CN2613055Y - Module structure of LED - Google Patents

Module structure of LED Download PDF

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Publication number
CN2613055Y
CN2613055Y CNU032415656U CN03241565U CN2613055Y CN 2613055 Y CN2613055 Y CN 2613055Y CN U032415656 U CNU032415656 U CN U032415656U CN 03241565 U CN03241565 U CN 03241565U CN 2613055 Y CN2613055 Y CN 2613055Y
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CN
China
Prior art keywords
circuit board
light emitting
emitting diode
side
housing
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CNU032415656U
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Chinese (zh)
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熊麒
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熊麒
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Priority to CNU032415656U priority Critical patent/CN2613055Y/en
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Publication of CN2613055Y publication Critical patent/CN2613055Y/en

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors

Abstract

A light emitting diode mode structure comprises a circuit board, a light emitting diode chip, a metal plate, an external shell and a focus gathering lens, wherein the metal plate is equipped under the circuit board, the light emitting diode chip is contained on a slot hole on the circuit board, the lower side of the light emitting diode chip is electrically connected with the upper side of the metal plate, the upper side of the light emitting diode chip is electrically connected with the upper side of the circuit board by a wire, the circuit board and the metal plate are positioned inside the external shell, the circuit board and the external shell reach an electric connection, and the focus gathering lens is equipped above the light emitting diode chip, by which, a light emitting diode mode structure with a high brightness, better radiation effect, convenient equipment and simplified craft can be composed.

Description

发光二极管模块结构 LED module structure

技术领域 FIELD

本实用新型涉及一种发光二极管模块结构,特指一种具有高亮度、散热效率较佳、组装方便且工艺简化的发光二极管模块结构。 The present invention relates to a light emitting diode module structure, especially having a high brightness, better heat dissipation efficiency, simplification of the process and easy assembly LED module structure.

背景技术 Background technique

发光二极管(Light Emission Diode,简称LED)为一种利用单晶半导体材料制成的电子零件,目前大量生产的有三原色中的红色和绿色二种发光二极管。 LED (Light Emission Diode, referred to as LED) as a electronic component made using a single crystal semiconductor material, the volume production of the three primary colors are two kinds of red and green light emitting diodes. 发光二极管因信赖度高,且发光点仅用ON、OFF两种控制,可依线段来显示数字及文字,故应用十分广泛且简便,已逐渐取代传统照明灯源,成为照明用材料。 Due to high reliability light emitting diode, and the light emitting point only ON, OFF two control, and to follow the line of text to display numbers, it is widely used and simple, has gradually replaced traditional lighting sources, lighting has become the material. 但是,公知的发光二极管欲符合高亮度的要求时,由于需使用较大的电流,相对的会导致温度的升高,造成散热方面的问题。 However, when the light emitting diode known to be in line with the requirements of high luminance, since the need to use large currents, the relative increase in temperature will result, causing heat issues.

请参阅图1,是一种公知的发光二极管,其主要是为于一具有阳、阴极电路的电路板90上设有碗槽91,且于碗槽91中设有发光二极管芯片92,该发光二极管芯片92是以导线93连接至阳极电路或阴极电路,且于发光二极管芯片92上覆设有胶体94,该电路板90是一不导电的基础层901上侧设有一导电用以形成阳、阴极电路的电路层902,及于基础层901下侧设有一导电且可供接脚导通至电路层902的导电层903。 Please refer to FIG. 1, is a well-known light emitting diode, which is on a main circuit board having the anode, the cathode circuit is provided with grooves 91 on the bowl 90, and is provided with 92 LED chips in the bowl groove 91, the light emitting diode chip 92 on the lead 93 is connected to the anode or cathode circuits, and 92 in overlying colloid LED chip 94 is provided, the circuit board 90 is a non-conductive base side is provided with a conductive layer 901 for forming a male, the circuit and the cathode layer 902, and is provided with a conductive layer on the side of the base 901 and a lower pin for conducting to the circuit layer 902 of the conductive layer 903. 但是,此公知的发光二极管,其发光二极管芯片92所产生的高温无法迅速的传递至导电层903,其散热效率较差,导致发光二极管芯片92容易烧毁,且由于电路层902的阳、阴极电路均设于电路板90上侧,因此二接脚95、96需穿过电路板90方可伸出于下方,造成组装的不便,使得发光二极管工艺较为复杂。 However, this known light-emitting diodes, the high temperature of an LED chip 92 can not be generated quickly transmitted to the conductive layer 903, its poor thermal efficiency, resulting in the LED chip 92 is easy to burn, and since the anode, the cathode circuit of the circuit layer 902 are located on the circuit board 90 side, the two pins 95 and 96 need only extend through the circuit board 90 below, resulting in inconvenience assembly, such that the light emitting diode process is more complex.

于是,由上可知,上述公知的发光二极管,在生产制造及实际使用上,显然具有不便与缺点存在,而可待加以改善。 Thus, known from the above, the above-described light-emitting diodes known in the production and the actual use, obviously has the disadvantage and inconvenience, but may be be improved.

于是,本实用新型人针对上述缺点,提出一种设计合理且有效改善上述缺点的本实用新型。 Thus, the present invention is human response to these shortcomings, we propose reasonable design and improve the above disadvantages of the present invention.

发明内容 SUMMARY

本实用新型的主要目的,在于可提供一种发光二极管模块结构,是将发光二极管芯片直接设置于一导电及导热效果佳的金属片上,发光二极管芯片产生的高温可迅速的传递至金属片,用以协助散热,以获得较佳的散热效率,使发光二极管芯片得以稳定发挥其高亮度的特性,而不致烧毁。 Present invention the main object, is that it can provide a light emitting diode module structure, a light emitting diode chip is disposed directly on a conductive and good thermally conductive effect of the metal sheet, high-temperature light-emitting diode chip produced can be quickly transferred to the metal sheet, with to assist in heat dissipation, in order to obtain better heat dissipation efficiency, stable light emitting diode chip to exert high luminance characteristics thereof, and not burn.

本实用新型的另一目的,在于可提供一种发光二极管模块结构,其接线无需穿过电路板,组装较为方便,使得发光二极管工艺较为简化。 Another object of the present invention, is that it can provide a light emitting diode module structure, the wiring circuit board without passing through the assembly more convenient, so that the light emitting diode process is more simplified.

本实用新型的上述目的是这样实现的,本实用新型提供的一种发光二极管模块结构,包括:一电路板,其设有一槽孔;一金属片,设置于该电路板下方;一发光二极管芯片,容置于该槽孔中,该发光二极管芯片下侧与该金属片上侧电性连接,该发光二极管芯片上侧以一导线与该电路板上侧电性连接,该发光二极管芯片上还覆设有胶体;一外壳,其内部形成有一容置空间,该电路板及金属片容置于该容置空间内,该电路板与该外壳达成电性连接;以及一聚焦透镜,其设置于该外壳的容置空间内,并位于该发光二极管芯片上方。 The present invention this object is achieved, according to the present invention provides an LED module structure, comprising: a circuit board provided with a slot; a metal sheet disposed below the circuit board; a light-emitting diode chips , received in the slot, the lower side of the LED chip is electrically connected to the side of the metal sheet on the side of the LED chip to a lead wire electrically connected to the circuit board side, on which the light emitting diode chip further coating provided colloid; a housing, inside which an accommodating space is formed, the circuit board and the metal plate is received in the receiving space, the circuit board is electrically connected to reaching the housing; and a focusing lens, which is disposed in the accommodating space of the housing and located above the LED chip.

以下参照本实用新型的具体实施例及其附图,进一步详细的说明本实用新型的特征及技术内容,然而所示附图仅提供参考与说明用,并非用来对本实用新型加以限制。 Embodiments and drawings of the present invention with reference to specific embodiments, further detailed description of the present invention features and technical content, however, shown in the drawings for reference and description only, and is not used for limiting the present invention.

附图说明 BRIEF DESCRIPTION

图1是公知发光二极管的剖视图;图2是本实用新型的立体分解图;图3是本实用新型的立体组合图;图4是本实用新型的剖视图。 FIG 1 is a cross-sectional view of a well-known light emitting diode; FIG. 2 is an exploded perspective view of the present invention; Figure 3 is a perspective view of a combination according to the present invention; Figure 4 is a cross-sectional view of the present invention.

具体实施方式 Detailed ways

在本实用新型的图1至图4中涉及如下图号:电路板90,碗槽91,发光二极管芯片92,导线93,胶体94,接脚95,接脚96,基础层901,电路层902,导电层903,电路板10,阴极电路11,槽孔12,发光二极管芯片20,金属片30,导电胶31,接线32,绝缘体40,外壳50,容置空间51,第一开口52,第二开口53,第一挡缘54,第二挡缘55,接线56,聚焦透镜60,凹穴61,凸缘62,导线70,胶体80。 In 4 according to the present invention, FIG. 1 to FIG below No: circuit board 90, 91, the light emitting diode chip 92, the wires 93, the colloid 94, pin 95, pin 96, base layer 901, the circuit layer bowl slot 902 The conductive layer 903, the circuit board 10, the cathode circuit 11, the slot 12, the light emitting diode chip 20, a metal sheet 30, conductive paste 31, the wiring 32, the insulator 40, the housing 50, the accommodating space 51, a first opening 52, the second opening 53, first blocking edge 54 and second blocking edge 55, wiring 56, condenser lens 60, the pocket 61, the flange 62, the wires 70, 80 colloids.

请参阅图2、图3及图4,本实用新型提供一种发光二极管模块结构,包括有一电路板10、一发光二极管芯片20、一金属片30、一绝缘体40、一外壳50及一聚焦透镜60所构成,其中该电路板(PC板)10呈圆形板状或其它形状,其上侧具有阴极电路11,且该电路板10上设有一槽孔12,该槽孔12贯穿电路板10上侧及下侧,该发光二极管芯片20为高亮度的芯片,其容置于该槽孔12中。 Please refer to FIG. 2, 4, the present invention provides a light emitting diode module structure 3 and includes a circuit board 10, an LED chip 20, a metal sheet 30, an insulator 40, a housing 50 and a focusing lens 60 configuration, wherein the circuit board (PC board) 10 circular-shaped or other shape, having a cathode side on which the circuit 11, and is provided with a slot 12 on the circuit board 10, the slot 12 through the circuit board 10 upper side and the lower side of the LED chip 20 is a chip with high luminance, which is received in the slot 12.

该金属片30是以铜等导电及导热效果佳的金属材料所制成,其呈圆形片状或其它形状,该金属片30设置于该电路板10下方,且该金属片30面积小于该电路板10面积,使该金属片30外缘较该电路板10外缘内缩,以避免该金属片30外缘接触该外壳50内缘进而造成短路。 The metal sheet 30 is electrically conductive such as copper and good heat conducting metal material is made of the effect, which is a circular sheet or other shape, the sheet metal 30 disposed below the circuit board 10, and the metal sheet 30 is smaller than the area area of ​​the circuit board 10 so that the outer edge of the metal plate 30 than the reduced outer edge of the circuit board 10 to prevent the outer edge of the metal sheet 30 contacts the inner edge of the housing 50 and cause a short circuit.

该发光二极管芯片20下侧(阳极)是以导电胶(如银胶)31与该金属片30上侧电性连接,使该发光二极管芯片20与该金属片30达成电性连接。 The lower side of the LED chip 20 (anode) is a conductive paste (e.g., silver paste) 31 electrically connected to the upper side of the metal sheet 30, so that the LED chip 20 is electrically connected to reach the sheet metal 30. 该发光二极管芯片20上侧(阴极)则以一导线70与该电路板10上侧的阴极电路11电性连接,使该发光二极管芯片20与该电路板10达成电性连接,且于该发光二极管芯片20上覆设有胶体80,用以保护及固定芯片20。 The LED chip 20 side (cathode) 70 places a lead 11 is electrically connected to the cathode side of the circuitry on the circuit board 10, so that the LED chip 20 and the circuit board 10 is electrically connected reached, and to the emission diode chip 20 is provided with an overlying colloid 80 to protect the chip 20 and fixed.

该绝缘体40是以陶瓷等绝缘材料所制成,其呈一圆形环状或其它形状,该绝缘体40也可以金属环加绝缘片(图略)所制成,该绝缘体40设置于该金属片30下方。 The insulator 40 is made of an insulating material such as ceramic, which is a circular ring shape or other shape, the insulator 40 may be added to the insulating sheet metal ring (not shown) is made, the insulator 40 disposed in the sheet metal 30 below.

该外壳50是以铜等导电及导热效果佳的金属材料所制成,该外壳50为一圆形或其它形状的中空体,其内部形成有一容置空间51,该容置空间51上、下二端分别形成有一第一开口52及一第二开口53,该第一开口52内径小于该容置空间51内径,使该容置空间51上缘形成有一环第一挡缘54,该第二开口53内径则大于该容置空间51内径,使该容置空间51下缘形成有一环第二挡缘55。 The housing 50 is made of copper or the like and a conductive metal material excellent thermal effects, the housing 50 is a circular or other shaped hollow body which has formed therein an accommodating space 51, the accommodating space 51, the two terminals are formed with a first opening 52 and second opening 53, the inner diameter of the first opening 52 is smaller than the inner diameter of the accommodating space 51, so that the accommodating space has a first ring gear rim 54 is formed on the edge 51, the second the inner diameter of the opening 53 is greater than the inner diameter of the accommodating space 51, so that the lower edge of the accommodating space 51 is formed with a second ring gear rim 55.

该电路板10、金属片30及绝缘体40容置于该外壳50的第二开口53内,且可利用该电路板10抵触于该第二挡缘55而定位,并可将该绝缘体40与该外壳50铆接结合为一体、使该电路板10、金属片30及绝缘体40稳固的定位,并令该电路板10的阴极电路11外缘与该外壳50接触达成电性连接,使该发光二极管芯片20上侧、导线70、电路板10与外壳50达成电性连接,使阴极电可由此输入发光二极管芯片20。 The circuit board 10, metal sheet 30 and the insulator 40 received in the second opening 50 of the housing 53, and may utilize the circuit board 10 abuts against the second stop edge 55 is positioned, and the insulator 40 with the crimping the housing 50 is integral, so that the circuit board 10, metal sheet 30 and the insulator 40 is securely positioned, so that the circuit board and the cathode to reach the outer edge 11 of the circuit 10 is electrically connected to the contact with the housing 50, so that the LED chip upper side 20, the wire 70, the circuit board 10 and the casing 50 is electrically connected to reach the cathode can thereby enter the light emitting diode chip 20.

该聚焦透镜60是以聚丙烯酸树脂(压克力)等透光材料所制成,其设置于该外壳50的容置空间51内,且该聚焦透镜60位于该发光二极管芯片20上方,该聚焦透镜60下端设一对应于胶体80及发光二极管芯片20的凹穴61。 The focusing lens 60 is made of a polyacrylic acid resin (acrylic) a light-transmissive material disposed within the accommodating space 50 of the housing 51, and the focusing lens 60 positioned above the light emitting diode chip 20, the focusing a lens 60 arranged corresponding to the lower cavity 6180 and colloidal LED chip 20. 该聚焦透镜60上端抵触于该第一挡缘54而定位,且于该聚焦透镜60上端设有一凸缘62,该凸缘62抵触于该外壳50的第一开口52内缘,使该聚焦透镜60稳固的定位于该外壳50的容置空间51内;借由上述的组成以形成本实用新型的发光二极管模块结构。 The upper end of the focusing lens 60 abuts against the first stop edge 54 is positioned, and at the upper end of the focusing lens 60 is provided with a flange 62, the flange 62 abuts against the edge of the first opening 52 of the housing 50, so that the focusing lens 60 is firmly positioned within the accommodating space 50 of the housing 51; by means of the above-described composition of the present invention to form the light emitting diode module structure.

本实用新型在实际使用时,可分别利用接线32输入阳极电至金属片30及发光二极管芯片20下侧,以及接线56输入阴极电至外壳50、电路板10、导线70及发光二极管芯片20上侧,以驱动发光二极管芯片20发光,光线并可透过聚焦透镜60聚集后射出,借此形成一种高亮度的发光二极管模块结构,可用以显示数字及文字,或作为照明灯源。 The present invention in practical use, respectively, using 32 inputs the anode connection to the lower 30 and the LED chip 20 side of the metal sheet, and a junction 56 enter the cathode to the housing 50, a circuit board 10, the wire 70 and the light emitting diode chip 20 side, the light emitting diode 20 to drive the light emitting chip, and light is emitted through the focusing lens 60 after the aggregation, thereby forming a structure of a light emitting diode module with high luminance, can be used to display numbers and text, or as a lighting source.

本实用新型是将发光二极管芯片20直接设置于一导电及导热效果佳的金属片30上,因此发光二极管芯片20产生的高温可迅速的传递至该金属片30,以便借由该金属片30协助散热,以获得较佳的散热效率,使发光二极管芯片20得以稳定发挥其高亮度的特性,而不致烧毁,使得高亮度发光二极管的散热问题得以有效的解决。 The present invention is a light emitting diode chip 20 is directly disposed on a conductive and good thermally conductive effect of the metal sheet 30, a high temperature so the light emitting diode chip 20 produced can be rapidly transferred to the metal plate 30, so as to assist by means of the sheet metal 30 cooling, to obtain a better heat dissipation efficiency of the light emitting diode chip 20 to exert its stabilizing properties of high luminance, but not burn, so that the heat of the high-brightness light-emitting diode can be effectively solved.

再者,本实用新型是将发光二极管芯片20的阴极电性连接于电路板10上侧的阴极电路11,而该发光二极管芯片20的阳极是直接与电路板10下方的金属片30电性连接,使阴、阳两极回路位于电路板10不同面,且位于底部的金属片30可作为阳极接点,位于外部的外壳50可作为阴极接点,接线32及56均无需穿过电路板10,组装较为方便,使得发光二极管工艺较为简化。 Furthermore, the present invention is a cathode of the cathode circuit 20 is connected to the LED chip 10 on the side of the circuit board 11, and the anode of the LED chip 20 is electrically metal sheet 30 is directly beneath the circuit board 10 is connected the cathodic and anodic circuits located at different sides of the circuit board 10, and the bottom sheet metal as an anode contacts 30, 50 may be located outside the housing as the cathode contacts 32 and 56 are wiring without passing through the circuit board 10 is assembled more convenience, the light emitting diode so that the process is more simplified.

综上所述,本实用新型有效克服了公知技术中存在的缺点。 In summary, the present invention effectively overcomes the drawbacks present in the known art.

但是,以上所述仅为本实用新型的较佳可行实施例,并非因此而拘限本实用新型的专利范围,故凡是运用本实用新型说明书及图附图内容所为的等效技术变化,均同理包含于本实用新型的范围内。 However, the present invention described above are only preferred possible embodiment, the capture is not therefore patentable scope of the present invention, so those who use the present invention and the description of the drawings of FIG equivalent technical changes are Similarly included within the scope of the present invention.

Claims (7)

1.一种发光二极管模块结构,其特征在于,包括:一电路板,设有一槽孔;一金属片,设置于该电路板下方;一发光二极管芯片,容置于该槽孔中,该发光二极管芯片下侧与该金属片上侧电性连接,该发光二极管芯片上侧以一导线与该电路板上侧电性连接,该发光二极管芯片上覆设有胶体;一外壳,其内部形成有一容置空间,该电路板及金属片容置于该容置空间内,该电路板与该外壳达成电性连接;以及一聚焦透镜,设置于该外壳的容置空间内,并位于该发光二极管芯片上方。 A light emitting diode module structure comprising: a circuit board is provided with a slot; a metal sheet disposed below the circuit board; a light emitting diode chip received in the slot, the luminescent a diode chip side connected to the side electrode of the metal sheet on the LED chip side to a wire connected to the side electrode of the circuit board, overlying provided colloid on the light emitting diode chip; a housing formed inside a receiving space, the circuit board and the metal plate is received in the receiving space, the circuit board to achieve electrical connection to the housing; and a focusing lens, disposed in the accommodating space of the housing, and the LED chip is located above.
2.如权利要求1所述的发光二极管模块结构,其特征在于,所述的电路板上侧具有阴极电路,该发光二极管芯片上侧以该导线与该电路板上侧的阴极电路电性连接。 2. The LED module as claimed in claim 1 on the structure of the light emitting diode chip to the lead side are electrically connected to the cathode of the circuit board side, characterized in that said circuit board having a cathode-side circuit, .
3.如权利要求1所述的发光二极管模块结构,其特征在于,所述的金属片面积小于该电路板面积,该金属片外缘较该电路板外缘内缩。 LED module structure according to claim 1, wherein said metal sheet is smaller than the area of ​​the circuit board area reduction than the outer edge of the sheet metal within the outer edge of the circuit board.
4.如权利要求1所述的发光二极管模块结构,其特征在于,所述的金属片下方设置有一绝缘体,该绝缘体与该外壳结合。 The LED module structure as claimed in claim 1, characterized in that, below the metal sheet is provided with an insulator, the insulator bonded to the shell.
5.如权利要求1所述的发光二极管模块结构,其特征在于,所述的发光二极管芯片下侧以导电胶与该金属片上侧电性连接。 The light emitting diode module structure according to claim 1, characterized in that the lower side of the light emitting diode chip is connected to the electrically conductive adhesive side of the sheet metal.
6.如权利要求1所述的发光二极管模块结构,其特征在于,所述外壳的容置空间二端形成有一第一开口及一第二开口,该容置空间上缘形成有第一挡缘,该容置空间下缘形成有第二挡缘,该电路板及金属片容置于该外壳的第二开口内,且该电路板抵触于该第二挡缘而定位,该聚焦透镜上端抵触于该第一挡缘而定位,且于该聚焦透镜上端设有凸缘,该凸缘抵触于该外壳的第一开口内缘。 The light emitting diode module structure according to claim 1, characterized in that, the accommodating space housing the two ends is formed with a first opening and a second opening edge of the accommodating space formed on a first blocking edge , the edges of the receiving space is formed with a second blocking edge, the circuit board and the metal sheet is accommodated in the second opening of the housing, and the circuit board abuts against the second stop edge is positioned, the upper end of the focusing lens conflict to the first blocking edge positioned, and at the upper end of the focusing lens is provided with a flange abuts against the inner edge of the first opening of the housing.
7.如权利要求1所述的发光二极管模块结构,其特征在于,所述的聚焦透镜下端设一对应于胶体及发光二极管芯片的凹穴。 The light emitting diode module structure according to claim 1, characterized in that the lower end of the focusing lens is provided corresponding to a colloid LED chip pocket.
CNU032415656U 2003-04-07 2003-04-07 Module structure of LED CN2613055Y (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1825586B (en) 2005-02-14 2012-06-27 奥斯兰姆施尔凡尼亚公司 Led assembly and method of making the same
US8754427B2 (en) 2006-12-29 2014-06-17 Osram Opto Semiconductors Gmbh Lens arrangement and LED display device
CN107211532A (en) * 2015-03-31 2017-09-26 惠普发展公司,有限责任合伙企业 A printed circuit board

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1825586B (en) 2005-02-14 2012-06-27 奥斯兰姆施尔凡尼亚公司 Led assembly and method of making the same
US8754427B2 (en) 2006-12-29 2014-06-17 Osram Opto Semiconductors Gmbh Lens arrangement and LED display device
CN107211532A (en) * 2015-03-31 2017-09-26 惠普发展公司,有限责任合伙企业 A printed circuit board

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