CN112648755A - Semiconductor refrigerating device - Google Patents
Semiconductor refrigerating device Download PDFInfo
- Publication number
- CN112648755A CN112648755A CN202011389339.7A CN202011389339A CN112648755A CN 112648755 A CN112648755 A CN 112648755A CN 202011389339 A CN202011389339 A CN 202011389339A CN 112648755 A CN112648755 A CN 112648755A
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- refrigeration
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- cold
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B49/00—Arrangement or mounting of control or safety devices
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- Engineering & Computer Science (AREA)
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- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a semiconductor refrigerating device, and relates to the technical field of refrigerating devices. The air conditioner comprises a shell, a refrigeration assembly, a fan assembly, a heat dissipation port, an air outlet and a power supply module, wherein a wind direction plate is arranged at the bottom of the inner side of the shell; the refrigeration assembly comprises at least one semiconductor refrigeration piece with a cold end and a hot end, and is arranged on the inner side wall of the shell; the fan assembly is arranged on the inner side wall of the shell; the heat dissipation port is arranged at the top of the shell; the air outlet sets up in the bottom of shell, and power module is used for adjusting, control and protection circuit and electrical equipment. The invention can realize the switching of refrigeration and ventilation by the switching of the air ports and the control of the refrigeration component; the invention has the appearance size equal to or less than the height of the suspended ceiling, can meet the requirement that a user can conveniently embed a refrigerating device on the premise of not changing the original room layout and structure, and has the effects of reducing the ambient temperature and improving the comfort level of human bodies.
Description
Technical Field
The invention belongs to the technical field of refrigerating devices, and particularly relates to a semiconductor refrigerating device.
Background
In high temperature weather, in certain less room, place such as kitchen, bathroom are in order to adjust ambient temperature to suitable temperature, refer in particular to when the demand that high temperature environment needs the cooling, to the too high problem of room temperature, ordinary fan, thermantidote have appeared at present and can realize the air conditioning equipment of refrigeration output: natural wind blown by a common fan is used for carrying away human body heat, the body sensing temperature is reduced, and the cooling effect is limited when the temperature is higher in summer; the cooling fan, the fan and the water circulation are combined to reduce the environment temperature, the scheme can achieve a smaller cooling effect, but the arrangement of a water path or a water storage tank is more complicated and cannot achieve a better cooling effect; the air conditioning equipment capable of realizing refrigeration output is complex in installation, high in manufacturing cost and high in power consumption.
Disclosure of Invention
The invention aims to provide a semiconductor refrigerating device, which can realize the switching of refrigeration and ventilation by switching an air port and controlling a refrigerating assembly; in addition, the appearance size of the invention is equal to or less than the height of the suspended ceiling, and for a room with the suspended ceiling, a user can conveniently embed a refrigerating device on the premise of not changing the original room layout and structure, thereby reducing the environmental temperature and improving the comfort level of the human body.
In order to solve the technical problems, the invention is realized by the following technical scheme:
the invention relates to a semiconductor refrigerating device which comprises a shell, a refrigerating assembly, a fan assembly, a heat dissipation port, an air outlet and a power supply module, wherein a wind direction plate is arranged at the bottom of the inner side of the shell; the bottom of the shell is provided with an air inlet used for leading in outdoor fresh air; the refrigeration assembly comprises at least one semiconductor refrigeration piece with a cold end and a hot end, the refrigeration assembly is arranged on the inner side wall of the shell, and a refrigeration channel close to the cold end and a heat dissipation channel close to the hot end are formed in the refrigeration assembly; the fan assembly is used for guiding part of outdoor fresh air into the cold air duct, and converting the outdoor fresh air into refrigerating airflow after heat exchange with the cold end; the other part of the outdoor fresh air is guided into the hot air duct, is subjected to heat exchange with the hot end and then is converted into heat dissipation airflow, and the fan assembly is arranged on the inner side wall of the shell; the heat dissipation port is arranged at the top of the shell and communicated with the heat dissipation channel so as to discharge heat dissipation airflow to the outside; the air outlet is arranged at the bottom of the shell and communicated with the refrigerating channel so as to discharge the refrigerating airflow to the indoor; the power supply module is used for adjusting, controlling and protecting the circuit and the electrical equipment.
Furthermore, the air inlet is provided with a plurality of baffle plates to form a plurality of air inlet ducts.
Furthermore, the air outlet is provided with an air swinging plate for adjusting the air outlet direction of the refrigerating airflow, and one end of the air swinging plate is connected with a first motor.
Further, the air outlet is provided with a temperature detector to detect the quantity of work of the semiconductor refrigeration pieces according to the temperature of the air outlet.
Further, the fan assembly includes a second motor and a first fan.
Furthermore, the refrigerating assembly also comprises a cold end cold guide fin group and a hot end heat radiation fin group, wherein the cold end cold guide fin group is arranged in the refrigerating channel and connected with the cold end of the semiconductor refrigerating sheet so as to exchange heat with outdoor fresh air flowing through; the hot end radiating fin group is arranged in the radiating channel and connected with the hot end of the semiconductor refrigerating sheet so as to exchange heat with outdoor fresh air flowing through.
Furthermore, the cold end cold guide fin group is arranged in the refrigerating channel and connected with a guide pipe, one end of the guide pipe is connected with the cold end of the semiconductor refrigerating sheet, and the cold end cold guide fin group is provided with a first fan (205); the hot end radiating fin group is arranged in the radiating channel and connected with the hot end of the semiconductor refrigerating sheet, and the upper surface of the hot end radiating fin group is provided with a second fan.
The invention has the following beneficial effects:
1. the invention can realize the switching of refrigeration and ventilation by the switching of the air ports and the control of the refrigeration component; by starting the power supply module, the refrigeration assembly works, the fan assembly works, and the refrigeration airflow at the cold end of the semiconductor refrigeration sheet is discharged into a kitchen space through the refrigeration channel, so that the cooling and ventilation effects are achieved; when the refrigeration subassembly was out of work, start power module, the work of fan subassembly will be followed the outdoor new trend that the air intake got into and directly pass through the air outlet and arrange in the kitchen space to play the effect of taking a breath.
2. The invention can ensure that the air flowing through the whole equipment is clean and pollution-free outdoor fresh air during working, avoid the pollution of indoor dirty air to the equipment and further improve the service life of the equipment.
3. The invention has the advantages that the appearance size is equal to or less than the height of the suspended ceiling, and for a room with the suspended ceiling, a user can conveniently embed a refrigerating device on the premise of not changing the original room layout and structure, thereby reducing the environmental temperature and improving the comfort level of the human body.
Of course, it is not necessary for any product in which the invention is practiced to achieve all of the above-described advantages at the same time.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic structural view of a semiconductor refrigeration apparatus;
FIG. 2 is a schematic structural view of the bottom of the semiconductor refrigeration device;
FIG. 3 is a bottom view of the semiconductor refrigeration apparatus;
FIG. 4 is a cross-sectional view taken along A-A of FIG. 3;
FIG. 5 is a schematic view showing the flow direction of the air flow of the semiconductor refrigeration device;
FIG. 6 is a schematic structural view of a third semiconductor refrigeration apparatus according to an embodiment;
FIG. 7 is a side view of a semiconductor cooling device according to an embodiment;
in the drawings, the components represented by the respective reference numerals are listed below:
1-shell, 2-refrigeration component, 3-fan component, 4-heat dissipation port, 5-air outlet, 6-power supply module, 101-wind direction plate, 102-wind adjusting plate, 103-baffle plate, 104-air inlet, 201-semiconductor refrigeration sheet, 202-cold end cold guide fin group, 203-hot end heat dissipation fin group, 204-guide pipe, 205-first fan, 206-second fan, 301-second motor, 302-first fan, 501-wind swinging plate and 502-first motor.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "open," "upper," "lower," "bottom," "top," "middle," "outer," "inner," "sidewall," and the like are used in an orientation or positional relationship that is merely used to facilitate the description of the invention and to simplify the description, but do not indicate or imply that the referenced components or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be considered as limiting the present invention.
Example one
Referring to fig. 1 and 2, the present invention is a semiconductor refrigeration device, which includes a housing 1, a refrigeration component 2, a fan component 3, a heat dissipation opening 4, an air outlet 5, and a power supply module 6.
An air inlet 104 is formed in the bottom of the shell 1 and used for leading in outdoor fresh air, a plurality of baffle plates 103 are arranged on the air inlet 104 to form a plurality of air inlet channels, the baffle plates 103 are arranged in parallel, and a certain angle is formed between each baffle plate 103 and the air inlet 104 to increase the air inlet area.
Referring to fig. 3 and 4, the refrigeration assembly 2 includes a semiconductor refrigeration sheet 201 having a cold end and a hot end, the refrigeration assembly 2 is disposed on the inner side wall of the housing 1, and a refrigeration channel near the cold end and a heat dissipation channel near the hot end are formed in the refrigeration assembly 2; the refrigerating assembly 2 further comprises a cold end cold guide fin group 202 and a hot end heat radiation fin group 203, wherein the cold end cold guide fin group 202 is arranged in the refrigerating channel and connected with the cold end of the semiconductor refrigerating sheet 201 to exchange heat with outdoor fresh air flowing through; the hot-end radiating fin group 203 is arranged in the radiating channel and connected with the hot end of the semiconductor refrigerating sheet 201 so as to exchange heat with outdoor fresh air flowing through.
Specifically, the semiconductor refrigeration sheet 201 is sandwiched between the cold-end cold-guide fin group 202 and the hot-end heat-dissipation fin group 203, and the cold-end cold-guide fin group 202 and the hot-end heat-dissipation fin group 203 both include a plurality of fins perpendicular to the cold end of the semiconductor refrigeration sheet 201, wherein the plurality of fins included in the cold-end cold-guide fin group 202 and the plurality of fins included in the hot-end heat-dissipation fin group 203 are arranged in parallel at intervals, and the extending direction of the fins is the same as the flowing direction of outdoor fresh air entering the refrigeration assembly 2.
The bottom of the inner side of the shell 1 is provided with a wind deflector 101, the wind deflector 101 is arranged in the middle of the fan assembly 3 and the semiconductor refrigerating sheet 201, the wind deflector 101 is arranged to be of a V-shaped structure, the wind adjusting plate 102 for changing the wind direction is arranged on the inner side of the shell 1, the wind adjusting plate 102 is arranged above the wind deflector 101, the wind adjusting plate 102 is preferably a V-shaped plate and comprises a transverse plate and an inclined plate, the transverse plate and the wind deflector 101 form a cold wind channel, and the inclined plate and the top wall of the shell 1 form a hot.
The fan assembly 3 is arranged on the inner side wall of the shell 1, the fan assembly 3 comprises a second motor 301 and a first fan 302, the first fan 302 is preferably a perfusion fan and is used for guiding part of outdoor fresh air into a cold air duct, exchanging heat with a cold end and converting the outdoor fresh air into refrigerating air flow; referring to fig. 5, white arrows represent the flowing direction of the refrigerating airflow, and another part of the outdoor fresh air is introduced into the hot air duct to be converted into the heat dissipation airflow after being subjected to heat exchange with the hot end, and referring to fig. 5, black arrows represent the flowing direction of the heat dissipation airflow.
The heat dissipation port 4 is disposed at the top of the housing 1 and is communicated with the heat dissipation channel to discharge the heat dissipation airflow to the outside, so as to achieve the purpose of dissipating heat for the semiconductor chilling plate 201.
The air outlet 5 is arranged at the bottom of the shell 1 and is communicated with the refrigerating channel to discharge refrigerating airflow to the indoor; the air outlet 5 is provided with an air swinging plate 501, one end of the air swinging plate 501 is connected with a first motor 502, and the inclination angle between the air swinging plate 501 and the air outlet 5 can be changed through the first motor 502 so as to adjust the air outlet direction of the refrigerating airflow; the air outlet 5 is provided with a temperature detector to control the number of the semiconductor chilling plates 201 according to the temperature detection of the air outlet.
The power supply module 6 is used for adjusting, controlling and protecting the circuit and the electrical equipment, the power supply module 6 comprises an operation interface, and the operation interface can be an entity strong-current switch, a remote control or an APP operation interface; the operation interface comprises a temperature adjusting module, the temperature adjusting module can be set to be adjusted in multiple gears, and a user adjusts and sets gears according to the temperature detector.
Semiconductor refrigerating plant can switch and the control of refrigeration subassembly 2 through the wind gap, can realize the refrigeration, the switching of taking a breath, start power module 6, refrigeration subassembly 2 during operation, fan subassembly 3 work, arrange the refrigerated air current of semiconductor refrigeration piece 201 cold junction in the kitchen space through the refrigeration passageway, thereby play the refrigerated effect of cooling, when refrigeration subassembly 2 is out of work, start power module 6, fan subassembly 3 work, the outdoor new trend that will follow air intake 104 entering directly arranges the kitchen space in through air outlet 5, thereby play the ventilation effect.
Semiconductor refrigerating plant is arranged in setting up the intermediate layer district between the furred ceiling and the roof in room, sets up the first hole that corresponds with air intake 104 position, size in order to channel into on the furred ceiling outdoor new trend is seted up the second hole that corresponds with thermovent 4 positions, size on the room outer wall in order to arrange the radiating air current outdoor, because the refrigerating air current in the cold wind channel needs to be arranged indoor simultaneously, consequently also can punch in order to introduce the refrigerating air current indoor on the furred ceiling, in addition, semiconductor refrigerating plant's overall dimension equals or is less than the height of furred ceiling to realize convenient pleasing to the eye installation.
Example two
Referring to fig. 1 and 2, the present invention is a semiconductor refrigeration device, which includes a housing 1, a refrigeration component 2, a fan component 3, a heat dissipation opening 4, an air outlet 5, and a power supply module 6.
An air inlet 104 is formed in the bottom of the shell 1 and used for leading in outdoor fresh air, a plurality of baffle plates 103 are arranged on the air inlet 104 to form a plurality of air inlet channels, the baffle plates 103 are arranged in parallel, and a certain angle is formed between each baffle plate 103 and the air inlet 104 to increase the air inlet area.
Referring to fig. 3 and 4, the refrigeration assembly 2 includes two semiconductor refrigeration sheets 201 having a cold end and a hot end, the refrigeration assembly 2 is disposed on the inner side wall of the housing 1, and a refrigeration channel near the cold end and a heat dissipation channel near the hot end are formed in the refrigeration assembly 2; the refrigerating assembly 2 further comprises a cold end cold guide fin group 202 and a hot end heat radiation fin group 203, wherein the cold end cold guide fin group 202 is arranged in the refrigerating channel and connected with the cold end of the semiconductor refrigerating sheet 201 to exchange heat with outdoor fresh air flowing through; the hot-end radiating fin group 203 is arranged in the radiating channel and connected with the hot end of the semiconductor refrigerating sheet 201 so as to exchange heat with outdoor fresh air flowing through.
Specifically, the semiconductor refrigeration sheets 201 are sandwiched between the cold-end cold-guide fin group 202 and the hot-end heat-radiating fin group 203, and when the number of the semiconductor refrigeration sheets 201 is two, the two semiconductor refrigeration sheets 201 share one cold-end cold-guide fin group 202 and one hot-end heat-radiating fin group 203; meanwhile, the cold-end cold-guiding fin group 202 and the hot-end heat-radiating fin group 203 both comprise a plurality of fins vertical to the cold end of the semiconductor refrigerating sheet 201, wherein the plurality of fins respectively comprised by the cold-end cold-guiding fin group 202 and the hot-end heat-radiating fin group 203 are arranged in parallel at intervals, and the extending direction of the fins is the same as the flowing direction of outdoor fresh air entering the refrigerating assembly 2.
The bottom of the inner side of the shell 1 is provided with a wind direction plate 101, the wind direction plate 101 is arranged to be of a V-shaped structure, the wind adjusting plate 102 for changing the wind direction is arranged on the inner side of the shell 1, the wind adjusting plate 102 is arranged to be of a V-shaped structure and comprises a transverse plate and an inclined plate, the transverse plate and the wind direction plate 101 form a cold wind channel, and the inclined plate and the top wall of the shell 1 form a hot wind channel.
The fan assembly 3 is arranged on the inner side wall of the shell 1, and the fan assembly 3 comprises a second motor 301 and a first fan 302 and is used for guiding part of outdoor fresh air into the cold air duct, exchanging heat with the cold end and converting the outdoor fresh air into refrigerating air flow; and guiding the other part of the outdoor fresh air into the hot air duct, and converting the outdoor fresh air into heat dissipation air flow after heat exchange with the hot end.
The heat dissipation port 4 is disposed at the top of the housing 1 and is communicated with the heat dissipation channel to discharge the heat dissipation airflow to the outside, so as to achieve the purpose of dissipating heat for the semiconductor chilling plate 201.
The air outlet 5 is arranged at the bottom of the shell 1 and is communicated with the refrigerating channel to discharge refrigerating airflow to the indoor; the air outlet 5 is provided with an air swinging plate 501, one end of the air swinging plate 501 is connected with a first motor 502, and the inclination angle between the air swinging plate 501 and the air outlet 5 can be changed through the first motor 502 so as to adjust the air outlet direction of the refrigerating airflow; the air outlet 5 is provided with a temperature detector to control the number of the semiconductor chilling plates 201 according to the temperature detection of the air outlet.
Semiconductor refrigerating plant is arranged in setting up the intermediate layer district between the furred ceiling and the roof in room, sets up the first hole that corresponds with air intake 104 position, size in order to channel into on the furred ceiling outdoor new trend is seted up the second hole that corresponds with thermovent 4 positions, size on the room outer wall in order to arrange the radiating air current outdoor, because the refrigerating air current in the cold wind channel needs to be arranged indoor simultaneously, consequently also can punch in order to introduce the refrigerating air current indoor on the furred ceiling, in addition, semiconductor refrigerating plant's overall dimension equals or is less than the height of furred ceiling to realize convenient pleasing to the eye installation.
EXAMPLE III
Compared with the first embodiment and the second embodiment, the difference is that as shown in fig. 6 and 7, the cold-end cold-guiding fin set 202 is arranged in the refrigeration channel and connected with the conduit 204, one end of the conduit 204 is connected with the cold end of the semiconductor refrigeration sheet 201, and the cold-end cold-guiding fin set 202 is provided with the first fan 205; the hot-end radiating fin group 203 is arranged in the radiating channel and connected with the hot end of the semiconductor refrigerating sheet 201, the second fan 206 is arranged on the upper surface of the hot-end radiating fin group 203, the cold energy at the cold end of the semiconductor refrigerating sheet 201 is conducted to the hot-end radiating fin group 203 through the guide pipe 204, and the cold energy is blown out along with the wind by the second fan 206.
In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention. The invention is limited only by the claims and their full scope and equivalents.
Claims (8)
1. A semiconductor refrigeration device, characterized by: comprises that
The air conditioner comprises a shell (1), wherein a wind direction plate (101) is arranged at the bottom of the inner side of the shell (1), an air adjusting plate (102) for changing the wind direction is arranged at the inner side of the shell (1), the air adjusting plate (102) and the wind direction plate (101) form a cold wind channel, and the air adjusting plate (102) and the top wall of the shell (1) form a hot wind channel; the bottom of the shell (1) is provided with an air inlet (104) for leading in outdoor fresh air;
the refrigeration assembly (2) comprises at least one semiconductor refrigeration piece (201) with a cold end and a hot end, the refrigeration assembly (2) is arranged on the inner side wall of the shell (1), and a refrigeration channel close to the cold end and a heat dissipation channel close to the hot end are formed in the refrigeration assembly (2);
the fan assembly (3) is used for guiding part of outdoor fresh air into the cold air duct, and converting the outdoor fresh air into refrigerating airflow after heat exchange with the cold end; the other part of the outdoor fresh air is guided into the hot air duct, and is converted into heat dissipation airflow after heat exchange with the hot end, and the fan assembly (3) is arranged on the inner side wall of the shell (1);
the heat dissipation opening (4) is arranged at the top of the shell (1) and communicated with the heat dissipation channel so as to discharge the heat dissipation airflow to the outside;
the air outlet (5) is arranged at the bottom of the shell (1) and communicated with the refrigerating channel so as to discharge the refrigerating airflow to the indoor;
and the power supply module (6) is used for adjusting, controlling and protecting the circuit and the electrical equipment.
2. A semiconductor cooling device according to claim 1, characterized in that the air inlet (104) is provided with a plurality of baffles (103) to form a plurality of air inlet ducts.
3. A semiconductor refrigeration device according to claim 1, characterized in that the air outlet (5) is provided with an air swinging plate (501) for adjusting the air outlet direction of the refrigeration airflow, and one end of the air swinging plate (501) is connected with a first motor (502).
4. A semiconductor refrigeration device according to claim 3, characterized in that the air outlet (5) is provided with a temperature detector to control the number of operations of the semiconductor refrigeration sheet (201) according to the temperature detection of the air outlet.
5. A semiconductor cooling device according to claim 1, characterized in that the fan assembly (3) comprises a second electric motor (301) and a first fan (302).
6. A semiconductor cooling device according to claim 1, wherein the cooling module (2) further comprises a cold side cooling fin set (202) and a hot side cooling fin set (203).
7. A semiconductor refrigeration device according to claim 6, wherein the cold end cold guide fin set (202) is arranged in the refrigeration channel and connected with the cold end of the semiconductor refrigeration sheet (201) to exchange heat with the outdoor fresh air flowing through; the hot end radiating fin group (203) is arranged in the radiating channel and connected with the hot end of the semiconductor refrigerating sheet (201) so as to exchange heat with the outdoor fresh air flowing through.
8. A semiconductor refrigeration device according to claim 6, characterized in that the cold end cold-guiding fin group (202) is arranged in the refrigeration channel and connected with a conduit (204), one end of the conduit (204) is connected with the cold end of the semiconductor refrigeration sheet (201), and the cold end cold-guiding fin group (202) is provided with a first fan (205); the hot end radiating fin group (203) is arranged in the radiating channel and connected with the hot end of the semiconductor refrigerating sheet (201), and a second fan (206) is arranged on the upper surface of the hot end radiating fin group (203).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011389339.7A CN112648755A (en) | 2020-12-01 | 2020-12-01 | Semiconductor refrigerating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011389339.7A CN112648755A (en) | 2020-12-01 | 2020-12-01 | Semiconductor refrigerating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112648755A true CN112648755A (en) | 2021-04-13 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011389339.7A Withdrawn CN112648755A (en) | 2020-12-01 | 2020-12-01 | Semiconductor refrigerating device |
Country Status (1)
| Country | Link |
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| CN (1) | CN112648755A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113558329A (en) * | 2021-08-25 | 2021-10-29 | 纪萍 | Helmet internal temperature regulation and control device |
| CN113719934A (en) * | 2021-09-10 | 2021-11-30 | 中电海康无锡科技有限公司 | Semiconductor refrigeration cooling device |
| CN113758047A (en) * | 2021-09-10 | 2021-12-07 | 中电海康无锡科技有限公司 | Control method and control device of semiconductor refrigeration cooling heater, electric control system and cooling heater |
| CN114393953A (en) * | 2022-01-18 | 2022-04-26 | 重庆电子工程职业学院 | Color palette for advertisement design |
| CN114909734A (en) * | 2022-03-25 | 2022-08-16 | 北京小米移动软件有限公司 | Desktop air conditioner and control method |
-
2020
- 2020-12-01 CN CN202011389339.7A patent/CN112648755A/en not_active Withdrawn
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113558329A (en) * | 2021-08-25 | 2021-10-29 | 纪萍 | Helmet internal temperature regulation and control device |
| CN113719934A (en) * | 2021-09-10 | 2021-11-30 | 中电海康无锡科技有限公司 | Semiconductor refrigeration cooling device |
| CN113758047A (en) * | 2021-09-10 | 2021-12-07 | 中电海康无锡科技有限公司 | Control method and control device of semiconductor refrigeration cooling heater, electric control system and cooling heater |
| CN114393953A (en) * | 2022-01-18 | 2022-04-26 | 重庆电子工程职业学院 | Color palette for advertisement design |
| CN114909734A (en) * | 2022-03-25 | 2022-08-16 | 北京小米移动软件有限公司 | Desktop air conditioner and control method |
| CN114909734B (en) * | 2022-03-25 | 2024-06-11 | 北京小米移动软件有限公司 | Desktop air conditioner and control method |
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Application publication date: 20210413 |