CN2725985Y

CN2725985Y - Host computer radiation system

Info

Publication number: CN2725985Y
Application number: CN 200420085193
Authority: CN
Inventors: 游文隆; 周益群; 陆坤池
Original assignee: Shuttle Inc
Current assignee: Shuttle Inc
Priority date: 2004-08-19
Filing date: 2004-08-19
Publication date: 2005-09-14
Anticipated expiration: 2014-08-19

Abstract

The utility model relates to a host computer radiation system including a computer case, a mainboard and a power supply. The computer case comprises a fore board, a back board and a base board. The base board is connected between the fore board and the back board and separates the fore board and the back board. The mainboard and the power supply are equipped in the computer case. The mainboard is equipped above the base board. The top face is equipped with a processor heat-radiating module and a chip heat-radiating module. The chip heat-radiating module is located behind the processor heat-radiating module. A power supply is connected to the back board of the computer case to make the processor heat-radiating module, the chip heat-radiating module and the power supply serially arranged on the same heat radiation channel. So, when the outer air is introduced into the heat radiation channel, the high heat produced by the electronic component can be quickly taken away which can greatly raise the radiation efficiency in the host computer.

Description

The cooling system of main frame

Technical field

The utility model relates to a kind of cooling system of main frame, relate in particular to a kind of main frame inside of being used for, extraneous air can be introduced in the computer housing, and with heat dissipation path the most fast with the heat band from, improve the cooling system of the main frame of main frame radiating efficiency.

Background technology

Existing various electronic equipment, main frame particularly, because of inside being installed by various electronic package and peripherals with high-speed computation function, as central processing unit (CPU), chip (MCH, I/OCH), various adapter, high power capacity mnemon (Winchester disk drive), DVD, CD writer and power supply unit etc., adding these main frames all is to adopt approximate closed casing basically, and electronic package and peripherals all can produce the heat that temperature does not wait when operation, particularly carry out the CPU of high-speed computation, especially Zui Da heat generation component.So how with in the main frame, especially the heat that is produced during the CPU computing is effectively got rid of, real be an important topic to be solved now.

Present common way is installed heat radiator, radiator fan or its heat abstractor that combines on electronic package, utilize heat abstractor to reduce main frame or interior assembly and the environment temperature of electronic equipment.Being communicated with importing of this heat abstractor and extraneous air mostly is to utilize the radiator fan that is fixedly installed on plate behind the computer housing and is opened in slotted eye on the back plate, reach the effect that obtains extraneous air, further utilize the heat abstractor that is arranged on CPU and the chip to remove heat then.But this radiating mode, because CPU, chip and peripherals all are set in the same space, and CPU and chip are because of the restriction of motherboard allocation position, be arranged on casing nearly center bottom place more or be the setting of staggering of scrambling, therefore these peripherals and electronic package move the heat that is produced, not only all accumulate in the casing of main frame, more because in the same space, have a plurality of thermals source, cause heat in this space, to form greenhouse effect, and the hot environment that continues makes the cold air that is imported by the outside can't directly arrive the position at CPU and chip place and remove the heat that is produced because of operation.

The design people is in view of the defective that exists in the above-mentioned prior art, rely on the research and development experience for many years of being engaged in, at carrying out improved inconvenience and defective, through concentrating on studies and cooperating actual utilization, and, propose a kind of reasonable in design and effectively reconstruct the utility model of above-mentioned defective finally in line with excelsior spirit.

Content of the present utility model

Fundamental purpose of the present utility model is to provide a kind of cooling system of main frame, it utilizes processor radiating module, chip cooling module and the formed heat dissipation channel of power supply unit, when extraneous air is introduced into this heat dissipation channel, can with the fast speed belt of the high heat that electronic package produced from, thereby significantly improve the radiating efficiency of main frame inside.

To achieve these goals, the utility model provides a kind of cooling system of main frame, includes a computer housing, a motherboard and a power supply unit, and wherein this computer housing comprises header board, back plate and base plate.This base plate is connected between header board and the back plate, and header board and back plate are separated at interval.Be provided with motherboard and power supply unit in this computer housing inside, this motherboard is located at described base plate top, and its end face is provided with processor radiating module and chip cooling module, and this chip cooling module is positioned at the rear of processor radiating module; On the back plate of computer housing, be connected with a power supply unit, make processor radiating module, chip cooling module and power supply unit series arrangement on same heat dissipation channel, thus the purpose on realizing.

The cooling system of main frame of the present utility model can with the fast speed belt of the high heat that electronic package produced from, significantly improve the radiating efficiency of main frame inside.

Brief description of drawings

Fig. 1 is the combination synoptic diagram of the utility model embodiment;

Fig. 2 is the combination synoptic diagram at another visual angle of the utility model embodiment;

Fig. 3 is the user mode figure () of the utility model embodiment;

Fig. 4 is the user mode figure (two) of the utility model embodiment.

In the accompanying drawing, the list of parts of each label representative is as follows:

The 10-computer housing

11-header board 111-through hole

112-elongated slot 113, the 122-hole

Plate 121-intercommunicating pore behind the 12-

123-slotted eye 13-base plate

The 14-web joint

The 20-motherboard

21-processor radiating module 211-radiator fan

212-heating radiator 213-central processing unit

The 22-first chip cooling module 23-second chip cooling module

24-memory modules 25-adapter card module

The 30-power supply unit

31-framework 311-runs through groove

The 32-radiator fan

The 40-panel

The 41-air vent

Embodiment

In order to make those skilled in the art can further understand feature of the present utility model and technology contents, see also following about detailed description of the present utility model and accompanying drawing, accompanying drawing only provide with reference to and explanation, be not to be used for limiting the utility model.

Fig. 1 and Fig. 2 are respectively the combination synoptic diagram at combination synoptic diagram of the present utility model and another visual angle.The utility model provides a kind of cooling system of main frame, and as shown in Figures 1 and 2, it mainly comprises a computer housing 10, a motherboard 20 and a power supply unit 30, wherein:

Computer housing 10 can be a computer housing that is used for the central processing unit (CPU) of two-forty, it is made up of a header board 11, a back plate 12, a base plate 13 and two web joints 14, centre at header board 11 offers a manhole 111, reaches dual-side and offer elongated slot 112 and a plurality of hole 113 respectively above through hole 111; Back plate 12 is set in parallel in header board 11 rears one suitable distance, offers an intercommunicating pore 121, a plurality of hole 122 and other various difform slotted eyes 123 on the plate 12 of back; Base plate 13 is connected the bottom of header board 11 and back plate 12, and web joint 14 is parallel to base plate 13, and is connected on the top of header board 11 and back plate 12, makes computer housing 10 be a long rectangle stereo structure.

Motherboard 20 is a tabular, fixedly install on the base plate 13 that is connected computer housing 10, be provided with a processor radiating module 21, one first chip cooling module 22, one second chip cooling module 23, a plurality of memory modules 24, adapter card module 25 and other various electronic package and connectors that difference in functionality is provided at the end face of motherboard 20; Wherein, processor radiating module 21 is located at the place ahead place of motherboard 20, and it includes the central processing unit 213 that heating radiator 212 and that a forward type radiator fan 211, is positioned at radiator fan 211 rears is fitted in heating radiator 212 bottom surfaces.Radiator fan 211 correspondences of processor radiating module 21 are arranged on through hole 111 places of header board 11; The first chip cooling module 22 can be for being made up of any and a heating radiator of a north bridge chips (Memory Controller Hub) or a South Bridge chip (I/O Controller Hub), it is arranged on the rear of processor radiating module 21, and fixedly installs and be connected on the motherboard 20; The second chip cooling module 23 also can be made up of any and a heating radiator of a north bridge chips or a South Bridge chip, and it is arranged on the rear of the first chip cooling module 22.Thus, make processor radiating module 21, the first chip cooling module 22 and the second chip cooling module 23 form the heat dissipation channel of a nearly linearity.Memory modules 24 and adapter card module 25 fixedly install respectively and are connected on the motherboard 20, and the and arranged on left and right sides limit of close above-mentioned heat dissipation channel.

Power supply unit 30 is fixedly installed on the top of the back plate 12 of computer housing 10, and it includes a framework 31, a radiator fan 32 and a transformer (not shown).On each side plate of framework 31, offer a plurality of grooves 311 that run through, be installed with radiator fan 32 at its rear, transformer is arranged on the inside of framework 31, radiator fan 32 is provided with corresponding to the intercommunicating pore 121 of back plate 12, and power supply unit 30 correspondences are arranged on processor radiating module 21, the first chip cooling module 22 and the second chip cooling module, 23 formed heat dissipation channel rears.

Fig. 3 and Figure 4 shows that user mode figure of the present utility model () and user mode figure (two), combination by said modules, wherein the header board 11 of computer housing 10 can connect a panel 40, on panel 40, offer a plurality of air vents 41, after radiator fan 211 runnings of processor radiating module 21, the cold air of main frame outside is inhaled in the computer housing 10 from the air vent 41 of panel 40, this cold air will be earlier dispels the heat to the processor radiating module 21 of high heat, secondly order is through the first chip cooling module 22 and the second chip cooling module 23, the groove 311 that runs through from framework 31 enters the power supply unit 30 again, and by the radiator fan 32 of power supply unit 30 directly this heat is blown out band from, form a heat dissipation path the most fast.Be located at the heat that memory modules 24 around the above-mentioned heat dissipation channel and adapter card module 25 are produced, also can the heat of memory modules 24 and adapter card module 25 be taken away, and then reach the inner best heat dissipation of main frame by the suction that this heat dissipation channel is produced when flowing fast.

In sum, the cooling system of main frame of the present utility model has practicality, novelty and creativeness, and structure of the present utility model also never sees like product and public use, does not more publish before the application on any publication, meets the requirement of utility application fully.

The above only is a preferred embodiment of the present utility model, be not so promptly limit claim of the present utility model, the equivalent structure transformation that every utilization the utility model instructions and accompanying drawing content are done, or directly or indirectly be used in other relevant technical field, all in like manner be included in the claim of the present utility model.

Claims

1. the cooling system of main frame is characterized in that, comprising:

One computer housing comprises a header board, a back plate and a base plate, and described base plate is connected between header board and the back plate, and described header board and back plate are separated at interval;

One motherboard is arranged on the inside of described computer housing, and is fixedly mounted on its base plate top, and described motherboard is provided with processor radiating module and chip cooling module, and described chip cooling module is positioned at the rear of processor radiating module; And

One power supply unit is arranged on the inside of described computer housing, and is connected thereafter on the plate, makes described processor radiating module, chip cooling module and power supply unit stationary arrangement on same heat dissipation channel.

2. the cooling system of main frame as claimed in claim 1 is characterized in that offering a through hole at the header board of described computer housing, and described processor radiating module has a radiator fan, and described radiator fan correspondence is arranged on the through hole of header board.

3. the cooling system of main frame as claimed in claim 1 is characterized in that the back plate of described computer housing offers an intercommunicating pore, and described power supply unit has a radiator fan, and described radiator fan correspondence is arranged on the intercommunicating pore of back plate.

4. the cooling system of main frame as claimed in claim 1 is characterized in that described processor radiating module includes the central processing unit that heating radiator and that a radiator fan, is positioned at the radiator fan rear is fitted in the heating radiator bottom surface.

5. the cooling system of main frame as claimed in claim 1 is characterized in that described chip cooling module includes the second chip cooling module that one first chip cooling module and is located at its rear.

6. the cooling system of main frame as claimed in claim 5 is characterized in that the described first chip cooling module is made up of any and heating radiator of north bridge chips or South Bridge chip.

7. the cooling system of main frame as claimed in claim 5 is characterized in that the described second chip cooling module is made up of any and heating radiator of north bridge chips or South Bridge chip.

8. the cooling system of main frame as claimed in claim 1 is characterized in that described power supply unit comprises a framework, and each side plate of described framework offers a plurality of grooves that run through.