CN2660413Y - Metallic semiconductor refrigerating sheet - Google Patents
Metallic semiconductor refrigerating sheet Download PDFInfo
- Publication number
- CN2660413Y CN2660413Y CN 200320116620 CN200320116620U CN2660413Y CN 2660413 Y CN2660413 Y CN 2660413Y CN 200320116620 CN200320116620 CN 200320116620 CN 200320116620 U CN200320116620 U CN 200320116620U CN 2660413 Y CN2660413 Y CN 2660413Y
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- China
- Prior art keywords
- metal
- conducting film
- utility
- semiconductor
- model
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
A metal semiconductor refrigerating plate comprises a layer metal oxide film arranged on the surface of a metal radiating plate, an electrical insulating layer with heat conducting function arranged on the surface of the metal oxide film and an electrical conducting film arranged on the electrical conducting layer. After the required figure is etched on the electrical conducting film, the PN junction of the semiconductor is welded on the electrical conducting film between two metal radiating plates to form a complete metal semiconductor refrigerating plate. The utility model has the beneficial effect that: 1. low energy consumption; 2. the refrigerating plate is integrated with the heat radiating plate without contact surface between two plates; 3. the utility model can radiate heat directly; 4. low fabrication cost; 5. good stability and non-shattering; 6. easy installation and durability; 7. the utility model can be manufactured with arbitrary size and arbitrary shape, which break through the bottleneck of ceramic plate.
Description
Technical field
The utility model relates to a kind of metal semiconductor cooling piece, particularly a kind of metal semiconductor cooling piece that is widely used in household electric appliances such as air-conditioning, refrigerator.
Background technology
Household electric appliances comprised industrial aspect in the past, and the semiconductor refrigerating equipment that is adopted all adopts ceramic cooling piece, and ceramic cooling piece exists the shortcoming that self can't overcome: 1, energy consumption is big; 2, the contact-making surface of cooling piece and fin is imperfect; 3, can not directly dispel the heat; 4, manufacturing cost height; 5, poor stability, frangible; 6, difficulty is installed, damages easily; 7,, cause cooling piece being accomplished any size and arbitrary deformation because of potsherd bottleneck reason.
Summary of the invention
The purpose of this utility model is: overcome the deficiency of above-mentioned semiconductor chilling plate, a kind of metal semiconductor cooling piece simple in structure that is applicable to the compressor-free of household electric appliances such as refrigerator, air-conditioning, no cold-producing medium, environment-friendly type is provided.
The technical scheme that its technical problem that solves the utility model adopts is:
The semiconductor chilling plate of metal, form by heat dissipation metal plate, metal oxide layer, insulating barrier, conducting film and semiconductor PN connection, it is characterized in that it is handled through oxide isolated by the metal fin surface forms the layer of metal oxide-film, on the metal oxide film surface, enclose one deck not only heat conduction but also nonconducting insulating barrier, one deck conducting film will be enclosed again on the insulating barrier, with conducting film corrode into behind the needed figure again with semiconductor PN with the tin soldering on the conducting film in the middle of two fin, form a complete metal semiconductor cooling piece.
The beneficial effects of the utility model are: 1, energy consumption is little; 2, do not exist the contact-making surface problem of cooling piece and fin because they are incorporate; 3, can directly dispel the heat; 4, at the bottom of the manufacturing cost; 5, good stability, non-friable; 6, install easily, not fragile; 7, broken the potsherd bottleneck, cooling piece can be accomplished any size and arbitrary deformation.
Description of drawings
Below in conjunction with drawings and Examples the utility model is further specified.
Fig. 1 is a structure chart of the present utility model;
The specific embodiment
A kind of semiconductor chilling plate of metal, handle formation layer of metal oxide-film 2 on metal fin 1 surface through oxide isolated, on metal oxide film 2 surfaces, enclose one deck not only heat conduction but also nonconducting insulating barrier 3 again, one deck conducting film 4 will be enclosed again on the insulating barrier 3, conducting film 4 is corroded into behind the needed figure semiconductor PN 5,6 usefulness tin solderings on the conducting film 4 in the middle of two fin again, form a complete metal semiconductor cooling piece.
Claims (1)
1, a kind of semiconductor chilling plate of metal, it is characterized in that: handle formation layer of metal oxide-film (2) through oxide isolated on metal fin (1) surface, on metal oxide film (2) surface, enclose one deck not only heat conduction but also nonconducting insulating barrier (3) again, one deck conducting film (4) will be enclosed again on the insulating barrier (3), conducting film (4) corroded into behind the needed figure again semiconductor PN (5), (6) on the conducting film (4) in the middle of two fin, are formed a complete metal semiconductor cooling piece with the tin soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200320116620 CN2660413Y (en) | 2003-11-04 | 2003-11-04 | Metallic semiconductor refrigerating sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200320116620 CN2660413Y (en) | 2003-11-04 | 2003-11-04 | Metallic semiconductor refrigerating sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2660413Y true CN2660413Y (en) | 2004-12-01 |
Family
ID=34346320
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200320116620 Expired - Fee Related CN2660413Y (en) | 2003-11-04 | 2003-11-04 | Metallic semiconductor refrigerating sheet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2660413Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9210832B2 (en) | 2012-08-13 | 2015-12-08 | Asustek Computer Inc. | Thermal buffering element |
| CN108099299A (en) * | 2017-12-18 | 2018-06-01 | 中国科学院光电技术研究所 | A kind of radiative cooling multilayer film of visible transparent |
-
2003
- 2003-11-04 CN CN 200320116620 patent/CN2660413Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9210832B2 (en) | 2012-08-13 | 2015-12-08 | Asustek Computer Inc. | Thermal buffering element |
| CN108099299A (en) * | 2017-12-18 | 2018-06-01 | 中国科学院光电技术研究所 | A kind of radiative cooling multilayer film of visible transparent |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |