CN2576099Y - Temp-regulating bed - Google Patents
Temp-regulating bed Download PDFInfo
- Publication number
- CN2576099Y CN2576099Y CN 02259769 CN02259769U CN2576099Y CN 2576099 Y CN2576099 Y CN 2576099Y CN 02259769 CN02259769 CN 02259769 CN 02259769 U CN02259769 U CN 02259769U CN 2576099 Y CN2576099 Y CN 2576099Y
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- Prior art keywords
- bed
- temperature
- bed board
- heat
- conductive device
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- Expired - Fee Related
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Abstract
The utility model relates to a temperature-regulating bed, which comprises a bed plate, a temperature-conducting deice connected to one end of the bed plate, a temperature-regulating device connected to the lower edge of the temperature-conducting deice, a plurality of refrigeration wafers arranged between the temperature-conducting deice and the temperature-regulating device, and a control die set arranged on the temperature-regulating device, wherein, the bed plate is composed of a hollow temperature-conducting shell; the temperature-conducting device has a frame body and a plurality of hollow conducting plates which are communicated with the hollow temperature-conducting shell; heat transfer mediums with high heat transfer and cold transfer efficiency are filled in the hollow conducting plates and the temperature-conducting shell. The temperature-regulating device has a box body, a heat dispersion liquid groove, and a plurality of groups of heat dispersion fins extending in the heat dispersion liquid groove. A first conducting face of every wafer is stuck with the heat dispersion fins; a second conducting face is stuck with the hollow conducting plates. The temperature-regulating bed of the utility model can properly adjust the temperature of the bed plate to provide comfortable lying feel for users.
Description
[technical field]
The utility model relates to a kind of bed, particularly relates to a kind of temperature adjustment bed of adjustable bed plate temperature.
[background technology]
Commercially available bed at present has different pliabilitys or bone safeguard function more, and can provide user's health, the comfortable sense that couches, help user to reach the sleep state of Cui.Yet general bed itself does not have the equipment of supply cold and heat source, therefore, when the time in midsummer, temperature was higher, just need can makes the temperature reduction in bedroom or reach heat radiation by brushing of electric fan by air conditioner, so that nice and cool sleep environment to be provided; When time in severe winter temperature is low, just need can makes the temperature rising in bedroom or must come warming health by warming machine by thick and heavy cotton-wadded quilt.Therefore, general bed only has comfortable pliability or healthy function, does not have the function of refrigeration and heat supply.
[utility model content]
The purpose of this utility model is to provide a kind of can suitably regulate the bed plate temperature, and the user can be provided the temperature adjustment bed of the comfortable sense that couches.
In order to achieve the above object, the utility model provides a kind of temperature adjustment bed, comprises that bed board pedestal, that a bed board, is arranged at this bed board below is layed in the mattress on the bed board; It is characterized in that: comprise that also one is arranged in the heat conductive device of this bed board one end, one is arranged in the register of this heat conductive device lower edge, most sheets are arranged at the cooling wafer between heat conductive device and this register, an and control module that is installed on this register, this bed board is that the warm housing of leading by at least one hollow form is constituted, and lead in the warm housing in this and to be filled with heat transfer, pass the high heat transfer medium of cold efficiency, this heat conductive device has a framework and most the hollow guide plates that are placed on side by side in this framework, and define an airspace between this framework inside and this hollow guide plate, this each hollow guide plate is connected with the warm housing of leading of this bed board, and in this hollow guide plate, be filled with heat transfer, pass the high heat transfer medium of cold efficiency, and this register has a casing, one is located in this casing and is filled with the heat radiation liquid bath of water liquid, majority is mounted in the casing and stretches the radiating fin that places the heat radiation liquid bath, and at least one heat emission fan that is installed on this casing, and this box house is made a heat-dissipating space with heat radiation liquid bath boundary, offer most exhaust vents on this casing, this each cooling wafer all have two-phase reverse first, two conducting surfaces, first conducting surface of this each cooling wafer is to paste mutually with the radiating fin of this register to touch, and this second conducting surface is to paste mutually with the hollow guide plate of this heat conductive device to touch.
Described temperature adjustment bed, it is characterized in that: this bed board can be formed by mutually assembling by the warm housing of leading of most hollow forms, these lead long limit and minor face that warm housing has two parallel correspondences, and each is led on the minor face of warm housing and all offers an opening, again, each is led on the long limit of warm housing and has protruded out a blocking wall, and depression is formed with a clamping slot on another long limit, moreover, all offer a communication port that is connected with the opening of leading warm housing of bed board on each hollow guide plate of this heat conductive device.
Described temperature adjustment bed, it is characterized in that: this temperature adjustment bed more comprises a hollow form tap that is arranged between this heat conductive device and bed board, one side of this tap be provided with respect to hollow guide plate quantity and corresponding with its communication port connect first connect the hole, and be provided with second of most the corresponding connections of the openings of leading warm housing with relative populations in opposite side and connect the hole.
Described temperature adjustment bed is characterized in that: each hollow guide plate of this heat conductive device is the bending that is a reversed J shape.
Described temperature adjustment bed is characterized in that: more be equiped with a blowing fan on the framework of this heat conductive device, and offer most exhaust outlets in this framework towards a side of bed board.
Described temperature adjustment bed is characterized in that: more be provided with a coil pipe in the heat radiation liquid bath of this register, and an end of this coil pipe is to stretch to place register outer and connect with the framework of heat conductive device, the other end is then stretched and is placed outside the heat radiation liquid bath.
Described temperature adjustment bed is characterized in that: be equiped with an observing window and a water plug on the heat radiation liquid bath of this register.
Described temperature adjustment bed is characterized in that: this temperature adjustment bed more comprises a cold and hot obstruct pad that is arranged between bed board and bed board pedestal.
In sum, temperature adjustment bed of the present utility model, its feature and effect are: this temperature adjustment bed includes one and is filled with heat transfer, pass the bed board that warm housing constitutes of leading of the high heat transfer medium of cold efficiency, one can support this bed board and make the bed board pedestal of bed board horizontal, one is layed on the bed board and the mattress with gas permeability, one is arranged in the heat conductive device of bed board one end, one is arranged in the register of this heat conductive device lower edge, most sheets are arranged at the cooling wafer between heat conductive device and register, and one is located on the register and can controls each cooling wafer conductance current whether control module.Be formed with an airspace in the framework of this heat conductive device and exist side by side and be provided with most hollow guide plates, and all be filled with heat transfer, the high heat transfer medium of biography cold efficiency in these hollow guide plates, and be connected with the warm housing of leading of bed board.Be provided with in the casing of this temperature adjustment dress and one be filled with the heat radiation liquid bath of water liquid, most group is stretched the radiating fin that places this heat radiation liquid bath, and at least one be located on the casing and extraneous air-flow can be blown into the heat emission fan of the heat-dissipating space in the casing.Wherein, but offer the exhaust vent that most air feed streams are discharged on this casing.And first and second conducting surface perseverance of these cooling wafers has been kept a cold and hot temperature difference, and first conducting surface of each cooling wafer is to paste mutually with the radiating fin of register to touch, and second conducting surface is to paste mutually with the hollow guide plate of heat conductive device to touch.Temperature adjustment bed of the present utility model is when using, can be by driving the control module to being arranged at each the cooling wafer energising between heat conductive device and register, make first conducting surface of each cooling wafer reach default temperature, make the difference variation of second conducting surface generation simultaneously with respect to first conducting surface, at this moment, heat transfer in each hollow guide plate of this heat conductive device, pass the high heat transfer medium temperature of cold efficiency and also can produce variations in temperature thereupon, and conduct in the warm housing of leading of bed board, make the bed board of the utility model temperature adjustment bed can be adjusted to a default comfort temperature, provide the user application target of the comfortable sense that couches and can reach.
Below by temperature adjustment bed of the present utility model being elaborated than Cui embodiment and accompanying drawing:
[description of drawings]
Fig. 1 is the stereogram of the utility model one than Cui embodiment.
Fig. 2 is a side view cutaway drawing of the present utility model.
Fig. 3 is a sectional perspective exploded view of the present utility model.
Fig. 4 is a front cross-section view of the present utility model.
[specific embodiment]
As Fig. 1,2, shown in 3, the utility model one is than the temperature adjustment bed 1 of Cui embodiment, include one by most individual bed boards 11 that the warm housing 111 of leading of hollow form is formed by mutually assembling that are, one can support this bed board 11 and make the bed board pedestal 12 of bed board 11 horizontal, one is layed on the bed board 11 and the mattress 13 with gas permeability, one is arranged in the heat conductive device 14 of bed board 11 1 ends, one is arranged in the register 15 of these heat conductive device 14 lower edges, most sheets are arranged at the cooling wafer 16 of 15 of heat conductive device 14 and registers, and one is installed on the register 15 and can controls each cooling wafer 16 conductance currents whether control module 17 simultaneously.
Wherein, cooling wafer 16 can have been bought on market, is a kind of refrigerator of the CPU of can be used for heat radiation, is lined up by many N types and P-type semiconductor particle, and is connected with conductor, and the outside coats two potsherds.
Each of this bed board 11 is led and all is filled with heat transfer in the warm housing 111, passes the high heat transfer of cold efficiency, passes the high heat transfer medium of cold efficiency.This bed board pedestal 12 has one can be for a substrate 121 of bed board 11 horizontal, and most the stands 122 that are arranged in these substrate 121 bottom surfaces and can shore this substrate 121.This heat conductive device 14 has a framework 141, most the hollow guide plates 142 that are placed on side by side in the framework 141, and framework 141 inside and 142 on hollow guide plate define an airspace 140, other makes, and each hollow guide plate 142 is to be connected with the warm housing 111 of leading of bed board 11, and also is filled with heat transfer in these hollow guide plates 142, passes the high heat transfer medium of cold efficiency.This register 15 has a casing 151, and is located in this casing 151 and the heat radiation liquid bath 153, the majority that are filled with water liquid 152 is mounted in the casing 151 and stretches the radiating fin 154, that places heat radiation liquid bath 153 and be located at coil pipe 155 in the heat radiation liquid bath 153, and one is installed on the casing 151 and extraneous air-flow can be blown into heat emission fan 156 in the casing 151.These casing 151 inside and 153 of liquid baths of heat radiation define a heat-dissipating space 150, and an end of this coil pipe 155 is that to convexedly stretch in register 15 outer and connect with the framework 141 of heat conductive device 14, the other end is then stretched and is placed outside the heat radiation liquid bath 153, make the airspace 140 of this heat conductive device 14 and the heat-dissipating space 150 of register 15 to be conducted by coil pipe 155, the simultaneously low temperature that is given out by the hollow guide plate 142 of coil pipe 155 guiding heat conductive devices 14 or the air-flow of warm temperature, cooling or warm up water liquid 152 in the heat radiation liquid bath 153, in addition, but offer the exhaust vent 157 that most air feed streams are discharged on this casing 151.And these cooling wafers 16 all have the first reverse conducting surface 161 of two-phase and second conducting surface 162, and these first and second conducting surface 161,162 perseverances have been kept a cold and hot temperature difference, and first conducting surface 161 that makes each cooling wafer 16 is to paste mutually with the radiating fin 154 of register 15 to touch, and second conducting surface 162 is to paste mutually with the hollow guide plate 142 of heat conductive device 14 to touch.
Shown in Fig. 2,3, each of this bed board 11 is led long limit and the minor face that warm housing 111 all has two parallel correspondences, and each is led on the minor face of warm housing 111 and all offers an opening 112, again, each is led on the long limit of warm housing 111 and has protruded out a blocking wall 113, and depression is formed with a clamping slot 114 on another long limit, and makes arbitrary blocking wall 113 of leading warm housing 111 just can be equipped in another clamping slot of leading warm housing 111 114, reaches mutual winding by means of making these lead warm housing 111.And each hollow guide plate 142 of this heat conductive device 14 all is the bending of a reversed J shape, makes these hollow guide plates 142 have bigger contact-making surface with airspace 140, and all offers a communication port 143 on each hollow guide plate 142.Moreover, be provided with a cold and hot obstruct pad 18 between this bed board 11 and the bed board pedestal 12, make that the low temperature that given out by the warm housing 111 of leading of bed board 11 or warm temperature can be by the obstructs of this cold and hot obstruct pad 18, and unlikely loss.
In addition, the temperature adjustment bed 1 of present embodiment more includes a hollow form tap 19 that is arranged at 11 of this heat conductive device 14 and bed boards, one side of this tap 19 is provided with respect to hollow guide plate 142 quantity can connect hole 191 with first of its communication port 143 corresponding connections, and in opposite side be provided with most can correspondingly with the opening 112 of the warm housing 111 of leading of relative populations connect second connect hole 192, by means of make these hollow guide plates 142 can be connected more than the warm housing 111 of leading of its quantity.And more be equiped with a blowing fan 144 that extraneous air-flow can be blown into airspace on the framework 141 of this heat conductive device 14, but and this framework 141 offer the exhaust outlet 145 that most air feed streams are discharged towards a side of bed board 11.In addition, more be equiped with a transparent observing window 158 and a water plug 159 on the heat radiation liquid bath 153 of this register 15, but and can whether loss be arranged by the water liquid 152 in this observing window 158 visual inspection cooling fluid grooves 153, and can open water plug 159 at any time with supplementing water liquid 152.
As Fig. 2, shown in 4, when the weather sweltering heat, as the temperature adjustment bed 1 of desiring to make present embodiment is when having nice and cool low temperature, can drive this control module 17 earlier to each cooling wafer 16 conductance current, make first conducting surface 161 of each cooling wafer 16 reach default high temperature, at this moment, second conducting surface 162 of these cooling wafers 16 promptly produces relative difference variation, also promptly reach low temperature with respect to first conducting surface 161, second conducting surface 162 that relends by each cooling wafer 16 all pastes each the hollow guide plate 142 that touches in heat conductive device 14, make the heat transfer medium in each hollow guide plate 142 also can lower the temperature thereupon, and import first of taps 19 via the communication port 143 of hollow guide plate 142 and connect hole 191, each that connects that hole 192 is directed at bed board 11 respectively by most second of tap 19 is led the opening 112 of warm housing 111 again, each is led in the warm housing 111 and with low temperature conducts to bed board 11, make each lead and reach default low temperature after warm housing 111 interior heat transfer mediums are conducted, and the user can be provided the comfortable nice and cool sense that couches.
On the other hand, when the temperature of first conducting surface 161 of these cooling wafers 16 raises, touch each radiating fin 154 by subsides in register 15, and high temperature can be conducted to the section of stretching the radiating fin 154 that places heat radiation liquid bath 163, utilize the 152 pairs of radiating fins 154 of water liquid in the heat radiation liquid bath 153 to absorb heat again, make first conducting surface 161 of these cooling wafers 16 can reach the purpose of heat radiation.Moreover, disengage hot gas by these radiating fins 154 from cooling wafer 16, water liquid 152 in the heat radiation liquid bath 153 is heated up thereupon, make the surface temperature of heat radiation liquid bath 153 raise, can be blown into extraneous air-flow in the heat-dissipating space 150 this moment by the heat emission fan of being located on the casing 151 156, to brush the section that pastes the radiating fin 154 that touches with cooling wafer 16, brush the surface of heat radiation liquid bath 153 simultaneously, and hot gas is discharged outside the casing 151 via air outlet 157, further reach the purpose of auxiliary heat dissipation.
In addition, when this temperature adjustment bed 1 is in user mode, the user also can start the blowing fan 144 on the framework 141 of being located at heat conductive device 14, so as to extraneous air-flow being blown in the airspace 140 in the framework 141, at this moment, because the heat transfer in the hollow guide plate 142, passing the high heat transfer medium of cold efficiency is to be in low-temperature condition, make and may be interspersed in the airspace 140 by these hollow guide plates 142 outer cold air that given out, utilize again this blowing fan 144 brush shown in the arrow among Fig. 2 as cold air is blown out outside the framework 141 via exhaust outlet 145, make this temperature adjustment bed 1 except that having comfortable nice and cool cold temperature effect, have more the effect that cold air brushes.In this simultaneously, cold air in the airspace 140 of heat conductive device 14 also flows to downwards in the coil pipe 155 of register 15, but and the cold air that is given out by the coil pipe 155 high-temperature water liquid 152 in the cooling heat dissipation liquid bath 153 just, and then can reach the acceleration cooling purpose.Afterwards, after the cold air in the coil pipe 155 warms up, promptly be expelled in the heat-dissipating space 150, relend by the cold air after being located at heat emission fan 156 on the casing 151 and will warming up and discharge outside the casings 151 via air outlet 157.
Opposite, when weather cold, as the temperature adjustment bed 1 of desiring to make present embodiment is when having warm high temperature, can adjust this control module 17 equally, change the sense of current that it imports each cooling wafer 16, to control first of each cooling wafer 16, two conducting surfaces 161,162 variations in temperature, make first conducting surface 161 of each cooling wafer 16 reach default low temperature, and the high temperature that second conducting surface 162 promptly produces with respect to first conducting surface 161 changes, make each hollow guide plate 142 interior heat transfer medium of this heat conductive device 14 also can heat up thereupon, and via hollow guide plate 142, tap 19 conduct to bed board 11 each lead in the warm housing 111, make each lead and reach default high temperature after warm housing 111 interior heat transfer mediums are conducted, and the user can be provided the comfortable warm sense that couches.
On the other hand, when the temperature of first conducting surface 161 of these cooling wafers 16 descends, can warm up radiating fin 154 by the water liquid 152 in the heat radiation liquid bath 163 equally.In addition, when this temperature adjustment bed 1 is in user mode, the user also can start the blowing fan 144 on the framework 141 of being located at heat conductive device 14, so as to hollow guide plate 142 outer giving out being interspersed among the heating installation in the airspace 140, blow out outside the framework 141 via exhaust outlet 145 again, make this temperature adjustment bed 1 except that having comfortable warm effect, have more the effect that heating installation brushes.In this simultaneously, heating installation in the airspace 140 of this heat conductive device 14 has also flow in the coil pipe 155 of register 15, and just can warm up water at low temperature liquid 152 in the heat radiation liquid bath 153 of register 15 by the heating installation that coil pipe 155 is given out, make water liquid 152 quick recoverables in this heat radiation liquid bath 153 to normal temperature, and then make this register 15 can keep good user mode at any time.
Conclude above-mentioned, temperature adjustment bed 1 of the present utility model is when using, can be arranged at heat conductive device 14 and switch on by driving 17 pairs of modules of control with each cooling wafer 16 of 15 of registers, make first conducting surface 161 of each cooling wafer 16 reach default temperature, the difference variation that second conducting surface 162 is produced with respect to first conducting surface 161, at this moment, heat transfer medium temperature in each hollow guide plate 142 of this heat conductive device 14 also can produce variations in temperature thereupon, and conduct in the warm housing 111 of leading of bed board 11, make the bed board 11 of the utility model temperature adjustment bed 1 can be adjusted to a default comfort temperature, provide the user application target of the comfortable sense that couches and can reach.
Claims (8)
1, a kind of temperature adjustment bed comprises that bed board pedestal, that a bed board, is arranged at this bed board below is layed in the mattress on the bed board; It is characterized in that: comprise that also one is arranged in the heat conductive device of this bed board one end, one is arranged in the register of this heat conductive device lower edge, most sheets are arranged at the cooling wafer between heat conductive device and this register, an and control module that is installed on this register, this bed board is that the warm housing of leading by at least one hollow form is constituted, and lead in the warm housing in this and to be filled with heat transfer, pass the high heat transfer medium of cold efficiency, this heat conductive device has a framework and most the hollow guide plates that are placed on side by side in this framework, and define an airspace between this framework inside and this hollow guide plate, this each hollow guide plate is connected with the warm housing of leading of this bed board, and in this hollow guide plate, be filled with heat transfer, pass the high heat transfer medium of cold efficiency, and this register has a casing, one is located in this casing and is filled with the heat radiation liquid bath of water liquid, majority is mounted in the casing and stretches the radiating fin that places the heat radiation liquid bath, and at least one heat emission fan that is installed on this casing, and this box house is made a heat-dissipating space with heat radiation liquid bath boundary, offer most exhaust vents on this casing, this each cooling wafer all have two-phase reverse first, two conducting surfaces, first conducting surface of this each cooling wafer is to paste mutually with the radiating fin of this register to touch, and this second conducting surface is to paste mutually with the hollow guide plate of this heat conductive device to touch.
2, temperature adjustment bed as claimed in claim 1, it is characterized in that: this bed board is formed by mutually assembling by the warm housing of leading of most hollow forms, this respectively leads long limit and minor face that warm housing has two parallel correspondences, and this is respectively led on the minor face of warm housing and all offers an opening, this is respectively led on the long limit of warm housing and has protruded out a blocking wall, and depression is provided with a clamping slot on another long limit, all offers a communication port that is connected with the opening of leading warm housing of this bed board on each hollow guide plate of this heat conductive device.
3, temperature adjustment bed as claimed in claim 2, it is characterized in that: this temperature adjustment bed also comprises a hollow form tap that is arranged between this heat conductive device and this bed board, one side of this tap be provided with respect to this hollow guide plate quantity and corresponding with its communication port connect first connect the hole, and in opposite side be provided with most with this of relative populations lead warm housing the corresponding connection of opening second connect the hole.
4, temperature adjustment bed as claimed in claim 1 is characterized in that: each hollow guide plate of this heat conductive device is the bending that is a reversed J shape.
5, temperature adjustment bed as claimed in claim 1 is characterized in that: also be equiped with a blowing fan on the framework of this heat conductive device, and offer most exhaust outlets in this framework towards a side of bed board.
6, temperature adjustment bed as claimed in claim 1, it is characterized in that: also be provided with a coil pipe in the heat radiation liquid bath of this register, one end of this coil pipe is to stretch to place this register outer and connect with the framework of this heat conductive device, and the other end is then stretched and placed outside this heat radiation liquid bath.
7, temperature adjustment bed as claimed in claim 1 is characterized in that: be equiped with an observing window and a water plug on the heat radiation liquid bath of this register.
8, temperature adjustment bed as claimed in claim 1 is characterized in that: this temperature adjustment bed also comprises a cold and hot obstruct pad that is arranged between this bed board and this bed board pedestal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02259769 CN2576099Y (en) | 2002-09-28 | 2002-09-28 | Temp-regulating bed |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02259769 CN2576099Y (en) | 2002-09-28 | 2002-09-28 | Temp-regulating bed |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2576099Y true CN2576099Y (en) | 2003-10-01 |
Family
ID=33727022
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02259769 Expired - Fee Related CN2576099Y (en) | 2002-09-28 | 2002-09-28 | Temp-regulating bed |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2576099Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106880216A (en) * | 2017-03-16 | 2017-06-23 | 谢玉林 | A kind of air blowing type temp.-controlled bed |
| CN110484897A (en) * | 2018-05-14 | 2019-11-22 | 北京北方华创微电子装备有限公司 | Chip register and semiconductor equipment |
-
2002
- 2002-09-28 CN CN 02259769 patent/CN2576099Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106880216A (en) * | 2017-03-16 | 2017-06-23 | 谢玉林 | A kind of air blowing type temp.-controlled bed |
| CN110484897A (en) * | 2018-05-14 | 2019-11-22 | 北京北方华创微电子装备有限公司 | Chip register and semiconductor equipment |
| CN110484897B (en) * | 2018-05-14 | 2021-10-15 | 北京北方华创微电子装备有限公司 | Temperature adjusting device for wafer and semiconductor device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20031001 Termination date: 20091028 |