CN2618405Y - Board carrying dipplating mechanism of PC board through out hole electroplating device - Google Patents

Board carrying dipplating mechanism of PC board through out hole electroplating device Download PDF

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Publication number
CN2618405Y
CN2618405Y CN 03245199 CN03245199U CN2618405Y CN 2618405 Y CN2618405 Y CN 2618405Y CN 03245199 CN03245199 CN 03245199 CN 03245199 U CN03245199 U CN 03245199U CN 2618405 Y CN2618405 Y CN 2618405Y
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China
Prior art keywords
groups
plate
framework
plating
support plate
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Expired - Fee Related
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CN 03245199
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Chinese (zh)
Inventor
李伯仲
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YIHONG INDUSTRIAL Co Ltd
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YIHONG INDUSTRIAL Co Ltd
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Priority to CN 03245199 priority Critical patent/CN2618405Y/en
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Publication of CN2618405Y publication Critical patent/CN2618405Y/en
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Abstract

The utility model relates to a support plate immersion plating machine for a via hole on a PC plate plating device, wherein, the support plate immersion plating machine is positioned above the main frame, mainly comprising a driving motor, two groups of reducers, a placing frame and a supporting frame, wherein, the driving motor is connected and drives the two groups of reducers, shafts of the two group of reducers are respectively hinged on both side ends of the placing frame to drive the placing frame to move, the supporting frame is crossed between the left and right side frame of the placing frame and is not interfered mutually with the PC plate positioned by the two groups of hanging rods on the rod body at the interval corresponding to two anode areas in the plating tank; thereby, the driving motor of the support plate immersion plating machine drives the two groups of reducers synchronously, making the placing frame and supporting frame together move along the circumference track, making at least more than an anode plating point be plated on each plating area of the PC plate, making the plating liquid be evenly replaced on the each plating area, and making the coating layer evenly be attached on the via hole on the PC plate, and the fine quality plating via hole is produced.

Description

The support plate immersion plating mechanism of PC plate perforation electroplanting device
Technical field
The utility model relates to a kind of PC plate perforation electroplanting device, the particularly a kind of PC of carrying plate carries out the support plate immersion plating mechanism of circular path motion immersion plating in electroplating bath, can make the electroplate liquid displacement property of each plating block on the PC plate good, and allowing each electroplate block electroplates above more than one anode plating point at least, reaching the interior electrodeposited coating of perforation can more evenly adhere to, and electroplates to make high-quality PC plate perforation.
Background technology
Fig. 1 makes the electroplating bath schematic diagram of conventional P C plate perforation electroplanting device, both sides are mounted with corresponding separately anode region 1 ', 2 ' in its groove, each anode region 1 ', 2 ' is uniformly-spaced to be provided with a plurality of anodes plating points 11 ', 21 ', and each anode plates between point 11 ', 21 ' and jet pipe 3 ', 4 ' is installed, so PC plate 5 ' is when implementing perforation and electroplate, this PC plate 5 ' then with a support plate immersion plating mechanism bolster fixation in the mutual non-contravention in 1 ' the corresponding interval, two anode regions.
In addition, in electroplating process is implemented, put 11 ', a 21 ' pairing block because of the PC plate 5 ' of immersion plating in each anode plating and can form thicker electrodeposited coating, therefore avoid this phenomenon, make PC plate 5 ' each block can obtain the better electrical coating uniformity, therefore generally all this support plate immersion plating mechanism design can be become have oscillation action.
Yet this support plate immersion plating mechanism cooperates the design of vibration, and it is comparatively complicated that it forms member designs, so the equipment purchasing cost is higher.Support plate immersion plating mechanism design is subject to the electroplating bath space again, and therefore carrying PC plate 5 ' orientation of oscillation is all single direction at present, as Fig. 1 arrow direction, so can't accomplish vertically to reach horizontal two to space vibration simultaneously.Therefore, 5 ' the immersion plating of PC plate is subjected in electroplating bath under the single direction vibration situation of support plate immersion plating mechanism, the plate face of its PC plate 5 ' up and down degree of oscillation can be variant, therefore can cause the phenomenon of electrodeposited coating variable thickness of the plate face upper and lower of PC plate 5 ', and its applicability is not attained ideal yet.
Summary of the invention
Main purpose of the present utility model provides a kind of support plate immersion plating mechanism of PC plate perforation electroplanting device, this support plate immersion plating mechanism not only forms simply, and the carrying PC of this support plate immersion plating mechanism plate is carried out circular path motion immersion plating mode in electroplating bath, can impel on each block of PC plate electroplate liquid displacement property good, and utilize the plate face to carry out circular path motion immersion plating mode, allow each electroplate block and surpass more than one anode plating point at least, reaching the interior electrodeposited coating of perforation can more evenly adhere to, the phenomenon that the plating bed thickness that can avoid the PC plate to electroplate block up and down differs is made high-quality PC plate perforation and is electroplated.
Above-mentioned purpose of the present utility model is to realize like this, a kind of support plate immersion plating mechanism of PC plate perforation electroplanting device, wherein this support plate immersion plating mechanism framework is in body frame body top, it mainly includes a CD-ROM drive motor, two groups of decelerators, pendulum framework and carriers, it is characterized in that: this CD-ROM drive motor framework is in body frame body one side top, and the reductor of its main shaft institute transmission is with two groups of reductors of an axostylus axostyle interlock; These two groups of reductors organize respectively structure driven by CD-ROM drive motor can driven in synchronism, and the axostylus axostyle of these two groups of reductors is articulated in pendulum framework two side ends respectively, does displacement to drive the pendulum framework; This pendulum framework is provided with the pivot joint wheel that an insulator makes in four corners to each group of bottom, and the axostylus axostyle that the is provided with two groups of reductors eccentric interlock that articulates that stretches through is respectively made a circular path moving displacement with interlock pendulum framework; This carrier crossbearer is in the middle of the left and right sides side frame of pendulum framework, it is two groups of suspension rods of hook on shaft, this suspension rod is the one pole face pressing plate that can lock in the lower end, be positioned between two groups of suspension rods for making PC plate dual-side be subjected to the pressure holding locking, and can bolster fixation mutual non-contravention in corresponding interval, two anode regions in electroplating bath.
The utility model is elaborated with instantiation below in conjunction with accompanying drawing.
Description of drawings
Figure 1 shows that the enforcement illustration when conventional P C plate carries out the perforation plating;
Figure 2 shows that the schematic appearance of the utility model PC plate perforation electroplanting device;
Figure 3 shows that the utility model support plate immersion plating mechanism associated components schematic diagram;
Figure 4 shows that the enforcement illustration of carrier crossbearer on the pendulum framework of the utility model support plate immersion plating mechanism;
Figure 5 shows that the enforcement illustration of the utility model PC plate crossbearer fixation mutual non-contravention in corresponding interval in two anode regions;
Figure 6 shows that the enforcement illustration when the utility model PC plate carries out the perforation plating;
Figure 7 shows that the enforcement illustration of device anode shield in the utility model electroplating bath.
Description of reference numerals: 1 ', 2 ' anode region; 11 ', 21 ' anode plating point; 3 ', 4 ' jet pipe; 5 ' PC plate; 1 body frame body; 2 electroplating baths; 21,22 anode regions; 211,212 anodes plating point; 3 support plate immersion plating mechanisms; 31 CD-ROM drive motor; 311,32,33 reductors; 312,321,331 axostylus axostyles; 34 pendulum frameworks; 341,342,343,344 articulate wheel; 345,346 hold block; 35 carriers; 351,352 pieces; 353,354 suspension rods; 355,356 pressing plates; 4 filters; 41,42 jet pipes; The 5PC plate; 6,7 anode shields.
Embodiment
See also Fig. 2, PC plate perforation electroplanting device of the present utility model mainly comprises members such as body frame body 1, electroplating bath 2, support plate immersion plating mechanism 3 and filter 4, this electroplating bath 2 is mounted on body frame body 1 bottom, its inner splendid attire electroplate liquid, this support plate immersion plating mechanism 3 is for being installed on body frame body 1 top, and filter 4 is installed on body frame body 1 one sides, and it is communicated with many group jet pipes 41,42.Wherein both sides are mounted with the anode region 21,22 of correspondence separately and conducting cathode power supply in the groove of electroplating bath 2, each anode region 21,22 is uniformly-spaced to be provided with a plurality of anode plating points 211,221, and each 211,221 of anode plating point is equipped with jet pipe 41,42, therefore PC plate 5 bolster fixations are in the two anode region mutual non-contraventions in 21,22 corresponding intervals and the conducting negative power supply, each anode plating this moment point 211,221 the cation that produces can dissociate, and quicken with the jet flow of jet pipe 41,42 liberation to the PC plate 5 to form an electrodeposited coating.
See also Fig. 3 again, this support plate immersion plating mechanism 3 mainly includes a CD-ROM drive motor 31, two groups of decelerators 32,33, pendulum framework 34 and carriers 35, wherein these CD-ROM drive motor 31 frameworks are in body frame body 1 one sides top, the reductor 311 of its main shaft institute transmission is with two groups of reductors of an axostylus axostyle 312 interlocks 32,33, make two groups of reductors 32,33 organize structure respectively on body frame body 1 one side two ends, be subjected to CD-ROM drive motor 31 to drive the energy driven in synchronism, and the axostylus axostyle 321,331 of these two groups of reductors 32,33 is articulated in pendulum framework 34 two side ends respectively, to drive 34 displacements of pendulum framework.
And for example shown in Figure 4, this pendulum framework 34 is provided with the pivot joint wheel 341,342,343,344 that an insulator is made in four corners to each group of bottom, wherein two of the same side groups articulate wheel 341,342 in the eccentric axostylus axostyle 321 of wearing pivot reductor 32 of wheel face employing, and two groups of pivot joint wheels 343,344 of another homonymy adopt off-centre to wear on the axostylus axostyle 331 of another group reductor 33 of pivot in wheel face, so put framework 34 frameworks and can make a circular path moving displacement on the axostylus axostyle 321,331 of two groups of reductors 32,33.What this pendulum framework 34 respectively was provided with a conducting negative power supply in the middle of the frame of the left and right sides again holds block 345,346, can mount for carrier 35 to be positioned.
Each group is provided with wedging and holds block 345 and this carrier 35 is in two ends, 346 frame piece 351,352, make carrier 35 hold block 345 in two of pendulum framework 34 by firm crossbearer, 346, but this carrier 35 is in two groups of suspension rods 353 of each hook of shaft in addition, 354, this suspension rod 353,354 in the lower end the one pole face pressing plate 355 that can lock, 356, therefore PC plate 5 dual-sides can utilize two pressing plates 355,356 pressure holdings lock and are positioned two groups of suspension rods 353, between 354, the PC plate 5 of different area size also can utilize two groups of suspension rods 353 relatively, 354 adjust suitable demand spacing and fixation makes PC plate 5 bolster fixations in two anode regions 21 on carrier 35, the mutual non-contraventions in 22 corresponding intervals (as shown in Figure 5).
Learn by above-mentioned explanation, the utility model is implemented concrete the plating, two groups of decelerators 32 of CD-ROM drive motor 31 drives when support plate immersion plating mechanism 3,33 driven in synchronism, must make pendulum framework 34 and carrier 35 make a circular path moving displacement in the lump, so can impel the electroplate liquid displacement property of PC plate 5 each plating block good, allow PC plate 5 each plating block surpass more than one anode plating point 211 at least relatively, 221 electroplate (shown in Figure 6 as), in the time of can avoiding conventional P C plate 5 ' to carry out the perforation plating, each anode plating point 11 ', 21 ' the corresponding electrodeposited coating of electroplating block thicker, or the phenomenon that differs of the plating bed thickness of electroplating block up and down, and then reach that electrodeposited coating can more evenly adhere in PC plate 5 perforations, electroplate to make high-quality PC plate 5 perforations.
In addition, PC plate perforation electroplanting device of the present utility model is when implementing to electroplate, it is more concentrated that its each anode plating point 211,221 places produce cation, for its cation that produces can be distributed in the electrolysis tank 2, therefore can be in the fore device one anode shield 6,7 (as shown in Figure 7) of each anode plating point 211,221, impel produce cation can uniform penetrating and free each is electroplated on blocks to PC plate 5.

Claims (6)

1, a kind of support plate immersion plating mechanism of PC plate perforation electroplanting device, wherein this support plate immersion plating mechanism framework is in body frame body top, and it mainly includes a CD-ROM drive motor, two groups of decelerators, pendulum framework and carriers, it is characterized in that:
This CD-ROM drive motor framework is in body frame body one side top, and the reductor of its main shaft institute transmission is with two groups of reductors of an axostylus axostyle interlock;
These two groups of reductors organize respectively structure driven by CD-ROM drive motor can driven in synchronism, and the axostylus axostyle of these two groups of reductors is articulated in pendulum framework two side ends respectively, does displacement to drive the pendulum framework;
This pendulum framework is provided with the pivot joint wheel that an insulator makes in four corners to each group of bottom, and the axostylus axostyle that the is provided with two groups of reductors eccentric interlock that articulates that stretches through is respectively made a circular path moving displacement with interlock pendulum framework;
This carrier crossbearer is in the middle of the left and right sides side frame of pendulum framework, it is two groups of suspension rods of hook on shaft, this suspension rod is the one pole face pressing plate that can lock in the lower end, be positioned between two groups of suspension rods for making PC plate dual-side be subjected to the pressure holding locking, and can bolster fixation mutual non-contravention in corresponding interval, two anode regions in electroplating bath.
2, the support plate immersion plating mechanism of PC plate perforation electroplanting device as claimed in claim 1 wherein puts two groups of pivot joints on the same right side of framework and takes turns in the eccentric axostylus axostyle of wearing pivot right side reductor of wheel face employing.
3, the support plate immersion plating mechanism of PC plate perforation electroplanting device as claimed in claim 1, two groups that wherein put the same left side of framework articulate the axostylus axostyle of taking turns reductor on the left of wheel face employing off-centre is worn pivot.
4, the support plate immersion plating mechanism of PC plate perforation electroplanting device as claimed in claim 1, wherein this pendulum framework respectively is provided with the block that holds of a conducting negative power supply in the middle of the frame of the left and right sides, mounts for carrier to be positioned.
5, the support plate immersion plating mechanism of PC plate perforation electroplanting device as claimed in claim 1, wherein each group is provided with the frame piece that wedging holds block to this carrier in two ends, and carrier can be held between block in two of pendulum framework by firm crossbearer.
6, the support plate immersion plating mechanism of PC plate perforation electroplanting device as claimed in claim 1, wherein the PC plate of different area size utilizes carrier to hang two groups of suspension rods and does suitable demand spacing adjustment, is subjected to two pressing plate pressure holding lockings again and fixation is electroplated between two groups of suspension rods.
CN 03245199 2003-04-16 2003-04-16 Board carrying dipplating mechanism of PC board through out hole electroplating device Expired - Fee Related CN2618405Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 03245199 CN2618405Y (en) 2003-04-16 2003-04-16 Board carrying dipplating mechanism of PC board through out hole electroplating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 03245199 CN2618405Y (en) 2003-04-16 2003-04-16 Board carrying dipplating mechanism of PC board through out hole electroplating device

Publications (1)

Publication Number Publication Date
CN2618405Y true CN2618405Y (en) 2004-05-26

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101914800A (en) * 2010-08-31 2010-12-15 广州杰赛科技股份有限公司 Electroplating rack and electroplating device for printed circuit board
CN103668418A (en) * 2013-11-21 2014-03-26 郑先锋 Automatic swing electroplating machine

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101914800A (en) * 2010-08-31 2010-12-15 广州杰赛科技股份有限公司 Electroplating rack and electroplating device for printed circuit board
CN101914800B (en) * 2010-08-31 2012-12-05 广州杰赛科技股份有限公司 Electroplating rack and electroplating device for printed circuit board
CN103668418A (en) * 2013-11-21 2014-03-26 郑先锋 Automatic swing electroplating machine
CN103668418B (en) * 2013-11-21 2017-01-04 郑先锋 A kind of automatic swinging electroplating machine

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