CN2715348Y - LED with heat radiation function - Google Patents

LED with heat radiation function Download PDF

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Publication number
CN2715348Y
CN2715348Y CNU2004200077912U CN200420007791U CN2715348Y CN 2715348 Y CN2715348 Y CN 2715348Y CN U2004200077912 U CNU2004200077912 U CN U2004200077912U CN 200420007791 U CN200420007791 U CN 200420007791U CN 2715348 Y CN2715348 Y CN 2715348Y
Authority
CN
China
Prior art keywords
led
heat radiation
led chip
pin
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNU2004200077912U
Other languages
Chinese (zh)
Inventor
姚志图
周泽松
张则佩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Waichi Photoelectric Co., Ltd.
Original Assignee
姚志图
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 姚志图 filed Critical 姚志图
Priority to CNU2004200077912U priority Critical patent/CN2715348Y/en
Application granted granted Critical
Publication of CN2715348Y publication Critical patent/CN2715348Y/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Led Device Packages (AREA)

Abstract

The utility model discloses an LED with the heat radiation function, which overcomes the problem that the heat can not be emitted in time in the prior art. The LED with the heat radiation function comprises two potential feet encapsulated together and an LED chip electrically connected with the potential feet. A heat radiation foot is encapsulated between the two potential feet, the LED chip is fixedly installed at one end of the heat radiation foot in the encapsulating body, and the other end of the heat radiation foot extends out of the encapsulating body. The positive electrode potential foot and the negative electrode potential foot in the structure are the power input feet of the LED chip, and the heat radiation foot emits the heat generated by the LED chip in the working time to ensure that the LED can normally work in the high efficiency. Especially the LED with the heat radiation function is suitable for the capsulation of the high-power high-brightness LED.

Description

The LED of band heat sinking function
Technical field
The utility model relates to a kind of LED, particularly a kind of LED with heat sinking function.
Background technology
Advantages such as LED is low in energy consumption with it, brightness is high, volume is little, the life-span is long, reaction speed is fast, easy encapsulation have been applied to all trades and professions, the led chip that existing LED generally installs the current potential pin by transparent encapsulating material with two current potential pin and one is packaged together and forms, the LED of various difformities and specification, their packaged type is SMD (paster) substantially, support, these directly are welded on the mainboard, because these LED encapsulation do not have special radiator structure, only be applicable to low-power, the led chip encapsulation of low-light level.Along with science and technology development, high-power, the led chip manufacturing technology of high brightness is increasingly mature, these led chip power can reach more than the 1W, when work, these led chips can produce very big heat, dissipate if these heats are untimely, the led chip temperature is constantly raise and influence performance, the life-span of LED.
Summary of the invention
For overcoming above-mentioned shortcoming, the utility model provides a kind of LED with heat sinking function.
The LED of the utility model band heat sinking function, comprise two current potential pin and a led chip that is electrically connected with the current potential pin of being packaged together, between described two current potential pin, also be packaged with the heat radiation pin, described led chip is fixedly mounted on the end of heat radiation pin in packaging body, and the other end of heat radiation pin is drawn outside packaging body.
Both positive and negative polarity current potential pin in the said structure is a led chip power supply input pin, and the heat radiation pin dissipates the heat that led chip produced in when work, provides safeguard for LED can work normally, efficiently, is specially adapted to the encapsulation of the led chip of high-power, high brightness.
Description of drawings
Fig. 1 is the cross-sectional schematic of the LED of the utility model band heat sinking function.
Fig. 2 is the LED user mode cross-sectional schematic of band heat sinking function shown in Figure 1.
Embodiment
With reference to Fig. 1, the LED of the utility model band heat sinking function, comprise two current potential pin 3 and a led chip 6 that is electrically connected with current potential pin 3 of being packaged together, between described two current potential pin 3, also be packaged with heat radiation pin 4, described led chip 6 is fixedly mounted on the end of heat radiation pin 4 in packaging body 1, and the other end of heat radiation pin 4 is drawn outside packaging body 1.
As further improvement of the utility model, the end of described heat radiation pin 4 in packaging body 1 is spill cambered surface 2.The spill cambered surface 2 of above-mentioned heat radiation pin end in packaging body can produce good reflex to the led chip of installing within it 6 when luminous, can make LED can further reduce power consumption, strengthen the brightness of LED, for working efficiently of LED provides further guarantee.The profile of certain LED of the present utility model heat radiation pin 4 and described spill cambered surface 2, big I according to led chip power, shape is different and design separately, so that satisfy the different led chip light reflections and the requirement of heat radiation.
As further improvement of the utility model, above-mentioned led chip 6 adopts the heat conduction binding material to cement in the end of heat radiation pin 4 in packaging body, so that led chip 6 is dispelled the heat better.
The use reference state of the LED of the utility model band heat sinking function as shown in Figure 2, the current potential pin 3 of the LED of band heat sinking function of the present utility model is welded on the control main board 7, the heat radiation pin 4 be welded on the heating panel 8.

Claims (3)

1, a kind of LED with heat sinking function, comprise two current potential pin and a led chip that is electrically connected with the current potential pin of being packaged together, it is characterized in that: between described two current potential pin, also be packaged with the heat radiation pin, described led chip is fixedly mounted on the end of heat radiation pin in packaging body, and the other end of heat radiation pin is drawn outside packaging body.
2, the LED of band heat sinking function as claimed in claim 1, its particular-trade is levied and is: the end of described heat radiation pin in packaging body is the spill cambered surface.
3, the LED of band heat sinking function as claimed in claim 1 or 2 is characterized in that described led chip adopts the heat conduction binding material to cement in the end of heat radiation pin in packaging body.
CNU2004200077912U 2004-03-26 2004-03-26 LED with heat radiation function Expired - Lifetime CN2715348Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2004200077912U CN2715348Y (en) 2004-03-26 2004-03-26 LED with heat radiation function

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2004200077912U CN2715348Y (en) 2004-03-26 2004-03-26 LED with heat radiation function

Publications (1)

Publication Number Publication Date
CN2715348Y true CN2715348Y (en) 2005-08-03

Family

ID=34869948

Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2004200077912U Expired - Lifetime CN2715348Y (en) 2004-03-26 2004-03-26 LED with heat radiation function

Country Status (1)

Country Link
CN (1) CN2715348Y (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117038818A (en) * 2023-10-08 2023-11-10 盐城鸿石智能科技有限公司 High-reflection micro LED and preparation method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117038818A (en) * 2023-10-08 2023-11-10 盐城鸿石智能科技有限公司 High-reflection micro LED and preparation method thereof

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: WEIZHI INTELLIGENT LTD.

Free format text: FORMER OWNER: YAO ZHITU

Effective date: 20070601

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20070601

Address after: The British Virgin Islands of Tortola Luther Wenham town 1 De Castro Road No. 24 building Accra Island

Patentee after: Wezhi Intelligent Ltd

Address before: 518126 Guangdong city of Shenzhen province Baoan District Xixiang Town Industrial Zone second Weizhi electronic (Shenzhen) Co., Ltd.

Patentee before: Yao Zhitu

EE01 Entry into force of recordation of patent licensing contract

Assignee: Waichi Opto Technology (Shenzhen) Ltd.

Assignor: Wezhi Intelligent Ltd

Contract fulfillment period: 2009.2.1 to 2014.2.1

Contract record no.: 2009990000227

Denomination of utility model: LED energy-saving illuminating lamp with radiating function

Granted publication date: 20050803

License type: Exclusive license

Record date: 20090330

LIC Patent licence contract for exploitation submitted for record

Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2009.2.1 TO 2014.2.1; CHANGE OF CONTRACT

Name of requester: WEIZHI OPTOELECTRONIC( SHENZHEN ) CO., LTD.

Effective date: 20090330

ASS Succession or assignment of patent right

Owner name: WAI CHI OPTOELECTRONIC (SHENZHEN) CO., LTD.

Free format text: FORMER OWNER: WAI CHI INTELLIGENT CO., LTD.

Effective date: 20120214

C41 Transfer of patent application or patent right or utility model
COR Change of bibliographic data

Free format text: CORRECT: ADDRESS; TO: 518126 SHENZHEN, GUANGDONG PROVINCE

TR01 Transfer of patent right

Effective date of registration: 20120214

Address after: 518126 Guangdong city of Shenzhen province Baoan District Xixiang Town Industrial Zone second

Patentee after: Waichi Opto Technology (Shenzhen) Ltd.

Address before: The British Virgin Islands, Tortola, Luther Wenham Town, 1 islands, 24 De Castro Road, building Accra

Patentee before: Wezhi Intelligent Ltd

C56 Change in the name or address of the patentee

Owner name: WAI CHI OPTO (SHENZHEN) TECHNOLOGY LTD.

Free format text: FORMER NAME: WEI CHI OPTO TECHNOLOGY (SHENZHEN) LTD.

CP01 Change in the name or title of a patent holder

Address after: 518126 Guangdong city of Shenzhen province Baoan District Xixiang Town Industrial Zone second

Patentee after: Shenzhen Waichi Photoelectric Co., Ltd.

Address before: 518126 Guangdong city of Shenzhen province Baoan District Xixiang Town Industrial Zone second

Patentee before: Waichi Opto Technology (Shenzhen) Ltd.

C17 Cessation of patent right
CX01 Expiry of patent term

Expiration termination date: 20140326

Granted publication date: 20050803