CN2613055Y - Module structure of LED - Google Patents
Module structure of LED Download PDFInfo
- Publication number
- CN2613055Y CN2613055Y CNU032415656U CN03241565U CN2613055Y CN 2613055 Y CN2613055 Y CN 2613055Y CN U032415656 U CNU032415656 U CN U032415656U CN 03241565 U CN03241565 U CN 03241565U CN 2613055 Y CN2613055 Y CN 2613055Y
- Authority
- CN
- China
- Prior art keywords
- emitting diode
- light
- circuit board
- diode chip
- backlight unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Led Device Packages (AREA)
Abstract
A light emitting diode mode structure comprises a circuit board, a light emitting diode chip, a metal plate, an external shell and a focus gathering lens, wherein the metal plate is equipped under the circuit board, the light emitting diode chip is contained on a slot hole on the circuit board, the lower side of the light emitting diode chip is electrically connected with the upper side of the metal plate, the upper side of the light emitting diode chip is electrically connected with the upper side of the circuit board by a wire, the circuit board and the metal plate are positioned inside the external shell, the circuit board and the external shell reach an electric connection, and the focus gathering lens is equipped above the light emitting diode chip, by which, a light emitting diode mode structure with a high brightness, better radiation effect, convenient equipment and simplified craft can be composed.
Description
Technical field
The utility model relates to a kind of light-emitting diode (LED) module structure, refer in particular to a kind ofly have high brightness, radiating efficiency is preferable, easy to assembly and the light-emitting diode (LED) module structure of work simplification.
Background technology
Light-emitting diode (Light Emission Diode is called for short LED) is a kind of electronic component that utilizes single-crystal semiconductor material to make, at present mass-produced redness and green two kinds of light-emitting diodes that have in the three primary colors.Light-emitting diode is because of the reliability height, and luminous point only uses two kinds of controls of ON, OFF, can show numeral and literal according to line segment, so use very extensively and easy, replaces traditional lighting lamp source gradually, becoming the illumination material.But when known light-emitting diode desired to meet requiring of high brightness, owing to need to use bigger electric current, relative meeting caused the rising of temperature, causes the problem of heat radiation aspect.
See also Fig. 1, it is a kind of known light-emitting diode, it mainly is for having sun in one, the circuit board 90 of cathode circuit is provided with bowl groove 91, and in bowl groove 91, be provided with light-emitting diode chip for backlight unit 92, this light-emitting diode chip for backlight unit 92 is to be connected to anode circuit or cathode circuit with lead 93, and on light-emitting diode chip for backlight unit 92, be covered with colloid 94, this circuit board 90 is that nonconducting basal layer 901 upsides are provided with a conduction in order to form sun, the circuit layer 902 of cathode circuit, and be provided with a conduction and can be for the pin conducting to the conductive layer 903 of circuit layer 902 in basal layer 901 downsides.But, this known light-emitting diode, the high temperature that its light-emitting diode chip for backlight unit 92 is produced can't be passed to conductive layer 903 rapidly, its radiating efficiency is relatively poor, cause light-emitting diode chip for backlight unit 92 to burn easily, and because the positive and negative polar circuit of circuit layer 902 all is located at circuit board 90 upsides, therefore two pins 95,96 need pass circuit board 90 and can stretch out in the below, cause the inconvenience of assembling, make light-emitting diode technology comparatively complicated.
So as from the foregoing, above-mentioned known light-emitting diode on the manufacturing and actual the use, obviously has inconvenience and shortcoming existence, and can wait to be improved.
So the utility model people is at above-mentioned shortcoming, propose a kind of reasonable in design and effectively improve the utility model of above-mentioned shortcoming.
Summary of the invention
Main purpose of the present utility model, be to provide a kind of light-emitting diode (LED) module structure, be that light-emitting diode chip for backlight unit directly is arranged on a conduction and the good sheet metal of heat-conducting effect, the high temperature that light-emitting diode chip for backlight unit produces can be passed to sheet metal rapidly, in order to assist heat radiation, to obtain preferable radiating efficiency, make light-emitting diode chip for backlight unit be stablized the characteristic of its high brightness of performance, and unlikely burning.
Another purpose of the present utility model is to provide a kind of light-emitting diode (LED) module structure, and its wiring need not to pass circuit board, and it is comparatively convenient to assemble, and makes light-emitting diode technology comparatively simplify.
Above-mentioned purpose of the present utility model is achieved in that a kind of light-emitting diode (LED) module structure that the utility model provides, and comprising: a circuit board, and it is provided with a slotted eye; One sheet metal is arranged at this circuit board below; One light-emitting diode chip for backlight unit is placed in this slotted eye, and this light-emitting diode chip for backlight unit downside and this sheet metal upside electrically connect, and this light-emitting diode chip for backlight unit upside electrically connects with a lead and this circuit board upside, also is covered with colloid on this light-emitting diode chip for backlight unit; One shell, its inside is formed with an accommodation space, and this circuit board and sheet metal are placed in this accommodation space, and this circuit board and this shell are reached electric connection; And a condenser lens, it is arranged in the accommodation space of this shell, and is positioned at this light-emitting diode chip for backlight unit top.
Following with reference to specific embodiment of the utility model and accompanying drawing thereof, further detailed explanation feature of the present utility model and technology contents, yet shown in accompanying drawing only provide with reference to and explanation usefulness, be not to be used for the utility model is limited.
Description of drawings
Fig. 1 is the cutaway view of known light-emitting diode;
Fig. 2 is a three-dimensional exploded view of the present utility model;
Fig. 3 is a three-dimensional combination figure of the present utility model;
Fig. 4 is a cutaway view of the present utility model.
Embodiment
In Fig. 1 to Fig. 4 of the present utility model, relate to following figure number: circuit board 90, bowl groove 91, light-emitting diode chip for backlight unit 92, lead 93, colloid 94, pin 95, pin 96, basal layer 901, circuit layer 902, conductive layer 903, circuit board 10, cathode circuit 11, slotted eye 12, light-emitting diode chip for backlight unit 20, sheet metal 30, conducting resinl 31, wiring 32, insulator 40, shell 50, accommodation space 51, the first openings 52, second opening, 53, the first retaining edge, 54, the second retaining edge 55, wiring 56, condenser lens 60, depression 61, flange 62, lead 70, colloid 80.
See also Fig. 2, Fig. 3 and Fig. 4, the utility model provides a kind of light-emitting diode (LED) module structure, including a circuit board 10, a light-emitting diode chip for backlight unit 20, a sheet metal 30, an insulator 40, a shell 50 and a condenser lens 60 constitutes, this circuit board (PC plate) 10 rounded tabular or other shapes wherein, its upside has cathode circuit 11, and this circuit board 10 is provided with a slotted eye 12, this slotted eye 12 runs through circuit board 10 upsides and downside, this light-emitting diode chip for backlight unit 20 is the chip of high brightness, and it is placed in this slotted eye 12.
This sheet metal 30 is made with the good metal material of conductions such as copper and heat-conducting effect, its rounded sheet or other shape, this sheet metal 30 is arranged at this circuit board 10 belows, and these sheet metal 30 areas are less than these circuit board 10 areas, make these sheet metal 30 outer rims than contracting in these circuit board 10 outer rims, to avoid these sheet metal 30 outer rims to contact these shell 50 inner edges and then to cause short circuit.
These light-emitting diode chip for backlight unit 20 downsides (anode) are to electrically connect with conducting resinl (as elargol) 31 and these sheet metal 30 upsides, make this light-emitting diode chip for backlight unit 20 reach electric connection with this sheet metal 30.These light-emitting diode chip for backlight unit 20 upsides (negative electrode) then electrically connect with the cathode circuit 11 of a lead 70 with these circuit board 10 upsides; make this light-emitting diode chip for backlight unit 20 reach electric connection with this circuit board 10; and on this light-emitting diode chip for backlight unit 20, be covered with colloid 80, in order to protection and fixed chip 20.
This insulator 40 is made with insulating material such as potteries, and it is a circular ring-type or other shape, and it is made that this insulator 40 also can becket adds insulating trip (figure slightly), and this insulator 40 is arranged at this sheet metal 30 belows.
This shell 50 is made with the good metal material of conductions such as copper and heat-conducting effect, this shell 50 is the ducted body of a circle or other shape, its inside is formed with an accommodation space 51, these accommodation space 51 upper and lower two ends are formed with one first opening 52 and one second opening 53 respectively, these first opening, 52 internal diameters are less than these accommodation space 51 internal diameters, make these accommodation space 51 upper limbs be formed with a ring first retaining edge 54, these second opening, 53 internal diameters make these accommodation space 51 lower edges be formed with a ring second retaining edge 55 then greater than these accommodation space 51 internal diameters.
This circuit board 10, sheet metal 30 and insulator 40 are placed in second opening 53 of this shell 50, and can utilize this circuit board 10 to contact at this second retaining edge 55 and locating, and this insulator 40 and this shell 50 riveted joints can be combined as a whole, make the firm location of this circuit board 10, sheet metal 30 and insulator 40, and cathode circuit 11 outer rims that make this circuit board 10 contact with this shell 50 and reach electric connection, make these light-emitting diode chip for backlight unit 20 upsides, lead 70, circuit board 10 reach electric connection, make cathodic electricity can import light-emitting diode chip for backlight unit 20 thus with shell 50.
This condenser lens 60 is made with polyacrylic resin light transmissive materials such as (acryl), it is arranged in the accommodation space 51 of this shell 50, and this condenser lens 60 is positioned at this light-emitting diode chip for backlight unit 20 tops, and a depression 61 corresponding to colloid 80 and light-emitting diode chip for backlight unit 20 is established in these condenser lens 60 lower ends.These condenser lens 60 upper ends contact at this first retaining edge 54 and locate, and be provided with a flange 62 in these condenser lens 60 upper ends, this flange 62 contacts at first opening, 52 inner edges of this shell 50, makes in the firm accommodation space that is positioned this shell 50 51 of this condenser lens 60; By above-mentioned composition to form light-emitting diode (LED) module structure of the present utility model.
When the utility model uses in reality, can utilize wiring 32 input anode electricity to sheet metal 30 and light-emitting diode chip for backlight unit 20 downsides respectively, and wiring 56 input cathodic electricities are to shell 50, circuit board 10, lead 70 and light-emitting diode chip for backlight unit 20 upsides, luminous with driven for emitting lights diode chip for backlight unit 20, light also can see through condenser lens 60 gathering back ejaculations, form a kind of light-emitting diode (LED) module structure of high brightness whereby, can be in order to showing numeral and literal, or as the illuminating lamp source.
The utility model is that light-emitting diode chip for backlight unit 20 directly is arranged on a conduction and the good sheet metal 30 of heat-conducting effect, therefore the high temperature of light-emitting diode chip for backlight unit 20 generations can be passed to this sheet metal 30 rapidly, so that assist heat radiation by this sheet metal 30, to obtain preferable radiating efficiency, make light-emitting diode chip for backlight unit 20 be stablized the characteristic of its high brightness of performance, and unlikely burning makes the heat dissipation problem of high brightness LED be able to effective solution.
Moreover, the utility model is the cathode circuit 11 that the negative electrode of light-emitting diode chip for backlight unit 20 is electrically connected at circuit board 10 upsides, and the anode of this light-emitting diode chip for backlight unit 20 is sheet metal 30 electric connections of direct and circuit board 10 belows, make loop, yin, yang the two poles of the earth be positioned at not coplanar of circuit board 10, and the sheet metal 30 that is positioned at the bottom can be used as the anode contact, be positioned at outside shell 50 and can be used as cathode contact, wiring 32 and 56 all need not to pass circuit board 10, it is comparatively convenient to assemble, and makes light-emitting diode technology comparatively simplify.
In sum, the utility model has effectively overcome the shortcoming that exists in the known technology.
But, the above only is a preferable possible embodiments of the present utility model, be not therefore to arrest limit claim of the present utility model,, all in like manner be contained in the scope of the present utility model so the equivalence techniques that every utilization the utility model specification and figure accompanying drawing content are done changes.
Claims (7)
1. a light-emitting diode (LED) module structure is characterized in that, comprising:
One circuit board is provided with a slotted eye;
One sheet metal is arranged at this circuit board below;
One light-emitting diode chip for backlight unit is placed in this slotted eye, and this light-emitting diode chip for backlight unit downside and this sheet metal upside electrically connect, and this light-emitting diode chip for backlight unit upside electrically connects with a lead and this circuit board upside, is covered with colloid on this light-emitting diode chip for backlight unit;
One shell, its inside is formed with an accommodation space, and this circuit board and sheet metal are placed in this accommodation space, and this circuit board and this shell are reached electric connection; And
One condenser lens is arranged in the accommodation space of this shell, and is positioned at this light-emitting diode chip for backlight unit top.
2. light-emitting diode (LED) module structure as claimed in claim 1 is characterized in that, described circuit board upside has cathode circuit, and this light-emitting diode chip for backlight unit upside electrically connects with the cathode circuit of this lead and this circuit board upside.
3. light-emitting diode (LED) module structure as claimed in claim 1 is characterized in that, described sheet metal area is less than this board area, and this sheet metal outer rim is than contracting in this circuit board outer rim.
4. light-emitting diode (LED) module structure as claimed in claim 1 is characterized in that, described sheet metal below is provided with an insulator, and this insulator combines with this shell.
5. light-emitting diode (LED) module structure as claimed in claim 1 is characterized in that, described light-emitting diode chip for backlight unit downside electrically connects with conducting resinl and this sheet metal upside.
6. light-emitting diode (LED) module structure as claimed in claim 1, it is characterized in that, accommodation space two ends of described shell are formed with one first opening and one second opening, this accommodation space upper limb is formed with the first retaining edge, this accommodation space lower edge is formed with the second retaining edge, this circuit board and sheet metal are placed in second opening of this shell, and this circuit board contacts at this second retaining edge and locatees, this condenser lens upper end contacts at this first retaining edge and locatees, and be provided with flange in this condenser lens upper end, this flange contacts at the first opening inner edge of this shell.
7. light-emitting diode (LED) module structure as claimed in claim 1 is characterized in that, a depression corresponding to colloid and light-emitting diode chip for backlight unit is established in described condenser lens lower end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU032415656U CN2613055Y (en) | 2003-04-07 | 2003-04-07 | Module structure of LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU032415656U CN2613055Y (en) | 2003-04-07 | 2003-04-07 | Module structure of LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2613055Y true CN2613055Y (en) | 2004-04-21 |
Family
ID=34168441
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU032415656U Expired - Fee Related CN2613055Y (en) | 2003-04-07 | 2003-04-07 | Module structure of LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2613055Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1825586B (en) * | 2005-02-14 | 2012-06-27 | 奥斯兰姆施尔凡尼亚公司 | Led assembly and method of making the same |
| US8754427B2 (en) | 2006-12-29 | 2014-06-17 | Osram Opto Semiconductors Gmbh | Lens arrangement and LED display device |
| CN107211532A (en) * | 2015-03-31 | 2017-09-26 | 惠普发展公司，有限责任合伙企业 | Printed circuit board (PCB) |
| CN109244696A (en) * | 2018-09-26 | 2019-01-18 | 云南电网有限责任公司电力科学研究院 | A kind of electric substation fitting and the construction method for preventing electric substation fitting ponding |
-
2003
- 2003-04-07 CN CNU032415656U patent/CN2613055Y/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1825586B (en) * | 2005-02-14 | 2012-06-27 | 奥斯兰姆施尔凡尼亚公司 | Led assembly and method of making the same |
| US8754427B2 (en) | 2006-12-29 | 2014-06-17 | Osram Opto Semiconductors Gmbh | Lens arrangement and LED display device |
| CN107211532A (en) * | 2015-03-31 | 2017-09-26 | 惠普发展公司，有限责任合伙企业 | Printed circuit board (PCB) |
| US10296119B2 (en) | 2015-03-31 | 2019-05-21 | Hewlett-Packard Development Company, L.P. | Printed circuit board |
| CN107211532B (en) * | 2015-03-31 | 2019-06-28 | 惠普发展公司，有限责任合伙企业 | Printed circuit board |
| CN109244696A (en) * | 2018-09-26 | 2019-01-18 | 云南电网有限责任公司电力科学研究院 | A kind of electric substation fitting and the construction method for preventing electric substation fitting ponding |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20040421 |