CN2651941Y - Heat-conductive board structure - Google Patents
Heat-conductive board structure Download PDFInfo
- Publication number
- CN2651941Y CN2651941Y CN 200320100923 CN200320100923U CN2651941Y CN 2651941 Y CN2651941 Y CN 2651941Y CN 200320100923 CN200320100923 CN 200320100923 CN 200320100923 U CN200320100923 U CN 200320100923U CN 2651941 Y CN2651941 Y CN 2651941Y
- Authority
- CN
- China
- Prior art keywords
- base plate
- heat
- plate
- conducting plate
- fins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Abstract
The utility model relates to a heat conducting plate structure, which comprises a plate with a base plate. Both sides of the base plate respectively extended upwards a prearranged width and height to form a vertical wall. A holding groove is formed amongst the base plate and two vertical walls. The two vertical walls horizontally and outwards extended a limb. An upward concave groove is provided in the bottom center of the base plate. Therefore, a position of the base plate towards the concave groove is thin and provided with a lower thermal resistance to achieve quick heat conduction.
Description
Technical field
The utility model is relevant with heat dissipation technology, more detailed it, be to refer to a kind of heat-conducting plate structure.
Background technology
Press, known heat-conducting plate generally is all metal plate, and the top is provided with some fins, and can strengthen area of dissipation by these fins, to reach preferable radiating effect.
After, as shown in Figure 6, it is that heat pipe 61 is placed through between the fin 63 that some design is arranged, being used for increases the speed that 63 heat of fin are transmitted, in the hope of better radiating effect; Only, this kind structure only can be transmitted the heat energy on the fin fast, can not be effectively with heat on the heat-conducting plate 60 with effective derivation.
If desire improves the shortcoming of earlier figures 6 structures, and desire to make these heat pipes directly to adhere on this heat-conducting plate and be positioned at below the fin, then have only two kinds of modes:
One, heat pipe is adhered on the heat-conducting plate end face, and be placed through the bottom of these fins, or;
Two, heat-conducting plate is changed design, make its groove with ccontaining heat pipe, heat-conducting plate must increase thickness in response to this kind structure, and heat pipe also must be placed in this groove in the mode that section is flat; The heat-conducting plate of this kind design groove diapire during fabrication can not be too thin, otherwise the bottom surface will be out of shape and out-of-flatness, yet blocked up groove diapire also can cause heat conducting deleterious.
The utility model content
Main purpose of the present utility model is promptly providing a kind of heat-conducting plate structure, and its heat-conducting plate can be under fixing structural strength, and more existing heat-conducting plate has thinner base plate, and has preferable thermal conduction effect.
Of the present utility model time a purpose is that a kind of heat-conducting plate structure is being provided, and the radiator structure of its formed thereby has the radiating effect that is better than existing heat-conducting plate.
A kind of heat-conducting plate structure of the utility model is characterized in that, includes:
One plate body, have a base plate, these base plate both sides extend upward a wall of preset width and height respectively, and in this base plate, and this two wall between form a tank, this two walls level alar part that stretches out, the bottom surface central authorities of this base plate have a groove that upwards is arranged with.
Wherein: this alar part is higher than this base plate.
A kind of radiator structure of the utility model is characterized in that, includes:
One heat-conducting plate, have a base plate, these base plate both sides extend upward a wall of preset width and height respectively, and in this base plate, and this two wall between form a tank, this two walls level alar part that stretches out, the bottom central part position of this base plate has a groove that upwards is arranged with;
At least one heat pipe is arranged in this tank;
Some fins, upright being located on this heat-conducting plate and these heat pipes, the bottom of these fins is to be cross-placed on this tank, and is connected in the end face of these heat pipe surfaces and these alar parts.
Wherein: these heat pipes are to prolong so that its at least one end is outwards upwards curved, and are arranged in these fins.
Wherein: also include a top board, be arranged at these fin tops, these heat pipes are to prolong so that its at least one end is outwards upwards curved, and are arranged in this top board.
Description of drawings
For further specifying technology contents of the present utility model, below in conjunction with accompanying drawing and preferred embodiment describes in detail as after, wherein:
Fig. 1 is the stereogram of the utility model first preferred embodiment, shows by the bottom to see the state of looking;
Fig. 2 is the cutaway view along 2-2 hatching line among Fig. 1;
Fig. 3 is the assembled state schematic diagram of the utility model second preferred embodiment;
Fig. 4 is the assembled state schematic diagram of the utility model the 3rd preferred embodiment;
Fig. 5 is the assembled state schematic diagram of the utility model the 4th preferred embodiment;
And
Fig. 6 is the structural representation of existing radiator structure.
Embodiment
In order to describe structure of the present utility model and characteristics place in detail, lift following four preferred embodiments and conjunction with figs. explanation as back now:
See also Fig. 1 to Fig. 2, a kind of heat-conducting plate structure 10 that the utility model first preferred embodiment is provided includes:
One plate body 11, has a base plate 12, these base plate 12 both sides extend upward a wall 14 of preset width and height respectively, and in this base plate 12, and this two wall 14 between form a tank 16, these two walls, 14 levels alar part 18 that stretches out, the height of this alar part 18 is high than this base plate 12, and the bottom surface central authorities of this base plate 12 have a groove that upwards is arranged with 19, is used for cooperating contacting with the heater element (not shown);
Thus, this base plate 12 promptly can have thin thickness in central authorities because of the setting of this groove 19, therefore has lower thermal resistance, can reach the effect of quick conductive.
Moreover, be positioned at the both sides in addition of this groove 19 by the base plate 12 of these groove 19 both sides (than the base plate 12 of groove 19 tops for thick) and this two alar part 18, can produce a kind of structure of similar framework and be set around around this groove 19, and then has an effect of the base plate 12 of brace groove 19 tops, plant structure thus, the base plate 12 of tolerable groove 19 tops exists with thin form and can not be out of shape, can be as thin as below the 1mm even, 12 of thinner base plates have littler thermal resistance, and have better heat-conducting effect.
In addition, this two wall 14 also can be with the thermal energy conduction of this base plate 12 to this two alar part 18 and these fins that arrive help heat radiation.
Please consult Fig. 3 again, a kind of radiator structure 30 that the utility model second preferred embodiment is provided, the heat-conducting plate before being to use among the embodiment cooperates at least one heat pipe 31 and some fins 33 to form again, wherein:
These heat pipes 31, in the present embodiment be with three be example, be arranged in the tank 16 of this heat-conducting plate 10 and amplexiform in this base plate 12 end faces;
Some fins 33, upright being located on heat-conducting plate 10 and these heat pipes 31, the bottom of these fins 33 is to be cross-placed on this tank 16, and is connected in the end face of these heat pipe 31 surfaces and these alar parts 18.
Aforesaid radiator structure 30 in use, the position of the base plate 12 central respective slot (not shown) of this heat-conducting plate 10 is thinner, its thermal resistance is less, can be fast the heat energy of heater element (not shown) be directed to end face by the bottom surface of this base plate 12, and heat energy be conducted to all fins 33 fast by these heat pipes 31; Existing person is good for its radiating effect.
Please consult Fig. 4 again, a kind of radiator structure 4 that the utility model the 3rd preferred embodiment is provided is taken off embodiment before mainly generally being same as, and difference is:
These heat pipes 41 more outwards extend upward with the one end except being arranged in this tank 16, and are arranged in these fins 43.
The occupation mode of present embodiment is taken off embodiment before generally being same as, and holds and does not give unnecessary details.
Please consult Fig. 5 again, a kind of radiator structure 50 that the utility model the 4th preferred embodiment is provided is taken off embodiment before mainly generally being same as, and difference is:
Also have a top board 55, be arranged at these fin 53 tops;
These heat pipes 51 more outwards extend upward with the one end except being arranged in this tank 16, and oppositely extension is placed through in this top board 55.
The radiator structure 50 of present embodiment is by these heat pipes 51 heat energy of this heat-conducting plate 10 to be directly conducted to this top board 55, and this top board 55 is to be equal temperature state with this heat-conducting plate 10, by these fins 53 heat is shed again.
Via above-mentioned method and structure, the utility model can produce native following advantage:
By thicker base plate 12 and the alar part 18 around this groove 19, can form the supporting construction of a similar framework, get as thin as a wafer and the minimizing thermal resistance is used in unlikely distortion with base plate 12 Thickness Design of structure tolerable groove 19 tops, and reach preferable heat-conducting effect.
Claims (5)
1. a heat-conducting plate structure is characterized in that, includes:
One plate body, have a base plate, these base plate both sides extend upward a wall of preset width and height respectively, and in this base plate, and this two wall between form a tank, this two walls level alar part that stretches out, the bottom surface central authorities of this base plate have a groove that upwards is arranged with.
2. according to the described heat-conducting plate structure of claim 1, it is characterized in that wherein: this alar part is higher than this base plate.
3. a radiator structure is characterized in that, includes:
One heat-conducting plate, have a base plate, these base plate both sides extend upward a wall of preset width and height respectively, and in this base plate, and this two wall between form a tank, this two walls level alar part that stretches out, the bottom central part position of this base plate has a groove that upwards is arranged with;
At least one heat pipe is arranged in this tank;
Some fins, upright being located on this heat-conducting plate and these heat pipes, the bottom of these fins is to be cross-placed on this tank, and is connected in the end face of these heat pipe surfaces and these alar parts.
4. according to the described radiator structure of claim 3, it is characterized in that wherein: these heat pipes are to prolong so that its at least one end is outwards upwards curved, and are arranged in these fins.
5. according to the described radiator structure of claim 3, it is characterized in that wherein: also include a top board, be arranged at these fin tops, these heat pipes are to prolong so that its at least one end is outwards upwards curved, and are arranged in this top board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200320100923 CN2651941Y (en) | 2003-10-09 | 2003-10-09 | Heat-conductive board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200320100923 CN2651941Y (en) | 2003-10-09 | 2003-10-09 | Heat-conductive board structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2651941Y true CN2651941Y (en) | 2004-10-27 |
Family
ID=34339452
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200320100923 Expired - Fee Related CN2651941Y (en) | 2003-10-09 | 2003-10-09 | Heat-conductive board structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2651941Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102049672A (en) * | 2009-11-03 | 2011-05-11 | 鈤新科技股份有限公司 | Manufacturing method of coplane of evaporation parts of plurality of heat pipes as well as finished product structure and tools thereof |
-
2003
- 2003-10-09 CN CN 200320100923 patent/CN2651941Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102049672A (en) * | 2009-11-03 | 2011-05-11 | 鈤新科技股份有限公司 | Manufacturing method of coplane of evaporation parts of plurality of heat pipes as well as finished product structure and tools thereof |
| CN102049672B (en) * | 2009-11-03 | 2014-12-17 | 鈤新科技股份有限公司 | Manufacturing method of coplane of evaporation parts of plurality of heat pipes as well as finished product structure and tools thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201396725Y (en) | Fin type radiator | |
| CN2651941Y (en) | Heat-conductive board structure | |
| US20240230055A1 (en) | Heat spreader and illumination device | |
| CN1933713A (en) | Radiating module and heat tube thereof | |
| CN101655329B (en) | Heat pipe radiator | |
| CN2833889Y (en) | CPU radiator with high performance | |
| CN210807995U (en) | Temperature-equalizing heat dissipation structure suitable for IGBT module | |
| CN2696125Y (en) | Plate heat sink | |
| CN2591775Y (en) | Thin flat heat pipe radiator | |
| CN2875005Y (en) | Heat radiator base and heat radiator using said base | |
| CN207651506U (en) | The radiator structure of the anti-light equipment that declines of PERC batteries | |
| CN2847818Y (en) | Heat radiator structure | |
| CN210639563U (en) | Heat dissipation module beneficial to quick assembly | |
| CN201503870U (en) | LED heat dissipation base | |
| CN2752959Y (en) | Composite material radiator | |
| CN214281432U (en) | Camera backup pad for cell-phone | |
| CN218336995U (en) | Aluminum profile radiator with good heat transfer efficiency | |
| CN218510842U (en) | Combined LED semiconductor lighting module | |
| CN218385232U (en) | High-power field effect transistor | |
| CN2641833Y (en) | Liquid cooling device | |
| CN213921924U (en) | Potsherd pendulum piece tool | |
| CN219459649U (en) | Multilayer combined type heat conduction gasket | |
| CN221228149U (en) | Heat storage plate with heat conduction structure | |
| CN212033010U (en) | Novel extensible heat dissipation module | |
| CN221570360U (en) | Light guide illumination light receiving plate convenient for angle adjustment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |