CN2665921Y - Improved radiator - Google Patents
Improved radiator Download PDFInfo
- Publication number
- CN2665921Y CN2665921Y CN 200320100806 CN200320100806U CN2665921Y CN 2665921 Y CN2665921 Y CN 2665921Y CN 200320100806 CN200320100806 CN 200320100806 CN 200320100806 U CN200320100806 U CN 200320100806U CN 2665921 Y CN2665921 Y CN 2665921Y
- Authority
- CN
- China
- Prior art keywords
- radiating fin
- heat radiation
- heat abstractor
- base plate
- improved heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to an improved radiation device, comprising plural of radiation fins arranged layer by layer, wherein, each two adjacent radiation fins are provided with a radiation clearance; the bending part of the bottom edge of the radiation fin is provided with an adhesive part and plural of accommodating grooves which are embedded internally with radiation tubes with smooth contact plane to lead the contact plane of the radiation pipe and the adhesive part of the radiation fins to stick to preset chips, radiation base plates covering the outer edge of the chips or the upper surface of a bottom board positioned at the bottom of the radiation fins to realize a quick radiation.
Description
Technical field
The utility model relates to a kind of improved heat abstractor, refers to a kind of heat abstractor that is used for computer chip especially.The root edge of this radiating fin is provided with a plurality of storage tanks, then be embedded with heat radiation conduit in the storage tank, the contact-making surface of this heat radiation conduit and the sticking part of radiating fin can support on the backplate surface be affixed on default chip, heat-radiating substrate that the chip outer rim is coated or radiating fin.
Background technology
The calculation function of computer is all the more powerful now, and its arithmetic speed also promotes rapidly, and its global shape, structure and need to break through traditional design especially with the motherboard connected mode, this is the major reform of computer circle.The calculation function of hypervelocity because central processing unit of new generation is carried under one's arms, the temperature that also makes central processing unit be produced when handling operational order is higher, so how to utilize good heat conduction and cooling system to make central processing unit operate as normal under the temperature that it allowed, be considered as very important problem by industry.Thus, promptly there is the dealer that a kind of heat abstractor that is provided with heat pipe is provided, sees also shown in Figure 7ly, be present heat abstractor perspective exploded view.By can clearly be seen that among the figure, this kind heat abstractor A is made up of a plurality of fin A1 and heat pipe A2, wherein fin A1 surface is provided with a plurality of interlocking A11 of portion, and fin A1 central authorities be provided with the perforation A12, and the A11 of interlocking portion of above-mentioned fin A1 can with the mutual chimeric location of the A11 of interlocking portion of another fin A1; The perforation A12 of fin A1 can be equipped with heat pipe A2, makes heat abstractor A can reach the purpose of heat radiation by fin A1 and heat pipe A2; Yet, though above-mentioned prior art has certain radiating effect, when using, reality still has following deficiency:
(1) traditional fin A1 is passed to thermal source heat pipe A2 indirectly and dispels the heat, so the radiating efficiency of heat pipe A2 and can't effectively bringing into play.
(2) traditional fin A1 and the location between fin A1 utilize the A11 of interlocking portion to wear the location mutually; Thus, the location between each fin A1 also more built on the sand.
(3) traditional heat pipe A2 is round bar shape, so support when being affixed on the upper surface of chip as heat pipe A2, then can form line contact form; So its heat transfer efficiency can't effectively increase.
Thus, how to improve the deficiency and the defective of above-mentioned conventional art, be and be engaged in this journey dealer and desire most ardently improved direction place.
Summary of the invention
Main purpose of the present utility model is to provide a kind of improved heat abstractor, the technical characterictic of this heat abstractor is that the root edge of radiating fin is provided with a plurality of storage tanks, and in storage tank, then be embedded with heat radiation conduit, and the root edge of radiating fin is bent with smooth sticking part, and the heat radiation conduit root edge is formed with smooth contact-making surface, is affixed on heat-radiating substrate or the radiating fin plate upper surface set in the bottom that default chip, chip outer rim are coated so that the sticking part of the contact-making surface of heat radiation conduit and radiating fin can support.
Secondary objective of the present utility model is provides this improved heat abstractor, the radiating fin of its a plurality of stacked arrangements is provided with buckling parts in both sides, and buckling parts is provided with button and holds sheet and buckle, and the button of buckling parts holds sheet and can be fastened on the set buckle by the radiating fin that each is adjacent, and then reaches firm location.
Another purpose of the present utility model is to provide this improved heat abstractor, and the end face of its radiating fin is positioned with fan, can blow cooling air via the gap of each radiating fin to radiating fin and chip by fan.
A purpose more of the present utility model is that the contact-making surface root edge of the sticking part of radiating fin and heat radiation conduit is provided with the base plate of a plurality of heat radiation conduits, and the root edge of base plate can fit in chip surface, and the heat radiation conduit of base plate then can support the sticking part root edge be affixed on radiating fin and be staggered with the heat radiation conduit of radiating fin.
For reaching above-mentioned purpose and structure, technological means that the utility model adopted and effect thereof illustrate with preferred embodiment of the present utility model now in conjunction with the accompanying drawings in detail.
Description of drawings
Fig. 1 is the utility model monomer radiating fin schematic perspective view.
Fig. 2 is a three-dimensional exploded view of the present utility model.
Fig. 3 is the stereo appearance figure after the utility model overall package.
Fig. 4 installs the side cutaway view of electric fan additional for the utility model.
Fig. 5 installs the side cutaway view of base plate and heat radiation conduit additional for the utility model.
Fig. 6 installs the side cutaway view of heat-radiating substrate additional for the utility model.
Fig. 7 is the three-dimensional exploded view of traditional heat-dissipating device.
Symbol description among the figure
1 radiating fin
11 holding pieces, 141 buttons are held sheet
12 storage tanks, 142 buckles
13 holding pieces, 15 heat radiation gaps
14 buckling partss
2 heat radiation conduits
21 contact-making surfaces
3 wiring boards
31 chips, 311 heat-radiating substrates
4 fans
5 base plates
51 heat radiation conduits
A traditional heat-dissipating device
A1 fin A2 heat pipe
The A11 interlocking A12 of portion perforation
Embodiment
See also Fig. 1, Fig. 2, shown in Figure 3, be the decomposition of the utility model monomer radiating fin, heat abstractor, the assembling schematic diagram, this device includes a plurality of radiating fins 1 and heat radiation conduit 2 constitutes, wherein:
As shown in Figure 1, this radiating fin 1 is bent with sticking part 11 and is provided with a plurality of storage tanks 12 in root edge, and then be bent with a plurality of holding pieces 13 in the surface of radiating fin 1, and be provided with buckling parts 14 in the both sides of radiating fin 1, buckling parts 14 then is provided with button simultaneously and holds sheet 141 and buckle 142.
As shown in Figure 2, above-mentioned a plurality of radiating fin 1 can the stacked arrangement setting, and between each adjacent radiating fin 1, be formed with the heat radiation gap 15, and radiating fin 1 is in 13 surfaces that are held in each adjacent radiating fin 1 of a plurality of holding pieces that the surface bent, and the buckling parts 14 on the radiating fin 1 has button and holds sheet 141 and buckle 142, radiating fin 1 clip that this structure is adjacent with each is as a whole, and then makes a plurality of radiating fins 1 form firm location.
The bottom surface of this heat radiation conduit 2 is smooth contact-making surface 21.
As shown in Figure 3, assembling by above-mentioned member, heat radiation conduit 2 is embedded in a plurality of storage tanks 12 of radiating fin 1, even the contact-making surface of heat radiation conduit 2 21 forms a smooth supporting surface with sticking part 11 root edges of radiating fin 1, and then radiating fin 1 and heat radiation conduit 2 can be fitted in the surface of presetting the chip 31 on the wiring board 3, can finish the assembling of the utility model integral body.
Please consult shown in Figure 4 simultaneously, side cutaway view for the utility model preferred embodiment, can find out by clear among the figure, the utility model can be positioned with fan 4 in the apical margin of a plurality of radiating fins 1, dispel the heat so that fan 4 can directly blow cooling air to chip 31 surfaces of wiring board 3 via the heat radiation gap 15 of radiating fin 1, and the thermal source that can be by radiating fin 1 be produced during with chip 31 runnings with heat radiation conduit 2 leaves fast.
Please consult shown in Figure 5 simultaneously, side cutaway view for another preferred embodiment of the utility model, can find out by clear among the figure, the utility model also can be provided with a base plate 5 in radiating fin 1 and 31 of chips, and radiating fin 1 supports with 2 of heat radiation conduits and is affixed on base plate 5 surfaces, and the root edge of base plate 5 then can fit in chip 31 surfaces; Moreover above-mentioned base plate 5 also is equipped with a plurality of heat radiation conduits 51 simultaneously, and 51 of the heat radiation conduits of base plate 5 are staggered with above-mentioned heat radiation conduit 2 formation, and simultaneously to being affixed on sticking part 11 root edges of radiating fin 1 and the contact-making surface 21 of heat radiation conduit 2.
Please consult shown in Figure 6 simultaneously, be the utility model side cutaway view of a preferred embodiment again, can find out by clear among the figure, the utility model also can be coated with heat-radiating substrate 311 in chip 31 outer rims, and radiating fin 1 can support with 2 of heat radiation conduits and be affixed on heat-radiating substrate 311 surfaces, and then can reach the effect of heat radiation.
Moreover the utility model can be filled with cooling fluid in use in heat radiation conduit 2,51, can reach the effect of water-cooled heat radiation.
Thus, the architecture advances of the utility model heat abstractor mainly is provided with a plurality of storage tanks by the root edge of radiating fin, and in storage tank, then be embedded with heat radiation conduit, be affixed on heat-radiating substrate or the radiating fin plate upper surface set that default chip, chip outer rim are coated so that the sticking part of the contact-making surface of heat radiation conduit and radiating fin can support, and above-mentioned base plate can be pottery or metal material is made in the bottom; So, the utility model is above-mentioned only with the preferred implementation explanation, be not so promptly limit to claim of the present utility model, so the simple and easy modification and the equivalent structure that use the utility model specification and graphic content to do such as change, all should in like manner be contained in the claim of the present utility model, close and give Chen Ming.
In sum, the improved heat abstractor of the utility model can reach its effect and purpose in use really, so the utility model really is the design of a practicality excellence, meets the important document of patent application in fact, files an application in accordance with the law.
Claims (11)
1. an improved heat abstractor includes the radiating fin of a plurality of stacked arrangements, and is provided with the heat radiation gap between each adjacent radiating fin, it is characterized in that:
This radiating fin root edge is bent with sticking part, and is provided with a plurality of storage tanks, is embedded with the heat radiation conduit of the smooth contact-making surface of tool in the storage tank, and the sticking part root edge of the contact-making surface of heat radiation conduit and radiating fin supports the upper surface that is affixed on chip.
2. a kind of improved heat abstractor as claimed in claim 1, wherein the surface of this radiating fin is for being bent with a plurality of holding pieces, and this holding piece is held in the surface of each adjacent radiating fin.
3. a kind of improved heat abstractor as claimed in claim 1, wherein the both sides of this radiating fin are provided with buckling parts, and this buckling parts is provided with button and holds sheet and buckle, and it is as a whole that button is held sheet radiating fin clip each is adjacent with buckle.
4. a kind of improved heat abstractor as claimed in claim 1, wherein the end face of this radiating fin is positioned with fan.
5. a kind of improved heat abstractor as claimed in claim 1, wherein the contact-making surface root edge of the sticking part of this radiating fin and heat radiation conduit is provided with base plate, and the root edge of this base plate fits in chip surface.
6. a kind of improved heat abstractor as claimed in claim 5, wherein this base plate is equipped with a plurality of heat radiation conduits, and the heat radiation conduit of this base plate supports the sticking part root edge that is affixed on radiating fin.
7. a kind of improved heat abstractor as claimed in claim 5, wherein the heat radiation conduit of the heat radiation conduit of this base plate and radiating fin is staggered.
8. a kind of improved heat abstractor as claimed in claim 5, wherein this base plate is that metal material is made.
9. a kind of improved heat abstractor as claimed in claim 5, wherein this base plate is that ceramic material is made.
10. a kind of improved heat abstractor as claimed in claim 1, wherein this chip outer rim is coated with heat-radiating substrate.
11. a kind of improved heat abstractor as claimed in claim 10, wherein this heat-radiating substrate is that ceramic material is made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200320100806 CN2665921Y (en) | 2003-10-09 | 2003-10-09 | Improved radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200320100806 CN2665921Y (en) | 2003-10-09 | 2003-10-09 | Improved radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2665921Y true CN2665921Y (en) | 2004-12-22 |
Family
ID=34339398
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200320100806 Expired - Lifetime CN2665921Y (en) | 2003-10-09 | 2003-10-09 | Improved radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2665921Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103987231A (en) * | 2013-02-08 | 2014-08-13 | 技嘉科技股份有限公司 | Heat sink and method for manufacturing the same |
| CN107883360A (en) * | 2016-09-30 | 2018-04-06 | 惠普赛天使公司 | LED radiator |
-
2003
- 2003-10-09 CN CN 200320100806 patent/CN2665921Y/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103987231A (en) * | 2013-02-08 | 2014-08-13 | 技嘉科技股份有限公司 | Heat sink and method for manufacturing the same |
| CN107883360A (en) * | 2016-09-30 | 2018-04-06 | 惠普赛天使公司 | LED radiator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: YUANRUI SCIENCE AND TECHNOLOGY CO., LTD.; PATENTE Free format text: FORMER OWNER: YUANRUI SCIENCE AND TECHNOLOGY CO., LTD. Effective date: 20080627 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20080627 Address after: No. 173-2, Great Lakes Road, Xiangshan District, Taiwan, Hsinchu: Co-patentee after: Xiao Fuyuan Patentee after: THERMOSHUTTLE CO.,LTD. Address before: No. 173-2, Great Lakes Road, Xiangshan District, Taiwan, Hsinchu: Patentee before: THERMOSHUTTLE CO.,LTD. |
|
| ASS | Succession or assignment of patent right |
Owner name: SHENGYE TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: XIAO FUYUAN Effective date: 20110715 Owner name: XIAO FUYUAN Free format text: FORMER OWNER: YUANRUI SCIENCE AND TECHNOLOGY CO., LTD. Effective date: 20110715 Free format text: FORMER OWNER: XIAO FUYUAN |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: NO. 173-2, DAHU ROAD, XIANGSHAN DISTRICT, HSINCHU CITY, TAIWAN, CHINA TO: TAIPEI COUNTY, TAIWAN, CHINA Free format text: CORRECT: ADDRESS; FROM: TAIPEI COUNTY, TAIWAN, CHINA TO: BUILDING 12, NO. 123-9, XINGDE ROAD, SANCHONG DISTRICT, NEW TAIPEI CITY, TAIWAN, CHINA |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20110715 Address after: Chinese Taiwan New Taipei City three District Road No. 9 Hing 123 12 floor Patentee after: SHENGYE TECHNOLOGY Co.,Ltd. Address before: Taiwan County, Taipei, China Patentee before: Xiao Fuyuan Effective date of registration: 20110715 Address after: Taiwan County, Taipei, China Patentee after: Xiao Fuyuan Address before: Xiangshan Road, Hsinchu, Taiwan, China Lake Road, No. 173-2 Co-patentee before: Xiao Fuyuan Patentee before: THERMOSHUTTLE CO.,LTD. |
|
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20131009 Granted publication date: 20041222 |
|
| C35 | Partial or whole invalidation of patent or utility model | ||
| IP01 | Partial invalidation of patent right |
Commission number: 5W101321 Conclusion of examination: Claim No. 200320100806.5 of the utility model 1-4 is invalid, and the patent shall be maintained on the basis of claim 5-11. Decision date of declaring invalidation: 20110815 Decision number of declaring invalidation: 17058 Denomination of utility model: Improved radiator Granted publication date: 20041222 Patentee: SHENGYE TECHNOLOGY Co.,Ltd.|Xiao Fuyuan |