CN2613050Y - Simplified image sensor die set - Google Patents

Simplified image sensor die set Download PDF

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Publication number
CN2613050Y
CN2613050Y CNU03236864XU CN03236864U CN2613050Y CN 2613050 Y CN2613050 Y CN 2613050Y CN U03236864X U CNU03236864X U CN U03236864XU CN 03236864 U CN03236864 U CN 03236864U CN 2613050 Y CN2613050 Y CN 2613050Y
Authority
CN
China
Prior art keywords
image sensing
image sensor
plate
sensing wafer
sensor module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNU03236864XU
Other languages
Chinese (zh)
Inventor
谢志鸿
吴志成
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kingpak Technology Inc
Original Assignee
Kingpak Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kingpak Technology Inc filed Critical Kingpak Technology Inc
Priority to CNU03236864XU priority Critical patent/CN2613050Y/en
Application granted granted Critical
Publication of CN2613050Y publication Critical patent/CN2613050Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

Enclosed is a simplified image sensor mode. In order to provide an image sensing mode with simple structure, convenient manufacturing, decreasing the manufacturing cost and reducing the whole size, the utility mode is proposed, comprising a basic board with an upper and lower surface, an image sensing chip equipped with plural welding pads, plural wires electrically connected on the welding pad of the image sensing chip and the upper surface of the basic board, and transparent colloid which embraces the image sensing crystal, wherein the position that the transparent colloid is against the image sensing chip is formed a convex portion with a focus gathering function, and the image sensing chip is fixed on the surface of the basic board.

Description

Reduced form image sensor module
Technical field
The utility model belongs to the image sensor module, particularly a kind of reduced form image sensor module.
Background technology
As shown in Figure 1, known image sensor module comprises microscope base 10, lens barrel 20 and image sensor 30.
Microscope base 10 is provided with upper surface 12, lower surface 14 and connects to the lower surface 14 and form the accommodation chamber 16 of internal thread 18 by upper surface 12.
Lens barrel 20 is provided with external screw thread 22 corresponding with microscope base 10 accommodation chambers 16 internal threads 18 and that be spirally connected, from top to bottom is provided with transparent area 24, aspherical lens 26 and infrared ray filter glass 28 in it.Lens barrel 20 is placed in the accommodation chamber 16 by the upper surface 12 of microscope base 10, and with internal thread 18 screw locks of microscope base 10.
Image sensor 30 is provided with first 32 and second 34, the first 32 and is provided with photic zone 36.
Image sensor 30 is to stick together the lower surface 14 of being fixed in microscope base 10 by photic zone 36, and by adjusting the degree of depth that lens barrel 20 and microscope base 10 screw togather, with the focal length of 36 of the aspherical lens 26 of control lens barrel 20 and image sensor 30 photic zones.
There is following shortcoming in known image sensor module:
1, comparatively complicated in the manufacturing, after the encapsulation of image sensor 30 must being gone ahead of the rest is finished, again with itself and microscope base 10 and lens barrel 20 collocation and form the image sensor module, so that the light signal behind image sensor 30 reception aspherical lens 26 optically focused, so its structure is complicated, and overall dimensions is higher, can't reach compact requirement.
2, photic zone 36 is to be attached on the lower surface 14 of microscope base 10 with viscose, and in the processing procedure, viscose easily pollutes photic zone 36 surfaces, thereby it is bad to cause the light signal to receive.
When 3, carrying out the assembling of module, photic zone 36 must carry out contraposition with aspherical lens 26 accurately, and fixes with the viscose adhesive means, in case contraposition precision to some extent during deviation, entire module just can't be gone again and be re-assemblied, and must be scrapped.
Summary of the invention
The purpose of this utility model provides a kind of simple in structure, reduced form image sensor module of being convenient to make, reduce production costs, dwindle overall dimensions.
The utility model comprises the substrate that is provided with upper and lower surface, be provided with the image sensing wafer of plural weld pad and be electrically connected on the weld pad of image sensing wafer and the plural wires of upper surface of base plate and be covered in and use the transparent colloid that envelopes image sensing wafer on the substrate; Transparent colloid is formed with the convex part with focussing force with respect to the image sensing wafer position; Image sensing wafer is fixed on the upper surface of base plate.
Wherein:
Convex part on the transparent colloid is curved shape.
Substrate system is made up of a plurality of sheet metals and the industrial plastic layer that envelopes sheet metal.
Sheet metal has first plate, second plate and is connected with in the 3rd plate between first and second plate.
Industry plastic cement series of strata are that material use penetrates or the pressing mold mode forms enveloping sheet metal with industrial plastic cement, and the first plate upper surface and the second plate lower surface are exposed by plastic layer.
Because the utility model comprises the substrate that is provided with upper and lower surface, be provided with the image sensing wafer of plural weld pad and be electrically connected on the weld pad of image sensing wafer and the plural wires of upper surface of base plate and be covered in and use the transparent colloid that envelopes image sensing wafer on the substrate; Transparent colloid is formed with the convex part with focussing force with respect to the image sensing wafer position; Image sensing wafer is fixed on the upper surface of base plate.After image sensing wafer encapsulation finished, by the convex part of transparent colloid, light signal that can collectiong focusing, the image sensor module of need not arranging in pairs or groups is separately used, so not only product size is effectively dwindled, and comparatively convenient on making, can effectively reduce production costs; Not only simple in structure, be convenient to make, reduce production costs, and dwindle overall dimensions, thereby reach the purpose of this utility model.
Description of drawings
Fig. 1, be known image sensor modular structure schematic sectional view.
Fig. 2, be the utility model embodiment one structural representation cutaway view.
Fig. 3, be the utility model embodiment two structural representation cutaway views.
Embodiment
As shown in Figure 2, the utility model comprises substrate 40, is provided with image sensing wafer 42, plural wires 44 and the transparent colloid 46 of a plurality of weld pads 56.
Substrate 40 is provided with the upper surface 48 that forms a plurality of first contacts 52 and forms a plurality of in order to be electrically connected to second contact, 54 lower surfaces 50 on the printed circuit board (PCB) 53.
Image sensing wafer 42 is fixed on the upper surface 48 of substrate 40.
Plural wires 44 is to be electrically connected between the weld pad 56 and first contact 52 on substrate 40 upper surfaces 48 of image sensing wafer 42, is passed on the substrate 40 with the signal with image sensing wafer 42.
Transparent colloid 46 is to be covered in substrate 40 upper surfaces 48, use and envelope image sensing wafer 42, it is formed with the convex part 58 that curved shape has the effect of focusing with respect to image sensing wafer 42 positions, receives the light signal so that image sensing wafer 42 can see through convex part 58.
After image sensing wafer 42 encapsulation finished, by the convex part 58 of transparent colloid 46, light signal that can collectiong focusing, the image sensor module of need not arranging in pairs or groups is separately used, so not only product size is effectively dwindled, and comparatively convenient on making, can effectively reduce production costs.
Embodiment two
As shown in Figure 3, comprise substrate 40, the image sensing wafer 42 that is provided with a plurality of weld pads 56, plural wires 44 and transparent colloid 46.
Substrate 40a system is made up of the sheet metal of a plurality of mutual arrangements and the plastic layer that envelopes sheet metal, and sheet metal has first plate 60, second plate 62 and is connected with the 3rd plate 64 between first and second plate 60,62.
The plastic cement series of strata are that material use penetrates or the pressing mold mode forms and envelopes sheet metal with industrial plastic cement, and first plate, 60 upper surfaces and second plate, 62 lower surfaces are exposed by plastic layer, to form substrate 40a.
Image sensing wafer 42 is fixed on the substrate 40a.
Plural wires 44 is to be electrically connected between the weld pad 56 and substrate 40a first plate 60 upper surfaces of image sensing wafer 42, is passed on the substrate 40a with the signal with image sensing wafer 42.
Transparent colloid 46 is to be covered on the substrate 40a, use and envelope image sensing wafer 42, it is formed with the convex part 58 that curved shape has the effect of focusing with respect to image sensing wafer 42 positions, receives the light signal so that image sensing wafer 42 can see through convex part 58.
After image sensing wafer 42 encapsulation finished, by the convex part 58 of transparent colloid 46, light signal that can collectiong focusing, the image sensor module of need not arranging in pairs or groups is separately used, so not only product size is effectively dwindled, and comparatively convenient on making, can effectively reduce production costs.

Claims (5)

1, a kind of reduced form image sensor module, it comprises the substrate that is provided with upper and lower surface, be provided with the image sensing wafer of plural weld pad and be electrically connected on the plural wires of the weld pad and the upper surface of base plate of image sensing wafer; Image sensing wafer is fixed on the upper surface of base plate; It is characterized in that being coated with on the described substrate and use the transparent colloid that envelopes image sensing wafer; Transparent colloid is formed with the convex part of the effect with focusing with respect to the image sensing wafer position.
2, reduced form image sensor module according to claim 1 is characterized in that the convex part on the described transparent colloid is curved shape.
3, reduced form image sensor module according to claim 1 is characterized in that described substrate system is made up of a plurality of sheet metals and the industrial plastic layer that envelopes sheet metal.
4, reduced form image sensor module according to claim 3 is characterized in that described sheet metal has first plate, second plate and is connected with in the 3rd plate between first and second plate.
5, reduced form image sensor module according to claim 3, it is characterized in that described industrial plastic cement series of strata are that material use penetrates or the pressing mold mode forms enveloping sheet metal with industrial plastic cement, and the first plate upper surface and the second plate lower surface are exposed by plastic layer.
CNU03236864XU 2003-01-27 2003-01-27 Simplified image sensor die set Expired - Fee Related CN2613050Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU03236864XU CN2613050Y (en) 2003-01-27 2003-01-27 Simplified image sensor die set

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU03236864XU CN2613050Y (en) 2003-01-27 2003-01-27 Simplified image sensor die set

Publications (1)

Publication Number Publication Date
CN2613050Y true CN2613050Y (en) 2004-04-21

Family

ID=34167042

Family Applications (1)

Application Number Title Priority Date Filing Date
CNU03236864XU Expired - Fee Related CN2613050Y (en) 2003-01-27 2003-01-27 Simplified image sensor die set

Country Status (1)

Country Link
CN (1) CN2613050Y (en)

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C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20040421