CN2618187Y - Thin film transistor liquid crystal displaying devices - Google Patents

Abstract

The utility model relates to a thin-film transistor liquid crystal display, which comprises a transparent baseplate on which at least two adjacent gate electrodes form, a gate insulating layer forming on the surface of the gate electrodes, a semiconductor layer defined into the preset shape forming on the gate insulating layer, a source/ drain metal layer forming on the preset area on the transparent baseplate, an insulating layer forming on the source/ drain metal layer, a contact window which passes through the insulating layer, the source/ drain metal layer and the gate insulating layer and protrudes out of the surface of the transparent baseplate between the adjacent gate electrodes, a transparent electric layer forming on the transparent baseplate, and a black matrix area forming on the corresponding upper area of the contact window. The utility model has advantages of reducing mask times of photoetching technology, reducing production time and needed equipments, and increasing production and reducing cost.

Description

Thin Film Transistor-LCD

Technical field

The utility model relates to a kind of Thin Film Transistor-LCD, particularly relates to a kind of Thin Film Transistor-LCD that reduces the array light shield number of plies.

Background technology

LCD (liquid crystal display, hereinafter to be referred as LCD) be at present by the most widely used a kind of flat-panel screens, it has features such as low consumption electric power, slim light weight and low voltage drive, can be applied in the portable machine in PC, word processor, navigational system, Game device, projector, view finder (view finder) and the life, for example: the demonstration aspect of wrist-watch, robot calculator, televisor etc.

The displaying principle of LCD is dielectric anisotropy and the conduction anisotropy that utilizes liquid crystal molecule to have, and can make the ordered state conversion of liquid crystal molecule when extra electric field, causes liquid crystal film to produce various photoelectric effect.And thin film transistor (TFT) (thin film transistor is hereinafter to be referred as TFT)-LCD utilizes TFT as active member, makes it have low consumption electric power, low voltage drive, advantage such as thin, light.

Please refer to Figure 1A to Fig. 1 E, Figure 1A to Fig. 1 E is the sectional view that shows conventional thin film transistor LCD making flow process.At first, shown in Figure 1A,,, be deposited on the transparency carrier 21, utilize one light etching process (lithography technology) that this metal level definition is formed a gate electrode (gate electrode) 22 again as molybdenum/aluminum-neodymium alloys with a metal level.Then, on gate electrode 22 surfaces, form a gate insulator 23 again.

Then, shown in Figure 1B, on transparency carrier 21, deposit an insulation course 24, one first semiconductor layer 25 in regular turn, as amorphous silicon (amorphous silicon is hereinafter to be referred as a-Si) layer and one second semiconductor layer 26, as doped silicon layer (n ⁺Doped amorphous silicon).Afterwards, definition insulation course 24, first semiconductor layer 25 and second semiconductor layer 26 are to form island structure as shown in the figure.

Then, shown in Fig. 1 C, deposition one aluminium alloy layer for example is pure aluminum metal, aluminium-niobium alloy, aluminum-neodymium alloys, aluminum-titanium alloy or al-si-cu alloy on transparency carrier 21.Afterwards, utilize light etching process one, the metal level definition is formed a signal wire 27 and a source electrode, wherein, the source/drain metal layer comprises source electrode 31 and drain electrode 32 intervals one passage 28, and first semiconductor layer 25 in the passage 28 is come out.

Then, shown in Fig. 1 D, deposition one protective seam 34 on transparency carrier 21 coats whole TFT element fully and to cover, but exposes contact hole 30, avoids extraneous erosion with protecting component and disturbs.Protective seam 34 for example is a silicon nitride layer.

At last, and deposition one indium tin oxide on transparency carrier 21 (indium tin oxide, ITO) layer, and carry out light etching process, indium tin oxide layer is defined as a signal wire district 36 and a pixel (pixel) district 38, shown in Fig. 1 E.

Fig. 2 is the sectional view that shows another kind of conventional thin film transistor LCD, and this sectional view mainly shows capacitor (capacitor storage) part of Thin Film Transistor-LCD.The making requirements of process six road light etching process of this conventional thin film transistor LCD, at first, deposition one the first metal layer on a transparency carrier 50 utilizes the first road light etching process that this first metal layer definition is formed a gate electrode 52 again.Afterwards, on gate electrode 52 surfaces, form a gate insulator 54, and utilize the second road light etching process definition gate insulator 54.On gate insulator 54, form the semi-conductor layer (not shown), and utilize the 3rd road light etching process to define this semiconductor layer.Then, deposition one second metal level utilizes the 4th road light etching process again on transparency carrier 50, and the definition of second metal level is formed source electrode 56.Next deposits a protective seam 58 and a flatness layer 60 in regular turn on transparency carrier 50, whole TFT element is coated fully cover; avoiding extraneous erosion with protecting component disturbs; afterwards, carry out the 5th road light etching process, definition flatness layer 60, protective seam 58 are to form a contact hole.At last, deposition one indium tin oxide layer 64 on transparency carrier 50, and carry out the 6th road light etching process, indium tin oxide layer 64 is defined as a signal wire district and a pixel (pixel) district.

Behind said process, also comprise the process that forms colored filter (color filter) 70 again and form sept (spacer) and liquid crystal (liquid crystal) 72.

And because traditional TFT needs twice contact hole manufacturing process, make existing TFT manufacture process need reach six road masks (mask) and carry out repeatedly light etching process (photolithographyprocess), therefore can produce low yield, problem such as expensive.

Summary of the invention

In view of this, the utility model proposes a kind of Thin Film Transistor-LCD, utilize this Thin Film Transistor-LCD can reduce the light shield number that array is made, this Thin Film Transistor-LCD comprises: a transparency carrier is formed with at least two adjacent gate electrodes on it; One gate insulator is formed on the above-mentioned gate electrode surface; One is defined as the semiconductor layer of reservation shape, is formed on the gate insulator; Source electrode is formed at the presumptive area that this transparent base is pulled; One insulation course is formed on this source/drain metal layer; One contact hole, it passes this insulation course, this source/drain metal layer and this gate insulator and exposes transparency carrier surface between these neighboring gates electrodes; One transparency conducting layer is formed on the transparency carrier; And a black matrix district, be formed at the corresponding region, top of contact hole.

Therefore Thin Film Transistor-LCD of the present utility model can reduce mask (mask) number of times of light etching process, can reduce manufacturing time and the required equipment of manufacture process, increases output and reduces cost; And simultaneously, grid is formed at the contact hole both sides, can avoids the contact hole over etching and produce short circuit with grid by the design of grid structure; In addition, owing to be formed with black matrix district, can avoid the contact hole neighboring area to produce light leak in contact hole top position correspondence.

Description of drawings

For above-mentioned purpose of the present utility model, feature and advantage can be become apparent, preferred embodiment cited below particularly and conjunction with figs. are described in detail below:

Figure 1A to Fig. 1 E makes the sectional view of flow process for showing the conventional thin film transistor LCD.

Fig. 2 is the sectional view of the capacitor department separation structure of the another kind of conventional thin film transistor LCD of demonstration.

Fig. 3 makes the pixel layout top view of flow process for the Thin Film Transistor-LCD that shows the utility model embodiment.

Fig. 4 A to Fig. 4 E is for showing the making flow process sectional view according to the AA ' section of Fig. 3.

Embodiment

At first, please refer to Fig. 3, shown pixel layout top view according to the LCD Structure of thin film transistor of the utility model embodiment.This LCD Structure of thin film transistor comprises a transparency carrier 100; Gate regions 310; Doped silicon layer 320; Source/drain regions 330; Contact region 340; Indium tin oxide layer 350; Black matrix district 360 on the colored filter; Capacitor line 370 and gate line 380.

Fig. 4 A to Fig. 4 E has shown the making flow process sectional view according to the AA ' section of Fig. 3, and these flow process sectional views have mainly shown the capacitor part of Thin Film Transistor-LCD.At first, shown in Fig. 4 A,,, be deposited on the transparency carrier 100, utilize the first road light etching process that this first metal layer definition is formed a gate electrode (gate electrode) 102 again as molybdenum-aluminum-neodymium alloys layer with a first metal layer.

Then, shown in Fig. 4 B, on gate electrode 102 surfaces, form a gate insulator 104 again, for example utilize chemical vapor deposition method deposition monoxide layer.Afterwards, on gate insulator 104, form the semi-conductor layer (not shown), as doped silicon layer (n+doped amorphous silicon).Afterwards, utilize the second road light etching process to define this semiconductor layer again.

Then, shown in Fig. 4 C, deposition one second metal level for example is pure aluminum metal, aluminium-niobium alloy, aluminum-neodymium alloys, aluminum-titanium alloy or al-si-cu alloy on transparency carrier 100.Afterwards, utilize the 3rd road light etching process, the definition of second metal level is formed source electrode 106.

Secondly, shown in Fig. 4 D, on transparency carrier 100, deposit an insulation course in regular turn,, whole TFT element coated fully cover, avoid extraneous erosion with protecting component and disturb as a protective seam 108 and the flatness layer 110 in order to planarization with protection function.Protective seam 108 for example is oxide skin(coating) or the nitride layer that forms with chemical vapour deposition technique, and flatness layer 110 for example is the oxide skin(coating) that forms with chemical vapour deposition technique.Afterwards; carry out the 4th road light etching process, definition flatness layer 110, protective seam 108, source/drain metal layer 106 and gate insulator 104 are to form a contact hole 112; and contact hole 112 is between above-mentioned gate electrode 102, and gate electrode 102 is not connected with contact hole 112.

At last, shown in Fig. 4 E, deposition one transparency conducting layer as an indium tin oxide layer 114, and carries out the 5th road light etching process on transparency carrier 100, and indium tin oxide layer 114 is defined as a signal wire district and a pixel (pixel) district.

Please again referring to Fig. 4 E, the specified distance that the utility model embodiment still is included in distance transparent substrate 100 forms a colored filter (color filter) 120.Afterwards, on the corresponding region of corresponding contact hole 112 on the colored filter (colorfilter) 120, form black matrix (black matrix) district 122.The purpose that forms black matrix district 122 is will block fringe region (edge domain) to avoid light leakage phenomena.Then, between transparency carrier 100 and colored filter 120, form sept (spacer) and liquid crystal (liquid crystal) 124 again.

As mentioned above, the Thin Film Transistor-LCD of the utility model embodiment includes a transparency carrier 100, is formed with at least two adjacent gate electrodes 102 on it; One gate insulator 104 is formed on gate electrode 102 surfaces; The one semiconductor layer (not shown) that is defined as reservation shape is formed on the gate insulator 104; Source electrode 106 is formed at the presumptive area on the transparency carrier 100; One protective seam 108 and a flatness layer 110 are formed on the source/drain metal layer 106; One contact hole 112 passes protective seam 108, flatness layer 110, source/drain metal layer 106 and gate insulator 104 and exposes transparency carrier 100 surfaces; One indium tin oxide layer 114 is formed on the transparency carrier 100; And one black matrix district 122 be formed at the corresponding region, top of contact hole 112.

The utility model is in the process of etch protection layer with the formation contact hole, and the etching process with contact hole continues to be etched to source/drain metal layer and gate electrode simultaneously, so can omit the light etching process/process of definition gate insulator.And in capacitor area, grid is also corresponding to be excavated to avoid the short circuit of source/drain metal layer and indium tin oxide interlayer.What method of the present utility model had reduced light etching process covers shielding (mask) number of times, therefore can reduce equipment needed thereby in manufacturing time and the manufacture process, increases output and reduces cost; And by the design of grid structure, grid is formed at the contact hole both sides simultaneously, can avoids the contact hole over etching and produce short circuit with grid; In addition, owing to be formed with black matrix district, can avoid the contact hole neighboring area to produce light leak in contact hole top position correspondence.

Though the utility model illustrates as above in the mode of preferred embodiment; right its is not in order to limit the utility model; any personnel that have the knack of present technique; under the situation that does not break away from spirit and scope of the present utility model; also can make various improvement or variation, these all should belong to protection domain of the present utility model.

Description of reference numerals

100～transparency carrier; 310～gate regions; 320～doped silicon layer; 330～source/drain regions; 340～contact zone; 350～indium tin oxide layer; 360～black matrix district; 370～capacitor line; 380～Gate line; 102～gate electrode; 104～gate insulator, 106～source/drain metal layer; 108～Protective layer; 110～flatness layer; 112～contact hole; 114～indium tin oxide layer; 120～colour Optical filter; 122～black matrix district; 124～sept and liquid crystal.

Claims (8)

1, a kind of Thin Film Transistor-LCD is characterized in that, comprising:

One transparency carrier is formed with at least two adjacent gate electrodes on it;

One gate insulator, it is formed on those gate electrode surfaces;

One is defined as the semiconductor layer of reservation shape, and it is formed on this gate insulator;

Source electrode, it is formed at the presumptive area on this transparency carrier;

One insulation course, it is formed on this source/drain metal layer;

One contact hole, it passes this insulation course, this source/drain metal layer and this gate insulator and exposes transparency carrier surface between those neighboring gates electrodes;

One transparency conducting layer, it is formed on this transparency carrier; And

One black matrix district, it is formed at the corresponding region, top of this contact hole.

2, Thin Film Transistor-LCD as claimed in claim 1 is characterized in that, this gate electrode is molybdenum/aluminum-neodymium alloys.

3, Thin Film Transistor-LCD as claimed in claim 1 is characterized in that, this source/drain metal layer is pure aluminum metal, aluminium-niobium alloy, aluminum-neodymium alloys, aluminum-titanium alloy or al-si-cu alloy.

4, Thin Film Transistor-LCD as claimed in claim 1 is characterized in that, this gate insulator is the monoxide layer that utilizes the chemical vapor deposition method deposition

5, Thin Film Transistor-LCD as claimed in claim 1 is characterized in that, this insulation course is monoxide layer or the nitride layer that utilizes the chemical vapor deposition method deposition.

6, Thin Film Transistor-LCD as claimed in claim 1 is characterized in that, more comprises:

One colored filter, it is formed at the specified distance apart from this transparency carrier; And

One black matrix district, its be formed on a pair of on this colored filter should the corresponding region of contact hole on.

7, Thin Film Transistor-LCD as claimed in claim 1 is characterized in that, this gate electrode is not connected with this contact hole.

8. Thin Film Transistor-LCD as claimed in claim 1 is characterized in that, described transparency conducting layer is an indium tin oxide layer.

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