CN2584388Y - Chip cutting machine - Google Patents
Chip cutting machine Download PDFInfo
- Publication number
- CN2584388Y CN2584388Y CN 02291301 CN02291301U CN2584388Y CN 2584388 Y CN2584388 Y CN 2584388Y CN 02291301 CN02291301 CN 02291301 CN 02291301 U CN02291301 U CN 02291301U CN 2584388 Y CN2584388 Y CN 2584388Y
- Authority
- CN
- China
- Prior art keywords
- wafer
- travelling carriage
- speed
- direct current
- fixed
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a wafer cutting machine without cooling, which comprises a wafer positioning system, a dragging system, a control panel, a display system and a TV monitoring system. The utility model is characterized in that the wafer cutting machine without cooling also comprises a wafer cutting system which is composed of a direct current motor with high speed, a diamond blade clamping apparatus and a speed measuring device and a speed controlling device of the direct current motor with high speed, wherein the speed controlling device of the direct current motor with high speed comprises a light barrier with a light through hole, a digital frequency meter, a sensor and a potentiometer, wherein the potentiometer is utilized to regulate the voltage of a power supply to control the rotational speed of the motor. The cutting speed and the processing speed of the wafer cutting machine without cooling can be regulated, and the wafer cutting machine without cooling successfully solves the difficulty that a wafer can not cut if the wafer is not cooled. In addition, the utility model has the advantages of reasonable structure, easy operation, safe use and low cost. The utility model not only provides a novel cutting device for superconducting film wafers and various superconducting devices with high temperature, but also for semiconductor industry and solar cell industry.
Description
Technical field
The utility model relates to a kind of wafer cutter sweep, particularly a kind of nothing cooling wafer cutter sweep.
Background technology
Wafer cutter sweep commonly used is to use the high speed pneumatic rotating shaft to drive the cutting mode of diamond blade.Because the wafer that is cut has very high hardness, and it is easily broken, common wafer cutting machine adopts the blade (for example 300,000 rev/mins) of high speed rotating more, in the cutting meeting, produce a large amount of heat, need to adopt force the means cooling high speed blade of cooling, make water, wet goods cooling way make that the skive sheet is unlikely to be burnt usually.But some wafer liquid that is easy to be cooled damages, and for example has the jewel wafer of high-temperature superconducting thin film, various high-temperature superconductive devices etc., therefore can not adopt the usual manner cutting.
Summary of the invention
The purpose of this utility model is: solve cutter sweep commonly used and must adopt the means and the cooling fluid of forcing to cool off can damage the contradiction of some wafer, thereby a kind of new nothing cooling wafer cutter sweep is provided.
The purpose of this utility model is achieved in that the utility model does not have cooling wafer cutter sweep, as depicted in figs. 1 and 2, comprising: wafer orientation system, dragging system, control panel, display system, TV monitor system; It is characterized in that: also comprise the wafer diced system; Crystal navigation system, dragging system, crystal-cut system and four parts of video camera are installed in a side of this device, this side has one, wherein, dragging system is fixedlyed connected with the Y direction travelling carriage in the crystal navigation system, the crystal-cut system is fixed on the top of wafer orientation system by a support, and video camera is installed in the upper left side in the frame; Control panel and display are installed in the opposite side of this device.
Described crystal comprises: jewel sheet, monocrystalline silicon piece, quartz, glass, pottery, superconducting thin film and superconductive device.
Described crystal navigation system is four-dimensional travelling carriage, form by directions X travelling carriage, Y direction travelling carriage, Z direction travelling carriage and angle of rotation travelling carriage, Y direction travelling carriage is fixed on the frame, the directions X travelling carriage is fixed on the Y direction travelling carriage, Z direction travelling carriage is fixed on the directions X travelling carriage, and the angle of rotation travelling carriage is fixed on the Z direction travelling carriage.
Described wafer diced system comprises: the speed measuring device and the speed-controlling device of high speed direct current generator, diamond blade jig, high speed direct current generator; Light barrier in the speed measuring device of high speed direct current generator, high speed direct current generator, diamond blade jig, blade, anti-back lid be coaxial to be fixed on the axle sleeve of motor shaft.
The power of described high speed direct current generator is 10000-18000 rev/min greater than 10W, rotating speed.
Described blade jig is made up of preceding chuck, back chuck and blade, and jig takes place in rotation beat and swing should be less than 0.05mm.
The speed measuring device of described high speed direct current generator and speed-controlling device, form by the light barrier that has a light hole, digital frequency meter, sensor and potentiometer, the coaxial afterbody that is fixed on motor shaft of light barrier, sensor is fixed on the light barrier both sides by a female bracket, and sensor is electrically connected with digital frequency meter.
Described sensor comprises: a pair of light emitting diode; This places the light barrier both sides respectively to diode.
The utlity model has following advantage:
(1) this utility model adopts the mode of middling speed cutting, successful solution do not have the difficult problem of cooling wafer cutting, guarantee the not contaminated and destruction of cutting object;
(2) cutting speed of this utility model and gait of march can be regulated, to adapt to the needs of different cutting objects;
(3) this utility model prepares rational in infrastructure, easy operating, safe in utilization, with low cost.
In a word, the utility model not only provides a kind of novel cutting equipment for high temperature superconducting thin film wafers and various high-temperature superconductive device, also is semi-conductor industry, and solar cell industry provides a kind of novel cutting equipment.
Description of drawings
Fig. 1, the utility model do not have the structural representation of cooling wafer cutting machine
Fig. 2, the utility model do not have the wafer diced system schematic diagram in the cooling wafer cutting machine
Accompanying drawing indicates:
1, frame 2, display 3, control panel
4, diamond blade 5, angle of rotation travelling carriage 6, Z direction travelling carriage
7, directions X travelling carriage 8, Y direction travelling carriage 9, motor shaft
10, axle sleeve 11, anti-back lid 12, chuck
13, light barrier 14, light hole 15, motor
Specific embodiment embodiment 1
Make a wafer diced system that does not have in the cooling wafer cutting machine, as shown in Figure 2, at first, axle sleeve 10 is installed on the motor shaft, then, diamond blade 4, anti-back lid 11 and chuck 12 are installed on the axle sleeve 10 the light barrier 13 coaxial afterbodys that are fixed on motor shaft, sensor is fixed on the light barrier both sides by a female bracket, and sensor is electrically connected with digital frequency meter.In the present embodiment, adopting power is 10000-18000 rev/min of adjustable dc motor greater than 10W, rotating speed; ST/C type digital frequency meter and infraluminescence two extremely are electrically connected pipe, form speed measuring system; Motor power adopts the adjustable direct-flow voltage regulation source of voltage, 3 amperes of maximum currents, and voltage range is the 10-18 volt, the potentiometer on the motor power is by regulating supply voltage control rotating speed of motor.Embodiment 2
The wafer diced system that utilizes embodiment 1 to make, making one does not have the cooling wafer cutting machine, and as shown in Figure 1, crystal navigation system, dragging system, crystal-cut system and four parts of video camera are installed in the left side of this device, this side has one, closes when cutting machine is worked.Chip device is on the crystal navigation system, and dragging system is made up of small-sized low-speed DC motor and belt ratio wheel, and the crystal navigation system is fixed on the dragging system, and its Y direction translation stage 8 links to each other with the belt ratio wheel.The crystal-cut system is fixed on the top of wafer orientation system by a support; TV monitor system adopts SP-709 televimonitor 2 and SP-926PA gamma camera, and video camera is contained in the support bracket fastened left end of crystal-cut system; Control panel 3 and display 2 are installed in the right side of this device.Wherein, four-degree-of-freedom wafer cutting bed is adopted by the wafer orientation system, by model is directions X translation stage 7 (the stroke 100mm of 01TS, translational speed≤0.1mm/s, central loading 10kg), model is Y direction translation stage 8 (the stroke 50mm of 02TSM12, manually control speed), model is Z direction lifting platform 6 (the stroke 13mm of 02TV021, manually control speed) and model be that the θ precise angle turntable 5 (scope 360 degree, least count 2 ') of 02RM0141 is formed, directions X translation stage 7 uses digital forms demonstration displacement result, the support of Z direction lifting platform 6 uses spiral micrometer bar location, and precise angle turntable 5 uses the vernier location.
Claims (7)
1, a kind of nothing cooling wafer cutter sweep, this device comprises: wafer orientation system, dragging system, control panel, display system, TV monitor system; Wherein, wafer orientation system, dragging system and three parts of video camera are installed in a side of this device, this side has one, dragging system is fixedlyed connected with the Y direction travelling carriage in the wafer orientation system, video camera is installed in the upper left side in the frame, and control panel and display are installed in the opposite side of this device; It is characterized in that: comprise that also one is fixed on the wafer diced system of the top of wafer orientation system, this system comprises: the speed measuring device and the speed-controlling device of high speed direct current generator, blade jig, high speed direct current generator; Light barrier in the speed measuring device of high speed direct current generator, high speed direct current generator, blade jig, anti-back lid be coaxial to be fixed on the axle sleeve of motor shaft.
2, according to the described nothing cooling of claim 1 wafer cutter sweep, it is characterized in that: the wafer that is cut comprises: jewel sheet, monocrystalline silicon piece, quartz, glass, pottery, superconducting thin film and superconductive device.
3, according to the described nothing cooling of claim 1 wafer cutter sweep, it is characterized in that: described wafer orientation system is four-dimensional travelling carriage, form by directions X travelling carriage, Y direction travelling carriage, Z direction lifting platform and angle of rotation travelling carriage, Y direction travelling carriage is fixed on the frame, the directions X travelling carriage is fixed on the Y direction travelling carriage, Z direction lifting platform is fixed on the directions X travelling carriage, and the angle of rotation travelling carriage is fixed on the Z direction lifting platform.
4, according to the described nothing cooling of claim 1 wafer cutter sweep, it is characterized in that: the power of described high speed direct current generator is 10000-18000 rev/min greater than 10W, rotating speed.
6, according to the described nothing cooling of claim 1 wafer cutter sweep, it is characterized in that: described blade jig, form by preceding chuck, back chuck and diamond blade, before diamond blade is fixed between chuck and the back chuck, jig takes place in rotation beats and swings less than 0.05mm.
7, according to the described nothing cooling of claim 1 wafer cutter sweep, it is characterized in that: the speed measuring device of described high speed direct current generator and speed-controlling device, form by the light barrier that has a light hole, digital frequency meter, sensor and potentiometer, the coaxial afterbody that is fixed on motor shaft of light barrier, sensor is fixed on the light barrier both sides by a female bracket, and sensor is electrically connected with digital frequency meter.
8, according to the described nothing cooling of claim 7 wafer cutter sweep, it is characterized in that: described sensor comprises: a pair of light emitting diode; This places the light barrier both sides respectively to diode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02291301 CN2584388Y (en) | 2002-12-17 | 2002-12-17 | Chip cutting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02291301 CN2584388Y (en) | 2002-12-17 | 2002-12-17 | Chip cutting machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2584388Y true CN2584388Y (en) | 2003-11-05 |
Family
ID=33750176
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02291301 Expired - Fee Related CN2584388Y (en) | 2002-12-17 | 2002-12-17 | Chip cutting machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2584388Y (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100424816C (en) * | 2006-11-27 | 2008-10-08 | 成都华冠精密机械加工有限公司 | A method to eliminate residual glue on semiconductor component and its special device |
| CN100566931C (en) * | 2005-12-08 | 2009-12-09 | 株式会社迪思科 | Topping machanism |
| CN102107461A (en) * | 2010-12-24 | 2011-06-29 | 江苏大学 | Seed crystal cutting machine |
| CN107052970A (en) * | 2017-06-27 | 2017-08-18 | 盐城市宁润玻璃制品有限公司 | A kind of glass forming processing device |
| CN107443600A (en) * | 2017-08-25 | 2017-12-08 | 芜湖长润特种铜线有限公司 | A kind of copper material cutting processing equipment |
| CN114074380A (en) * | 2022-01-19 | 2022-02-22 | 沈阳和研科技有限公司 | Scribing device |
-
2002
- 2002-12-17 CN CN 02291301 patent/CN2584388Y/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100566931C (en) * | 2005-12-08 | 2009-12-09 | 株式会社迪思科 | Topping machanism |
| CN100424816C (en) * | 2006-11-27 | 2008-10-08 | 成都华冠精密机械加工有限公司 | A method to eliminate residual glue on semiconductor component and its special device |
| CN102107461A (en) * | 2010-12-24 | 2011-06-29 | 江苏大学 | Seed crystal cutting machine |
| CN102107461B (en) * | 2010-12-24 | 2014-02-12 | 江苏大学 | Seed crystal cutting machine |
| CN107052970A (en) * | 2017-06-27 | 2017-08-18 | 盐城市宁润玻璃制品有限公司 | A kind of glass forming processing device |
| CN107443600A (en) * | 2017-08-25 | 2017-12-08 | 芜湖长润特种铜线有限公司 | A kind of copper material cutting processing equipment |
| CN114074380A (en) * | 2022-01-19 | 2022-02-22 | 沈阳和研科技有限公司 | Scribing device |
| CN114074380B (en) * | 2022-01-19 | 2022-04-22 | 沈阳和研科技有限公司 | Scribing device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |