CN2586335Y - Radiating substrate structure - Google Patents
Radiating substrate structure Download PDFInfo
- Publication number
- CN2586335Y CN2586335Y CN 02287327 CN02287327U CN2586335Y CN 2586335 Y CN2586335 Y CN 2586335Y CN 02287327 CN02287327 CN 02287327 CN 02287327 U CN02287327 U CN 02287327U CN 2586335 Y CN2586335 Y CN 2586335Y
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- Prior art keywords
- heat radiating
- material structure
- heat
- radiating material
- filling slot
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Abstract
The utility model discloses a heat radiating base material structure, which is arranged between a heat radiating device and a central processor, and the heat radiating device and the central processor are combined tightly. The utility model comprises a base plate and metal material bodies, wherein, the base plate is provided with a plurality of filling slots, and the filling slots of the base plate are filled with the metal material bodies. When the heat radiating base material structure bears the combined pressure of the heat radiating device and heat energy is generated by the central processor, the metal material bodies can be only melted in the filling slots owing to the limitation of the filling slots. Thereby, the degree of tight combination between the heat radiating device and the central processor is added, and the heat radiating efficiency is increased.
Description
Technical field
The utility model relates to a kind of heat radiating material structure, is applied between heat abstractor and the central processing unit, to increase the applying degree between heat abstractor and the central processing unit, improves rate of heat dissipation.
Background technology
Because in the process of using electronic instrument, its assembly tends to produce many heat energy, so needing to adopt heat abstractor discharges the heat energy of electronic instrument, to avoid too much heat energy to accumulate on assembly, cause assembly to damage, particularly the operational capability at the central processing unit of computer day by day improves, and when satisfying the demands, uses radiator to solve heat dissipation problem and is still very important.
Operated by rotary motion heat abstractor to the mode of central processing unit is to pass through thermal paste, make the one side of radiator fit in the surface of central processing unit, but because the operational capability of central processing unit day by day improves at present, so the low heat conductivity of thermal paste no longer can meet the radiating requirements of central processing unit, so develop a kind of novel heat radiating material structure on the market.
This novel heat radiating material structure proximate is in the use of thermal paste, and be arranged at 20 of heat abstractor 10 and central processing units, see also Fig. 3, this heat radiating material structure can be divided into two kinds of structures haply: as shown in Figure 1, wherein a kind of structure is as substrate 41 with copper coin, and on the two sides of substrate 41 material to be set be the indium heat conduction layer 42 with high thermal conductivity character, but in use, because central processing unit 20 has the zone of higher temperature, and heat conduction layer 42 is herein understood Yin Gaowen and is melted by Rong, and flow to other side, so after use, it is thinner that heat conduction layer 42 herein also will become, or even disappear, and being had, 20 of heat abstractor 10 and central processing units contact closely, so this heat radiating material structure also is not suitable for reusing, moreover when the heat radiating material structure is inserted and put by heat abstractor 10 and central processing unit 20, its be subjected to both in conjunction with pressure influence, so heat conduction layer 42 just can be after fusion, flow to the pressurized smaller part, and form spherically, even might fall to circuit board, and therefore the damage circuit board increases the danger of using.
As shown in Figure 2, another kind of structure then is directly to use the made heat conduction layer of indium 42, but in use, can be the zone of higher temperature because central processing unit 20 has the somewhere equally, and cause herein heat conduction layer 42 attenuation, or even disappear, and being had, 20 of heat abstractor 10 and central processing units contact closely, thereby this heat radiating material structure and be not suitable for reusing, moreover when the heat radiating material structure is inserted and put by heat abstractor 10 and central processing unit 20, be subjected to both in conjunction with pressure influence, so heat conduction layer 42 just can be after fusion, flow to the pressurized smaller part, and form spherically, even fall to circuit board, and the possibility of damage circuit board, thereby increase the danger of using, therefore, developing a kind of heat radiating material structure is considerable to remove these shortcomings.
Summary of the invention
Main purpose of the present utility model, be to provide a kind of heat radiating material structure, by the heat radiating material structure is arranged between heat abstractor and central processing unit, and central processing unit produces heat energy, when causing the fusion of heat radiating material structure, increase the degree of fitting tightly between heat abstractor and the central processing unit, improve radiating efficiency.
Another purpose of the present utility model, be to provide a kind of heat radiating material structure, make its heat abstractor and central processing unit both in conjunction with under the pressure influence, unlikelyly using the situation that thickness degree inequality is arranged later to take place, with the raising reusability, and reduce and understand the danger that takes place when using.
Above-mentioned purpose of the present utility model is to realize like this, the heat radiating material structure that the utility model provides, be arranged between the heat abstractor and central processing unit of combining closely, this heat radiating material structure includes substrate and metal material body, wherein substrate has most filling slots, the metal material body then is filled in the filling slot of substrate, and is sealed in heat abstractor and central processing unit and the filling slot.
Heat radiating material structure described in the utility model, wherein, described substrate includes a plurality of bonding jumpers, and described bonding jumper cross arrangement constitutes this filling slot.
Heat radiating material structure described in the utility model, wherein, described substrate includes a plurality of beckets, and the tight permutation and combination of described becket forms described filling slot.
Heat radiating material structure described in the utility model, wherein, described filling slot is square filling slot.
Heat radiating material structure described in the utility model, wherein, described filling slot is circular filling slot.
Heat radiating material structure described in the utility model, wherein, described metal material body is the high-thermal conductive metal material bodies.
Heat radiating material structure described in the utility model, wherein, described metal material body is the indium metal material bodies.
Heat radiating material structure described in the utility model, wherein, described bonding jumper is a copper bar.
Heat radiating material structure described in the utility model, wherein, described becket is the copper becket.
The heat radiating material structure that the utility model provides be subjected to heat abstractor and central processing unit both in conjunction with under the pressure, when central processing unit produces heat energy, the metal material body is because of being subject to filling slot, and only can be melted in the filling slot, therefore can increase the degree of fitting tightly between heat abstractor and the central processing unit, improve rate of heat dissipation, and the metal material body is unlikely under molten condition, mobile situation is arranged, can improve the repeatability of use like this, and reduce the danger of using.
According to the disclosed heat radiating material structure of the utility model, compare with known technology, have following effect at least:
1. by the heat radiating material structure is arranged between heat abstractor and central processing unit, and produce heat energy at central processing unit, when causing the fusion of heat radiating material structure, the utility model can increase the degree of fitting tightly between heat abstractor and the central processing unit, and improves rate of heat dissipation.
Heat abstractor and central processing unit both in conjunction with under the pressure influence, the heat radiating material structure is unlikely when fusion, flow to other place, and form spherical, and cause the impaired situation of circuit board to take place, so the heat radiating material structure is using the situation that does not have thickness degree inequality later to take place, thereby can improve reusability, and reduces and understand the danger that takes place when using.
Below, in conjunction with specific embodiments and accompanying drawing technical characterictic of the present utility model and technology contents are described in further detail, yet, shown in accompanying drawing only for reference with the explanation usefulness, be not to be used for the utility model is limited.
Description of drawings
Fig. 1 is known heat radiating material architecture;
Fig. 2 is another kind of known heat radiating material architecture;
Fig. 3 is arranged at schematic diagram between heat abstractor and the central processing unit for the heat radiating material structure;
Fig. 4 is the structure chart of the utility model heat radiating material structure; And
Fig. 5 is the structure chart of another embodiment of the utility model heat radiating material structure.
Embodiment
Among the utility model Fig. 1 to Fig. 5, relate to following element: heat abstractor 10, central processing unit 20, heat radiating material structure 3, substrate 31, the first bonding jumpers 311, several second bonding jumpers 312, filling slot 313, metal material body 32, substrate 41, heat conduction layer 42.
As shown in Figure 3, according to the disclosed heat radiating material structure 3 of the utility model, can be arranged between heat abstractor 10 and the central processing unit 20, and combine closely at heat abstractor 10 and central processing unit 20, and when central processing unit 20 produces heat energy, get so that the surface of heat abstractor 10 and central processing unit 20 increases contact rate.
As shown in Figure 4, the disclosed heat radiating material structure 3 of the utility model includes substrate 31 and metal material body 32, wherein substrate 31 includes several first bonding jumpers 311 and several second bonding jumpers 312, the material of first bonding jumper 311 is a copper, and the material of second bonding jumper 312 also is a copper, and described first bonding jumper 311 and 312 cross arrangements of second bonding jumper are combined to form a plurality of filling slots 313.
32 of metal material bodies are filled in the filling slot 313 of substrate 31, and it has high-termal conductivity matter, and material is an indium.
In use, must earlier heat radiating material structure 3 be arranged between heat abstractor 10 and the central processing unit 20, and by combining closely of heat abstractor 10 and central processing unit 20, make heat radiating material structure 3 be subjected to heat abstractor 10 and central processing unit 20 both combine pressure, the heat energy that is produced when therefore central processing unit 20 operates, the metal material body 32 of tool high-termal conductivity matter is melted, and the surperficial contact rate of increase heat abstractor 10 and central processing unit 20, make the applying of 20 of heat abstractor 10 and central processing units more tight, improve rate of heat dissipation, and because metal material body 32 is subject to filling slot 313, so metal material body 32 can not flow out outside its filling slot of filling 313, therefore reason metal material body 32 does not flow out 20 of heat abstractors 10 and central processing units, and fall to circuit board, cause danger.
As shown in Figure 5, described substrate 31 comprises a plurality of beckets, described becket is the evenly distributed filling slot 313 that is combined to form closely, and this moment, this filling slot 313 was circular, at this moment, metal material body 32 is filled in the filling slot 313, and reach above-mentioned effect, certainly, no matter the shape of other kind filling slot 313 is why, as long as when 32 fusions of metal material body, be restricted to this filling slot 313 interior getting final product.
Certainly, the size of above-mentioned filling slot 313 all is suitable small, thereby metal material body 32 can be limited to this.
The above only is the utility model preferred embodiment wherein, is not to be used for limiting practical range of the present utility model; Be that every equalization of being done according to the utility model claim changes and modification, all be encompassed in the claimed claim of the utility model.
Claims (9)
1, a kind of heat radiating material structure is arranged between the heat abstractor and central processing unit of combining closely, and it is characterized in that, comprising:
One substrate has a plurality of filling slots; And
A plurality of metal material bodies are filled in the filling slot of this substrate, and are sealed in heat abstractor and central processing unit and the filling slot.
2, heat radiating material structure according to claim 1 is characterized in that described substrate includes a plurality of bonding jumpers, and described bonding jumper cross arrangement constitutes this filling slot.
3, heat radiating material structure according to claim 1 is characterized in that described substrate includes a plurality of beckets, and the tight permutation and combination of described becket forms described filling slot.
4, heat radiating material structure as claimed in claim 1 or 2 is characterized in that described filling slot is square filling slot.
5, as heat radiating material structure as described in claim 1 or 3, it is characterized in that described filling slot is circular filling slot.
6, heat radiating material structure according to claim 1 is characterized in that described metal material body is the high-thermal conductive metal material bodies.
7, as heat radiating material structure as described in the claim 6, it is characterized in that described metal material body is the indium metal material bodies.
8, as heat radiating material structure as described in the claim 2, it is characterized in that described bonding jumper is a copper bar.
9, as heat radiating material structure as described in the claim 3, it is characterized in that described becket is the copper becket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02287327 CN2586335Y (en) | 2002-11-25 | 2002-11-25 | Radiating substrate structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02287327 CN2586335Y (en) | 2002-11-25 | 2002-11-25 | Radiating substrate structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2586335Y true CN2586335Y (en) | 2003-11-12 |
Family
ID=33747651
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02287327 Expired - Fee Related CN2586335Y (en) | 2002-11-25 | 2002-11-25 | Radiating substrate structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2586335Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101389202B (en) * | 2007-09-12 | 2010-07-28 | 鑫电光科技股份有限公司 | Cooling device for electronic element |
| CN104582446A (en) * | 2014-12-31 | 2015-04-29 | 广州汉源新材料有限公司 | Heat conducting gasket of composite structure |
| CN104602495B (en) * | 2015-01-19 | 2017-06-30 | 太仓市兴港金属材料有限公司 | A kind of high-efficiency inserted fin radiator |
-
2002
- 2002-11-25 CN CN 02287327 patent/CN2586335Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101389202B (en) * | 2007-09-12 | 2010-07-28 | 鑫电光科技股份有限公司 | Cooling device for electronic element |
| CN104582446A (en) * | 2014-12-31 | 2015-04-29 | 广州汉源新材料有限公司 | Heat conducting gasket of composite structure |
| CN104582446B (en) * | 2014-12-31 | 2018-01-05 | 广州汉源新材料股份有限公司 | A kind of heat-conducting pad of composite construction |
| CN104602495B (en) * | 2015-01-19 | 2017-06-30 | 太仓市兴港金属材料有限公司 | A kind of high-efficiency inserted fin radiator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20031112 Termination date: 20101125 |