CN2694096Y - LED light string structure - Google Patents

LED light string structure Download PDF

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Publication number
CN2694096Y
CN2694096Y CNU2004200479287U CN200420047928U CN2694096Y CN 2694096 Y CN2694096 Y CN 2694096Y CN U2004200479287 U CNU2004200479287 U CN U2004200479287U CN 200420047928 U CN200420047928 U CN 200420047928U CN 2694096 Y CN2694096 Y CN 2694096Y
Authority
CN
China
Prior art keywords
platform
string structure
led lamp
lamp string
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNU2004200479287U
Other languages
Chinese (zh)
Inventor
王宗杰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHEN XIANDA
Original Assignee
SHEN XIANDA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHEN XIANDA filed Critical SHEN XIANDA
Priority to CNU2004200479287U priority Critical patent/CN2694096Y/en
Application granted granted Critical
Publication of CN2694096Y publication Critical patent/CN2694096Y/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)

Abstract

The utility model provides an LED light string structure. The utility model comprises at least one luminescence wafer, and two conducting wires having insulated coating layers; wherein, according to an appropriate length which is positioned between the two conducting wires, a platform is arranged on the one conducting wire. A luminescence wafer is arranged on the platform which can directly form or uses a nice metal filament to form an electronic connection with the two conducting wires, a transparent material sealant which is arranged on the luminescence wafer can finish the covering of the luminescence wafer, and the platform, the luminescence wafer, the metal filament and the conducting wire which are positioned at the part are covered by the sealant. The structure is adopted, so the utility model has the efficiencies and characters of volume narrowing, easy installation, cost reducing, wide-angle irradiation, water proof and bending deflection.

Description

LED lamp string structure
Technical field
The utility model relates to a kind of lamp string structure, refers in particular to a kind of effect that reaches reduced volume, is easy to install and reduce cost, and has the LED lamp string of the characteristic of wide-angle irradiation waterproof and flexible.
Background technology
Known LED structure as shown in Figure 4, mainly form a post lamp shape by sealing 5, in this sealing 5, be provided with two relative pole pieces 60,61, be provided with a luminescent wafer 1 in a pole piece 60 wherein, this luminescent wafer 1 is done electric connection with imperceptible wire 30 and two pole pieces 60,61, this two pole piece 60,61 forms legs 62,63 downwards, and passes sealing 5 and join with power supply.
According to above-mentioned structure, the LED lamp string that if known LED will be serially connected make Christmas lamp and so on, the leg of a plurality of known LED need be welded in one has on the lead of positive supply, again another leg being welded in one has on the lead of negative supply, therefore its manufacturing process is loaded down with trivial details, production cost is higher, influences its market competitiveness.
Moreover because sealing, pole piece and the leg of known LED lamp string all protrude from lead, so its whole volume is bigger, installation is difficult for, and the light of known LED only can be by the top ejaculation of sealing, so its light irradiation is less, also attractive in appearance inadequately, the user is caused very big puzzlement.
The design people has the disappearance of stating known LED lamp string structure in view of this, and the whence studies intensively, and long-pending individual is engaged in the many years of experience of this cause, designs a kind of brand-new LED lamp string structure eventually.
Summary of the invention
The technical problems to be solved in the utility model is: a kind of LED lamp string structure is provided, and it can reach reduced volume, be easy to install and reduce the effect of cost, and has the advantage of wide-angle irradiation, waterproof and flexible.
For reaching above-mentioned purpose, the utility model LED lamp string structure comprises a luminescent wafer at least, and two leads with insulation coating layer, wherein, this two lead is provided with a platform every a suitable length in a lead wherein, be provided with a luminescent wafer in this platform, this luminescent wafer can directly or with imperceptible wire and two leads be done electric connection, and finish coating with the sealing of a transparent material in this wafer placement, this sealing can be coated on platform, luminescent wafer, wire and the lead that is positioned at this place wherein.
Aforesaid LED lamp string structure, luminescent wafer wherein can directly be done electric connection with two leads.
Aforesaid LED lamp string structure, lead wherein is an enamel-covered wire.
Aforesaid LED lamp string structure, lead wherein be one be coated with the insulation glued membrane cable.
Aforesaid LED lamp string structure, the outer rim of cable wherein is provided with the support that an iron plate is made every a suitable length, and the end face of this support is provided with a platform.
According to above-mentioned structure, LED lamp string structure of the present utility model can reach reduced volume, be easy to install and reduce the effect of cost, and has the characteristic of wide-angle irradiation, waterproof and flexible, and this structure also can effectively reduce production costs, and improves Enterprises'Competitiveness.
Description of drawings
Fig. 1 is a three-dimensional exploded view of the present utility model;
Fig. 2 is a three-dimensional combination figure of the present utility model;
Fig. 3 is the cutaway view of another embodiment of the utility model;
Fig. 4 is the stereogram of known LED.
The drawing reference numeral explanation:
1, luminescent wafer 2,3, lead 4, cable 5, sealing
20, platform 21, support 30, wire 40, insulation glued membrane
60,61, pole piece 62,63, leg
The specific embodiment
In order further to understand structure of the present utility model, device and special efficacy thereof, now lift a preferable possible embodiments and a conjunction with figs. and be described in detail as follows:
Please arrange in pairs or groups shown in Fig. 1,2, LED lamp string structure of the present utility model, it reaches two 2,3 in leads with insulation coating layer and combines at least by a luminescent wafer 1, wherein:
This two lead 2,3 is provided with a platform 20 every a suitable length in a lead 2 wherein, be provided with a luminescent wafer 1 in this platform 20, this luminescent wafer 1 can directly or with imperceptible wire 30 and two leads 2,3 be done electric connection, and finish coating with the sealing 5 of a transparent material in the placement of this luminescent wafer 1, this sealing 5 can be coated on platform 20, luminescent wafer 1, wire 30 and the lead 2,3 that is positioned at this place wherein.
Above-mentioned lead can be an enamel-covered wire, and utilizes mold pressing or lapping mode to form a platform in the outer rim of this enamel-covered wire.
The continuous lead shown in Figure 3, above-mentioned 2,3 that please refer to also can be the cable 4 that is coated with insulation glued membrane 40, and is provided with the support 21 that an iron plate is made in the outer rim of this cable 4 every a suitable length, is provided with a platform 20 in the end face of this support 21.
As mentioned above,, LED lamp string structure of the present utility model coats and combination because can utilizing sealing that luminescent wafer, wire and lead are done, therefore effective reduced volume, and have good water proofing property; In addition, as coating and the object of combination can make structure of the present utility model more tough, the characteristic of flexible is arranged, can do the bending or the winding of various angles with sealing, and not fragile; In addition, because be different from the welding that known needs are done pin,, and reach the effect that reduces production costs so always the equalization mode is made and finished.
Moreover the light of LED lamp string structure of the present utility model luminescent wafer wherein can be gone out by the scattering all around of sealing, reaches the effect of wide-angle irradiation, the radiance that it is sent are more apparent dazzle beautiful.
In sum, LED lamp string structure of the present utility model can reach reduced volume really, and has good The effect of water proofing property, flexible and wide-angle irradiation, and the improvement of this structure also can effectively reduce production costs.

Claims (5)

1. LED lamp string structure, it comprises at least by a luminescent wafer and two leads with insulation coating layer, it is characterized in that:
This two lead is to be provided with a platform every a suitable length in a lead wherein, be provided with a luminescent wafer in this platform, this luminescent wafer can imperceptible wire and two leads do electric connection, and in the placement of this luminescent wafer with the sealant covers setting of a transparent material, this sealing can be coated on platform, luminescent wafer, wire and the lead that is positioned at this place wherein.
2. LED lamp string structure as claimed in claim 1 is characterized in that: described luminescent wafer can directly be done electric connection with two leads.
3. LED lamp string structure as claimed in claim 1 is characterized in that: described lead is an enamel-covered wire.
4. LED lamp string structure as claimed in claim 1 is characterized in that: described lead be one be coated with the insulation glued membrane cable.
5. LED lamp string structure as claimed in claim 4, it is characterized in that: the outer rim of described cable is provided with the support that an iron plate is made every a suitable length, and the end face of this support is provided with a platform.
CNU2004200479287U 2004-03-31 2004-03-31 LED light string structure Expired - Lifetime CN2694096Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2004200479287U CN2694096Y (en) 2004-03-31 2004-03-31 LED light string structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2004200479287U CN2694096Y (en) 2004-03-31 2004-03-31 LED light string structure

Publications (1)

Publication Number Publication Date
CN2694096Y true CN2694096Y (en) 2005-04-20

Family

ID=34776203

Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2004200479287U Expired - Lifetime CN2694096Y (en) 2004-03-31 2004-03-31 LED light string structure

Country Status (1)

Country Link
CN (1) CN2694096Y (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7989837B2 (en) 2007-12-19 2011-08-02 Foxsemicon Integrated Technology, Inc. Light chain

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7989837B2 (en) 2007-12-19 2011-08-02 Foxsemicon Integrated Technology, Inc. Light chain
CN101465394B (en) * 2007-12-19 2011-11-09 富士迈半导体精密工业(上海)有限公司 Light-emitting diode, light-emitting diode string

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CX01 Expiry of patent term

Expiration termination date: 20140331

Granted publication date: 20050420