CN2582336Y - Radiation apparatus having elastic positioning function - Google Patents
Radiation apparatus having elastic positioning function Download PDFInfo
- Publication number
- CN2582336Y CN2582336Y CN 02286193 CN02286193U CN2582336Y CN 2582336 Y CN2582336 Y CN 2582336Y CN 02286193 CN02286193 CN 02286193 CN 02286193 U CN02286193 U CN 02286193U CN 2582336 Y CN2582336 Y CN 2582336Y
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- building brick
- electronic building
- heat abstractor
- buckling piece
- contact end
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Abstract
The utility model relates to a radiating device with an elastic positioning function, which can be used for emitting the heat of electronic subassemblies of electronic products. The radiating device mainly comprises a base and an elastic fastener group, wherein, the base is provided with a contact end part, the first contact surface of the contact end part is provided with at least one groove and one convex column arranged on the groove side, and the second contact surface of the contact end part is connected with electronic subassemblies. The elastic fastener group is used for positioning the contact end part of the base to a circuit board which is provided with electronic subassemblies, the elastic fastener group comprise a first fastener which can be clipped to the contact end part and electronic subassemblies and a second fastener, the second fastener is correspondingly assembled with the first fastener, wherein, a dishing part is formed on the position of the first fastener corresponding to the groove of the contact end part, because the dishing depth of the dishing part is less than the groove depth of the contact end surface, a height difference is formed, when the electronic subassemblies and the contact end part of the base are fixed through the elastic fastener group, and a prestressing created by the height difference can reduce an improper pressure which is created by the radiating device to the electronic subassemblies.
Description
Technical field
The utility model is about a kind of heat abstractor of tool elasticity positioning action, and it is used for the electronic building brick of electronic product is dispelled the heat, and can reduce it after with heat abstractor and electronic building brick location to undue influence that electronic building brick produced.
Background technology
The technical bottleneck of high-tech electronic product such as notebook maximum is when by wherein heat abstractor its electronic building brick being dispelled the heat, the inconsistent tolerance that causes (tolerance) owing to for example various locking degree or contact height, weld problems such as improper, cause the inconsistent and suitable situation such as do not contact of locking degree between assembly in the heat abstractor or device and this electronic building brick or contact height, thereby cause after this heat abstractor and this electronic building brick location, in loading and unloading, carrying, this heat abstractor will cause improperly or excessive pressure this electronic building brick in replacing or the operation, and make for example central processing unit (CPU, Central Processing Unit), the performance and the useful life of little process chip or microprocessor electronic building bricks such as (Micorprocessor) are greatly affected.
Heat abstractor commonly used as shown in Figure 5, this heat abstractor 10 comprises that fan 11, radiating fin 12, heat pipe 13, pedestal 14 and have the fastener 15 of last cramp 16 and time cramp 17.Fan 11 is arranged on the radiating channel outlet side of a plurality of radiating fins 12, and is connected with the glutinous pedestal 14 that is provided with heat pipe 13, and 13 of heat pipes are transmitted to the other end near fan 11 with heat from the end with little process chip 190 substrate contacted 14.Cramp 17 was respectively arranged with the perforation 160 and the fore-set 170 of mutual correspondence under the last cramp 16 of fastener 15 reached, and the corner of each upper and lower cramp 16,17 offers screw 161,171.
When assembling above-mentioned heat abstractor to electronic product, after spreading the very thin thermal grease of one deck on little process chip 190, touch a heat-conducting block 191 (Heat Block) by tin ball (Solder Ball) in little process chip 190, increasing external radiator structure and area of dissipation, and pedestal 14 is engaged with the printed circuit board (PCB) 18 that carries little process chip 190.Then, pedestal 14 that will engage again and printed circuit board (PCB) 18 are interposed between the last cramp 16 and following cramp 17 of fastener 15, and the perforation 160 of cramp 16 and the fore-set 170 of following cramp 17 are coupled, simultaneously, the screw 161 that will go up cramp 16 with screw 150 tightly pins with the screw 171 of corresponding following cramp 17.
Wherein, as shown in Figure 6, between pedestal 14, printed circuit board (PCB) 18 and upper and lower cramp 16,17, be provided with coil tension spring K (or elastic components such as laborsaving lever, bend shape shrapnel) again, so that can utilize the elasticity of coil tension spring K (or elastic components such as laborsaving lever, bend shape shrapnel) between pedestal 14, printed circuit board (PCB) 18 and the fastener 15, will be with the antagonism heat abstractor to the improper or excessive pressure that electronic building brick was produced.
Yet, as with fastener heat abstractor being navigated to electronic building brick with the screw deadlock, because the locking degree of each screw is inconsistent, and will cause the tolerance that highly differs, therefore make by the electronic building brick fixed with fastener in such as processes such as loading and unloading, carrying, replacing or runnings, to directly bear heat abstractor to improper or excessive pressure that it caused, and cause printed circuit board (PCB) flexural deformation, perhaps cause the packing colloid of electronic building brick to break even the generation of problem such as whole electronic building brick flexural deformation.
Also have, heat-conducting block is soldered to the juncture of electronic building brick with the tin ball, often because the height of tin ball after weld job is finished differs, and the highly inconsistent tolerance of formation another kind, thereby electronic building brick caused problems such as flexural deformation, the packing colloid of aforesaid tolerance break, and will make heat-conducting block can't touch electronic building brick effectively because of the height deficiency of tin ball, and make the glutinous pedestal that is provided with heat pipe not contact really with electronic building brick, simultaneously, the be full of cracks of tin ball also will make heat pipe fail to contact really with electronic building brick.
Therefore, do not contact really, will cause dispelling the heat bad and cause the situation of burning, not only influence its heat radiation quality and radiating efficiency greatly once this electronic building brick of start with electronic building brick owing to Welding Problems causes heat pipe and pedestal; Simultaneously again because of can't reducing between heat abstractor and the electronic building brick pressure improperly, and in the process of installing, transport, change or dismantle heat abstractor, will damage electronic building brick and printed circuit board (PCB) accidentally.
In addition, use elastic components such as coil tension spring, laborsaving lever or bend shape shrapnel between pedestal and printed circuit board (PCB), though can provide point-to-point nargin by pushing elastic components such as coil tension spring, laborsaving lever or bend shape shrapnel, but utilize elastic components such as spring force, leverage and bend shape shrapnel also will cause the highly inconsistent tolerance of another kind, and cause above-mentioned variety of problems; Therefore, still can cause the distortion of electronic building brick and printed circuit board (PCB) or crumble when fastener is too tight, too pine then may be caused poor heat radiation and be burnt electronic building brick; Simultaneously, point-to-point nargin also is unable to cope with installation, transports, continue the pressure that produces in replacing or the unloading process, will cause the distortion of this electronic building brick and printed circuit board (PCB) or damages.
Therefore, how effectively fixedly heat abstractor in the electronic product and the electronic building brick that needs heat radiation, reduce the excessive or undue influence that is created in loading and unloading, carrying, replacing or the operation between the two simultaneously, nargin suitable between heat abstractor and the electronic building brick is provided and keeps good radiating efficiency, and then the quality and the reliability of lifting heat abstractor and whole electronic product, real problem for needing to be resolved hurrily.
The utility model content
The utility model is to overcome above-mentionedly to design with the shortcoming and the problem of the locating structure of heat abstractor, its main purpose is to provide a kind of heat abstractor of tool elasticity positioning action, and it can make the heat abstractor in the electronic product touch heat abstractor really with the electronic building brick that needs heat radiation.
Another purpose of the present utility model be to provide a kind of can be when electronic building brick touches heat abstractor, between heat abstractor and electronic building brick, form a difference in height, the heat abstractor of the tool elasticity positioning action that can suitably be out of shape in the face of pressure the time, to have restoring force.
A purpose more of the present utility model is to provide a kind of thermal source that electronic building brick is produced to conduct to heat abstractor really, and can spill into the extraneous heat abstractor with elasticity positioning action rapidly.
For reaching above-mentioned purpose, the utility model provides a kind of heat abstractor of tool elasticity positioning action, is used for the electronic building brick person of heat radiation to electronic product, and it is characterized in that: described heat abstractor mainly comprises:
Pedestal, its be provided with one can ccontaining heat pipe groove, and be equipped with radiating fin at one end and have a contact end at the other end away from described radiating fin, first contact-making surface of described contact end is provided with groove at least and is located at projection on the described groove side, and second contact-making surface of described contact end then is to engage described electronic building brick;
One spring secures rail to sleeper group, have on the circuit board of described electronic building brick in order to the contact end of locating described pedestal, second buckling piece that comprises first buckling piece that can insert and put described contact end and described electronic building brick and the corresponding described first buckling piece winding, wherein, described first buckling piece is formed with a depressed part corresponding to the position of the groove of aforementioned contact end, the cup depth of described depressed part forms difference in height less than the depth of groove of described contact end face, make when with described spring secures rail to sleeper group with described electronic building brick and described pedestal contact the end fixedly the time, with by precompression that described difference in height was produced to allay described heat abstractor to undue influence that described electronic building brick was produced.
In other words, according to above-described purpose, the utility model provides a kind of heat abstractor with elasticity positioning action, this heat abstractor mainly comprise have the contact end pedestal and have first buckling piece and second buckling piece this pedestal is navigated to the spring secures rail to sleeper group of the printed circuit board (PCB) that is provided with electronic building brick.
Pedestal be provided with one can ccontaining heat pipe groove, and be equipped with radiating fin at one end and have a contact end at the other end away from radiating fin, first contact-making surface of contact end is provided with groove at least and is located at projection on the groove side, and second contact-making surface of contact end then engages electronic building brick; Simultaneously, be formed with a depressed part at first buckling piece corresponding to the position of the groove of aforementioned contact end, the cup depth of this depressed part forms a difference in height less than the depth of groove of this contact end face, make when with this spring secures rail to sleeper group with this electronic building brick and this pedestal contact the end fixedly the time, with by precompression that difference in height was produced with the subduction heat abstractor to undue influence that electronic building brick was produced.
Wherein, first buckling piece is formed with through hole in the position of the projection of correspondence contact end, and the height of projection is greater than the cup depth of groove, guaranteeing aforementioned difference in height, and first buckling piece can entirely be bridged at the contact end face of pedestal.
Also have, the through hole of first buckling piece then can be fixed on the contact end of pedestal to guarantee first buckling piece by as fixed components and the projection winding that contacts the end such as screw, hooking part, clasps; And first buckling piece is formed with the protuberance of downward extension in its corner positions, second buckling piece then is provided with through hole at the corresponding aforementioned protuberance of its corner positions, be provided with again on the protuberance screw with through hole by first and second buckling piece being connected with group as the fixed component of screw.
Like this, this heat abstractor can elasticity be located and contact with electronic building brick by the spring secures rail to sleeper group, between can be when the pressure, has restoring force by this height official post face and face, and make between the contact end of heat abstractor and the electronic building brick and can suitably be out of shape with tridimensional adequate allowance, and reduced improper or excessive pressure therebetween, and the thermal source that electronic building brick is produced can conduct rapidly and from the heat abstractor loss to extraneous.
Be different from the point-to-point nargin of heat abstractor of usefulness, the difference in height that heat abstractor with elasticity positioning action of the present utility model provides the restoring force between face and the face and keeps suitably being out of shape, make heat abstractor and electronic building brick be touched really and fixing, simultaneously, can form flexible fastening structure by this difference in height simultaneously with restoring force in certain stationary positioned.
Therefore, not only can be firm and closely be fixed on the surface of electronic building brick with heat abstractor, and energy shock resistance and vibration resistance, can prevent from simultaneously pressure is being installed, is transported, coming off in use or the unloading process and reducing therebetween improperly to avoid the electronic building brick bending, be out of shape or crumble, with quality and the reliability of guaranteeing electronic building brick, simultaneously also promote the radiating efficiency and the quality of heat abstractor, and then promoted the overall performance of electronic product.
In sum, remarkable efficacy provided by the utility model can be summarized as follows:
The printed circuit board (PCB) that heat abstractor with elasticity positioning action of the present utility model can the spring secures rail to sleeper group will for example be provided with electronic building bricks such as little process chip, CPU or microprocessor touches the pedestal at heat abstractor really, the thermal source that electronic building brick is produced can be transmitted to the outside rapidly, guarantees to make the printed circuit board (PCB) with electronic building brick to fix and be positioned at the heat abstractor of the tool elasticity positioning action of heat abstractor really to provide a kind of.
Use the heat abstractor of tool elasticity positioning action of the present utility model, cause can be by being formed on the difference in height in its pedestal and the spring secures rail to sleeper group, and make suitable deformation ability is arranged between face and the face, and heat abstractor is provided and has restoring force between the printed circuit board (PCB) of electronic building brick, the improper or excessive pressure that can reduce in the running to be produced.
The heat abstractor of tool elasticity positioning action of the present utility model is because of touching the printed circuit board (PCB) of electronic building brick really the pedestal at heat abstractor, and significantly increase the area of heat loss through conduction, make thermal source to conduct rapidly and spill into the external world, so provide a kind of can be fast and really with heat conduction and spill into the heat abstractor of outside tool elasticity positioning action.
Therefore, heat abstractor of the present utility model can its spring secures rail to sleeper group and electronic building brick location and form difference in height, between can be when the pressure, has restoring force by height official post face and face, and make between the contact end of heat abstractor and the electronic building brick and can suitably be out of shape with the adequate allowance of difference in height, the thermal source that not only makes this electronic building brick produce can conduct rapidly and from the heat abstractor loss to extraneous, more reduced improper or excessive pressure therebetween, to form the flexible fastening structure that has restoring force and can suitably be out of shape by this difference in height in the stationary positioned really.
Simultaneously, the utility model is not only can be with heat abstractor firm and closely be fixed on the surface of electronic building brick, and energy shock resistance and vibration resistance, can prevent from simultaneously pressure is being installed, is transported, coming off in use or the unloading process and allaying therebetween improperly to avoid the electronic building brick bending, be out of shape or crumble, with quality and the reliability of guaranteeing this electronic building brick, and then the overall performance of enhancement electronic product.
Description of drawings
For above-mentioned and other purpose of the present utility model, feature and advantage can be become apparent, will be by a preferred embodiment, and in conjunction with the accompanying drawings, describe embodiment of the present utility model in detail, the content Description of accompanying drawing is as follows.
Fig. 1 represents the structural representation of the embodiment of heat abstractor of the present utility model;
Fig. 2 represents the part top view of heat abstractor of the present utility model;
Fig. 3 represents that heat abstractor of the present utility model is assembled into the side schematic view of printed circuit board (PCB);
Fig. 4 represents that heat abstractor of the present utility model is assembled into the part cutaway view of printed circuit board (PCB);
Fig. 5 represents to use the organigram of heat abstractor; And
Fig. 6 represents that the utility model has been assembled into the part cutaway view of printed circuit board (PCB) with heat abstractor.
Embodiment
Embodiment of the present utility model is to be that example illustrates to be attached to as the heat abstractor on the electronic product of notebook etc., because known notebook etc. is applicable object, its internal structure does not change, so for simplicity and make feature of the present utility model and structure more clear understandable, so only demonstrate the structure that directly correlates with the utility model in the electronic product in the accompanying drawings, all the other partly then slightly remove.
Below promptly in conjunction with the accompanying drawings 1-4 describe the embodiment of the disclosed heat abstractor of the utility model in detail with elasticity positioning action.As shown in Figure 1, heat abstractor 2 of the present utility model mainly comprises pedestal 20 and spring secures rail to sleeper group 3.
Wherein, electronic building brick 4 can be any electronic building brick person that must dispel the heat such as for example little process chip, microprocessor and central processing unit.
A plurality of radiating fins 21 are provided in a side of on the lower surface of pedestal 20 away from the other end of aforementioned contact end 24, form radiating channel 210 between adjacent two radiating fins 21; Heat pipe 22 is to be located in the groove 25 of pedestal 20, simultaneously, shown in the circle choosing in Fig. 1 upper right corner, the groove 25 of ccontaining heat pipe 22 is provided with an opening 250 in the position of corresponding electronic building brick 4, so that heat pipe 22 must touch the surface of electronic building brick 4 at opening 250 places, and the thermal source that electronic building brick 4 is produced conducts rapidly; Fan 23 is radiating channel 210 sides that are installed in each radiating fin 21, spills into the external world rapidly in order to the thermal source that electronic building brick 4 is produced.
Wherein, because of the detailed structure and the operating principle of heat abstractor 2 belongs to known technology, so do not give unnecessary details in addition at this.
Spring secures rail to sleeper group 3 be have pedestal 20 in order to the location contact end 24 on the printed circuit board (PCB) 5 of electronic building brick 4, comprise inserting and putting contact end 24 and first buckling piece 30 of electronic building brick 4 and second buckling piece 31 of corresponding first buckling piece 30 windings.
Wherein, first buckling piece 30 is formed with a depressed part 300 corresponding to the position of the groove 240 of aforementioned contact end 24, the cup depth of depressed part 300 is less than the cup depth of the groove 240 of contact end face 24, and form a difference in height A, and the corner positions of first buckling piece 30 is formed with the protuberance 301 of downward extension, and be formed with through hole 302 in the position of the projection 245 of correspondence contact end 24, and the height of projection 245 is greater than the cup depth of groove 240, to guarantee aforementioned difference in height A, and first buckling piece 30 can entirely be bridged on the contact end face 24 of pedestal 2, as Fig. 2 and shown in Figure 4.
Also have, be provided with screw (not icon) on the protuberance 301 again, through hole 302 then can be fixed on the contact end 24 of pedestal 20 to guarantee first buckling piece 30 by as employed screw 303 in the present embodiment or other for example fixed component such as hooking part, clasp and projection 245 windings that contact end 24.
31 through holes 310 that are formed with the protuberance 301 of corresponding first buckling piece 30 in corner positions of second buckling piece, as shown in Figure 3, can be in the protuberance 301 of first buckling piece 30 by screw 311 with screw with through hole 310 screw locks of second buckling piece 31, so that but second buckling piece 31 fixes with winding with first buckling piece 30 that contacts on the end 24 that is fixed on pedestal 20, and the printed circuit board (PCB) 5 that makes the contact end 24 of pedestal 20 and be provided with the electronic building brick 4 that needs heat radiation can be interposed between first and second buckling piece 30,31.
As Fig. 1, shown in 3 and 4, desire winding heat abstractor of the present utility model when the printed circuit board (PCB) 5 of the electronic building brick 4 that needs heat radiation is set, be that substrate 5 is interposed between the contact end 24 and second buckling piece 31 that engages the pedestal 20 that first buckling piece 30 is arranged, and contact end face 24 is contacted with electronic building brick 4, and depressed part 300 and the groove 240 formed difference in height A that contact end face 24 by first buckling piece 30, make when the fixed component as screw 303 is tightened on first buckling piece 30 on the contact end face 24, can can suitably be out of shape because of the precompression that difference in height produces between heat abstractor 2 and the electronic building brick 4, and be reduced the undue influence that 2 pairs of electronic building bricks 4 of heat abstractor are produced.
Wherein, on first buckling piece 30 and second buckling piece 31, can offer opening 304 and opening 312 respectively, when electronic building brick 4 continues to produce thermal source, a large amount of thermals source is except being delivered to the external world by heat pipe 222, also can make partly thermal source loss, and be unlikely savings in electronic building brick 4 by opening 304 and opening 312.
Simultaneously, the part coating heat-conducting glue that contacts with electronic building brick 4 at heat pipe 22 to be binding, and improving heat transfer efficiency, and avoided the solder joints of known technology and the tolerance that causes; And it is made that pedestal 20 and spring secures rail to sleeper group 3 are heat-conducting, with can be rapidly with heat transferred that electronic building brick was produced to the external world and dissipation, heat radiation function of being desired to reach and radiating efficiency.
Be that with the heat abstractor difference this is to use as coil tension spring with heat abstractor, laborsaving lever, or elastic component such as bend shape shrapnel is between its pedestal and printed circuit board (PCB), only can be by pushing coil tension spring, laborsaving lever, or elastic component such as bending spring provides point-to-point elasticity, and the restoring force and the difference in height that can make appropriateness distortion between face and the face can't be provided, and will cause highly inconsistent tolerance, heat abstractor with elasticity positioning action of the present utility model then forms a difference in height, it can provide between face and the face and tridimensional nargin, simultaneously the problem of zero allowance.
Therefore, heat abstractor of the present utility model and have between the printed circuit board (PCB) of electronic building brick and can have restoring force and can appropriateness be out of shape by difference in height, to avoid the causing distortion of electronic building brick and printed circuit board (PCB) or to crumble or avoid causing the situation of burning electronic building brick because of poor heat radiation, and energy shock resistance and vibration resistance, and can prevent in the situation of installing, transport, coming off or damaging in use or the unloading process, with quality and the reliability of guaranteeing electronic product, also promote the radiating efficiency and the quality of heat abstractor simultaneously.
Wherein, the depressed part 300 of first buckling piece 30 and corresponding with it end 24 grooves 240, its quantity, position and shape etc. are set all are not limited to icon and can optionally do increase and decrease and change, for example, can make depressed part and groove with for example protuberance or opening etc. any have equate that the structure of rendeing a service replaces, as long as can make the difference in height that keeps suitable each other, the restoring force with can appropriateness distortion between formation face and the face gets final product with the improper or excessive pressure person who is produced in the subduction running.
Also have, set-up mode, form and the position of through hole 302, projection 245, perforate 310 or protuberance 301 etc., also be not limited to above-mentioned explanation and icon and can be optionally changed, for example, also can use latch fitting, clasp, hooking part or fastener etc. can reach the spare part of identical function, or also can 2 points, 3 and multiple spot be provided with above-mentioned spare part with first buckling piece of fixing spring secures rail to sleeper group with contact the end.
Simultaneously, the position of spring secures rail to sleeper group, shape and quantity are not limit yet, as long as with the contact-making surface of heat abstractor winding can the corresponding suitable difference in height that forms the tool restoring force, for example, can adopt integrally formed and have kink and can make unitary elasticity location fastener that two offsides are interlockingly connected being provided with the difference in height that has restoring force and can reduce improper or excessive pressure, heat abstractor and the printed circuit board (PCB) that is provided with electronic building brick are given winding and location.
Also have, the winding of its two fastener is not limited to lock with screw, and any spare parts with identical function such as also for example clamping, hook, latch closure, chain folder fix the location, also can be used for simultaneously other single or assembly and the device that makes up and the printed circuit board (PCB) elasticity location with the electronic installation that need dispel the heat in the heat abstractor.
The above is preferred embodiment of the present utility model only, is not in order to limiting scope of the present utility model, that is to say, the utility model in fact still can be made other change.Under the broad spirit and viewpoint situation that are defined without prejudice to the utility model claims, the change form or the modification of various equivalences all should belong among the scope of patent protection of the present utility model.
Claims (10)
1. the heat abstractor of a tool elasticity positioning action is used for the electronic building brick of electronic product is dispelled the heat, and it is characterized in that: described heat abstractor mainly comprises:
Pedestal, its be provided with one can ccontaining heat pipe groove, and be equipped with radiating fin at one end and have a contact end at the other end away from described radiating fin, first contact-making surface of described contact end is provided with groove at least and is located at projection on the described groove side, and second contact-making surface of described contact end then is to engage described electronic building brick;
One spring secures rail to sleeper group, have on the circuit board of described electronic building brick in order to the contact end of locating described pedestal, second buckling piece that comprises first buckling piece that can insert and put described contact end and described electronic building brick and the corresponding described first buckling piece winding, wherein, described first buckling piece is formed with a depressed part corresponding to the position of the groove of aforementioned contact end, the cup depth of described depressed part forms difference in height less than the depth of groove of described contact end face, make when with described spring secures rail to sleeper group with described electronic building brick and described pedestal contact the end fixedly the time, with by precompression that described difference in height was produced to reduce described heat abstractor to undue influence that described electronic building brick was produced.
2. heat abstractor as claimed in claim 1 is characterized in that: described electronic building brick is to be selected from little process chip, central processing unit and the microprocessor any one.
3. heat abstractor as claimed in claim 1 is characterized in that: the groove of described contact end is provided with an opening again exposing described heat pipe, and described heat pipe is contacted with described electronic building brick.
4. heat abstractor as claimed in claim 3 is characterized in that: described heat pipe expose partly be the coating heat-conducting glue with described electronic building brick gluing.
5. heat abstractor as claimed in claim 1 is characterized in that: the depressed part of described first buckling piece is to bridge accordingly on the groove of described contact end, and the height of the projection of described contact end is greater than the degree of depth of described groove.
6. heat abstractor as claimed in claim 1 is characterized in that: described first buckling piece is provided with through hole again in the position of the projection of the described contact of correspondence end, with described first buckling piece of winding and the described end that contacts.
7. heat abstractor as claimed in claim 6 is characterized in that: described first buckling piece can be selected from any one winding in addition in screw, hooking part, the clasp with the described end that contacts.
8. heat abstractor as claimed in claim 1, it is characterized in that: described first buckling piece is extended with protuberance downwards in its corner positions, be provided with screw on the described protuberance again, and described second buckling piece is provided with through hole at the corresponding described protuberance of its corner positions, by described first buckling piece of winding and described second buckling piece, and with described pedestal and the circuit board holding that is provided with described electronic building brick therein.
9. heat abstractor as claimed in claim 8 is characterized in that: the winding each other with clamping, hook, latch closure, chain folder and any one structure of being spirally connected of described first buckling piece and described second buckling piece.
10. heat abstractor as claimed in claim 1 is characterized in that: it is made that described pedestal and described spring secures rail to sleeper group are heat-conducting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02286193 CN2582336Y (en) | 2002-11-19 | 2002-11-19 | Radiation apparatus having elastic positioning function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02286193 CN2582336Y (en) | 2002-11-19 | 2002-11-19 | Radiation apparatus having elastic positioning function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2582336Y true CN2582336Y (en) | 2003-10-22 |
Family
ID=33746956
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02286193 Expired - Lifetime CN2582336Y (en) | 2002-11-19 | 2002-11-19 | Radiation apparatus having elastic positioning function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2582336Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101340803B (en) * | 2007-07-06 | 2010-09-01 | 华硕电脑股份有限公司 | Fixture construction |
| CN101312628B (en) * | 2007-05-25 | 2011-05-18 | 佛山市顺德区顺达电脑厂有限公司 | Heat radiator having bent spring plate |
| CN101106888B (en) * | 2006-07-14 | 2012-06-13 | 富准精密工业(深圳)有限公司 | Heat radiation module |
| CN101990382B (en) * | 2009-08-07 | 2012-12-19 | 鸿富锦精密工业（深圳）有限公司 | Fixing device and equipment using same |
-
2002
- 2002-11-19 CN CN 02286193 patent/CN2582336Y/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101106888B (en) * | 2006-07-14 | 2012-06-13 | 富准精密工业(深圳)有限公司 | Heat radiation module |
| CN101312628B (en) * | 2007-05-25 | 2011-05-18 | 佛山市顺德区顺达电脑厂有限公司 | Heat radiator having bent spring plate |
| CN101340803B (en) * | 2007-07-06 | 2010-09-01 | 华硕电脑股份有限公司 | Fixture construction |
| CN101990382B (en) * | 2009-08-07 | 2012-12-19 | 鸿富锦精密工业（深圳）有限公司 | Fixing device and equipment using same |
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