CN2572717Y - 配有天线接头的印刷电路板 - Google Patents

配有天线接头的印刷电路板 Download PDF

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Publication number
CN2572717Y
CN2572717Y CN02247542U CN02247542U CN2572717Y CN 2572717 Y CN2572717 Y CN 2572717Y CN 02247542 U CN02247542 U CN 02247542U CN 02247542 U CN02247542 U CN 02247542U CN 2572717 Y CN2572717 Y CN 2572717Y
Authority
CN
China
Prior art keywords
printed circuit
circuit board
pcb
joint
antenna
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN02247542U
Other languages
English (en)
Chinese (zh)
Inventor
玛丽安·巴兰
安妮特·贝尔克
伯恩德·凯泽
罗伯特·卡利基
乔尔格·罗曼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Application granted granted Critical
Publication of CN2572717Y publication Critical patent/CN2572717Y/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0286Programmable, customizable or modifiable circuits
    • H05K1/0295Programmable, customizable or modifiable circuits adapted for choosing between different types or different locations of mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09954More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10287Metal wires as connectors or conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17Post-manufacturing processes
    • H05K2203/173Adding connections between adjacent pads or conductors, e.g. for modifying or repairing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/222Completing of printed circuits by adding non-printed jumper connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Support Of Aerials (AREA)
  • Details Of Aerials (AREA)
  • Combinations Of Printed Boards (AREA)
  • Telephone Set Structure (AREA)
CN02247542U 2002-05-29 2002-08-21 配有天线接头的印刷电路板 Expired - Fee Related CN2572717Y (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE20208477U DE20208477U1 (de) 2002-05-29 2002-05-29 Leiterplatte mit Antennenanschluss
DE20208477.9 2002-05-29

Publications (1)

Publication Number Publication Date
CN2572717Y true CN2572717Y (zh) 2003-09-10

Family

ID=7971698

Family Applications (1)

Application Number Title Priority Date Filing Date
CN02247542U Expired - Fee Related CN2572717Y (zh) 2002-05-29 2002-08-21 配有天线接头的印刷电路板

Country Status (5)

Country Link
CN (1) CN2572717Y (es)
DE (1) DE20208477U1 (es)
ES (1) ES1053195Y (es)
FR (1) FR2840504B3 (es)
IT (1) ITMI20030014U1 (es)

Also Published As

Publication number Publication date
FR2840504A3 (fr) 2003-12-05
ITMI20030014U1 (it) 2003-11-30
ES1053195U (es) 2003-03-16
FR2840504B3 (fr) 2004-04-30
ES1053195Y (es) 2003-07-01
DE20208477U1 (de) 2002-08-29

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee