CN111145643A - Bonding method and display device - Google Patents
Bonding method and display device Download PDFInfo
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- CN111145643A CN111145643A CN201911296794.XA CN201911296794A CN111145643A CN 111145643 A CN111145643 A CN 111145643A CN 201911296794 A CN201911296794 A CN 201911296794A CN 111145643 A CN111145643 A CN 111145643A
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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Abstract
The invention provides a bonding method and a display device, wherein a first bonding assembly and a second bonding assembly are provided, the two bonding assemblies have different expansion coefficients, each bonding assembly comprises a plurality of bonding pads, and the distance between the adjacent bonding pads of the bonding assembly with the larger expansion coefficient is smaller than the distance between the adjacent bonding pads of the bonding assembly with the smaller expansion coefficient and to be electrically connected with the bonding assemblies to be pressed. In the preparation step before bonding, the distance between two bonding pads is set to a certain difference value, so that the dislocation of the two bonding pads caused by different expansion amounts is eliminated, and the bonding reliability is ensured.
Description
Technical Field
The invention relates to the technical field of display, in particular to a bonding method and a display device.
Background
In the field of display screen manufacturing, often can involve the bonding technique, need heat the bonding subassembly in the bonding manufacture craft, because different bonding subassemblies adopt different materials usually, so the coefficient of thermal expansion also can have the difference, leads to having the dislocation between the pad of different bonding subassemblies in the bonding craft, influences and binds the yield.
Therefore, how to reduce the occurrence of the dislocation phenomenon caused by the difference of the thermal expansion coefficients in the bonding process is a technical problem to be solved in the field.
Disclosure of Invention
In view of this, the present invention provides a bonding method and a display device, which solve the technical problem of misalignment between pads of different bonding components in a bonding process.
In order to solve the above technical problem, in a first aspect, the present invention provides a bonding method, including: a preparation step, namely providing a first bonding assembly and a second bonding assembly, wherein the first bonding assembly comprises a plurality of first bonding pads, the second bonding assembly comprises a plurality of second bonding pads, the distance between the adjacent first bonding pads is smaller than the distance between the adjacent second bonding pads, and the expansion coefficient of the first bonding assembly is larger than that of the second bonding assembly;
heating, namely heating the first bonding assembly and the second bonding assembly, wherein the first bonding assembly and the second bonding assembly are heated to expand, and the distance between the adjacent first bonding pads is equal to the distance between the second bonding pads to be in press-fit electrical connection with the first bonding pads;
and a pressing step, wherein the first bonding assembly and the second bonding assembly are pressed to enable the first bonding pad to be electrically connected with the second bonding pad one by one.
Optionally, the first bonding component includes a pressing region, the pressing region is an axisymmetric pattern, and the plurality of first pads and the plurality of second pads are all symmetrically disposed with respect to the symmetry axis of the pressing region.
Optionally, in the preparing step, the plurality of first pads and the plurality of second pads are arranged at equal intervals.
Optionally, a straight line where the extending directions of the plurality of first pads are located has an intersection with the symmetry axis;
optionally, a straight line along which the plurality of first pads extend intersects the symmetry axis at a point.
Optionally, an included angle between a straight line of the extending directions of the first pads and the symmetry axis is θ, and θ is greater than or equal to 18 ° and less than or equal to 22 °.
Optionally, the first bonding component and the second bonding component are each independently selected from a glass substrate, a flexible substrate, a chip on film, and a flexible circuit board.
Optionally, in the preparing step, a third bonding assembly is further provided, where the third bonding assembly includes a plurality of third pads, the second bonding assembly further includes a plurality of fourth pads, the second pads and the fourth pads are disposed at two opposite ends of the second bonding assembly, a distance between adjacent second pads is equal to a distance between adjacent fourth pads, a distance between adjacent fourth pads is smaller than a distance between adjacent third pads, and an expansion coefficient of the first bonding assembly is greater than an expansion coefficient of the second bonding assembly and greater than an expansion coefficient of the third bonding assembly;
in the heating step, the third bonding assembly is heated, the third bonding assembly expands when heated, and the distance between the adjacent third bonding pads is equal to the distance between the fourth bonding pads to be pressed and electrically connected with the third bonding pads;
and in the pressing step, pressing the other end of the second bonding assembly and the third bonding assembly to enable the third bonding pad to be electrically connected with the fourth bonding pad one by one.
Optionally, the first bonding component includes a pressing region, the pressing region is an axisymmetric pattern, the plurality of first pads and the plurality of second pads are all arranged corresponding to the axisymmetric pattern of the pressing region, and the plurality of third pads and the plurality of fourth pads are all arranged corresponding to the axisymmetric pattern of the pressing region.
Optionally, the first bonding assembly is a flexible circuit board, the second bonding assembly is a chip on film, and the third bonding assembly is a display panel.
Based on the same inventive concept, in a second aspect, the invention provides a display device, which includes a display panel and a display module, wherein the display panel and the display module are pressed together by using the bonding method according to any one of claims 1 to 6.
Compared with the prior art, the bonding method provided by the invention at least realizes the following beneficial effects:
according to the invention, a first bonding assembly and a second bonding assembly are provided, the first bonding assembly comprises a plurality of first bonding pads, the second bonding assembly comprises a plurality of second bonding pads, the distance between the adjacent first bonding pads is smaller than the distance between the adjacent second bonding pads, and the expansion coefficient of the first bonding assembly is larger than that of the second bonding assembly. The first bonding assembly and the second bonding assembly are heated, the first bonding assembly and the second bonding assembly are heated to expand, and the distance between the adjacent first bonding pads is equal to the distance between the second bonding pads to be electrically connected with the bonding pad. And pressing the first bonding assembly and the second bonding assembly to electrically connect the first bonding pad and the second bonding pad one by one. Because before the heating, the distance of adjacent first pad is less than the distance of adjacent second pad, after first nation decides the subassembly and the heating of second nation decides the subassembly, first nation decides subassembly and the thermal expansion of second nation decides the subassembly, the thermal expansion coefficient of first nation decides the subassembly to be greater than the thermal expansion coefficient of second nation decides the subassembly, the distance increase of adjacent first pad is greater than rather than the distance increase between the second pad of treating the pressfitting electricity and being connected, this kind of change makes after the heating, the distance between the adjacent first pad reaches the equivalence rather than the distance between the second pad of treating the pressfitting electricity and being connected, thereby the off normal between the pad that the thermal expansion coefficient difference leads to is eliminated. When the first bonding component and the second bonding component are pressed, the first bonding pad is electrically connected with the second bonding pad one by one, so that the bonding reliability can be ensured.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.
FIG. 1 is a flowchart illustrating a bonding method according to an embodiment.
FIG. 2 is a diagram of a bond pad design, according to one embodiment.
FIG. 3 is a diagram of a bond pad design, according to an embodiment.
FIG. 4 is a diagram of a bond pad design, according to an embodiment.
FIG. 5 is a diagram of a bond pad design, according to an embodiment.
FIG. 6 is a diagram of a bond pad design, according to an embodiment.
FIG. 7 is a flowchart illustrating a bonding method according to an embodiment.
FIG. 8 is a diagram of a bond pad design, according to an embodiment.
FIG. 9 is a diagram of a bond pad design, according to an embodiment.
The reference numbers illustrate:
10-a first bonding assembly; 11-a first pad; 20-a second bonding assembly; 21-a second pad; 30-a third bonding assembly; 31-a third pad; 41-fourth pad; a, pressing an area; an L-axis of symmetry.
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: unless specifically stated otherwise, the order of steps, relative positions of components, shapes, sizes, proportions, angles, numbers, and the like set forth in these embodiments are merely examples, and do not limit the scope of the invention.
Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.
In all embodiments shown and discussed herein, any particular value should be construed as exemplary only and not as a display. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
As described in the background art, in the field of manufacturing of display screens, a bonding technology is often involved, a bonding assembly needs to be heated in a bonding manufacturing process, different bonding assemblies usually adopt different materials, so that thermal expansion coefficients can also be different, and a bonding pad of different bonding assemblies in a bonding process is dislocated, so that the bonding yield is affected. Based on this, the inventor of the present invention provides a bonding method, please refer to fig. 1 and fig. 2a simultaneously, first providing a first bonding assembly 10 and a second bonding assembly 20, where the first bonding assembly 10 includes a plurality of first pads 11, the second bonding assembly 20 includes a plurality of second pads 21, a distance between any two adjacent first pads 11 is smaller than a distance between any two adjacent second pads 21, and an expansion coefficient of the first bonding assembly 10 is larger than an expansion coefficient of the second bonding assembly 20.
Note that the expansion coefficient here is a thermal expansion coefficient. Is the dimensional change of the bonding components caused by the expansion and contraction generated by the temperature change, the thermal expansion coefficients of the bonding components made of different materials are different, and the unit of the thermal expansion coefficient is 1/degree centigrade.
With continued reference to fig. 1 and 2b, the first bonding assembly 10 and the second bonding assembly 20 are heated to expand, and since the expansion coefficient of the first bonding assembly 10 is greater than that of the second bonding assembly 20, after the two bonding assemblies are heated, the expansion amount of the first bonding assembly 10 is greater than that of the second bonding assembly 20, and at this time, the distance between the adjacent first bonding pads 11 is equal to the distance between the second bonding pads 21 electrically connected to be bonded.
The first bonding assembly 10 and the second bonding assembly 20 are pressed to electrically connect the first bonding pads 11 and the second bonding pads 21 one by one. It should be noted that the distance between two adjacent first pads and the distance between two adjacent second pads both refer to the distance between the same side of two adjacent pads. According to the bonding method provided by the embodiment, before the bonding process, the distance between the bonding pads of the bonding assembly with a large expansion coefficient is reduced, and the expansion amount is reserved, so that the distance between the bonding pads of the other bonding assembly after expansion is equal, the phenomenon of bonding deviation is relieved to a certain extent, and the reliability of bonding is ensured.
In another embodiment of the present invention, referring to fig. 3a and 3b, a bonding method is provided, in which a first bonding assembly 10 includes a bonding area a, the bonding area a is an axisymmetric pattern, a plurality of first pads 11 are symmetrically disposed with respect to a symmetry axis L of the bonding area a, and a plurality of second pads 21 are symmetrically disposed with respect to the symmetry axis L of the bonding area a. In the bonding process, the bonding component can be heated, and ideally, the bonding area of the same bonding component is made of the same material, the expansion is uniform, the expansion displacement of the center of the bonding component is the minimum, and the expansion displacement is accumulated the farther away from the center. Therefore, when two bonding assemblies with different expansion coefficients are bonded, the alignment offset of each bonding pad is increasingly larger along the direction far away from the center of a plurality of bonding pads of the bonding assembly with the large expansion coefficient. The stitching area A of the first bonding component 10 with large thermal expansion coefficient is set to be an axisymmetric graph, so that the initial distance between the bonding pads of the two bonding components can be set according to the alignment offset of the different bonding pads after thermal expansion. The risk of the nation of the different nation of coefficient of expansion of can avoiding the nation of the different nation of coefficient of expansion to counterpoint skew to a certain extent, has especially solved the bad problem of both ends counterpoint when different nation decides the subassembly nation.
In another embodiment of the present invention, referring to fig. 4a, in a preparation step before bonding, a plurality of first pads 11 are disposed at equal intervals, and a plurality of second pads 21 are disposed at equal intervals. Taking an ideal situation as an example to illustrate, the expansion coefficient of the first bonding assembly is larger than that of the second bonding assembly, in the preparation step before bonding, the plurality of first pads 11 are arranged at equal intervals, the plurality of second pads 21 are arranged at equal intervals, and the distance between every two adjacent first pads is smaller than the distance between the two corresponding second pads. When two bonding assemblies heat like this, the expansion displacement volume between the first pad of first bonding assembly is greater than the expansion displacement volume between the second pad of second bonding assembly, and the difference of expansion displacement volume just in time offsets through the difference of two kinds of pad intervals before the bonding, like figure 4 b. The bonding method provided by the embodiment sets the difference value through the intervals of different bonding pads in advance, can offset the bonding pad offset difference value caused by the expansion of different bonding assemblies to a certain extent, enables the relative offset between the bonding pads electrically connected in different bonding assemblies to be within an error allowable range, solves the problem of poor bonding caused by thermal expansion to a certain extent, and improves the bonding reliability.
In another embodiment of the present invention, referring to fig. 5a and 5b, a bonding method is provided, in which a first bonding element 10 includes a plurality of first bonding pads 11, a first bonding element 20 includes a bonding area a, the bonding area a is an axisymmetric pattern, and the plurality of first bonding pads 11 are symmetrically disposed with respect to a symmetry axis L of the bonding area a. The straight line along which the plurality of first pads 11 extend intersects the axis of symmetry L, that is, the plurality of first pads 11 are symmetrically disposed along the left and right sides of the axis of symmetry L and are disposed obliquely with respect to the axis of symmetry L. The second bonding assembly 20 includes a plurality of second pads 21, and the plurality of second pads 21 are also symmetrically disposed with respect to the axis of symmetry of the stitching region a. The inclination angle of the second pads 21 with respect to the axis of symmetry L is kept identical to the corresponding first pads.
The first bonding pads are symmetrically arranged relative to the symmetry axis, the second bonding pads are symmetrically arranged relative to the symmetry axis, the first bonding pads are arranged in a shape inclined relative to the symmetry axis, and the corresponding second bonding pads are also arranged in a corresponding shape inclined relative to the symmetry axis, so that the bonding reliability is improved, the freedom of the arrangement positions of the bonding pads is improved, the arrangement mode of the bonding pads is more free, and the requirement of a bonding pad preparation process is reduced.
In another embodiment of the present invention, referring to fig. 6a and 6b, a first bonding element 10 includes a plurality of first bonding pads 11, the first bonding element 10 includes a bonding area a, the bonding area a is an axisymmetric pattern, and the plurality of first bonding pads 11 are symmetrically disposed with respect to a symmetry axis of the bonding area a. The straight line along which the plurality of first pads 11 extend intersects the axis of symmetry at a point. The first pads 11 are symmetrically arranged relative to the symmetry axis L, the second pads 21 are symmetrically arranged relative to the symmetry axis L, and the first pads are arranged in a shape inclined relative to the symmetry axis and the corresponding second pads are also arranged in a shape inclined relative to the symmetry axis, so that bonding reliability is improved, freedom of pad arrangement positions is improved, pad arrangement modes are more free, and requirements of pad preparation processes are reduced. Moreover, the straight line of the extending direction of the first bonding pads is intersected with the symmetry axis at one point, if the first bonding assembly and the second bonding assembly are heated and expanded, the adjacent first bonding pads and the second bonding pads correspondingly connected with the adjacent first bonding pads are staggered, and the relative displacement in the Y direction can be carried out on the two bonding assemblies before the bonding so as to weaken the influence of the staggered position in the X direction on the bonding reliability.
In one embodiment of the invention, the included angle between the straight line of the extending direction of the first bonding pad and the symmetry axis is theta, theta is more than or equal to 18 degrees and less than or equal to 22 degrees, the included angle between the straight line of the extending direction of the second bonding pad and the symmetry axis is theta, theta is more than or equal to 18 degrees and less than or equal to 22 degrees, and the included angle is called as the inclination angle of the straight line of the extending direction of the first bonding pad relative to the symmetry axis. This tilt angle is the taper of the pad, which is the angle created by the deposition or etch process conditions used to pattern the pad. At such an inclination angle, the thickness of the pads is appropriate, which is advantageous for reducing the pitch between the pads. After the spacing between the pads is reduced, more pads can be formed on a bonding assembly. If the first bonding assembly is a Chip On Film (COF) and the second bonding assembly is a display panel, the inclination angle range of the two bonding pads relative to the symmetry axis is 18-22 degrees, the bonding pads can be thinner at the moment, the distance between the adjacent bonding pads can be smaller, and more bonding pads can be arranged on the display panel and the COF, so that more pixels can be arranged on the display panel, electric signals can be provided for the pixels, and the large-screen or high-resolution display can be realized.
In the bonding method provided by the invention, the first bonding assembly and the second bonding assembly can be independently selected from a glass substrate, a flexible substrate, a chip on film and a flexible circuit board. Specifically, the first bonding component is a display panel, the second bonding component is a display panel, and the bonding method includes bonding the flexible substrates of the non-display areas of the two display panels, where the two display panels may display the same picture, may display different pictures, and may also be unfolded or folded to realize the change of the display area under the unfolded or folded condition, that is, to display a large screen, a folded screen, or a curled screen. Or the first bonding assembly is a flexible circuit board, the second bonding assembly is a flexible circuit board, the two flexible circuit boards have different thermal expansion coefficients, and the bonding method comprises the step of jointing the flexible films of the two flexible circuit boards to form the flexible module. Or, the first bonding assembly is a flexible module, the second bonding assembly is a display panel, and the bonding method comprises the step of bonding the flexible substrate of the non-display area of the display panel and the flexible film of the flexible film assembly to form the display device. However, the present invention is not limited thereto.
In another embodiment of the present invention, a bonding method is provided, referring to fig. 7 and 8a, in a preparation step, a first bonding assembly 10, a second bonding assembly 20 and a third bonding assembly 30 are provided, the first bonding assembly 10 includes a plurality of first pads 11, the second bonding assembly 20 includes a plurality of second pads 21, the third bonding assembly 30 includes a plurality of third pads 31, the second bonding assembly 20 further includes a plurality of fourth pads 41, the second pads 21 and the fourth pads 41 are disposed at opposite ends of the second bonding assembly 20, a distance between adjacent second pads 21 is equal to a distance between adjacent fourth pads 41, the third bonding assembly 30 includes a plurality of third pads 31, a distance between adjacent fourth pads 41 is smaller than a distance between adjacent third pads 31, a distance between adjacent first pads 11 is smaller than a distance between adjacent second pads 21, and of the three bonding components, the coefficient of expansion for the first bonding component 10 is greater than the coefficient of expansion for the second bonding component 20 is greater than the coefficient of expansion for the third bonding component 30.
In the heating step, please refer to fig. 8b, the first bonding assembly, the second bonding assembly, and the third bonding assembly are heated to expand, a distance between adjacent first pads is equal to a distance between second pads electrically connected to the adjacent first pads to be bonded, and a distance between adjacent third pads is equal to a distance between fourth pads electrically connected to the adjacent third pads to be bonded.
In the pressing step, the first bonding assembly and the second bonding assembly are pressed to enable the first bonding pad to be electrically connected with the second bonding pad one by one, and the other end of the second bonding assembly and the third bonding assembly are pressed to enable the third bonding pad to be electrically connected with the fourth bonding pad one by one.
In the bonding method provided in this embodiment, in the preparation step before bonding, referring to fig. 8a, a distance between first pads of a first bonding assembly having a large expansion coefficient is set to be smaller than a distance between second pads, so that after one end of the first bonding assembly and one end of the second bonding assembly are heated and expanded, the distance between two adjacent first pads is equal to the distance between two corresponding second pads, and the first pads and the second pads can be electrically connected one by one; similarly, the expansion coefficient of the second bonding component is larger than that of the third bonding component, the distance between the adjacent fourth bonding pads is set to be smaller than that between the third bonding pads corresponding to the adjacent fourth bonding pads, after the other end of the second bonding component and the third bonding component are heated and expanded, the distance between the adjacent third bonding pads is equal to that between the two corresponding fourth bonding pads, and the third bonding pads and the fourth bonding pads can be electrically connected one by one. That is to say, set up certain difference before the nation through the pad interval with the nation's subassembly that two thermal expansion coefficients are different for the pad interval of the big nation's subassembly of thermal expansion coefficient is little, and the pad interval of the little nation's subassembly of thermal expansion coefficient is big, and the interval difference coincide with the difference of inflation volume, can alleviate the pad off normal phenomenon because the inflation volume difference causes to a certain extent, thereby guarantee the reliability of nation.
In another embodiment of the present invention, with continued reference to fig. 9a and 9b, the first bonding element 10 includes a bonding area a, the bonding area a is an axisymmetric pattern, the first pads 11 and the second pads 21 are symmetrically disposed with respect to a symmetry axis L of the bonding area, and the third pads 31 and the fourth pads 41 are symmetrically disposed with respect to the symmetry axis L of the bonding area. Because the bonding pad is counterpoint offset from the center to both sides accumulation, set up the pressfitting region A through with first bonding subassembly into the axisymmetric figure, be favorable to according to the counterpoint offset after different pads are heated and expanded, set for the initial distance between two adjacent pads of different bonding subassemblies. The risk of bonding counterpoint skew of the pad of the bonding subassembly that can avoid coefficient of expansion difference to a certain extent, both ends counterpoint bad problem when especially having solved different bonding subassemblies and bonding.
In another embodiment of the present invention, the first bonding component is a flexible circuit board, the second bonding component is a chip-on-film (COF) with a chip, and the third bonding component is a display panel. However, the present invention is not limited thereto.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (10)
1. A method of bonding, comprising:
a preparation step, namely providing a first bonding assembly and a second bonding assembly, wherein the first bonding assembly comprises a plurality of first bonding pads, the second bonding assembly comprises a plurality of second bonding pads, the distance between the adjacent first bonding pads is smaller than the distance between the adjacent second bonding pads, and the expansion coefficient of the first bonding assembly is larger than that of the second bonding assembly;
heating, namely heating the first bonding assembly and the second bonding assembly, wherein the first bonding assembly and the second bonding assembly are heated to expand, and the distance between the adjacent first bonding pads is equal to the distance between the second bonding pads to be in press-fit electrical connection with the first bonding pads;
and a pressing step, wherein the first bonding assembly and the second bonding assembly are pressed to enable the first bonding pad to be electrically connected with the second bonding pad one by one.
2. The bonding method of claim 1, wherein the first bonding assembly includes a stitching region that is an axisymmetric pattern, and wherein the first and second pads are each symmetrically disposed with respect to an axis of symmetry of the stitching region.
3. The bonding method according to claim 1,
in the preparing step, the plurality of first pads and the plurality of second pads are arranged at equal intervals.
4. A bonding method according to claim 1 or 2, wherein the straight line in which the extending directions of the plurality of first pads are located has an intersection with the symmetry axis;
preferably, a straight line along which the plurality of first pads extend intersects the axis of symmetry at a point.
5. The bonding method according to claim 2, wherein an angle θ between a straight line in which the first pads extend and the symmetry axis is 18 ° ≦ θ ≦ 22 °.
6. The bonding method of claim 1, wherein the first bonding component and the second bonding component are each independently selected from a glass substrate, a flexible substrate, a chip on film, and a flexible circuit board.
7. The bonding method according to claim 1,
in the preparation step, a third bonding assembly is further provided, where the third bonding assembly includes a plurality of third pads, the second bonding assembly further includes a plurality of fourth pads, the second pads and the fourth pads are disposed at two opposite ends of the second bonding assembly, a distance between adjacent second pads is equal to a distance between adjacent fourth pads, a distance between adjacent fourth pads is smaller than a distance between adjacent third pads, and an expansion coefficient of the first bonding assembly is greater than an expansion coefficient of the second bonding assembly and greater than an expansion coefficient of the third bonding assembly;
in the heating step, the third bonding assembly is heated, the third bonding assembly expands when heated, and the distance between the adjacent third bonding pads is equal to the distance between the fourth bonding pads to be pressed and electrically connected with the third bonding pads;
and in the pressing step, pressing the other end of the second bonding assembly and the third bonding assembly to enable the third bonding pad to be electrically connected with the fourth bonding pad one by one.
8. The bonding method of claim 7, wherein the first bonding component includes a stitching region, the stitching region is in an axisymmetric pattern, the first and second pads are each symmetrically disposed with respect to an axis of symmetry of the stitching region, and the third and fourth pads are each symmetrically disposed with respect to an axis of symmetry of the stitching region.
9. The bonding method of claim 7, wherein the first bonding component is a flexible circuit board, the second bonding component is a flip-chip, and the third bonding component is a display panel.
10. A display device, comprising a display panel and a display module, wherein the display panel and the display module are bonded by the bonding method according to any one of claims 1 to 6.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112014988A (en) * | 2020-09-15 | 2020-12-01 | 武汉华星光电技术有限公司 | Display panel, binding method thereof and display device |
| CN112985274A (en) * | 2021-03-30 | 2021-06-18 | 昆山国显光电有限公司 | Method and device for measuring distance between bonding pads and electronic equipment |
| CN114241922A (en) * | 2021-12-31 | 2022-03-25 | 合肥维信诺科技有限公司 | Display panel and display module |
| CN114253037A (en) * | 2021-12-16 | 2022-03-29 | 武汉华星光电技术有限公司 | Display module |
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