CN216597566U - Heat radiator - Google Patents
Heat radiator Download PDFInfo
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- CN216597566U CN216597566U CN202122675249.0U CN202122675249U CN216597566U CN 216597566 U CN216597566 U CN 216597566U CN 202122675249 U CN202122675249 U CN 202122675249U CN 216597566 U CN216597566 U CN 216597566U
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- heat sink
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Abstract
The utility model relates to a semiconductor package technical field discloses a radiator, this application sets up the through-hole at heat radiation fins's horizontal base plate, and on the base plate with the position setting that the through-hole is relative just is the arch of magnet with base plate integrated into one piece, and make protruding with the through-hole meets with bonded magnet magnetism, and the magnetic force that magnet and bonded magnet produced can realize fixing a position fast and firmly link together base plate and heat radiation fins, and this heat radiation fins need not rely on semiconductor package with being connected of base plate, and need not to change heat radiation fins's horizontal base plate thickness, can satisfy the miniaturized requirement of chip package.
Description
Technical Field
The application relates to the technical field of semiconductor packaging, in particular to a radiator.
Background
In the field of heat dissipation, a heat sink is generally used to dissipate heat generated by electronic components, and the heat sink includes a substrate and heat dissipation fins formed by bending an aluminum plate into a continuous wave shape, and the heat dissipation fins are adhered to the substrate by resin. The substrate is in contact with the heating electronic element, so that after the heat of the heating electronic element is conducted to the substrate, the substrate conducts the heat to the radiating fins.
The resin deteriorates after a certain period of use to deteriorate the adhesion effect, so that the heat dissipation fins cannot be firmly attached to the base plate. The related art, for example, patent document 1 (patent application No. 202011307555.2) proposes a mounting method using an adsorption phenomenon by magnetic force.
In the technique described in patent document 1, a semiconductor device includes: a semiconductor package; an insulating substrate located inside the outer peripheral portion of the upper surface of the semiconductor package; a heat sink fin disposed on an upper surface of the semiconductor package; a first fixing portion which is located at an outer peripheral portion of an upper surface of the semiconductor package and is configured by one of a magnet and a bond magnet formed integrally with the semiconductor package; and a 2 nd fixing part which is located at a position of the lower surface of the heat radiating fin opposite to the 1 st fixing part and is composed of the other one of the magnet and the bonded magnet integrally formed with the heat radiating fin, wherein the semiconductor package and the heat radiating fin are attracted by a magnetic force generated between the 1 st fixing part and the 2 nd fixing part. The heat sink fin in the semiconductor device further has a pair of rails that specify the position of the heat sink fin with respect to the semiconductor package.
As described above, in the technique described in patent document 1, the connection between the heat sink fins and the insulating substrate depends on the semiconductor package, and the bottom of the heat sink fins needs to be increased by a certain thickness for providing the 2 nd fixing portion, which further restricts the requirement for miniaturization of the chip package, increases the thermal conduction resistance, and is not suitable for the heat sink structure in which the heat sink fins are not connected to the semiconductor package.
In addition, in the technique described in patent document 1, it is necessary to additionally add a guide rail to specify the position of the heat radiation fin with respect to the semiconductor package, which increases the manufacturing cost of the heat sink.
SUMMERY OF THE UTILITY MODEL
Therefore, an object of the embodiments of the present invention is to provide a heat sink, in which the connection between the heat sink fins and the substrate does not depend on the semiconductor package, and the thickness of the horizontal bottom plate of the heat sink fins does not need to be changed, so as to meet the requirement of miniaturization of the chip package.
In order to achieve the purpose, the technical scheme is as follows:
a heat sink is provided that includes a substrate and heat fins spaced apart from the substrate; the radiating fins comprise a horizontal bottom plate provided with a through hole and a vertical radiating plate extending from the horizontal bottom plate, a protrusion which is integrally formed with the substrate and is a magnet is arranged on the part of the substrate opposite to the through hole, and the protrusion is magnetically connected with the through hole through a bonded magnet.
According to one embodiment of the present application, the bonded magnet includes a melt of a magnetized magnet piece and a thermoplastic resin.
According to the mode that can realize of this application, bellied highly be less than the height of through-hole, protruding with through-hole accordant connection connects the back the through-hole with the arch forms a recess, bond magnet set up in the recess.
According to the mode that can realize of this application, bellied highly be equal to the height of through-hole, the arch includes first connecting portion and follows the second connecting portion that first connecting portion upwards extended, first connecting portion with through-hole accordant connection connects the back the second connecting portion with possess first clearance between the through-hole, first gap filling has bond magnet.
According to an implementation manner of the present application, a diameter of the protrusion is smaller than a diameter of the through hole, a second gap is formed between the protrusion and the through hole after the protrusion and the through hole are connected, and the bonded magnet is filled in the second gap.
According to one implementation of the present disclosure, a thermal interface material is filled in the gap between the substrate and the heat dissipation fins.
According to one mode of this application, the thermal interface material is in the form of a paste, and the thermal interface material includes a metal oxide and an organosiloxane that compounds the metal oxide.
Compared with the prior art, the application has at least the following beneficial technical effects:
this application sets up the through-hole at heat radiation fins's horizontal base plate, and on the base plate with the position setting that the through-hole is relative just is the arch of magnet with base plate integrated into one piece, and make protruding with the through-hole meets with bond magnet magnetism, and the magnetic force that magnet and bond magnet produced can be realized fixing a position fast and firmly link together base plate and heat radiation fins, and this heat radiation fins need not rely on semiconductor package with being connected of base plate, and need not to change heat radiation fins's horizontal base plate thickness, can satisfy the miniaturized requirement of chip package.
Drawings
FIG. 1 is a schematic structural view of an alternative embodiment of a heat sink provided herein;
FIG. 2 is a schematic structural view of another alternative embodiment of a heat sink provided herein;
FIG. 3 is a schematic structural diagram of yet another alternative embodiment of a heat sink provided herein;
fig. 4 is a schematic flow chart of an alternative embodiment of a method for manufacturing a heat sink provided by the present application.
The reference numerals are explained below:
1-a substrate; 2-radiating fins; 3-a through hole; 4-a horizontal floor; 5-vertical heat dissipation plate; 6-bulge; 7-a bond magnet; 8-a first connecting portion; 9-second connecting portion.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Fig. 1 is a schematic structural diagram of an alternative embodiment of a heat sink according to the present application.
As shown in fig. 1 to 3, the present embodiment provides a heat sink, which includes a substrate 1 and heat dissipation fins 2 spaced apart from the substrate 1; the radiating fins 2 comprise a horizontal bottom plate 4 provided with a through hole 3 and a vertical radiating plate 5 extending from the horizontal bottom plate 4, a protrusion 6 which is integrally formed with the substrate 1 and is a magnet is arranged at a position, opposite to the through hole 3, on the substrate 1, and the protrusion 6 is magnetically connected with the through hole 3 through a bonded magnet 7.
The bonded magnet 7 includes a melt of a magnetized magnet piece and a thermoplastic resin.
In some embodiments, the substrate 1 is a copper substrate, an aluminum substrate, or a VC (vacuum chamber vapor chamber) substrate.
The heat dissipation fins 2 are provided with a plurality of through holes 3, and correspondingly, the substrate 1 is provided with protrusions 6 with the same number as the through holes 3. The through holes 3 are arranged at positions which are favorable for realizing the connection of the radiating fins 2 and the substrate 1. As an alternative embodiment, one through hole 3 is provided on both sides of the horizontal base plate 4. As shown in fig. 1-3.
The horizontal bottom plate of the heat radiating fins is provided with the through holes, the part, opposite to the through holes, of the substrate is provided with the protrusions which are integrally formed with the substrate and are magnets, the protrusions are connected with the through holes in a magnetic manner through the bonding magnets, the magnets and the bonding magnets can achieve the effect that the substrate and the heat radiating fins are quickly positioned and firmly connected together, the heat radiating fins are connected with the substrate without depending on a semiconductor packaging part, the thickness of the horizontal bottom plate of the heat radiating fins is not required to be changed, and the requirement of miniaturization of chip packaging can be met.
In some embodiments, as shown in fig. 1, the height of the protrusion 6 is lower than that of the through hole 3, and the protrusion 6 is connected to the through hole 3 in a matching manner, so that the substrate 1 and the heat dissipation fin 2 can be quickly positioned, after the connection, the through hole 3 and the protrusion 6 form a groove, and the bonding magnet 7 is disposed in the groove.
In some embodiments, as shown in fig. 2, the height of the protrusion 6 is equal to the height of the through hole 3, the protrusion 6 includes a first connection portion 8 and a second connection portion 9 extending upward from the first connection portion 8, the first connection portion 8 is connected to the through hole 3 in a matching manner, so that the substrate 1 and the heat sink fin 2 can be positioned quickly, and after connection, a first gap is provided between the second connection portion 9 and the through hole 3, and the first gap is filled with the bonding magnet 7.
The sum of the heights of the second connection portion 9 and the first connection portion 8 is equal to the height of the through-hole 3. As an alternative embodiment, the height of the second connection portion 9 is greater than the height of the first connection portion 8.
In some embodiments, as shown in fig. 3, the diameter of the protrusion 6 is smaller than that of the through hole 3, and the protrusion 6 is connected to the through hole 3, so that the substrate 1 and the heat sink fin 2 can be quickly positioned, and after the connection, a second gap is formed between the protrusion 6 and the through hole 3, and the second gap is filled with the bonded magnet 7.
It should be noted that the shape and structure of the projection 6 and the through hole 3 are not limited to the shape and structure shown in fig. 1 to 3. For example, it is possible to provide that the cross-section of both the protrusion 6 and the through-hole 3 is non-circular, such as square, hexagonal, etc., irrespective of whether the process is complicated or not.
The shapes and structures of the protrusion 6 and the through hole 3 on the same heat sink are not limited to those in one embodiment, and may be a combination of two or more embodiments. For example, on the same heat sink, the first protrusion 6 and the corresponding through hole 3 may have the shape and structure shown in fig. 1, the second protrusion 6 and the corresponding through hole 3 may have the shape and structure shown in fig. 2, and the third protrusion 6 and the corresponding through hole 3 may have the shape and structure shown in fig. 3.
In some embodiments, the gap between the substrate 1 and the heat sink fin 2 is filled with a thermal interface material. The thermal interface material can be heat-conducting grease, heat-conducting glue, phase-change material, heat-conducting paste and the like, and can also be a mixed material formed by adding a metal material with high heat conductivity or a carbon nanotube material into a base material such as a polymer and the like to improve the heat-conducting property.
As an alternative embodiment, the thermal interface material is a thermally conductive paste. The thermal interface material is in a paste shape and comprises a metal oxide and organic siloxane compounding with the metal oxide.
As shown in fig. 4, the method for manufacturing the heat sink includes the following steps:
s1: providing a heat dissipation fin 2 with a through hole 3;
s2: providing a substrate 1 with a bulge 6 opposite to the through hole 3, wherein the bulge 6 is integrally formed with the substrate 1 and is a magnet;
s3 mounting the heat sink fins 2 on the substrate 1 and magnetically connecting the protrusion 6 and the through hole 3 via the bonded magnet 7.
In some embodiments, the height of the protrusion 6 is lower than the height of the through hole 3, and the magnetically contacting the protrusion 6 and the through hole 3 by the bond magnet 7 includes:
the bulge 6 is connected with the through hole 3 in a matching way, and a groove is formed between the through hole 3 and the bulge 6 after the connection;
injecting a melt formed by mixing and melting a magnet sheet and thermoplastic resin into the groove;
after the melt is cooled to harden, the melt is magnetized to form the bonded magnet 7.
In some embodiments, the height of the protrusion 6 is equal to the height of the through hole 3, the protrusion 6 includes a first connection portion 8 and a second connection portion 9 extending upward from the first connection portion 8, the magnetically contacting the protrusion 6 with the through hole 3 by a bond magnet 7 includes:
the first connecting part 8 is connected with the through hole 3 in a matching way, and a first gap is formed between the second connecting part 9 and the through hole 3 after the connection;
injecting a melt formed by mixing and melting the magnet sheet and the thermoplastic resin into the first gap;
after the melt is cooled and hardened, the melt is magnetized to form the bonded magnet 7.
In some embodiments, the height of the protrusion 6 is equal to the height of the through hole 3, and the magnetically connecting the protrusion 6 and the through hole 3 through the bonded magnet 7 includes:
connecting the bulge 6 with the through hole 3, wherein a second gap is formed between the bulge and the through hole;
injecting a melt formed by mixing and melting the magnet pieces and the thermoplastic resin into the second gap;
after the melt is cooled to harden, the melt is magnetized to form the bonded magnet 7.
In some embodiments, the method further comprises:
and filling a thermal interface material in the gap between the substrate 1 and the radiating fin 2.
While the foregoing is directed to alternative embodiments of the present application, it will be appreciated by those skilled in the art that various changes and modifications may be made without departing from the principles of the application, and that such changes and modifications are to be considered as within the scope of the application.
Claims (7)
1. A heat sink comprising a substrate and heat fins spaced apart from the substrate; the radiating fins comprise a horizontal bottom plate provided with a through hole and a vertical radiating plate extending from the horizontal bottom plate, a protrusion which is integrally formed with the substrate and is a magnet is arranged on the part of the substrate opposite to the through hole, and the protrusion is magnetically connected with the through hole through a bonded magnet.
2. The heat sink as claimed in claim 1, wherein the bonded magnet comprises a melt of a magnetized magnet piece and a thermoplastic resin.
3. The heat sink as claimed in claim 2, wherein the height of the protrusion is lower than the height of the through hole, the protrusion is connected with the through hole in a matching manner, a groove is formed between the through hole and the protrusion after the connection, and the bonded magnet is disposed in the groove.
4. The heat sink as claimed in claim 2, wherein the height of the protrusion is equal to the height of the through hole, the protrusion comprises a first connecting portion and a second connecting portion extending upward from the first connecting portion, the first connecting portion is connected with the through hole in a matching manner, a first gap is formed between the second connecting portion and the through hole after the connection, and the bonding magnet is filled in the first gap.
5. The heat sink as claimed in claim 2, wherein the protrusion has a diameter smaller than that of the through hole, and a second gap is formed between the protrusion and the through hole after the protrusion is connected to the through hole, and the second gap is filled with the bonded magnet.
6. The heat sink as claimed in any one of claims 1 to 5, wherein the gap between the substrate and the heat sink fins is filled with a thermal interface material.
7. The heat spreader of claim 6, wherein the thermal interface material is in the form of a paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122675249.0U CN216597566U (en) | 2021-11-03 | 2021-11-03 | Heat radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122675249.0U CN216597566U (en) | 2021-11-03 | 2021-11-03 | Heat radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216597566U true CN216597566U (en) | 2022-05-24 |
Family
ID=81642489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122675249.0U Active CN216597566U (en) | 2021-11-03 | 2021-11-03 | Heat radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216597566U (en) |
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2021
- 2021-11-03 CN CN202122675249.0U patent/CN216597566U/en active Active
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