and a part of heat is passed to liquid metal in the main radiator cavity, liquid metal in main radiator by modes such as heat conduction, convection current a part of heat that leaves.Meanwhile, the driven by motor stirring vane stirs liquid metal and causes certain actuating force, so, under its effect, liquid metals 8 in the circulation canal can be by 13 one-way cock regulation and control in the pipeline, flow to auxilliary radiator far-end and heat is emitted at this place, the liquid metals 8 of emitting behind the heat is back to temperature end through the one-way cock of connecting tubes 13, continues to finish new heat transportation.The shape of stirring vane 7 can in multiple shape such as square, oval, rotating vane, that stirring vane 7 must adopt is high temperature resistant, the material such as the making such as stainless steel, aluminium of rigidity and good toughness.The motion of stirring vane 7 can be rotated in the plane parallel with heat conduction plain film 1 bottom, also can survive plug form with bindiny mechanism's 9 co-design, thereby move up and down along direction perpendicular to heat conduction plain film 1 base plane, promoting high temperature fluent metal enters in the fin, when piston descended, liquid metal was back to heat conduction plain film 1 inside.The interior external diameter of all runners can be at tens nanometer to several millimeters, and length can be at several millimeters to tens of centimetres; And the flow channel cross-section shape can be square, triangle or circle etc.
Above-mentioned integrated radiator 1 can drive a plurality of complementary radiators 3, and the runner between them is interconnected, so heat discharges on the surface after expanding greatly thus.Such as, this device can include 1-10 the auxilliary radiator that communicates with heat conduction plain film 1 runner by connecting tube.The structure that connects the runner 13 of main radiator 2 and auxilliary radiator 3 can be variation setting, is provided with one-way cock in the runner to guarantee the one-way that liquid metal flows and to keep circulation.
Can process by prior art for micropore or groove in milli, the micron-sized pipeline in the utility model.Present progress can have been processed diameter at the 10nm microchannel.These conduits can be produced on the thin slice of silicon, metal or other suitable material.These technique guarantee the processing of the utility model heat abstractor.Such as, when making the runner of radiator, if desired line size less (as in tens of micron dimensions) then need adopt some micro-/ nano process technologies such as LIGA technology, laser drilling etc. to go up in radiator substrate (can be metal such as aluminium or semiconductor silicon etc.) and process a series of micro-grooves or duct by certain pipe method.If line size very big (arriving centimetre magnitude as millimeter) then adopts conventional method such as machining or electric machining to make.Whole manufacturing process is also uncomplicated.
The utlity model has lot of advantages, the chip radiator size can be very little, and owing to adopted liquid metal, initiatively heat-transfer capability is higher; And, adopted flowing of lower electrical micro-machine control stirring of energy consumption and fluid; The cyclic process of liquid metals is sealed in the entire radiator, can not impact environment.
Radiator of the present utility model can be advantageously used in the heat that device produces is led away from its surface.Use the mode of the utility model patent as follows: according to treating the heat removal surface area size, select the radiator of different sizes, it is close to the chip heating surface, contact-making surface between the two adopts the high thermal conductivity grease to increase heat-transfer effect, the heat conduction plain film is with the heat transferred liquid metal, and liquid metal is drained the heat that produces in the device by fin, thereby makes chip temperature maintain normal operating temperature range.
Claims (7)
1, a kind of fan-agitating type liquid metal chip radiator comprises:
One or more heat conduction plain films (1), the inside of described heat conduction plain film (1) has circulation passage, and liquid metals gallium or its alloy are housed in its circulation passage; Be connected by connecting tube (13) between the circulation passage of described heat conduction plain film (1), unidirectional valve is installed on the connecting tube;
Be installed in the lip-deep radiated rib of described heat conduction plain film (1) (5), it is characterized in that,
Also comprise being installed between the radiated rib (5), perhaps be installed in the interior electrical micro-machine (6) of circulation passage of heat conduction plain film (1) by external power supply (17) driving;
Be installed in the cross bar bindiny mechanism in the circulation passage of heat conduction plain film (1), described cross bar bindiny mechanism is made up of cross bar (9) and the stirring vane (7) that is installed in cross bar (9) two ends; The take-off (propeller) shaft of described electrical micro-machine (6) links to each other with the cross bar (9) of described cross bar bindiny mechanism and drives its rotation;
Flowing liquid gallium alloy is the alloy that gallium and tin, bismuth or indium are formed in the described circulation passage.
2, by the described fan of claim 1-agitating type liquid metal chip radiator, it is characterized in that, a radiator fan (14) by external motor (17) driving is installed on described radiated rib (5).
3, by the described fan of claim 1-agitating type liquid metal chip radiator, it is characterized in that, the shape of cross section of described radiated rib (5) is square, rectangle, triangle or circle, and the radiated rib overall dimensions that is constituted is between 10cm * 10cm * 10cm at 1mm * 1mm * 1mm.
4, by the described fan of claim 1-agitating type liquid metal chip radiator, it is characterized in that described radiated rib (5) is the fin that high-thermal conductive metal aluminium, copper, silver or semiconductor silicon material are made.
5, by the described fan of claim 1-agitating type liquid metal chip radiator, it is characterized in that described heat conduction plain film (1) is the plain film of high-thermal conductive metal aluminium, copper, silver or semiconductor silicon for material.
6, by the described fan of claim 1-agitating type liquid metal chip radiator, it is characterized in that described connecting tube (13) is high-thermal conductive metal materials of aluminum, copper or silver or polymethyl methacrylate pipeline for material.
7, by the described fan of claim 1-agitating type liquid metal chip radiator, it is characterized in that the flexible duct of described connecting tube (13) for making by plastics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420096010 CN2758974Y (en) | 2004-09-24 | 2004-09-24 | Fan-stirring type liquid metal core plate radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420096010 CN2758974Y (en) | 2004-09-24 | 2004-09-24 | Fan-stirring type liquid metal core plate radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2758974Y true CN2758974Y (en) | 2006-02-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200420096010 Expired - Lifetime CN2758974Y (en) | 2004-09-24 | 2004-09-24 | Fan-stirring type liquid metal core plate radiator |
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| CN (1) | CN2758974Y (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101872826A (en) * | 2010-05-28 | 2010-10-27 | 符建 | Liquid metal heat radiation based high-power LED light source of threaded connection structure |
| CN107101442A (en) * | 2017-04-21 | 2017-08-29 | 成都东浩散热器有限公司 | A kind of substrate cavity of bottom even radiating |
| CN108518659A (en) * | 2018-03-20 | 2018-09-11 | 上海环东光电科技股份有限公司 | Liquid metal heat radiation device and equipment, heat dissipation bulkhead lamp and heat dissipating method |
| CN110299336A (en) * | 2019-06-26 | 2019-10-01 | 东北大学 | A kind of closed liquid metal secondary circuit cooling system of high-power chip |
| CN111194161A (en) * | 2020-02-28 | 2020-05-22 | 维沃移动通信(重庆)有限公司 | Liquid cooling device and electronic equipment |
-
2004
- 2004-09-24 CN CN 200420096010 patent/CN2758974Y/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101872826A (en) * | 2010-05-28 | 2010-10-27 | 符建 | Liquid metal heat radiation based high-power LED light source of threaded connection structure |
| CN101872826B (en) * | 2010-05-28 | 2013-03-13 | 符建 | Liquid metal heat radiation based high-power LED light source of threaded connection structure |
| CN107101442A (en) * | 2017-04-21 | 2017-08-29 | 成都东浩散热器有限公司 | A kind of substrate cavity of bottom even radiating |
| CN108518659A (en) * | 2018-03-20 | 2018-09-11 | 上海环东光电科技股份有限公司 | Liquid metal heat radiation device and equipment, heat dissipation bulkhead lamp and heat dissipating method |
| CN110299336A (en) * | 2019-06-26 | 2019-10-01 | 东北大学 | A kind of closed liquid metal secondary circuit cooling system of high-power chip |
| CN111194161A (en) * | 2020-02-28 | 2020-05-22 | 维沃移动通信(重庆)有限公司 | Liquid cooling device and electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20140924 Granted publication date: 20060215 |