CN2698031Y - Improved overflow structure of heat-resisting and heat-insulating interface material - Google Patents
Improved overflow structure of heat-resisting and heat-insulating interface material Download PDFInfo
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- CN2698031Y CN2698031Y CN 200420006491 CN200420006491U CN2698031Y CN 2698031 Y CN2698031 Y CN 2698031Y CN 200420006491 CN200420006491 CN 200420006491 CN 200420006491 U CN200420006491 U CN 200420006491U CN 2698031 Y CN2698031 Y CN 2698031Y
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- assembly
- heat
- interface material
- thermal interface
- hot
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Abstract
The utility model relates to an improved overflow structure of heat-resisting and heat-insulating interface material, comprising a heat component, a hollow isolating component and a heat transferring component. The utility model is mainly characterized in that the isolating component is wound and arranged on the periphery of the heat component, the heat transferring component presses a heat interface material coated between the heat component and the heat transferring component and used for increasing the heat transferring efficiency to be limited in a sealed space formed between the isolating component and the heat component, and the heat transferring component is provided with a lug which just can be contacted to the surface of the heat component and has a smaller inner diameter than the isolating component. When the heat interface material is converted to a liquid phase or a glue phase following the rising temperature, the utility model can not cause the overflow pollution or cause the danger of the short circuit of the electron.
Description
Technical field
The utility model relates to a kind of structure that blocks the thermal interface material overflow of improvement, especially refer to a kind ofly prevent thermal interface material Yin Wendu rising transition and pollute or the structural design of electrical short, and can prevent that barrier assembly from flowing out because of excessive compression causes in the thermal interface material of inside.
Background technology
Electronic building brick produces the high heat person and is commonly referred to as hot assembly when running, such as: central processing unit (CPU), Power IC etc.; Surpass its patient critical value of institute for the temperature that hot assembly is produced is unlikely and burn, the habitual gimmick of industry is in installing a heat-conductive assembly (as fin heatsink) additional in hot assembly, operate normally heat is distributed the maintaining heat assembly, and on heat-conductive assembly, install a radiator fan again additional to accelerate the rate of heat dispation of this hot assembly; But be not that all hot assembly environment of living in all can provide enough space with the installing fan, for example: notebook computer, PDA(Personal Digital Assistant) etc., these devices are emphasized is light, thin, little, characteristic such as be easy to carry about with one, and the technological means that installs fan additional can't be applicable in the aforementioned means.
For increasing the rate of heat dispation of hot assembly, industry replaces the assembling of fan with another heat dissipation technology, promptly between heat-conductive assembly and hot component joint face, coating one deck thermal interface material is to increase radiating efficiency, this thermal interface material uses phase-transition material or thermal grease etc. usually, but the heat that produces along with hot assembly increases, though can keep electronic building brick in the running down of normal state, but the thermal interface material that is coated with is mushy stage (phase-transition material as the aforementioned) or liquid shape (thermal grease as the aforementioned) because of thermal change by solid-state transition, and derive problems such as overflow and pollution, if employed thermal interface material has conductivity, more can cause hot assembly or circuit board risk of short-circuits because of overflow or contamination phenomenon, the real puzzlement of this problem industry can't propose effective solution for a long time always.
But at above-mentioned problem, Taiwan notification number: 560842, New Name: the structure a case that blocks the thermal interface material overflow, one effective solution is proposed, as shown in Figure 1, this utility model includes: a hot assembly 10A, one barrier assembly 20A, an one heat-conductive assembly 30A and a thermal interface material 40A, this barrier assembly 20A is mainly in order to stop thermal interface material 40A overflow to outside, can prevent the short circuit of pollution load of overflow and circuit board 11A, and this barrier assembly 20A can be fixed between heat-conductive assembly 30A and the circuit board 11A because of the compressing that is subjected to heat-conductive assembly 30A, but, this barrier assembly 20A still can be because of the contacting of this heat-conductive assembly 30A and hot assembly 10A, and the situation that causes barrier assembly 20A itself to have excess compression takes place.Therefore, cause thermal interface material 40A easily, further cause pollution load of overflow and/or circuit board short circuit because of the deficiency in space flows out in the spatial dimension that is limited by barrier assembly 20A.
Summary of the invention
Main purpose of the present utility model is to overcome the deficiencies in the prior art and defective, a kind of structure that blocks the thermal interface material overflow of improvement is provided, mainly by a barrier assembly being set around hot assembly, and make that by the compressing of heat-conductive assembly coating thermal interface material between hot assembly and heat-conductive assembly is limited in the space that this heat-conductive assembly, hot assembly and barrier assembly surrounds.In addition, be positioned at and have more the projection that just can be contacted with hot assembly surface and be slightly less than the barrier assembly internal diameter on the heat-conductive assembly, thermal interface material is raise with temperature change liquid phase or glue phase time into, can not cause the danger of pollution load of overflow or initiation electrical short.
Another purpose of the present utility model provides a kind of structure that blocks the thermal interface material overflow of improvement, wherein, this barrier assembly has an appropriate elasticity, when being subjected to the fixing compressing of heat-conductive assembly, can do the extension of appropriateness and be close to circuit board and heat-conductive assembly surface, effectively block and isolate the thermal interface material overflow.
Wherein, aforementioned barrier assembly can be made from porous material and makes, and arranges from going out in order to the gas that will residue in the thermal interface material.
Be familiar with this technology personage and understand the purpose of this utility model, feature and effect for making, now by following specific embodiment, and conjunction with figs., to the utility model illustrate in detail as after.
Description of drawings
Fig. 1 is the schematic diagram of prior art;
Figure 2 shows that the utility model perspective exploded view;
Fig. 3 is the end view after Fig. 2 combination;
Fig. 4 is the A-A cutaway view of Fig. 3, and it shows the not preceding view of transition of thermal interface material;
Fig. 5 is the A-A cutaway view of Fig. 3, and it shows that thermal interface material Yin Wendu rising produces the view that transition changes;
Fig. 6 is the heat-conductive assembly cutaway view of another preferred embodiment of the present utility model;
Fig. 7 is the heat-conductive assembly cutaway view of a preferred embodiment more of the present utility model.
Symbol description among the figure
10, the hot assembly of 10A
11,11A circuit board
20,20A barrier assembly
21 suitable spacings
30,30A heat-conductive assembly
31 projections
32 grooves
40,40A thermal interface material
Embodiment
Extremely shown in Figure 5 as Fig. 2, Fig. 2 is that perspective exploded view of the present utility model, Fig. 3 are the A-A cutaway view of Fig. 3 for the end view after the combination of Fig. 2, Fig. 4, it shows the not view before the transition and Fig. 5 A-A cutaway view of be Fig. 3 of thermal interface material, and it shows that thermal interface material Yin Wendu raises and produces the view of transition variation.The utility model circle around hot assembly 10 is established the barrier assembly 20 of a hollow, this barrier assembly 20 is a material that blocks that not only has excellent elasticity and have made from porous material, its internal diameter and highly be slightly larger than hot assembly 10, in hot assembly 10 is surrounded on, and make the inner edge wall of barrier assembly 20 and 10 of hot assemblies form a suitable spacing 21, to provide the thermal interface material 40 of coating hot assembly 10 surfaces and 30 of heat-conductive assemblies, can supply ccontaining space (as shown in Figure 4) because of after the rising of temperature fades to liquid phase or glue polling mutually by solid phase.
This heat-conductive assembly 30 is extended with a projection 31, in order to contact with hot assembly 10, and be mounted on the surface of hot assembly 10, usually the fastener that adopts or other fixture are (irrelevant with the utility model, so do not draw among the figure), its fixedly strength that provides will make heat-conductive assembly 30 oppress on barrier assembly 20, this barrier assembly 20 outwards moderately extends because of having elasticity, make the projection 31 of this heat-conductive assembly 30 also begin to contact to some extent with hot assembly 10, remove the projection 31 that makes heat-conductive assembly 30 and be close to the surface of hot assembly 10 across part thermal interface material 40, on this barrier assembly 20, heat-conductive assembly 30 bottom surfaces and circuit board 11 surfaces more are close to because of the elasticity that compressing produces in following two sides, make barrier assembly 20, the face that connects that heat-conductive assembly 30 and circuit board are 11 does not have any slot and exists, and be contacted with hot assembly 10 in the near future immediately because of the projection 31 of heat-conductive assembly 30 can begin to oppress barrier assembly 20 at heat-conductive assembly 30, can avoid the deflection of barrier assembly 20 excessive.When the temperature of hot assembly 10 raises and makes thermal interface material 40 produce the transition phenomenons, and when the projection 31 of heat conduction assembly 30 and 10 of hot assemblies flow out, the isolation that stops by barrier assembly 20, make outside the zone that thermal interface material 40 can't overflow to barrier assembly 20 be surrounded (as shown in Figure 5), effectively solve pollution that is caused because of thermal interface material 40 overflows or the danger that causes electrical short, and because of this barrier assembly 20 is made for made from porous material, therefore, when the gas that residues in 40 li of thermal interface materials flows because of expanded by heating, can by barrier assembly 20 row from, the tightr contact between the projection 31 that so can make heat-conductive assembly 30 and the hot assembly 10, and do not influence the speed of its heat conduction.
Again as shown in Figure 6, be the heat-conductive assembly cutaway view of another embodiment of the present utility model; Present embodiment and previous embodiment have identical effect and assembling mode, and both discrepancys are the structure of heat-conductive assembly 30.Wherein, the bottom surface forms a groove 32 around these heat-conductive assembly 30 tool projections 31, and this groove 32 can make in barrier assembly 20 is placed in.Wherein, the projection 31 of this heat-conductive assembly 30 must meet the decrement that can reduce barrier assembly 20, and the heat transferred that will this hot assembly 10 be absorbed is to heat-conductive assembly 30 bodies, present which kind of situation as for bottom surface with heat-conductive assembly 30, then non-emphasis of the present utility model, certainly also can be as shown in Figure 7, though this projection 31 is depressed in the bottom surface of heat-conductive assembly 30, but, with respect to groove 32, this projection 31 is just like the aspect of protruding, and therefore, the situation that the bottom surface presented of this projection 31 and this heat-conductive assembly 30 is not from ought be in limited range of the present utility model.
Therefore, the utility model provides a kind of structure that blocks the thermal interface material overflow of improvement, not only can solve the pollution load of overflow phenomenon and the issuable electrical short danger of thermal interface material Yin Wendu rising transition effectively, has industry applications deeply, and can be in having under enough constant intensities, can avoid the excessive compression of barrier assembly, to such an extent as to because insufficient space forces thermal interface material to flow out, so the utility model has progressive.
Below the utility model is described in detail, only the above only is preferred embodiment of the present utility model, when not limiting the scope that the utility model is implemented.Be that all equalizations of doing according to the utility model claims change and modify etc., all should still belong in the patent covering scope of the present utility model.
Claims (10)
1. the structure that blocks the thermal interface material overflow of an improvement is characterized in that, includes:
One hot assembly, the source that produces heat;
One thermal interface material is in order to improve the radiating efficiency of this hot assembly;
The barrier assembly of one hollow, in order to circle be located at this hot assembly around; And
One heat-conductive assembly, this heat-conductive assembly has a projection, and contact across the hot assembly of this thermal interface material and this, wherein, this projection is in order to the heat that absorbs this hot assembly and produce and reach this heat-conductive assembly itself, this heat-conductive assembly also contacts with this barrier assembly, and this thermal interface material is subjected to projection when extruding of this heat-conductive assembly, this thermal interface material to have part to flow to this barrier assembly and enclose and be located at hot assembly space on every side.
2. the structure that blocks the thermal interface material overflow of improvement as claimed in claim 1, wherein, aforementioned projection can be contacted with hot assembly soon after this heat-conductive assembly is contacted with barrier assembly, to prevent the excess compression of barrier assembly, wherein, aforementioned projection is slightly less than the internal diameter of this barrier assembly, this barrier assembly can be enclosed be located at around it.
3. the structure that blocks the thermal interface material overflow of improvement as claimed in claim 1, wherein, aforementioned barrier assembly has elasticity.
4. the structure that blocks the thermal interface material overflow of improvement as claimed in claim 3, wherein, aforementioned barrier assembly is a made from porous material.
5. the structure that blocks the thermal interface material overflow of improvement as claimed in claim 1, wherein, the internal diameter of aforementioned barrier assembly and highly be slightly larger than the aforementioned hot assembly.
6. the structure that blocks the thermal interface material overflow of improvement as claimed in claim 1, wherein, aforementioned projection just can contact the surface of hot assembly.
7. the structure that blocks the thermal interface material overflow of improvement as claimed in claim 1, wherein, aforementioned heat-conductive assembly has a groove around projection, just can make in aforementioned barrier assembly is placed in.
8. the structure that blocks the thermal interface material overflow of improvement as claimed in claim 1, wherein, the aforementioned hot interface material is a phase-transition material, when this phase-transition material raises in hot assembly temperature, will fade to liquid phase by solid phase.
9. the structure that blocks the thermal interface material overflow of improvement as claimed in claim 1, wherein, the aforementioned hot interface material is a phase-transition material, when this phase-transition material raises in hot assembly temperature, will fade to the glue phase by solid phase.
10. the structure that blocks the thermal interface material overflow of improvement as claimed in claim 1, wherein, the aforementioned hot assembly is an electronic building brick.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420006491 CN2698031Y (en) | 2004-03-30 | 2004-03-30 | Improved overflow structure of heat-resisting and heat-insulating interface material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420006491 CN2698031Y (en) | 2004-03-30 | 2004-03-30 | Improved overflow structure of heat-resisting and heat-insulating interface material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2698031Y true CN2698031Y (en) | 2005-05-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200420006491 Expired - Fee Related CN2698031Y (en) | 2004-03-30 | 2004-03-30 | Improved overflow structure of heat-resisting and heat-insulating interface material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2698031Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101326867B (en) * | 2005-12-13 | 2012-03-21 | B2电子有限公司 | Arrangement comprising at least one electronic component |
| CN106486435A (en) * | 2016-09-29 | 2017-03-08 | 努比亚技术有限公司 | A kind of encapsulating method of conducting-heat elements |
-
2004
- 2004-03-30 CN CN 200420006491 patent/CN2698031Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101326867B (en) * | 2005-12-13 | 2012-03-21 | B2电子有限公司 | Arrangement comprising at least one electronic component |
| CN106486435A (en) * | 2016-09-29 | 2017-03-08 | 努比亚技术有限公司 | A kind of encapsulating method of conducting-heat elements |
| CN106486435B (en) * | 2016-09-29 | 2019-02-15 | 努比亚技术有限公司 | A kind of encapsulating method of conducting-heat elements |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |