CN2560989Y

CN2560989Y - Master board testing tool

Info

Publication number: CN2560989Y
Application number: CN 02242366
Authority: CN
Inventors: 许绩鸿; 黄宝庆
Original assignee: Giga Byte Technology Co Ltd
Current assignee: Giga Byte Technology Co Ltd
Priority date: 2002-08-14
Filing date: 2002-08-14
Publication date: 2003-07-16
Anticipated expiration: 2012-08-14

Abstract

The utility model discloses a testing and remedy tool for main boards, comprising a base plate, a working power supply, which is positioned on the base plate, supplying a working pressure, a plurality of stitches are also positioned on the base plate; and a plurality of stitches, which are positioned on a side of the bade plate in rows, so that a DDR slot of the Memory Module on the main board of the computer can be interposed respectively, in addition, each pitch is connected with a stitch respectively. Each stitch is in electrical connection with a BGA chip on the main board of the computer through the DDR slot of the Memory Module. Therefore, a sonde for testing an ammeter can be used to touch the stitches one by one, and the current variation can be observed the measured, so as to judge whether the BGA chip has been soldered or not.

Description

The host board testing tool

Technical field

The utility model relates to a kind of host board testing tool, refers to especially whether a kind of north bridge chips that detects is welded in the measurement jig of computing machine with motherboard really.

Background technology

Motherboard has the function of forming a connecting link and generally is considered as the base of computer system in computer system.That is to say that motherboard is to be responsible for carrying various elements, basic function and data transfer being provided in computer system.This makes that circuit and element on the motherboard are always complicated, owing to must producing motherboard in enormous quantities, increasing suddenly year by year of the market demand satisfy the demand in addition, therefore, in producing the process of motherboard, the generation ratio of the carelessness that some artificially maybe can not be expected also promotes with regard to the raising of the complexity of and then motherboard and output.In order to improve the qualification rate in the production, motherboard from the making of PCB so that the process of packing, shipment, the testing of controlling performance stability just needs to continue to carry out.

Recently, because free and open specification, DDR (Double Data Rate) SDRAM has obtained to support widely in the storer industry member.Moreover, because DDR SDRAM can continue to transmit data at the rising and the falling edge of clock signal, data conveying capacity in its unit interval is doubled, and it only needs the supply voltage of 2.5V, add its memory chip inside and have lower electric capacity and make obvious minimizing of power consumption or the like be better than the characteristics of PC133 SDRAM, make and promptly come as the epoch of the memory modules of personal computer, mobile computer with DDR SDRAM.Corresponding this trend, newer motherboard all begins to be provided with the DDR slot that plugs for DDR SDRAM memory module now, and the chipset of the corresponding DDR of support SDRAM is also arranged certainly.To this, in the processing procedure of motherboard, need the circuit reliable detection project whether between detection chip group and the DDR SDRAM slot naturally.Generally speaking, the problem between chipset and the DDRSDRAM slot produces, and mostly occurs at the north bridge chips of chipset, therefore, check the circuit between north bridge chips (or integrative chip core assembly sheet) and the DDR SDRAM slot, after DDR SDRAM is generally accepted, promptly become quite important.

Yet, because north bridge chips (or integrative chip core assembly sheet) is more based on splicing ear, and, normally adopt the BGA encapsulation for utilizing the surperficial interconnection technique (SMT) that is suitable for a large amount of procedure for producing, the splicing ear that is chip bottom is provided with the tin ball, through being welded on the motherboard after the reflow.Yet, owing to adopt the event of SMT, whether north bridge chips (or integrative chip core assembly sheet) promptly is difficult to utilize measurement instrument to detect it after by seam to be welded on the motherboard really, so mostly adopt visual examination at present, also have in addition because the maturation of technology, the bad situation of the chip generation seam of BGA encapsulation was far below the past, and the situation of simply omitting this inspection item.

Well imagine, use visual examination or do not check, all can't promote the qualification rate that motherboard is produced effectively.Therefore, in order significantly to promote the purpose of motherboard production qualification rate, corresponding requisite measure should be subjected to considering and pay attention to.

The utility model content

In view of this, the main technical problems to be solved in the utility model provides a kind of host board testing tool, and whether the gauger can be fast by some shirtsleeve operations and positively predicted bga chip and have the bad situation of rosin joint or seam to take place.

In order to achieve the above object, the utility model provides a kind of host board testing tool, is used to test a computing machine motherboard that has memory module slot and bga chip at least, it is characterized in that comprising: a substrate; One working power is located on this substrate, and an operating voltage can be provided; Some stitch also are located on this substrate, and between each stitch suitable spacing are arranged; Some pins are located at a side of this substrate spaced reciprocally, can correspondingly insert this memory module slot, and the equal correspondence of each pin is connected to described stitch, and each stitch that is connected with described pin all is electrically connected with this memory module slot formation.

In the such scheme, be characterized in that this working power comprises at least: a power supply input side can connect an external power source; One operating voltage output terminal is exported a suitable operating voltage; An and earth terminal.

In the such scheme, be characterized in that this power supply input side is provided with a connector, is connected with this external power source.

In the such scheme, be characterized in that this external power source is the ATX power supply.

As from the foregoing, advantage of the present utility model is: people only need the pin with this host board testing tool to be inserted in memory module slot on the computer main frame panel, bga chip on this stitch and this computer main frame panel is constituted be electrically connected.By simple wiring step, can utilize the probe of measuring ammeter to visit one by one and touch this stitch again, and observe the electric current variation of measuring on the reometer, whether be welded on this computer main frame panel really to judge this bga chip; Operating process easily and fast considerably, and the qualification rate of computer main frame panel production also significantly improves whereby.

Description of drawings

Fig. 1 is the utility model preferred embodiment and behaviour in service reference diagram thereof.

Fig. 2 is the circuit diagram under the behaviour in service of Fig. 1.

Embodiment

In explanation subsequently, to lift a preferred embodiment to further specify the utility model, the personage who is familiar with this technology can be understood, whether any bga chip is welded in the detection on the computer main frame panel really, can effectively be improved by the utility model.

Computing machine among Fig. 1 is targets to be measured with motherboard 10, and a measurement instrument 20 is as the usefulness of measurement, and one utilize the utility model and the host board testing tool 30 implemented, can be used to assist the carrying out of measuring operation.Wherein, this motherboard 10 comprises at least one memory module slot 11, is connected in the bga chip 12 of this memory module slot 11 and other relevant circuit (because of not having direct relation with this case, so not shown).And this measurement instrument 20 can be all ammeters to current gear (avometer), and this measurement instrument 20 has an anodal probe 21 and a negative pole probe 22.When the memory module slot 11 that makes this host board testing tool 30 with this motherboard 10 suitably constitute be electrically connected after, can utilize the positive and

negative electrode probe

21 and 22 of this measurement instrument 20 to survey this host board testing tool 30, and the current values of observing on this measurement instrument 20 changes, with the bga chip 12 of judging this motherboard 10 and the line conditions between this memory module slot 11, particularly, can judge at least whether this bga chip 12 is welding really in this motherboard 10.In brief, the fundamental purpose that this host board testing tool 30 exists is to be convenient for people to measure, judge whether this bga chip 12 is welding really on this motherboard 10, to improve the qualification rate that computer main frame panel is produced.

In explanation subsequently, this bga chip 12 is an example with north bridge chips (or integrative chip core assembly sheet), and this host board testing tool 30 comprises:

One substrate 31.

One working power 32 is located on this substrate 31, comprises that at least a power supply input side 321 is to connect an external power source 40, an operating voltage output terminal 322 to export a suitable operating voltage and an earth terminal 323.In the present embodiment, the circuit design of this working power 32, can utilize the connector of a 20PIN to connect ATX power supply (ATX POWER SUPPLY also is an external power source 40) importing a 5V voltage, and become test to go up required operating voltage 1.5V this 5V voltage transitions.That is to say that the voltage supply of this 1.5V promptly is the operating voltage of whole host board testing tool 30.

Some stitch 33 also are located on this substrate 31 and are touched for spy, and are separated with suitable spacing in order to test operation between between each stitch 33.

Some pins 34 are located at a side of this substrate 31, with this memory module slot 11 of relative insertion.Wherein, this pin 34 is " golden fingers " that are commonly called as, and all corresponding stitch 33 that connects of each pin 34, makes each stitch 33 constitute with this memory module slot 11 and is electrically connected.Furthermore, because this bga chip 12 is wired to this memory module slot 11, and this pin 34 inserts this memory module slot 11, therefore, each stitch 33 that connects each pin 34 can be considered as the extension of " part " splicing ear (tin ball) of this bga chip 12, alleged herein " part " is meant that this bga chip 12 need be electrically connected to the splicing ear of this memory module slot 11.

After this host board testing tool 30 is inserted in this memory module slot 11, promptly tentatively finish being electrically connected of each stitch 33 and this bga chip 12.Then, can make DDR Vcc contact 13 on this motherboard 10 be short-circuited to the earth point 14 of this motherboard 10, then, make this earth point 14 be online to the operating voltage output terminal 322 of the working power 32 of this host board testing tool 30 again, promptly finish being electrically connected of this host board testing tool 30 and this motherboard 10.At last, the negative pole probe 22 that will measure ammeter 20 again is connected and fixed on the earth terminal 323 of this working power 32, and the anodal probe 21 that utilizes this measurement ammeter 20, visits one by one and touches this stitch 33, and observe the variation situation of measuring the current value on the ammeter 20.

Shown in Figure 2 is that this positive pole probe 21 is visited and touched when a certain stitch 33 ', at the circuit diagram of this stitch 33 '.Can find out significantly that from figure the electric current that this working power 32 is supplied is divided into two paths to flow to this stitch 33 ', wherein the current i 1 in a path be through this DDR Vcc contact 13 ,-draw high (PULL HIGH) resistance A, this stitch 33 '.The current i 2 in another path then enters this bga chip 12 inside, protection diode 121, this stitch 33 ' of bga chip 12 inside of flowing through at least, and this current i 1 and i2 this stitch 33 ' locate the interflow for i3 through this positive pole probe 21 to this measurement ammeter 20.Based on such circuit relationships, when the splicing ear " not " to bga chip 12 that should stitch 33 ' was welded on this motherboard 10 really, the path that i2 flows through was an open-circuit condition, and 20 in this measurement ammeter can be measured i1.And when the splicing ear " " to bga chip 12 that should stitch 33 ' is welded on this motherboard 10 really open-circuit condition, then this measurement ammeter 20 will be measured the electric current of i1+i2=i3.

By the described mode of leading portion, whether the gauger can judge this bga chip 12 easily and not be welded in really on this motherboard 10 as long as judge the size of the current value of being measured.In case discover the situation of seam is really arranged not, can carry out corresponding maintenance (for example rewelding), so, can effectively promote the qualification rate that computer main frame panel is produced.

Contrast in above-mentioned known metering system, the utility model can provide a kind of host board testing tool, whether it can make the gauger can be fast by some shirtsleeve operations and positively predict bga chip and have the bad situation of rosin joint or seam to take place, and has practical improvement so as to significantly improving the qualification rate in the computer main frame panel production.

The above only is a preferred embodiment of the present utility model, when can not with the scope implemented of qualification the utility model, promptly the equalization of doing according to the utility model generally changes and modifies, and all should still belong to the scope of the utility model patent protection.

Claims

1, a kind of host board testing tool is used to test a computing machine motherboard that has memory module slot and bga chip at least, it is characterized in that comprising:

One substrate;

One working power is located on this substrate, and an operating voltage can be provided;

Some stitch are located on this substrate, and between each stitch suitable spacing are arranged;

Some pins are located at a side of this substrate spaced reciprocally, can correspondingly insert this memory module slot, and the equal correspondence of each pin is connected to described stitch, and each stitch that is connected with described pin all is electrically connected with this memory module slot formation.

2, host board testing tool as claimed in claim 1 is characterized in that this working power comprises at least:

One power supply input side can connect an external power source;

One operating voltage output terminal is exported a suitable operating voltage; And

One earth terminal.

3, host board testing tool as claimed in claim 2 is characterized in that this power supply input side is provided with a connector and is connected with this external power source.

4,, it is characterized in that this external power source is the ATX power supply as claim 2 or 3 described host board testing tools.