CN2756388Y - Polishing liquid supply controller - Google Patents
Polishing liquid supply controller Download PDFInfo
- Publication number
- CN2756388Y CN2756388Y CN 200420094553 CN200420094553U CN2756388Y CN 2756388 Y CN2756388 Y CN 2756388Y CN 200420094553 CN200420094553 CN 200420094553 CN 200420094553 U CN200420094553 U CN 200420094553U CN 2756388 Y CN2756388 Y CN 2756388Y
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- CN
- China
- Prior art keywords
- polishing
- supply controller
- pump
- flow
- transparent conductive
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- Expired - Lifetime
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Abstract
The utility model relates to a polishing solution supply controller for a polishing unit, particularly to a polishing solution supply controller for a polishing unit of a transparent conductive glass base plate and the control over the flow quantity supply of polishing solution during the buffing process of a transparent conductive film on the transparent conductive glass base plate which uses the polishing solution supply controller. A stirrer of the polishing liquid supply controller is provided with a container which is connected with a flow pump through a solution supply pipe, and the flow pump is provided with a flow control pump which is a peristaltic pump with a flow control function. The stirrer is a magnetic stirrer. Compared with the prior art, on the premise that the polishing quality is satisfied, the utility model can provide a reliable control condition to decrease the consumption of the polishing solution maximally and lower the polishing cost. The polishing solution supply controller uses the disposable polishing solution to polish the transparent conductive film on the transparent conductive glass, so the roughness degree of the conductive film surface can be controlled to be not more than 1 nm.
Description
Technical field
The utility model relates to a kind of polishing fluid apparatus for controlling of supply of polissoir, be particularly related to the polishing fluid apparatus for controlling of supply of the polissoir of transparent conducting glass substrate, and the control that the polishing process polishing fluid flow of nesa coating on the transparent conducting glass substrate that uses this polishing fluid apparatus for controlling of supply is supplied with.
Background technology
The well-illuminated conducting film that forms on glass substrate is used as the anode of flat-panel monitors such as LCD, PDP, OLED usually.And transmitance height, the materials that resistance is low of using in the well-illuminated conducting film, in this type of material, that generally adopt is indium oxide (In. more
2O
3) in added the tin indium oxide (Indium Tin Oxide: abbreviate ITO as) of tin (Sn).Requirement according to different display devices, what have need polish glass substrate before plating ITO, and the face to behind the plating ITO that has polishes, and the latter is different from the former: the former polishes liking base plate glass, require to improve the flatness of glass, polishing tolerance wants tens to the hundreds of nanometer; And latter polishing to as if the ITO rete, can not jettisoning too many, purpose be in order to reduce the roughness of rete, polishing tolerance only is several to dozens of nanometers.The former is not strict especially in the supply of polishing fluid; And the latter is in polishing process, to the particle diameter of polishing powder, the concentration of polishing fluid, temperature, flow should have strict control, and small difference may cause big difference, be difficult to control required uniformity of volume production and repeatability, be necessary to select certain polishing fluid feedway.
Though current polishing machine itself is with the polishing fluid feedway, also can carry out certain control to flow, but only can accomplish qualitative control, be difficult to accomplish quantitative control, more difficult whole glossing is monitored, soft polishing repeatability and inhomogeneity requirement can't be satisfied, the demand of volume production can't be satisfied.
Summary of the invention
The purpose of this utility model is to provide a kind of polishing fluid apparatus for controlling of supply that can accurately control the polishing fluid flow of acyclic use.
For the utility model that achieves the above object adopts following technical scheme: the polishing fluid apparatus for controlling of supply, it is provided with container on agitator, and container is connected with flow pump through feed pipe, and described flow pump is the flow control pump that is provided with flow control function.
Flow control pump described in the utility model is a peristaltic pump.
Agitator described in the utility model is a magnetic stirring apparatus.
The utility model compared with prior art can satisfy under the prerequisite of quality of finish, for the consumption that reduces polishing fluid to greatest extent provides reliable controlled condition, reduces the polishing cost.Throw nesa coating on the transparent conducting glass with disposable polishing fluid, with described conducting film Roughness Surface on Control at Ra≤1nm.
Description of drawings
Fig. 1 is a structural representation of the present utility model.
The specific embodiment
Embodiment is described in further detail the utility model below in conjunction with accompanying drawing.
As shown in Figure 1, polishing fluid apparatus for controlling of supply of the present utility model, constitute by magnetic stirring apparatus 1, flow control pump 2, container 3 and feed pipe 4, magnetic stirring apparatus 1 is provided with container 3, container 3 is connected with flow pump 2 through feed pipe 4, and this flow pump 2 is for being provided with the flow control pump of flow control mechanism.In the present embodiment, container 3 is a Plastic Drum, and feed pipe 4 is a rubber tube, and flow control pump is a peristaltic pump.
The utility model covers at peristaltic pump and is provided with pressure control lever 12 (vertically part), and in pressure control lever 12, spring is set, described feed pipe 4 is located in the middle of pressure control lever 12 and the spring, by the knob on the rotation pressure control lever 12, can regulate being pressed in the pressure of the rubber tube 4 below the pressure control lever, three flow-control buttons 13 that cooperate pressure control lever 12 the right, can between 01 to 99 ml/min, regulate the flow in the rubber tube arbitrarily, thereby can quantitatively control the polishing fluid quantity delivered.
The utility model and polishing machine are used, and have well finished the polishing fluid weight feed of polishing process and monitoring in real time.
Magnetic stirring apparatus of the present utility model 1 is directly powered by AC power, rotating speed is adjustable, can guarantee the abundant mixing of polishing powder polishing fluid, simultaneously also can be to its heating of carrying out maximum temperature to 70 ℃, satisfy in the polishing process temperature requirement to the polishing fluid of different glossings.
Claims (3)
1. polishing fluid apparatus for controlling of supply, it is provided with container (3) on agitator (1), and container (3) is connected with flow pump (2) through feed pipe (4), it is characterized in that: described flow pump (2) is for being provided with the flow control pump of flow control function.
2. polishing fluid apparatus for controlling of supply according to claim 1 is characterized in that: described flow control pump is a peristaltic pump.
3. polishing fluid apparatus for controlling of supply according to claim 1 is characterized in that: described agitator is a magnetic stirring apparatus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420094553 CN2756388Y (en) | 2004-10-29 | 2004-10-29 | Polishing liquid supply controller |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420094553 CN2756388Y (en) | 2004-10-29 | 2004-10-29 | Polishing liquid supply controller |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2756388Y true CN2756388Y (en) | 2006-02-08 |
Family
ID=35964776
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200420094553 Expired - Lifetime CN2756388Y (en) | 2004-10-29 | 2004-10-29 | Polishing liquid supply controller |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2756388Y (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103252724A (en) * | 2013-05-15 | 2013-08-21 | 中国科学院上海光学精密机械研究所 | Automatic polishing liquid dropwise adding device of annular polishing |
| CN104765295A (en) * | 2015-03-26 | 2015-07-08 | 湖南标立通用科技有限公司 | Control device of trace addition instrument and trace addition instrument |
| CN104858726A (en) * | 2015-01-23 | 2015-08-26 | 嘉兴学院 | Device and method for ultra precise polishing of double-frequency acoustic cavitation nanofluid under magnetic control action |
| CN105382678A (en) * | 2015-10-29 | 2016-03-09 | 江苏吉星新材料有限公司 | Polishing device and method of sapphire wafer |
| CN105437082A (en) * | 2014-07-18 | 2016-03-30 | 中国科学院微电子研究所 | Polishing solution stirring device and method |
| CN106737087A (en) * | 2017-01-12 | 2017-05-31 | 重庆四联特种装备材料有限公司 | Finlling automatically system |
| CN109822461A (en) * | 2019-04-11 | 2019-05-31 | 烟台工程职业技术学院(烟台市技师学院) | A kind of metal plate mirror finish polishing fluid automatic supplier |
-
2004
- 2004-10-29 CN CN 200420094553 patent/CN2756388Y/en not_active Expired - Lifetime
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103252724A (en) * | 2013-05-15 | 2013-08-21 | 中国科学院上海光学精密机械研究所 | Automatic polishing liquid dropwise adding device of annular polishing |
| CN105437082A (en) * | 2014-07-18 | 2016-03-30 | 中国科学院微电子研究所 | Polishing solution stirring device and method |
| CN104858726A (en) * | 2015-01-23 | 2015-08-26 | 嘉兴学院 | Device and method for ultra precise polishing of double-frequency acoustic cavitation nanofluid under magnetic control action |
| CN104765295A (en) * | 2015-03-26 | 2015-07-08 | 湖南标立通用科技有限公司 | Control device of trace addition instrument and trace addition instrument |
| CN104765295B (en) * | 2015-03-26 | 2017-07-07 | 湖南标立通用科技有限公司 | A kind of micro addition instrument control device and micro addition instrument |
| CN105382678A (en) * | 2015-10-29 | 2016-03-09 | 江苏吉星新材料有限公司 | Polishing device and method of sapphire wafer |
| CN106737087A (en) * | 2017-01-12 | 2017-05-31 | 重庆四联特种装备材料有限公司 | Finlling automatically system |
| CN106737087B (en) * | 2017-01-12 | 2019-06-04 | 重庆四联特种装备材料有限公司 | Finlling automatically system |
| CN109822461A (en) * | 2019-04-11 | 2019-05-31 | 烟台工程职业技术学院(烟台市技师学院) | A kind of metal plate mirror finish polishing fluid automatic supplier |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20141029 Granted publication date: 20060208 |