CN2627652Y - Built-in combined type heat sink - Google Patents

Built-in combined type heat sink Download PDF

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Publication number
CN2627652Y
CN2627652Y CN 03261560 CN03261560U CN2627652Y CN 2627652 Y CN2627652 Y CN 2627652Y CN 03261560 CN03261560 CN 03261560 CN 03261560 U CN03261560 U CN 03261560U CN 2627652 Y CN2627652 Y CN 2627652Y
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China
Prior art keywords
heat
fan
radiating
fin
series
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Expired - Fee Related
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CN 03261560
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Chinese (zh)
Inventor
刘建平
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Individual
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Individual
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Priority to CN 03261560 priority Critical patent/CN2627652Y/en
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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The utility model provides a built-in combined type heat sink, which comprises a radiator plate series and a fan (4). The series of radiator plates consists of a plurality of radiator plates (1) vertically arranged on a heat-radiating substrate (2) in parallel. The utility model is characterized in that two series of radiator plates (1) on the heat-radiating substrate (2) are provided, which are arranged respectively at the two ends of the heat-radiating substrate (2); a blowing zone (3) is formed between the two series of radiator plates (1); the fan (4) is a centrifugal fan arranged in the blowing zone (3) of the channel flow. The utility model changes the prior piling up arrangement of the fan and the radiator plate series into prior embedding arrangement, and discharges the air drawn by the beam-barrel to the two lateral sides of the channel flow by the centrifugal fan. Compared with prior heat-radiating structure, the type of heat-radiating structure greatly reduces the height of heat-radiating structure, makes the structure more compact, reduces heat-radiating material, and reduces the weight of the heat-radiating structure. Since the blowing direction of the fan is in parallel with the channel flow, the wind resistance of the fan is low and the fan blows air directly to the root of the radiator plates, with good heat-radiating effect.

Description

Embed combined radiating device
Technical field
The utility model belongs to the heat abstractor that uses on electronic devices and components or the assembly, belongs to a kind of with the heat abstractor of radiator distortion to raise the efficiency especially.
Background technology
It is the important step that electronic equipment and computer develop to miniaturization, portable direction that heater elements such as electronic devices and components, integrated circuit, refrigeration wafer or assembly are dispelled the heat.In recent years, because the development of technology electronic equipment develops to high-power, densification aspect, therefore, the heat that produces in the unit volume increases very fast, and meanwhile, effectively area of dissipation is corresponding dwindles, thereby makes heat dissipation problem more outstanding.Because the temperature and the reliability of electronic devices and components are inversely proportional to, therefore the heat dispersion that improves electronic devices and components has also become one of the measure of electronic devices and components functional reliability that ensures, especially concerning the refrigeration wafer, its heat dispersion is directly connected to refrigeration, and it is most important therefore how to resolve heat dissipation problem.
As everyone knows, the typical radiator structure that has heater elements such as being applied to electronic devices and components, integrated circuit, refrigeration wafer or assembly now is to be made of fan and groups of fins, wherein, each fin is arranged on the substrate, and be integral heat transfer structure with substrate, practical its air intake direction of tube-axial fan of fan and air-out direction are in line, and are fixed on the groups of fins top, form double-deck stacked configuration.Substrate is close to thermal source and is absorbed heat during use, and with heat transferred to each fin, thereby and fan promotes air flows and heat is taken away is realized the heat radiation purpose.The traditional heat-dissipating pattern is because simple in structure, and taken up space less demanding, therefore use till today always.But along with the concept of technological progress electronic equipment develops to high-power, densification direction, thereby adopt the traditional heat-dissipating pattern just to expose many deficiencies: volume is big, and structure is not compact, and especially the double-deck stacked configuration of fan and groups of fins is often highly too big; Traditional heat-dissipating structural material consumption is many, not only causes to a certain degree waste but also heaviness; Because fan is fixed on the fin end, the low-temperature end (end) that blows to fin during fan work earlier blows to temperature end (root) again, and this angle analysis from heat radiation is irrational.The layout designs of radiator structure does not obviously meet the miniaturization structure design philosophy in the prior art, and especially the application in current miniaturization structure design has been subjected to limitation.
Summary of the invention
The utility model is to overcome above-mentioned the deficiencies in the prior art part to have proposed a kind of new modified form radiator structure pattern,, efficiently dispel the heat requirement small-sized to satisfy.Make to stack up and down between original fan and the groups of fins and arrange and to change present embedded layout into, and utilize the effect of centrifugal blower fan that the beam barrel inhaled air is discharged to the conduit both sides, obvious this radiator structure can greatly reduce the height of original radiator structure, and makes structure become compact more.Can reduce the heat sink material consumption, make the weight saving of radiator structure.Because the direction of air blast is parallel with conduit, so windage is little during fan work, and fan directly blows to the root of fin, from the angle better effects if of dispelling the heat.
The purpose of this utility model can realize like this:
Design, a kind of embedding combined radiating device of manufacturing, comprise groups of fins and fan, this groups of fins comprises that some fin uprightly are arranged in parallel within on the heat-radiating substrate, and the fin on the especially described heat-radiating substrate is two groups, is divided into the two ends of described heat-radiating substrate; Form blast area therebetween; Described fan adopts centrifugal blower fan, and is located in the blast area of conduit.
Description of drawings
Fig. 1 is the utility model radiator structure pattern diagram;
Fig. 2 is the utility model radiator structure embodiment vertical view;
Fig. 3 is a traditional heat-dissipating tactic pattern schematic diagram.
Embodiment
Specific embodiment of the utility model below is described in detail in detail.
A kind of embedding combined radiating device, comprise groups of fins and fan 4, this groups of fins comprises that some fin 1 uprightly are arranged in parallel within on the heat-radiating substrate 2, is characterized in that: the fin 1 on the described heat-radiating substrate 2 is two groups, is divided into the two ends of described heat-radiating substrate 2; Form blast area 3 therebetween; Described fan 4 adopts centrifugal blower fan, and is located in the blast area 3 of conduit.Described heat-radiating substrate 2 is close to the heat radiation object as refrigeration wafer 8.
The both sides of described heat-radiating substrate 2 are provided with wind gathering plate washer 6.
Described wind gathering plate washer 6 is provided with streamline structure near described blast area 3, and the rotational trajectory of the blade 41 of close described fan 4 outside.
In the practicality, described conduit is that the frame by substrate radiating surface both sides projection is formed.Described " centrifugal blower fan " is meant the radially fan of air-out of a kind of air inlet through hollow shaft, and the blade of this fan is with centrifugal rotation mode work, and the air intake direction is vertical with air-out direction, and also the someone claims blower fan.By contrast, often use tube-axial fan in the prior art, this fan is an air inlet through hollow shaft, axially air-out, and air intake direction and air-out direction are in line, and the air channel is an axial flow.
In the such scheme, described " embedded combining structure " is meant between fan and the groups of fins by original stacking up and down and arranges that changing present fan into embeds layout among the groups of fins, obviously can greatly reduce the height of original heat spreader structures like this, make radiator structure compact more.
In the such scheme, in order to improve the air blast effect of centrifugal blower fan, corresponding blade is respectively equipped with the poly-side of pressing in blast area conduit two sides, and this poly-side of pressing matches with the poly-baric flow linear structure and the blade end surfaces of revolution.According to aerodynamic principle, the blade of fan can gather certain pressure when rotated near poly-pressure side, thereby makes the air blast better effects if of fan to the conduit two ends like this.
In the such scheme, formed air channel more rationally effectively forms the arcs of recesses structure in corresponding blast area one side of each fin between each fin in order to make, and fan is even relatively to the air output of each fin when work like this.
In the such scheme, generally speaking, fin is set to the best at the conduit two ends by the direction that is parallel to conduit.
The utility model operation principle is: shown in attached Fig. 1 and 2, because fin 1: upright secured in parallel is on substrate 2, substrate 2 is with each fin 1 of heat transferred, blade 41 rotations when centrifugal blower fan 4 is worked, at this moment, air from fan shaft to being inhaled into, because the blasting action of blade 41, force air to flow, and the heat on the fin is taken away to the conduit two ends.
The utility model can be applied to freeze heat sinking structure of wafer, with Fig. 2, structure shown in Figure 3 is the basis, can be close to respectively in positive and negative two sides of refrigeration wafer 8 a cover radiator structure is set, this radiator structure is constituted by groups of fins and centrifugal blower fan 4, this groups of fins uprightly is arranged in parallel within on the substrate 2 by some fin 1 and constitutes, the heat radiation side of substrate 2 forms a conduit by frame, each fin 1 is arranged on the exit passageway position at conduit two ends, conduit central authorities form a blast area 3, centrifugal blower fan 4 is located in the blast area 3 of conduit, constitutes embedded combining structure between centrifugal blower fan 4 and the groups of fins with this.
Described fin 2 is parallel to the setting of conduit direction at the conduit two ends, at this moment, in order to make between each fin 1 formed air channel more rationally effectively, each fin 1 corresponding blast area 3 one side forms arcs of recesses 7 structures, and fan is even relatively to the air output of each fin 1 when working like this.
The foregoing description only is explanation technical conceive of the present utility model and characteristics, and its purpose is to allow the personage who is familiar with this technology can understand content of the present utility model and enforcement according to this, can not limit protection range of the present utility model with this.All equivalences of being done according to the utility model spirit change or modify, and all should be encompassed within the utility model protection range.

Claims (3)

1, a kind of embedding combined radiating device comprises groups of fins and fan (4), and this groups of fins comprises that some fin (1) uprightly are arranged in parallel within on the heat-radiating substrate (2), is characterized in that:
Fin (1) on the described heat-radiating substrate (2) is two groups, is divided into the two ends of described heat-radiating substrate (2); Form blast area (3) therebetween;
Described fan (4) adopts centrifugal blower fan, and is located in the blast area (3) of conduit.
2, heat abstractor according to claim 1 is characterized in that:
The both sides of described heat-radiating substrate (2) are provided with wind gathering plate washer (6).
3, heat abstractor according to claim 2 is characterized in that:
Described wind gathering plate washer (6) is provided with streamline structure near described blast area (3), and the rotational trajectory of the blade (41) of close described fan (4) outside.
CN 03261560 2003-05-17 2003-05-17 Built-in combined type heat sink Expired - Fee Related CN2627652Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 03261560 CN2627652Y (en) 2003-05-17 2003-05-17 Built-in combined type heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 03261560 CN2627652Y (en) 2003-05-17 2003-05-17 Built-in combined type heat sink

Publications (1)

Publication Number Publication Date
CN2627652Y true CN2627652Y (en) 2004-07-21

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN 03261560 Expired - Fee Related CN2627652Y (en) 2003-05-17 2003-05-17 Built-in combined type heat sink

Country Status (1)

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CN (1) CN2627652Y (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103166580A (en) * 2011-12-09 2013-06-19 中国科学院微电子研究所 Radio frequency power amplification module and high-power radio frequency power supply with heat dissipation air duct

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103166580A (en) * 2011-12-09 2013-06-19 中国科学院微电子研究所 Radio frequency power amplification module and high-power radio frequency power supply with heat dissipation air duct

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GR01 Patent grant
C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee