CN2626193Y - Composite material having high heat conduction and electromagnetic shielding function - Google Patents
Composite material having high heat conduction and electromagnetic shielding function Download PDFInfo
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- CN2626193Y CN2626193Y CN 03256620 CN03256620U CN2626193Y CN 2626193 Y CN2626193 Y CN 2626193Y CN 03256620 CN03256620 CN 03256620 CN 03256620 U CN03256620 U CN 03256620U CN 2626193 Y CN2626193 Y CN 2626193Y
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- magnetic screen
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- heat conduction
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Abstract
The utility model relates to a composite material with functions of both high thermal conductivity and electromagnetic shielding. The composite material at least comprises a first thermal conduction layer and a first electromagnetic shielding layer. The first thermal conduction layer and the first electromagnetic shielding layer are formed by alternated pasting of an upper and lower layer. The first electromagnetic shielding layer takes a shape of checkerboard. The first electromagnetic shielding layer is formed by the electromagnetic shielding materials which are mutually interval arranged in a high thermal conduction sub-layer. The electromagnetic shielding material is electromagnetic absorbing material. The composite material further comprises the high thermal conduction layer and the electromagnetic shielding layer that are alternated pasting together by a plurality of mutual interval layers.
Description
Technical field
The utility model is about a kind of composite material, especially about a kind of composite material that has high heat conduction and capability of electromagnetic shielding simultaneously.
Background technology
Electric equipment, the particularly electric equipment that moves under high power mostly need to solve heat dissipation problem.Usually for bigger electric device, can adopt the mode of installing heat abstractor, as the forced convertion system that forms by one or several fans.
But, be used for the small-sized even micromodule (for example CPU) of high density state (as being used for surface-mounted integrated circuit) for those, it still is not enough only using the forced convertion cooling system, because in this congestion system, there are not enough area of dissipations, therefore must on the radiating surface of chip, add a radiator of making by highly heat-conductive material usually, so that bigger area of dissipation to be provided with a plurality of fin.But, common this radiator by metal material (for example: aluminium) made is, be bound to have gap slightly between the fin of its lower surface and chip, and will have the non-conductor-air of heat in these gaps, these air will cause great harmful effect to being made into cooling system.Therefore, industry wishes to have good conductor a kind of softness, heat can be present between chip and the radiator.And, this electronic devices and components in use, also must take measures to eliminate its because of the high frequency action to around the electromagnetic interference of other electronic devices and components, otherwise can make the entire circuit plate can't operate as normal.Therefore, relevant people in the industry promptly considers to adopt a kind of device, and it can have the function of heat radiation and anti-electromagnetic interference simultaneously.
For example on March 15th, 2000 Granted publication No. 91101947.2 Chinese patent just disclosed a kind of electromagnetic screen that is used for circuit board, this electromagnetic screen is a radome of being made by Heat Conduction Material in fact.But this radome must be used the function that can realize its heat conduction simultaneously and eliminate electromagnetic interference with the earth electrode on the corresponding circuit board, must must make corresponding circuit design on circuit board, thereby makes and use this design to become complicated, and very not convenient.
So industry considers to adopt certain to have the special material of thermal conductivity and anti-electromagnetic interference function simultaneously again, No. 345667 bulletin of TaiWan, China patent promptly is intended to provide a kind of like this composite magnetic body material with high thermal conductivity.This composite magnetic body material is to disperse soft-magnetic body powder and heat conductivity powder (as Al in organic bond
2O
3) and form, but because there is the problem of a maximum upper limit in the sum total of soft-magnetic body powder that this organic bond can infiltrate and heat conductivity powder, compare the material that originally only comprises the soft-magnetic body powder or only comprise the heat conductivity powder, the neither ideal of the performance of its heat conduction and shield electromagnetic interference.
It is base material with the resin that prior art also has employing, infiltrates alumina powder again (as Al
2O
3) and silica flour (Silicone) and a kind of material of obtaining, this material can have the characteristics of soft and high-termal conductivity, but this material does not have the ability of shield electromagnetic interference.In addition, also have and adopt the suction ripple material that adds soft magnetic powder separately and make in plastic substrate, it has capability of electromagnetic shielding preferably the suction ripple material that obtains like this, but the non-conductor of heat.Therefore, in industry in the practicality this traditional suction ripple material is applied in mode on the computer chip CPU, mostly be and be processed into the square or circular of hollow inhaling the ripple material, be attached to the upper surface of cpu chip again, then empty therein part is sticked conducting strip, and the top of conducting strip is pasted fin or small-sized fans again, to strengthen its heat-conductive characteristic, but can reduce the effect of electro-magnetic wave absorption thus, and make its radiating effect also undesirable because of the area of Pasting conducting strip diminishes.
The utility model content
The technical problems to be solved in the utility model is to overcome above-mentioned the deficiencies in the prior art, provides a kind of and can have the good high heat conduction and the composite material of electro-magnetic screen function simultaneously.
Technical essential of the present utility model is: this composite material with high heat conduction and electro-magnetic screen function comprises first high thermal conductivity layer and first electro-magnetic screen layer at least.
The utility model composite material may further include the high thermal conductivity layer and the electro-magnetic screen layer of the stacking one that is sticked in some spaces.The number of plies of high thermal conductivity layer and electro-magnetic screen layer can be set as required, and the thickness of each high thermal conductivity layer and electro-magnetic screen layer also can come to determine as requested.
Described first high thermal conductivity layer and first electro-magnetic screen layer are that stacking being sticked forms up and down; Described first electro-magnetic screen layer is the chessboard trellis, and it is about to that the electromagnetic shielding material space is arranged in the high heat conduction sublevel and forms.Described electromagnetic shielding material is an electromagnetic absorber; Can adopt the glue bond mode, perhaps the mode of planography way or injection moulding (insert-molding) and this high heat conduction sublevel integrally combine.
Composite material of the present utility model also comprises second high thermal conductivity layer, its stacking side that is attached at first electro-magnetic screen layer away from first high thermal conductivity layer.This composite material can further comprise second electro-magnetic screen layer, stacking being sticked in the side of second high thermal conductivity layer away from first electro-magnetic screen layer.The formation of second electro-magnetic screen layer is identical with first electro-magnetic screen layer, but the upper-lower position of its electromagnetic shielding material and the corresponding electromagnetic shielding material of first electro-magnetic screen layer just in time staggers each other.
The high thermal conductivity layer of the stacking one that is sticked in the some intervals of the utility model composite material by adopting and the design of electro-magnetic screen layer, wherein each electro-magnetic screen layer is and is the chessboard trellis on a high heat conduction sublevel, at interval electromagnetic absorber is set, the position of corresponding electromagnetic absorber is to stagger mutually to be provided with between each electro-magnetic screen layer, form interlaced with each other, curved prolonging but continuous heat conduction path, and the upper and lower faces of each electro-magnetic screen layer is complete high thermal conductivity layer, therefore has good high thermal conductivity.And electro-magnetic screen layer space, levels that the electromagnetic absorber that is distributed by the chessboard trellis constitutes stack puts, and forms a complete electromagnetic absorption guard, makes to have the utlity model has good capability of electromagnetic shielding.
In addition, the utility model can be made different shape as required, directly is arranged on the corresponding electronic devices and components, need not to make extra matching design with circuit board, therefore also has to use simple, reliable advantage.
Description of drawings
Fig. 1 is a vertical section of the present utility model schematic diagram;
Fig. 2 is the schematic top plan view of electro-magnetic screen layer of the present utility model.
Embodiment
Now, the composite material that the utlity model has high-termal conductivity and electro-magnetic screen function is described in further detail in conjunction with Figure of description.
Figure 1 shows that the vertical section schematic diagram of the utility model composite material, this composite material is made of first high thermal conductivity layer 1, first electro-magnetic screen layer 2, second high thermal conductivity layer 3, second electro-magnetic screen layer 4 and the 3rd high thermal conductivity layer 5.
Second heat-conducting layer 3 wherein, stacking being sticked in the side of first electro-magnetic screen layer 2 away from first high thermal conductivity layer 1; Second electro-magnetic screen layer, 4 stacking sides that are attached at second high thermal conductivity layer 3 away from first electro-magnetic screen layer 2.
First, second electro-magnetic screen layer the 2, the 4th adopts electromagnetic shielding material 22,42 to be arranged in the high heat conduction sublevel 23,43 interlacedly and to form.The formation of second electro-magnetic screen layer 4 is identical with first electro-magnetic screen layer 2, but the upper-lower position of its electromagnetic shielding material 42 and first electro-magnetic screen layer, 2 corresponding electromagnetic shielding materials 22 just in time staggers each other.
Consult Fig. 2, described first, second electro-magnetic screen layer 2,4 is the chessboard trellis, and described electromagnetic shielding material 22,42 is an electromagnetic absorber, is arranged in the high heat conduction sublevel 23,43 interlacedly; Electromagnetic shielding material 22,42 can adopt the glue bond mode, and perhaps the mode of planography way or injection moulding (insert-molding) and this high heat conduction sublevel 23,43 integrally combine.
The utility model composite material can further include some interlaced, stacking high thermal conductivity layer (1,3,5) and electro-magnetic screen layers (2,4) that are attached at one.The number of plies of high thermal conductivity layer and electro-magnetic screen layer can be set as required, and the thickness of each high thermal conductivity layer and electro-magnetic screen layer also can come to determine as requested.
The manufacture process that just the utlity model has the composite material of high heat conduction and electro-magnetic screen function is below again done a simple declaration:
Step 1 is a base material with heat-resisting plastic material (as SiC), infiltrates Al
2O
3Powder forms first high thermal conductivity layer 1;
Step 2 forms a tessellated high heat conduction sublevel 23 on this first high thermal conductivity layer 1, have space (not shown) that staggers the space on this high heat conduction sublevel 23; Electromagnetic shielding material 22 is set in space of high heat conduction sublevel 23 again, so form first electro-magnetic screen layer 2;
Step 3 on first electro-magnetic screen layer 2, is a base material with heat-resisting plastic material (as SiC), infiltrates Al
2O
3Powder forms second high thermal conductivity layer 3;
Step 4 forms a tessellated high heat conduction sublevel 43 on second high thermal conductivity layer 3, have space (not shown) that staggers the space on this high heat conduction sublevel 43; Electromagnetic shielding material 42 is placed in space of high heat conduction sublevel 43, so form first electro-magnetic screen layer 4, wherein, the upper-lower position of its electromagnetic shielding material 42 and first electro-magnetic screen layer, 2 corresponding electromagnetic shielding materials 22 just in time staggers each other again;
Step 5 on second electro-magnetic screen layer 4, is a base material with heat-resisting plastic material (as SiC), infiltrates Al
2O
3Powder forms the 3rd high thermal conductivity layer 5.
So repeatedly, can make as required have some intervals, the stacking high thermal conductivity layer (1,3,5) of one and the composite material of electro-magnetic screen layer (2,4) of being attached at.
The some intervals of the utility model composite material by adopting, the stacking design that is attached at the high thermal conductivity layer (1,3,5) and the electro-magnetic screen layer (2,4) of one; Wherein each electro-magnetic screen layer (2,4) is and is the chessboard trellis on a high heat conduction sublevel (23,43), at interval electromagnetic absorber is set and forms, the position of corresponding electromagnetic absorber is to stagger mutually to be provided with between each electro-magnetic screen layer (2,4), form interlaced with each other, curved prolonging but continuous heat conduction path, and each electro-magnetic screen layer (2,4) upper and lower faces is complete high thermal conductivity layer (1,3,5), therefore has good high thermal conductivity.And, be distributed with electro-magnetic screen layer space, levels that electromagnetic absorber constitutes by the chessboard trellis and stack and put, form a complete electromagnetic absorption guard, make the composite material of the utility model have good capability of electromagnetic shielding.
In addition, the utility model composite can be made various shape and size as required, Directly be arranged on the corresponding electronic devices and components, need not to make extra matching design with circuit board, Therefore also have and use simple, reliable advantage.
Claims (10)
1, a kind of composite material with high heat conduction and electro-magnetic screen function; It is characterized in that: this composite material comprises first high thermal conductivity layer and first electro-magnetic screen layer at least.
2, composite material as claimed in claim 1 is characterized in that: this composite material can comprise the high thermal conductivity layer and the electro-magnetic screen layer of the stacking one that is sticked in some spaces.
3, the composite material with high heat conduction and electro-magnetic screen function as claimed in claim 1 is characterized in that: described first high thermal conductivity layer and first electro-magnetic screen layer are stacking forming up and down.
4, as claim 2 or 3 described composite materials with high heat conduction and electro-magnetic screen function, it is characterized in that: described first electro-magnetic screen layer is the chessboard trellis.
5, the composite material with high heat conduction and electro-magnetic screen function as claimed in claim 4 is characterized in that: described first electro-magnetic screen layer is to adopt the electromagnetic shielding material space to be arranged in the high heat conduction sublevel and to form.
6, the composite material with high heat conduction and electro-magnetic screen function as claimed in claim 5 is characterized in that: described electromagnetic shielding material is an electromagnetic absorber; Can adopt the glue bond mode, perhaps planography way or injection molding mode and this high heat conduction sublevel integrally combine.
7, the composite material with high heat conduction and electro-magnetic screen function as claimed in claim 6, it is characterized in that: this composite material also can comprise second high thermal conductivity layer, its stacking side that is attached at first electro-magnetic screen layer away from first high thermal conductivity layer.
8, the composite material with high heat conduction and electro-magnetic screen function as claimed in claim 7 is characterized in that: this composite material can further comprise second electro-magnetic screen layer, stacking being sticked in the side of second high thermal conductivity layer away from first electro-magnetic screen layer.
9, the composite material with high heat conduction and electro-magnetic screen function as claimed in claim 6 is characterized in that: the upper-lower position of electromagnetic shielding material on second electro-magnetic screen layer and the corresponding electromagnetic shielding material of first electro-magnetic screen layer just in time staggers each other.
10, the composite material with high heat conduction and electro-magnetic screen function as claimed in claim 1 or 2, it is characterized in that: this composite material can also comprise the 3rd heat-conducting layer, stacking being sticked in the side of second electro-magnetic screen layer away from second high thermal conductivity layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03256620 CN2626193Y (en) | 2003-04-30 | 2003-04-30 | Composite material having high heat conduction and electromagnetic shielding function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03256620 CN2626193Y (en) | 2003-04-30 | 2003-04-30 | Composite material having high heat conduction and electromagnetic shielding function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2626193Y true CN2626193Y (en) | 2004-07-14 |
Family
ID=34253931
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03256620 Expired - Lifetime CN2626193Y (en) | 2003-04-30 | 2003-04-30 | Composite material having high heat conduction and electromagnetic shielding function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2626193Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101888769A (en) * | 2009-05-14 | 2010-11-17 | 鸿富锦精密工业（深圳）有限公司 | Wave-absorbing heat-radiating patch |
| CN104202445A (en) * | 2014-08-11 | 2014-12-10 | 太仓欧锐智能化工程有限公司 | Colorful mobile phone shell with wave-adsorbing radiating function |
| CN110099556A (en) * | 2019-03-11 | 2019-08-06 | 西安电子科技大学 | A kind of wideband electromagnetic shielding construction and its design method |
-
2003
- 2003-04-30 CN CN 03256620 patent/CN2626193Y/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101888769A (en) * | 2009-05-14 | 2010-11-17 | 鸿富锦精密工业（深圳）有限公司 | Wave-absorbing heat-radiating patch |
| CN104202445A (en) * | 2014-08-11 | 2014-12-10 | 太仓欧锐智能化工程有限公司 | Colorful mobile phone shell with wave-adsorbing radiating function |
| CN110099556A (en) * | 2019-03-11 | 2019-08-06 | 西安电子科技大学 | A kind of wideband electromagnetic shielding construction and its design method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: TIANJIN LAI ERDE ELECTRONIC MATERIAL CO., LTD. Free format text: FORMER OWNER: KERRY TOO LONG IT CO., LTD. Effective date: 20090703 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20090703 Address after: Taifeng Tianjin economic and Technological Development Zone Hongtai Industrial Park Road No. 87, building C3&C4, zip code: 300457 Patentee after: Tianjin Laird Electronic Materials Co., Ltd. Address before: 6F, 94, three West Creek Street, Taipei County, Taiwan Province, china: Patentee before: Jiadelong Science & Technology Co., Ltd. |
|
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20130502 Granted publication date: 20040714 |