CN2754311Y - Liquid crystal display device and flexible printed circuit board hot-pressing connection structure - Google Patents
Liquid crystal display device and flexible printed circuit board hot-pressing connection structure Download PDFInfo
- Publication number
- CN2754311Y CN2754311Y CN 200420105467 CN200420105467U CN2754311Y CN 2754311 Y CN2754311 Y CN 2754311Y CN 200420105467 CN200420105467 CN 200420105467 CN 200420105467 U CN200420105467 U CN 200420105467U CN 2754311 Y CN2754311 Y CN 2754311Y
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- lcd
- hot pressing
- fpc
- circuit board
- liquid crystal
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Abstract
The utility model relates to a hot pressing connection structure of a liquid crystal display and a flexible printed circuit board, and pins having the same width of the liquid crystal display are in one-to-one correspondence with golden fingers of the flexible printed circuit board. The utility model is characterized in that the pins of the liquid crystal display are in hot pressing connection with the golden fingers of the flexible printed circuit board through anisotropy electricity conducting glue films, and the space between the adjacent golden fingers of the flexible printed circuit board is 0.9980 to 0.9982 times of the space between the adjacent pins of the liquid crystal display. Aiming at the phenomenon of heat expansion and cold contraction of transverse size in the process of hot pressing of the FPC and namely the detect of a great hot pressing contraction percentage, the utility model proposes corresponding prosthesis measures that the space between the adjacent golden fingers of the PFC is slightly smaller than the sapce between the adjacent pins of the LCD; even some assembling tolerances exist, the problem that the FPC and circuits are short-circuited or are not switched into conduction because of hot pressing expansion of the FPC is effectively overcome. Thus, the communication performance of the circuits is enhanced, the LCD can be ensured to work normally, the fine percent of products is obviously increased and the repeatability of design work is reduced.
Description
Technical field
The utility model relates to based on liquid crystal and is used for the non-electric heating welding that the device of light intensity, color, phase place, polarization or direction or device from the control arbitrary source utilize forcing press, especially relates to the hot pressing syndeton of a kind of LCD and flexible print circuit board.
Background technology
Existing such as mobile phone, notebook computer, personal digital assistant various portable type electronic products such as (Personal Digital Assistant are called for short PDA), nearly all be as display floater with LCD (Liquid Crystal Display is called for short LCD).The connected mode of LCD pin mainly contains winding and engages (Tape AutomatedBonding is called for short TAB), glass flip chip encapsulation (Chip on Glass is called for short COG) and crystal grain Soft film joint (Chip-on-film is called for short COF) three kinds automatically, based on the consideration on the cost, in general, small size LCD is at present with the occupation rate of market maximum of COG, and general large-sized LCD adopts TAB mostly, and having as for high function, higher-priced LCD market day by day increases the trend of using COF.And but LCD is to be juncture with golden projection with thin spaceization (Fine Pitch) characteristic, because the high-melting-point of gold is difficult for using traditional welding technology, therefore mainly utilize anisotropic conductive film (Anisotropic Conductive Film is called for short ACF) to carry out bonding, use the ACF adhesive technology have operating temperature low, can reach high structure dress density, thin space requirement and simplify advantages such as technique for sticking, meet the leadless environment-friendly requirement.Yet the flexible print circuit board of adapted (Flexible Printed Circuit board is called for short FPC) has the phenomenon of expanding with heat and contract with cold in hot pressing, and it can form deviation when being connected with LCD hot pressing, and Fig. 1,2 illustrates the spacing P of the adjacent golden finger of FPC respectively
FCross less than, greater than the spacing P of LCD adjacent leads
LSyndeton, syndeton shown in Figure 1 is ignored the FPC expanded by heating, cause FPC and and then the line short that forms, the contact-making surface of FPC and LCD is too small in the syndeton shown in Figure 2, be unfavorable for FPC and and then the line conduction that forms, even not conducting appears, all make the LCD cisco unity malfunction.Among Fig. 1,21 is the LCD pin, the 2nd, and FPC golden finger, the 3rd, the contact-making surface of LCD pin and FPC golden finger.Have not yet to see the method that effective minimizing and control FPC hot pressing swelling are exerted an influence.
Summary of the invention
Technical problem to be solved in the utility model is to remedy the deficiencies in the prior art, the hot pressing syndeton of a kind of LCD and flexible print circuit board is proposed, this LCD pin adopts ACF and FPC hot pressing syndeton, can effectively overcome FPC hot pressing swelling cause FPC and and then the line short or the not conducting that form, strengthen the connectedness of circuit.
For the hot pressing syndeton of LCD of the present utility model and flexible print circuit board, above-mentioned technical problem is solved like this:
The hot pressing syndeton of this LCD LCD and flexible print circuit board FPC, LCD pin and FPC golden finger that width equates connect one to one.
The characteristics of the hot pressing syndeton of this LCD LCD and flexible print circuit board FPC are:
The LCD pin is connected with the hot pressing of FPC golden finger by ACF, the spacing of the adjacent golden finger of FPC is 0.9980～0.9982 times of spacing of LCD adjacent leads, its base material lateral dimension can expand and increase and material behavior that longitudinal size remains unchanged when being heated to adapt to FPC, effectively overcome FPC hot pressing swelling cause FPC and and then the line short or the not conducting that form, strengthen the connectedness of circuit.
The hot pressing syndeton of above-mentioned LCD LCD and flexible print circuit board FPC, relative dimensions satisfies following equation:
P
F＝(0.9980～0.9982)P
L …………(1)；
W
F＝W
L …………(2)。
In the formula (1):
P
F: the spacing of the adjacent golden finger of FPC;
P
L: the spacing of LCD adjacent leads;
In the formula (2):
W
F: FPC golden finger width;
W
L: the LCD pin widths.
The concrete manufacture method of the hot pressing syndeton of this LCD LCD and flexible print circuit board FPC has following steps successively:
Determine LCD pin number, pin widths W earlier
LSpacing P with adjacent leads
L, these data can obtain from LCD engineering drawing or supplier's product introduction;
Then, select to be fit to the FPC material of adapted, determine FPC golden finger width W
F=W
L
The ACF material of selecting the LCD pin to be connected with FPC hot pressing again to adopt, the technological parameter that pulse power thermal pressure welding equipment is suitable for, described technological parameter comprise that hot pressing temperature is that 175 ± 10 ℃, hot pressing time are 10 ± 0.2 seconds, and pressure is 0.05～0.3MPa;
At last, according to equation P
F=(0.9980～0.9982) P
L, determine the spacing P of the adjacent golden finger of FPC
FAfter carry out FPC thermo-compressed encapsulation.
The hot pressing syndeton of LCD of the present utility model and flexible print circuit board, at FPC the lateral dimension phenomenon of expanding with heat and contract with cold is arranged in hot pressing, the defective that promptly has big hot pressing shrinkage, propose to remedy accordingly measure, the spacing of the adjacent golden finger of requirement FPC is slightly less than the spacing of LCD adjacent leads, even there are some assembling tolerances, also can overcome effectively FPC hot pressing swelling cause FPC and and then the line short or the not conducting that form, strengthen the connectedness of circuit, guarantee the LCD operate as normal, improve the acceptance rate of product significantly, reduce the repeatability of design work.Hot pressing syndeton of the present utility model be applicable to pin widths be the above LCD of 0.075mm with flexible print circuit board between be connected.
Description of drawings
Contrast accompanying drawing below and the utility model is made further instruction in conjunction with embodiment.
Fig. 1 is that the spacing of the adjacent golden finger of FPC is crossed the hot pressing syndeton schematic diagram less than the spacing of LCD adjacent leads;
Fig. 2 is the hot pressing syndeton schematic diagram of the spacing of the adjacent golden finger of FPC greater than the spacing of LCD adjacent leads;
Fig. 3 is the hot pressing syndeton schematic diagram of LCD of the present utility model and FPC.
Embodiment:
Mobile telephone LCD of this embodiment and FPC hot pressing syndeton, as shown in Figure 3.Among Fig. 31 is LCD pin in one line, the 2nd, and with the FPC golden finger of the corresponding one by one hot pressing connection of LCD pin, the 3rd, the contact-making surface of LCD pin and FPC golden finger.FPC golden finger 2 width W
FWith LCD pin 1 width W
LRatio satisfy equation W
F=W
L, the spacing P of the adjacent golden finger of FPC
FSpacing P with the LCD adjacent leads
LRatio satisfy equation P
F=0.9981P
L
The manufacture method of above-mentioned hot pressing syndeton has following steps successively:
The quantity of determining earlier mobile telephone LCD pin 1 is 75, the width W of pin 1
LSpacing P for 0.1mm, adjacent leads
LBe 0.2mm, from mobile telephone LCD engineering drawing or supplier's product introduction, can obtain these data;
Then, select to be fit to the FPC material of adapted, determine FPC golden finger 2 width W
F=W
L=0.1mm;
Determine that again mobile telephone LCD pin 1 is connected with FPC hot pressing, adopting the model of HIT's product is the ACF material of AC7206U, and Korea S's star advances the pulse power thermal pressure welding equipment of company's product, and the applicable craft parameter of this thermal pressure welding equipment is as follows; Heating-up temperature is that 175 ℃, heating time are 10 seconds, and pressure is 0.2MPa;
At last, determine the spacing P of adjacent golden finger
F=0.9981P
LCarry out the encapsulation of FPC thermo-compressed behind the=0.19962mm.
Adopt the hot pressing syndeton of above-mentioned LCD and FPC, FPC golden finger 2 is to connect corresponding one by one staggering mutually with LCD pin 1, like this when the FPC expanded by heating, even there are some assembling tolerances, can not take place yet FPC and and then the line short that forms, guarantee LCD energy operate as normal, improve the acceptance rate of product significantly, reduce the repeatability of design work.
Above content be in conjunction with concrete preferred implementation to further describing that the utility model is done, can not assert that concrete enforcement of the present utility model is confined to these explanations.For the utility model person of an ordinary skill in the technical field; under the prerequisite that does not break away from the utility model design; can also make some simple deduction or replace, all should be considered as belonging to the scope of patent protection that the utility model is determined by claims of being submitted to.
Claims (1)
1. the hot pressing syndeton of LCD and flexible print circuit board, LCD pin and flexible print circuit board golden finger that width equates connect one to one, and it is characterized in that:
The LCD pin is connected with the hot pressing of flexible print circuit board golden finger by anisotropic conductive film, and the spacing of the adjacent golden finger of flexible print circuit board is 0.9980～0.9982 times of spacing of LCD adjacent leads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420105467 CN2754311Y (en) | 2004-12-01 | 2004-12-01 | Liquid crystal display device and flexible printed circuit board hot-pressing connection structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420105467 CN2754311Y (en) | 2004-12-01 | 2004-12-01 | Liquid crystal display device and flexible printed circuit board hot-pressing connection structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2754311Y true CN2754311Y (en) | 2006-01-25 |
Family
ID=35926418
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200420105467 Expired - Lifetime CN2754311Y (en) | 2004-12-01 | 2004-12-01 | Liquid crystal display device and flexible printed circuit board hot-pressing connection structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2754311Y (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102271457A (en) * | 2011-07-19 | 2011-12-07 | 南京中电熊猫液晶显示科技有限公司 | Display device |
| CN101521997B (en) * | 2008-02-29 | 2012-02-08 | 中兴通讯股份有限公司 | Method for processing grading connecting finger |
| WO2013170463A1 (en) * | 2012-05-16 | 2013-11-21 | 深圳市华星光电技术有限公司 | Flexible circuit board, chip on film, and manufacturing method |
| CN103677108A (en) * | 2012-09-25 | 2014-03-26 | 上海信颐电子科技有限公司 | External computer main board |
| CN104144576A (en) * | 2013-05-09 | 2014-11-12 | 三星显示有限公司 | Method of bonding flexible printed circuit board (FPCB), panel-FPCB assembly, and display device including the same |
| US9167687B2 (en) | 2012-05-16 | 2015-10-20 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Flexible printed circuit board, chip on film and manufacturing method |
| WO2016070493A1 (en) * | 2014-11-05 | 2016-05-12 | 深圳市华星光电技术有限公司 | Lead structure and method for preventing acf adhesive from overflowing to display area |
| CN107203075A (en) * | 2017-05-22 | 2017-09-26 | 京东方科技集团股份有限公司 | Touch display panel and liquid crystal display |
| CN107884963A (en) * | 2017-10-10 | 2018-04-06 | 惠科股份有限公司 | The preparation method and display device of circuit board |
| CN108495455A (en) * | 2018-03-23 | 2018-09-04 | 武汉华星光电半导体显示技术有限公司 | Connection component and display device |
| CN111145643A (en) * | 2019-12-16 | 2020-05-12 | 云谷（固安）科技有限公司 | Bonding method and display device |
-
2004
- 2004-12-01 CN CN 200420105467 patent/CN2754311Y/en not_active Expired - Lifetime
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101521997B (en) * | 2008-02-29 | 2012-02-08 | 中兴通讯股份有限公司 | Method for processing grading connecting finger |
| CN102271457A (en) * | 2011-07-19 | 2011-12-07 | 南京中电熊猫液晶显示科技有限公司 | Display device |
| WO2013170463A1 (en) * | 2012-05-16 | 2013-11-21 | 深圳市华星光电技术有限公司 | Flexible circuit board, chip on film, and manufacturing method |
| US9167687B2 (en) | 2012-05-16 | 2015-10-20 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Flexible printed circuit board, chip on film and manufacturing method |
| CN103677108A (en) * | 2012-09-25 | 2014-03-26 | 上海信颐电子科技有限公司 | External computer main board |
| CN104144576B (en) * | 2013-05-09 | 2018-06-29 | 三星显示有限公司 | Method, panel-FPCB components with reference to FPCB and include its display device |
| CN104144576A (en) * | 2013-05-09 | 2014-11-12 | 三星显示有限公司 | Method of bonding flexible printed circuit board (FPCB), panel-FPCB assembly, and display device including the same |
| WO2016070493A1 (en) * | 2014-11-05 | 2016-05-12 | 深圳市华星光电技术有限公司 | Lead structure and method for preventing acf adhesive from overflowing to display area |
| CN107203075B (en) * | 2017-05-22 | 2020-02-07 | 京东方科技集团股份有限公司 | Touch display panel and liquid crystal display device |
| CN107203075A (en) * | 2017-05-22 | 2017-09-26 | 京东方科技集团股份有限公司 | Touch display panel and liquid crystal display |
| CN107884963A (en) * | 2017-10-10 | 2018-04-06 | 惠科股份有限公司 | The preparation method and display device of circuit board |
| WO2019071778A1 (en) * | 2017-10-10 | 2019-04-18 | 惠科股份有限公司 | Method for preparing circuit board and display device |
| CN107884963B (en) * | 2017-10-10 | 2020-08-04 | 惠科股份有限公司 | Manufacturing method of circuit board and display device |
| US11178775B2 (en) | 2017-10-10 | 2021-11-16 | HKC Corporation Limited | Manufacturing method of circuit board and display device |
| CN108495455A (en) * | 2018-03-23 | 2018-09-04 | 武汉华星光电半导体显示技术有限公司 | Connection component and display device |
| CN111145643A (en) * | 2019-12-16 | 2020-05-12 | 云谷（固安）科技有限公司 | Bonding method and display device |
| CN111145643B (en) * | 2019-12-16 | 2022-05-17 | 云谷（固安）科技有限公司 | Bonding method and display device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20141201 Granted publication date: 20060125 |