CN2728730Y - Ultrafine powder composite chipboard - Google Patents

Ultrafine powder composite chipboard Download PDF

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Publication number
CN2728730Y
CN2728730Y CN 200420063119 CN200420063119U CN2728730Y CN 2728730 Y CN2728730 Y CN 2728730Y CN 200420063119 CN200420063119 CN 200420063119 CN 200420063119 U CN200420063119 U CN 200420063119U CN 2728730 Y CN2728730 Y CN 2728730Y
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CN
China
Prior art keywords
ultrafine powder
chipboard
composite
powder composite
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 200420063119
Other languages
Chinese (zh)
Inventor
李琳
田海江
何林
王春明
杨玲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RESEARCH INST OF FOREST PRODUCTS INDUSTRY HEILONGJIANG PROV
Original Assignee
RESEARCH INST OF FOREST PRODUCTS INDUSTRY HEILONGJIANG PROV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RESEARCH INST OF FOREST PRODUCTS INDUSTRY HEILONGJIANG PROV filed Critical RESEARCH INST OF FOREST PRODUCTS INDUSTRY HEILONGJIANG PROV
Priority to CN 200420063119 priority Critical patent/CN2728730Y/en
Application granted granted Critical
Publication of CN2728730Y publication Critical patent/CN2728730Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a composite board. More specifically, an ultrafine powder composite chipboard is disclosed. The ultrafine powder composite chipboard is composed of a PVC veneer layer (1), a composite board layer (2) pressed by the collosol of the superfines of silicon dioxide and the mixing of shavings and wood powder, and ordinary wood single board layer (3). The top and bottom both faces of the composite board layer (2) are respectively glued on the PVC veneer layer (1) and the ordinary wood single board layer (3). Owing to the composite board layer (2) of the utility model adopts the silicon dioxide of nanophase materials to dissolve in adhesive, the content of formaldehyde is decreased; in a composite process, the ultrafine powder composite chipboard adopts flat pressing method, so the ultrafine powder composite chipboard has no harm to people and environment; the PVC veneer layer has favorable moist resistance performance, and the wood single board has favorable secondary operation performance, so the ultrafine powder composite chipboard can show the proper natural characteristic and texture of woods. Thus, the ultrafine powder composite chipboard has the advantages of good performance, low toxicity, moist resistance, corrosion resistance, no pollution, etc.; the ultrafine powder composite chipboard can be used for industries, such as furniture, decoration, construction, etc.

Description

Ultra micro powder laminated particle-board
Technical field:
The utility model relates to a kind of composite plate, is specifically related to a kind of ultra micro powder laminated particle-board.
Background technology:
Be fancy wood chipboard in the mass-produced composite plate of wood working industry at present, this fancy wood chipboard needs to add the adhesive of a large amount of formaldehydes in process of production, and is therefore all harmful to the environment and the person.
The utility model content:
In order to overcome existing particieboard, provide a kind of laminated particle-board of low toxicity to environment and all harmful defective of the person.The utility model is realized by following proposal: a kind of ultra micro powder laminated particle-board, it is mixed with wood shavings and wood powder by PVC overlay coating 1, SiO 2 superfine powder colloidal sol, and the compound flaggy 2 that is pressed into and normal wood ply 3 form, and the upper and lower surface of compound flaggy 2 is pasted PVC overlay coating 1 and normal wood ply 3 respectively.Because the compound flaggy 2 of the utility model adopts nano material silica to be dissolved in the adhesive, reduced content of formaldehyde, be to adopt flat-press process compound in recombination process, therefore to people, environmentally friendly, the PVC overlay coating has good moisture resistance, single wood plate layer has good secondary workability, can embody the natural characteristic and the texture of timber itself.Therefore, this laminated particle-board has that serviceability is good, low toxicity, humidity, an advantage such as corrosion-resistant, pollution-free, of many uses, can be widely used in industries such as furniture, decoration, building.
Description of drawings:
Fig. 1 is a structural representation of the present utility model.
The specific embodiment:
The specific embodiment one: specify present embodiment below in conjunction with Fig. 1.It is mixed with wood shavings and wood powder by PVC overlay coating 1, SiO 2 superfine powder colloidal sol, and the compound flaggy 2 that is pressed into and normal wood ply 3 form, and the upper and lower surface of compound flaggy 2 is pasted PVC overlay coating 1 and normal wood ply 3 respectively.The selected colloidal sol that is infiltrated fine silica powder is the hot pressing urea-formaldehyde resin adhesive.

Claims (2)

1, ultra micro powder laminated particle-board, it is characterized in that it is mixed with wood shavings and wood powder by PVC overlay coating (1), SiO 2 superfine powder colloidal sol that the compound flaggy (2) that is pressed into and normal wood ply (3) form, the upper and lower surface of compound flaggy (2) is pasted PVC overlay coating (1) and normal wood ply (3) respectively.
2, ultra micro powder laminated particle-board according to claim 1 is characterized in that the selected colloidal sol that is infiltrated fine silica powder is the hot pressing urea-formaldehyde resin adhesive.
CN 200420063119 2004-07-16 2004-07-16 Ultrafine powder composite chipboard Expired - Fee Related CN2728730Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200420063119 CN2728730Y (en) 2004-07-16 2004-07-16 Ultrafine powder composite chipboard

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200420063119 CN2728730Y (en) 2004-07-16 2004-07-16 Ultrafine powder composite chipboard

Publications (1)

Publication Number Publication Date
CN2728730Y true CN2728730Y (en) 2005-09-28

Family

ID=35047513

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 200420063119 Expired - Fee Related CN2728730Y (en) 2004-07-16 2004-07-16 Ultrafine powder composite chipboard

Country Status (1)

Country Link
CN (1) CN2728730Y (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106113209A (en) * 2016-06-28 2016-11-16 浙江杰诚威林产品有限公司 A kind of New planing plank floor
CN106476340A (en) * 2016-10-18 2017-03-08 宁波中加低碳新技术研究院有限公司 A kind of fiber composite decorative engineering material and its manufacture method
CN110919789A (en) * 2019-12-18 2020-03-27 马鞍山市谷庆门业有限公司 Preparation method of laminated veneer lumber for bamboo powder reinforced door

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106113209A (en) * 2016-06-28 2016-11-16 浙江杰诚威林产品有限公司 A kind of New planing plank floor
CN106476340A (en) * 2016-10-18 2017-03-08 宁波中加低碳新技术研究院有限公司 A kind of fiber composite decorative engineering material and its manufacture method
CN110919789A (en) * 2019-12-18 2020-03-27 马鞍山市谷庆门业有限公司 Preparation method of laminated veneer lumber for bamboo powder reinforced door
CN110919789B (en) * 2019-12-18 2021-07-27 马鞍山市谷庆门业有限公司 Preparation method of laminated veneer lumber for bamboo powder reinforced door

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GR01 Patent grant
C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee