CN2669740Y - Heat exchanger of semiconductor cold warm cup seat - Google Patents
Heat exchanger of semiconductor cold warm cup seat Download PDFInfo
- Publication number
- CN2669740Y CN2669740Y CNU200320118337XU CN200320118337U CN2669740Y CN 2669740 Y CN2669740 Y CN 2669740Y CN U200320118337X U CNU200320118337X U CN U200320118337XU CN 200320118337 U CN200320118337 U CN 200320118337U CN 2669740 Y CN2669740 Y CN 2669740Y
- Authority
- CN
- China
- Prior art keywords
- heat exchanger
- semiconductor
- cup seat
- drinking cup
- ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model relates to a heat exchanger of semiconductor cold-warm cup seat, consisting of an annular heat exchanger and a fan installed in an annular hole, and the inner side of the annular heat exchanger is fin-shaped. The heat exchanger of the structure can effectively raise the semiconductor cooling and warming efficiencies of the semiconductor cold-warm cup seat.
Description
Technical field
The utility model relates to semiconductor refrigerating and heats technology, more particularly, relates to a kind of heat-exchange device that can be used for effectively improving semiconductor refrigerating, heats a kind of semiconductor changes in temperature drinking cup stand of usefulness.
Background technology
Mainly by being installed in semiconductor refrigerating on the glass stand, heating chip and connected heat exchanger constitutes, water tumbler places on the heat exchanger semiconductor changes in temperature drinking cup stand.Semiconductor refrigerating, the utilization that heats chip usefulness mainly rely on connected heat exchanger, existing heat exchanger all is to rely on directly to contact to transmit heat or utilize radiator fan drive air-flow to transmit heat, these two kinds of heat exchange methods all do not form the environment of a sealing, and the heat major part been has all has been scattered and disappeared through air in transmission.
The utility model content
The purpose of this utility model is the problem that exists at prior art, a kind of effective raising semiconductor refrigerating is provided, heats the heat-exchange device of the semiconductor changes in temperature drinking cup stand of usefulness.
The heat-exchange device of semiconductor changes in temperature drinking cup stand of the present utility model is made of ring-shaped heat exchanger and the fan that is installed in the annular distance, and described ring-shaped heat exchanger inboard is the fin shape.
Described ring-shaped heat exchanger can be rounded or square.
The utility model compared with prior art has following advantage:
1. this novel employing ring-shaped heat exchanger can make air all contact with the fin of heat exchanger on fan turnover wind both sides under the state of sealing, increases the efficient of heat exchange;
2. fan is stood in the centre of heat exchanger, can quicken flowing of inner air, accelerate the speed of heat exchange;
3. annular distribution has fin on the circular heat exchanger inwall, increases heat exchange area.
Description of drawings
Fig. 1 is the utility model structural representation;
Fig. 2 is the structural representation that the utility model is used for semiconductor changes in temperature drinking cup stand.
The specific embodiment
As shown in Figure 1, the heat-exchange device of semiconductor changes in temperature drinking cup stand of the present utility model is made of ring-shaped heat exchanger 1 and the fan 2 that is installed in the annular distance, and described ring-shaped heat exchanger 1 can be rounded, and described ring-shaped heat exchanger 1 inboard is the fin shape.
As shown in Figure 2, be installed in semiconductor refrigerating on the glass stand 4, heat chip 3 and be connected with ring-shaped heat exchanger 1, fan 2 is installed in the annular distance of ring-shaped heat exchanger, and water tumbler 5 places on the ring-shaped heat exchanger.
Because the ring-shaped heat exchanger 1 in drinking cup stand closely contacts with semiconductor chip 3, the heat of semiconductor chip 3 (refrigerating capacity) is delivered on the ring-shaped heat exchanger 1, the shape that is processed into fin around the endoporus can increase the area of heat exchange, place a fan in the middle of the ring-shaped heat exchanger inboard, when when work is placed on water tumbler 5 and makes a glass shell inner chamber on the drinking cup stand, heat exchanger, form an airtight space between the drinking cup stand, utilize the draught head on fan both sides whole confined space to be formed the air-flow of one circulation, the outer surface that the heat of heat exchanger (refrigerating capacity) is taken to water tumbler cup courage heats (cooling) to the liquid inside the water tumbler, then along with the air-flow Returning heat-exchanger.The gas that does not also carry out heat exchange can be utilized again, improved the usefulness of heating (refrigeration) greatly.
Claims (3)
1, a kind of heat-exchange device of semiconductor changes in temperature drinking cup stand is characterized in that being made of ring-shaped heat exchanger and the fan that is installed in the annular distance, and described ring-shaped heat exchanger inboard is the fin shape.
2, the heat-exchange device of semiconductor changes in temperature drinking cup stand according to claim 1 is characterized in that described ring-shaped heat exchanger is rounded.
3, the heat-exchange device of semiconductor changes in temperature drinking cup stand according to claim 1 is characterized in that described ring-shaped heat exchanger is square.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU200320118337XU CN2669740Y (en) | 2003-11-21 | 2003-11-21 | Heat exchanger of semiconductor cold warm cup seat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU200320118337XU CN2669740Y (en) | 2003-11-21 | 2003-11-21 | Heat exchanger of semiconductor cold warm cup seat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2669740Y true CN2669740Y (en) | 2005-01-12 |
Family
ID=34475489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU200320118337XU Expired - Fee Related CN2669740Y (en) | 2003-11-21 | 2003-11-21 | Heat exchanger of semiconductor cold warm cup seat |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2669740Y (en) |
-
2003
- 2003-11-21 CN CNU200320118337XU patent/CN2669740Y/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |