CN2588531Y - CPU cooler - Google Patents
CPU cooler Download PDFInfo
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- CN2588531Y CN2588531Y CN 02285993 CN02285993U CN2588531Y CN 2588531 Y CN2588531 Y CN 2588531Y CN 02285993 CN02285993 CN 02285993 CN 02285993 U CN02285993 U CN 02285993U CN 2588531 Y CN2588531 Y CN 2588531Y
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- 238000001816 cooling Methods 0.000 claims description 13
- 230000017525 heat dissipation Effects 0.000 description 19
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Abstract
Description
技术领域technical field
本实用新型涉及一种散热装置,尤其涉及一种可提高中央处理器散热效率的中央处理器的散热器。The utility model relates to a cooling device, in particular to a radiator for a central processing unit which can improve the cooling efficiency of the central processing unit.
背景技术Background technique
如图1、2所示,现有用于中央处理器10的散热器20,主要是由一种铝挤型材一体成型,包括一可贴附接触于中央处理器10上表面的平板基座21,及数个直立于平板基座21上的散热片22,因此,现有中央处理器10的散热器20是借助平板基座21将中央处理器10所产生的热传导至散热片22,并借助数个散热片22增加与空气接触的散热面积,以达到散热的效果。As shown in Figures 1 and 2, the existing
然而,由于现有中央处理器10的散热器20是以一种铝挤型材成型一体,因此其所能提供空气流通的路径,仅只限于数个散热片22间所形成的同一向通道23,且该数个散热片22皆成平板状,因此其所能提供与空气接触的散热面积有限。故,现有中央处理器10的散热器20所能提供的散热效率显然有限,尤其是,目前中央处理器10的信息处理速度日趋快速,导致中央处理器10愈容易发热,而现有散热器20的散热效率显然已不能满足需求。However, since the heat sink 20 of the existing central processing unit 10 is integrally formed by an extruded aluminum profile, the path it can provide for air circulation is only limited to the
实用新型内容Utility model content
为了克服现有中央处理器散热器存在与空气接触的散热面积有限,散热效率不高,不能满足中央处理器信息处理速度日趋快速的缺点,本实用新型提供一种中央处理器的散热器,其可大大增加散热面积,具有更多空气流通路径,进而提高中央处理器的散热效率。In order to overcome the shortcomings of the existing central processor radiators, which have limited heat dissipation area in contact with the air, low heat dissipation efficiency, and cannot meet the increasingly fast information processing speed of the central processor, the utility model provides a radiator for the central processor, which It can greatly increase the heat dissipation area and have more air circulation paths, thereby improving the heat dissipation efficiency of the central processing unit.
本实用新型解决其技术问题所采用的技术方案是:The technical scheme that the utility model solves its technical problem adopts is:
一种中央处理器的散热器,包括一贴附接触于中央处理器上表面的平板基座,及数个直立于平板基座上的散热片,其特征在于所述每一散热片均具有数个概呈梯形间隔而设的第一凸出部,该第一凸出部凸设于散热片侧面中心线的一侧,及数个概呈梯形反向设于两相邻第一凸出部间的第二凸出部,使第二凸出部位于散热片侧面中心线的另一侧,第一凸出部与第二凸出部相互连接形成一概呈波浪状的板片,借此提高散热面积;第一凸出部与第二凸出部相连接的侧壁上均具有数个间隔凸出的第三凸出部,使第三凸出部位于第一凸出部或第二凸出部中心线的一侧,数个反向凸设于两相邻第三凸出部间的第四凸出部,使第四凸出部位于第一凸出部或第二凸出部中心线的另一侧,使第三凸出部、第四凸出部的两侧各与第一凸出部、第二凸出部间形成一孔洞,借此能够提供更多向的空气流通路径,进而可提高散热器的散热效率。A heat sink for a central processing unit, comprising a flat base attached to the upper surface of the central processing unit, and several cooling fins standing upright on the flat base, characterized in that each cooling fin has several a plurality of first protruding portions arranged at approximately trapezoidal intervals, the first protruding portions protrude on one side of the center line of the side surface of the heat sink, and several trapezoidal oppositely disposed on two adjacent first protruding portions The second protruding part between, make the second protruding part be located on the other side of the centerline of the side of the heat sink, the first protruding part and the second protruding part are connected to each other to form a generally wavy plate, thereby improving Heat dissipation area; the side wall where the first protruding part is connected with the second protruding part has several third protruding parts protruding at intervals, so that the third protruding part is located at the first protruding part or the second protruding part On one side of the central line of the protruding part, several fourth protruding parts are provided in opposite directions between two adjacent third protruding parts, so that the fourth protruding part is located at the center of the first protruding part or the second protruding part On the other side of the line, a hole is formed between the third protruding part and the two sides of the fourth protruding part and the first protruding part and the second protruding part, thereby providing more directional air circulation paths , thereby improving the heat dissipation efficiency of the radiator.
本实用新型的有益效果是,其可大大增加散热面积,具有更多空气流通路径,进而提高中央处理器的散热效率。The beneficial effect of the utility model is that it can greatly increase the heat dissipation area, have more air circulation paths, and further improve the heat dissipation efficiency of the central processing unit.
附图说明Description of drawings
下面结合附图和实施例对本实用新型进一步说明。Below in conjunction with accompanying drawing and embodiment the utility model is further described.
图1是现有中央处理器的散热器立体示意图。FIG. 1 is a three-dimensional schematic diagram of a heat sink of a conventional central processing unit.
图2是现有中央处理器的散热器俯视图。Fig. 2 is a top view of a radiator of a conventional central processing unit.
图3是本实用新型的立体示意图。Fig. 3 is a perspective view of the utility model.
图4是本实用新型的散热片立体示意图。Fig. 4 is a three-dimensional schematic view of the heat sink of the present invention.
图5是本实用新型的散热片侧视图。Fig. 5 is a side view of the heat sink of the present invention.
图6是本实用新型的散热片主视图。Fig. 6 is a front view of the heat sink of the present invention.
图7是图5所示I-I割线的剖视图。Fig. 7 is a cross-sectional view of the I-I secant line shown in Fig. 5 .
图8是本实用新型的使用状态图。Fig. 8 is a diagram of the usage status of the utility model.
图中标号说明:Explanation of symbols in the figure:
现有部分existing part
10中央处理器10 CPU
20散热器20 radiator
21平板基座 22散热片21
23通道23 channels
本实用新型The utility model
30中央处理器30 CPU
40散热器40 radiator
41平板基座 42散热片41
421第一凸出部 422第二凸出部421
423第三凸出部 424第四凸出部423
425孔洞425 holes
50固定座50 fixed seat
60散热风扇60 cooling fan
70固定片70 fixed piece
具体实施方式Detailed ways
如图3所示,本实用新型中央处理器30的散热器40包括一可贴附接触于中央处理器30上表面的平板基座41,及数个直立于平板基座41上的散热片42,其特征在于:As shown in Figure 3, the
请同时参阅图4至图8所示,该每一散热片42均具有数个概呈梯形间隔而设的第一凸出部421,并使第一凸出部421凸设于散热片42侧面中心线L1的一侧(如图5所示),以数个概呈梯形反向设于两相邻第一凸出部421间的第二凸出部422,使第二凸出部422位于侧面中心线L1的另一侧,第一凸出部421与第二凸出部422相互连接形成一概呈波浪状的板片,借此能够增加散热面积;同时,在第一凸出部421与第二凸出部422相连接的侧壁上均具有数个间隔凸出的第三凸出部423,使第三凸出部423位于第一凸出部421或第二凸出部422中心线L2的一侧(如图6所示),及数个反向凸设于两相邻第三凸出部423间的第四凸出部424,并使第四凸出部424位于第一凸出部421或第二凸出部422中心线L2的另一侧,且使第三凸出部423、第四凸出部424的两侧各与第一凸出部421、第二凸出部422间形成一孔洞425(如图7所示),借此能够提供更多向的空气流通路径,进而可提高散热器40的散热效率。Please also refer to FIG. 4 to FIG. 8 , each
请再参阅图8所示,本实用新型在使用时,亦可与目前一般散热器一样,在散热器40的上方借助一固定座50组装一散热风扇60,可进一步提高散热效率;并在位于散热器40中央位置的散热片42与散热片42间的间隔空间穿设一固定片70,通过该固定片70两端锁固于基板上,使散热器40的平板基座41能够紧密贴附接触于中央处理器30上表面。Please refer to shown in Fig. 8 again, when the utility model is in use, it can also be the same as the current general radiator, and a
从以上所述及附图所示的实施例可知,本实用新型的散热器40主要在于将直立设于平板基座41上的数块散热片42设成具有第一凸出部421与第二凸出部422相互连接形成的波浪状板片,借此能够提高散热面积,同时,在散热片42的第一凸出部421与第二凸出部422相连接的侧壁上设有数个间隔凸出的第三凸出部423与第四凸出部424,且使第三凸出部423、第四凸出部424的两侧各形成一孔洞425。借此能够提供更多向的空气流通路径,进而提高散热器40的散热效率。因此,本实用新型与现有中央处理器的散热器相比,确具有显著的实用性与进一步性,且未曾有过,符合新型专利要件,故依法提出申请。From the above description and the embodiments shown in the accompanying drawings, it can be seen that the
以上所述,仅是本实用新型的较佳实施例而已,并非对本实用新型作任何形式上的限制,凡是依据本实用新型的技术实质对以上实施例所作的任何简单修改、等同变化与修饰,均仍属于本实用新型技术方案的范围内。The above is only a preferred embodiment of the utility model, and does not limit the utility model in any form. Any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the utility model, All still belong to within the scope of the technical solution of the utility model.
Claims (1)
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Application Number | Priority Date | Filing Date | Title |
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CN 02285993 CN2588531Y (en) | 2002-11-14 | 2002-11-14 | CPU cooler |
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Application Number | Priority Date | Filing Date | Title |
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CN 02285993 CN2588531Y (en) | 2002-11-14 | 2002-11-14 | CPU cooler |
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CN2588531Y true CN2588531Y (en) | 2003-11-26 |
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CN 02285993 Expired - Fee Related CN2588531Y (en) | 2002-11-14 | 2002-11-14 | CPU cooler |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100371855C (en) * | 2004-12-01 | 2008-02-27 | 广达电脑股份有限公司 | Porous heat dissipation fin array |
CN104812212A (en) * | 2015-04-01 | 2015-07-29 | 太仓陶氏电气有限公司 | Radiator and frequency converter comprising radiator |
CN107204314A (en) * | 2017-06-30 | 2017-09-26 | 上海嘉熙科技有限公司 | Hot superconductive radiating component and its manufacture method |
-
2002
- 2002-11-14 CN CN 02285993 patent/CN2588531Y/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100371855C (en) * | 2004-12-01 | 2008-02-27 | 广达电脑股份有限公司 | Porous heat dissipation fin array |
CN104812212A (en) * | 2015-04-01 | 2015-07-29 | 太仓陶氏电气有限公司 | Radiator and frequency converter comprising radiator |
CN107204314A (en) * | 2017-06-30 | 2017-09-26 | 上海嘉熙科技有限公司 | Hot superconductive radiating component and its manufacture method |
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C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |