CN2558056Y - Stacked ceramic capacitor with mechanical buffer layer - Google Patents
Stacked ceramic capacitor with mechanical buffer layer Download PDFInfo
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- CN2558056Y CN2558056Y CN 02237025 CN02237025U CN2558056Y CN 2558056 Y CN2558056 Y CN 2558056Y CN 02237025 CN02237025 CN 02237025 CN 02237025 U CN02237025 U CN 02237025U CN 2558056 Y CN2558056 Y CN 2558056Y
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- mechanical damping
- capacitor
- damping layer
- ceramic capacitor
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Abstract
Disclosed is a multilayer ceramic capacitor with a mechanical buffer layer, comprising a stacking body constructed by crossly stacking a ceramic layer and inner electrodes and two outer electrodes arranged on both ends of the stacking body. The outer electrodes comprises an electrode layer, a buffer layer with high ductility, a protective layer and a bonding layer, ensuring the capacitor to have high resistibility towards the instant destructive mechanical stress and longtime outer mechanical stress.
Description
(1) technical field
The utility model relates to a kind of monolithic ceramic capacitor, particularly relates to a kind of monolithic ceramic capacitor with mechanical damping layer.
(2) background technology
A kind of existing monolithic ceramic capacitor 1 shown in Figure 1.This monolithic ceramic capacitor 1 comprises the outer electrode 12 that a stacked body 11 and two is positioned at the both ends of stacked body 11.Stacked body 11 is to be that the ceramic layer 111 of ceramic dielectric matter and six layers of internal electrode 112 that is metallic conductor pile up alternately and form by seven layers.And each is one that connects respectively in two outer electrodes 12 to two adjacent internal electrodes 112.And each outer electrode 12 is three-deckers, are silver electrode layers near the electrode layer 121 of this stacked body 11 wherein, in order to serial connection internal electrode 112 at interval forming capacitor 1 in parallel, and the second layer 122 in the ceramic layer 111 of being responsible for binding stacked body simultaneously and the outer electrode 12.Then, protective layer 122 is to be stacked on the electrode layer 121 and is nickel metal layer, is subjected to the scolding tin corrode in order to avoid electrode layer 121.Thereafter, the conductive layer 123 that is positioned at outermost (just on protective layer 122) be a soldering-tin layer and in order to the scolding tin welding of electronic component such as circuit board.So, this capacitor 1 can connect with electronic component by two outer electrodes 12.
Yet capacitor 1 is in real process of assembling, and on circuit board, the circuit board that capacitor is installed continues situations such as other members and circuit board flexural deformation are installed, and causes capacitor 1 can suffer exterior mechanical stress such as capacitor 1 mounted on surface.But because the exterior mechanical stress that existing capacitor 1 can bear is limited, for example produce tensile stress at the outer electrode 12 of capacitor 1 because of circuit board flexural deformation, its tensile stress can reach 30～70 newton (N), feasible externally electrode 12 produces micro-crack with the contact of stacked body 11, and production reliability is descended.In addition, afore-mentioned takes place after, circuit board still may continue to assemble other elements, easily concentrate on outer electrode 12 by the mechanical stress that circuit board applied this moment, can cause destructive crack growth, cause capacitance to descend, and can't normally use, also cause simultaneously the voltage-resistent characteristic decay easily, and then component life is shortened.
Therefore, if can make the higher mechanical stress of capacitor ability, the probability that can effectively avoid foregoing problems to take place, and then improve the reliability of product and the life-span of prolongation product.And since mechanical stress concentrate through outer electrode 12 easily and force in the capacitor end points, so this case creator thinks to reach if can make outer electrode 12 have high ductibility, the effective exterior mechanical stress between decentralized capacitance device 1 and circuit board, and then can significantly reduce micro-crack in the real probability that produces in the industry pretended.
(3) utility model content
A purpose of the present utility model is to provide a kind of monolithic ceramic capacitor with mechanical damping layer that reaches the mechanical stress that effective increase can bear.
Another purpose of the present utility model is to provide a kind of monolithic ceramic capacitor with mechanical damping layer that improves the production reliability effect that reaches.
A purpose more of the present utility model is to provide a kind of monolithic ceramic capacitor with mechanical damping layer that prolongs the life of product effect that reaches.
Another purpose of the present utility model is to provide a kind of and reaches effective reduction micro-crack in the real monolithic ceramic capacitor with mechanical damping layer of pretending the probability of generation in the industry.
Above-mentioned purpose of the present utility model is achieved in that the monolithic ceramic capacitor with mechanical damping layer comprises one and has and intersect at least three ceramic layers pile up and the stacked body and two of at least two internal electrodes and lay respectively at the outer electrode at the both ends of this stacked body, wherein said each outer electrode has: an electrode layer is to be positioned on the end of corresponding described stacked body; One mechanical damping layer is to be positioned on the described electrode layer and to have high ductibility and conductivity; One protective layer is to be positioned on the described mechanical damping layer and in order to protect this electrode layer; And a conductive layer, be to be positioned on the described protective layer and in good time to connect with an electronic component.
Effect of the present utility model: when the outer electrode of this capacitor was exerted pressure by external force, described mechanical damping layer can effectively disperse mechanical stress, with the damage of effective this capacitor of prevention.
For further specifying above-mentioned purpose of the present utility model, design feature and effect, the utility model is described in detail below with reference to accompanying drawing.
(4) description of drawings
Fig. 1 is a kind of sectional side view of existing monolithic ceramic capacitor.
Fig. 2 is the sectional side view of preferred embodiment of the present utility model.
Fig. 3 is the schematic diagram that capacitor is assembled in a circuit board.
Fig. 4 is a schematic diagram of Fig. 3 being made stress test.
Fig. 5 is stress value of applying and application time figure.
Fig. 6 is capacitance and the time chart of an embodiment of the present utility model, the about 150 μ m of the outer electrode thickness of this capacitor.
Fig. 7 is the capacitance and the time chart of existing capacitor, the about 150 μ m of the outer electrode thickness of this capacitor.
(5) embodiment
Because exterior mechanical stress can concentrate on the stacked body of capacitor and the contact between outer electrode, thus the improvement of this case focus on increasing by a mechanical damping layer in the structure of outer electrode so that capacitor has preferable resistance for mechanical stress.As shown in Figure 2, be a preferred embodiment schematic diagram of the present utility model.The capacitor 2 of this embodiment comprises a stacked body 3 and two outer electrodes 4.
This stacked body 3 comprises at least three ceramic layers 31 and at least two internal electrodes 32,32 ' that intersection is piled up.Each ceramic layer 31 of present embodiment is to be a rectangle lamellar body approximately with internal electrode 32,32 ', form the just like stacked body 3 of cuboid to pile up, and comprising seven layers of ceramic layer 31, this stacked body 3 intersects the internal electrode 32,32 ' that is stacked in 31 of these ceramic layers with six layers, wherein two adjacent internal electrodes 32 are that 34,33 horizontal expansions one do not contact to the other end 34,33 suitable distance towards the other end by the different end of stacked body 3 33,34 respectively, and causing three internal electrodes 32 is that to be connected in end 33 be to be connected in end 34 with remaining three electrodes 32 '.In addition, ceramic layer 31 is made of ceramic dielectric material, and internal electrode 32,32 ' is made of the metal material such as silver-colored palladium, and so by the obstruct of ceramic layer 31, making can mutual conduction between adjacent internal electrode 32,32 '.
Two outer electrodes 4 be lay respectively on the both ends 33,34 of this stacked body 3 and with so that internal electrode 32,32 ' can connect to the electronic component such as circuit board, substrate.All outer electrodes 4 are four-layer structure in the present embodiment, are an electrode layer 41, a mechanical damping layer 42, a protective layer 43 and a conductive layer 44 from inside to outside in regular turn.
The electrode layer 41 of present embodiment is near the silver electrode layer of stacked body 3 and be positioned at the end 33,34 of stacked body 3 in four layers.This electrode layer 41 makes it become capacitor in parallel in order to serial connection internal electrode 32,32 '.This electrode layer 41 also has the effect of sticking together outer electrode 4 and stacked body 3.When making the capacitor 1 of present embodiment, be after can utilizing the silver machine that attaches to attach silver in the end 33 of stacked body 3, to utilize far infrared continous way drying oven to dry, it is attached to utilize silver reducing furnace to burn again at last, to form electrode layer 41.
This mechanical damping layer 42 is to be positioned on the electrode layer 41 and tool high ductibility and good electrical conductivity.In the present embodiment, the ductility of mechanical damping layer 42 is tens of times of electrode layer 41 and is the composite of metallic conductor and organic adhesive agent, its conductivity is about 0.07 Ω/unit are, and its ductility is about 1～3%, and the ratio of metallic conductor is about 60～70% and can be gold or silver or the like with its material, and the intensity 10～20Mpa (Newton/meter after the 42 dry sclerosis of this mechanical damping layer
2) with thickness be at 50～500 μ m.When the mechanical damping layer 42 of present embodiment is made, utilize the machine of attaching to attach the material of mechanical damping layer earlier, and be to be good to cover electrode layer when attaching mechanical damping layer 42, then utilize oven dry of far infrared continuous dryer and sclerosis, to form mechanical damping layer 42.
Protective layer 43 is to be positioned on the mechanical damping layer 42 and in order to guard electrode layer 41 to be subjected to the scolding tin corrode to avoid electrode layer 41.The material of this routine protective layer 43 is chemical nickel plating and can utilizes full-automatic barrel electroplating machine to form.
Conductive layer 44 is to be positioned on the protective layer 43 also to use so that capacitor 2 can connect to the electronic component such as circuit board, substrate.Conductive layer 44 materials of present embodiment are scolding tin and can utilize full-automatic barrel electroplating machine to form.
It should be noted that aforementioned each layer 41-44 formation technology for outer electrode 4 just discloses for explanation, knows all that and have the knack of this operator the formation technology of each layer is not limited to the explanation of this paper.
According to preceding described, be different from the three-decker of the outer electrode of existing capacitor, the outer electrode 4 of the utility model capacitor 2 is in electrode layer 41 and 43 four-layer structures that increase mechanical damping layer 42 of protective layer.So, when being assembled in electronic component capacitor 2 when being subjected to exterior mechanical stress, mechanical damping layer 42 can produce elasticity or plastic deformation, and then effectively be dispersed in the exterior mechanical stress between capacitor 2 and electronic component and keep and connect function, and then significantly reduce micro-crack in the real probability that produces in the industry pretended.In addition, compare with existing capacitor, really outside mechanical stress is had preferable resistance, describe by the experiment of actual operation hereinafter again for the capacitor 2 that proves present embodiment.
General capacitor is after it is assembled in electronic component such as circuit board, substrate; because still need carrying out follow-up reality, electronic component pretends industry; for example circuit board need be assembled other electronic components, circuit board flap (just a large scale circuit plate being divided into several undersized circuit boards) or the like situation, and regular meeting makes capacitor suffer exterior mechanical stress in this pretends already in fact.And according to capacitor specific characteristics, along with the increase or the external stress application time of exterior mechanical stress value increases progressively, the capacitance of capacitor can change, and once surpass and can bear exterior mechanical stress, then can produce micro-crack and capacitance is reduced significantly.So, as Fig. 3, this experiment is that capacitor 2 is attached on the surface 511 of printed circuit board (PCB) (PCB) 5 after reflow furnace treatment reason, and the length of this printed circuit board (PCB) 51 is that 100mm, the wide 40mm of being and thickness t are 1.53mm, and corresponding outer electrode 4 positions are provided with conductive path 512 on the surface 511 of printed circuit board (PCB) 51, so that conductive path 512 is connected to outer electrode 4.Then, as Fig. 4, printed circuit board (PCB) 51 is folded in the anchor clamps 52, simultaneously, place a precision capacity tester table (C/R Meter) 53 printed circuit board (PCB) 51 to connect on the surface 511 of capacitor 2 and make it connect two outer electrodes 4 of capacitors 2, and installed a bending stress and apply machine 53 in the meta of putting on another surface 513 of printed circuit board (PCB) 51 through conductive path 511.And as Fig. 5, the bending stress in this experiment applies machine 53 transport ratios, and to be designed to bending displacement in per 5 minutes be 0.5mm (0.5mm/5min) with increased by 5 newton (5N/5min) every 5 minutes, and so bending stress and time curve are to be increase progressively stepped.
Then, utilize test mode as Fig. 4, respectively outside thickness of electrode is respectively the existing capacitor sample of 40,60,80,150 μ m and this case capacitor 2 samples that outer electrode 4 thickness are 80,150,300 μ m are measured, and for real data more accurate, so it is aforementioned various sample comprises 30, then average to measure sampling.So, average data of measuring such as following table one:
Table one
| Embodiment | The outer electrode structure | Outer electrode thickness | Crooked application of force mean value (N) | Counter-bending time average (Min) |
| Existing one | Do not use the mechanical damping layer | The about 40 μ m of thickness | 28.5 | 20.0 |
| Existing two | Do not use the mechanical damping layer | The about 60 μ m of thickness | 40.0 | 32.1 |
| Existing three | Do not use the mechanical damping layer | The about 80 μ m of thickness | 49.0 | 41.3 |
| Existing four | Do not use the mechanical damping layer | The about 150 μ m of thickness | 45.5 | 107.1 |
| Embodiment one | Use the mechanical damping layer | The about 80 μ m of thickness | 135.5 | 127.8 |
| Embodiment two | Use the mechanical damping layer | The about 300 μ m of thickness | 140.0 | 142.7 |
| Embodiment three | Use the mechanical damping layer | The about 150 μ m of thickness | 166.0 | 158.5 |
Crooked application of force mean value is represented the maximum exterior mechanical stress that capacitor can bear in the table one, and the crooked application of force value when just the capacitance of capacitor acutely descends then is counter-bending time average with the time of this moment.So, under similar thickness condition, for example relatively existing three with embodiment one and relatively existing four with embodiment three, then the capacitor 2 of this case with mechanical damping layer 42 all has the characteristic of the preferable anti-bent plate application of force, and existing capacitor all can't bear the higher crooked application of force.Specifically, with regard to crooked application of force this case capacitor 2.9～3.6 times for existing capacitor, and with regard to the crooked application of force time, this case is existing 1.5～3 times.
In addition, corresponding to Fig. 6, be the capacitance and the curve chart of application of force time of the capacitor 2 (the about 150 μ m of outer electrode thickness just) of the embodiment three of this case.By among the figure as can be known, can increase and slightly descend with the crooked application of force though have the capacitance of the capacitor 2 of mechanical damping layer 42, yet when not surpassing the mean value of flexural loading, obviously as can be known, the increase capacitance along with the time under same pressure can go up gradually.But by describing Fig. 7 of existing four as can be known, the capacitance of existing capacitor increases with the crooked application of force and the application of force time increases and descends significantly, and can obviously compare the capacitor 2 of the endurance of bearing mechanical stress of existing capacitor far below this case.Therefore, but the capacitor 2 of inference this case can increase its capacitance that descends because of the application of force in time and recovers because of the effect of mechanical resilient coating 42 is arranged.The capacitor 2 of provable this case like this is compared to existing capacitor, because of the effect of mechanical damping layer 42 has better repellence for exterior mechanical stress really.
Described before combining, when capacitor 2 of the present utility model is subjected to exterior mechanical stress in pretending already in fact, because of the mechanical damping layer 42 of outer electrode 4 has high ductibility, and can produce elasticity or plastic deformation, and then effectively disperse the exterior mechanical stress of 2 in electronic component and capacitor and make stress can not concentrate on the end 33 of stacked body 3,34, and then can effectively improve the resistance of 2 pairs of mechanical stresses of capacitor and significantly reduce the probability that micro-crack produces, so that capacitor 2 can keep keeping due capacitance characteristic and proof voltage level for a long time, and then reach the effect that prolongs life of product.
Certainly, those of ordinary skill in the art will be appreciated that, above embodiment is used for illustrating the utility model, and be not to be used as qualification of the present utility model, as long as in connotation scope of the present utility model, all will drop in the scope of the utility model claims variation, the modification of the above embodiment.
Claims (8)
1. monolithic ceramic capacitor with mechanical damping layer, comprise one and have and intersect at least three ceramic layers pile up and the stacked body and two of at least two internal electrodes and lay respectively at the outer electrode at the both ends of this stacked body, it is characterized in that described each outer electrode has:
One electrode layer is to be positioned on the end of corresponding described stacked body;
One mechanical damping layer is to be positioned on the described electrode layer and to have high ductibility and conductivity;
One protective layer is to be positioned on the described mechanical damping layer and in order to protect this electrode layer; And
One conductive layer is to be positioned on the described protective layer and in good time to connect with an electronic component.
2. the monolithic ceramic capacitor with mechanical damping layer as claimed in claim 1 is characterized in that described electrode layer is a silver layer.
3. the monolithic ceramic capacitor with mechanical damping layer as claimed in claim 1 is characterized in that described protective layer is a nickel dam.
4. the monolithic ceramic capacitor with mechanical damping layer as claimed in claim 1 is characterized in that described conductive layer is a soldering-tin layer.
5. the monolithic ceramic capacitor with mechanical damping layer as claimed in claim 1 is characterized in that described mechanical damping layer is the composite material of metallic conductor and organic adhesive agent.
6. the monolithic ceramic capacitor with mechanical damping layer as claimed in claim 5 is characterized in that described metallic conductor is a silver.
7. the monolithic ceramic capacitor with mechanical damping layer as claimed in claim 1, the thickness range that it is characterized in that described mechanical damping layer are 50 microns to 500 microns.
8. the monolithic ceramic capacitor with mechanical damping layer as claimed in claim 1 is characterized in that the ductility about 1～3% of described mechanical damping layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02237025 CN2558056Y (en) | 2002-06-03 | 2002-06-03 | Stacked ceramic capacitor with mechanical buffer layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02237025 CN2558056Y (en) | 2002-06-03 | 2002-06-03 | Stacked ceramic capacitor with mechanical buffer layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2558056Y true CN2558056Y (en) | 2003-06-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02237025 Expired - Lifetime CN2558056Y (en) | 2002-06-03 | 2002-06-03 | Stacked ceramic capacitor with mechanical buffer layer |
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| Country | Link |
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| CN (1) | CN2558056Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102737833A (en) * | 2011-04-07 | 2012-10-17 | 徐孝华 | Ceramic capacitor with shock absorption and crack control functions |
| CN103165281A (en) * | 2011-12-16 | 2013-06-19 | 钜永真空科技股份有限公司 | Structure of passive device |
| CN106158377A (en) * | 2015-03-25 | 2016-11-23 | 禾伸堂企业股份有限公司 | The manufacture method of laminated ceramic electronic building brick and device thereof |
| CN108597868A (en) * | 2013-02-20 | 2018-09-28 | 三星电机株式会社 | The method for preparing laminated ceramic electronic component |
-
2002
- 2002-06-03 CN CN 02237025 patent/CN2558056Y/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102737833A (en) * | 2011-04-07 | 2012-10-17 | 徐孝华 | Ceramic capacitor with shock absorption and crack control functions |
| CN103165281A (en) * | 2011-12-16 | 2013-06-19 | 钜永真空科技股份有限公司 | Structure of passive device |
| CN103165281B (en) * | 2011-12-16 | 2015-10-28 | 钜永真空科技股份有限公司 | Structure of passive device |
| CN108597868A (en) * | 2013-02-20 | 2018-09-28 | 三星电机株式会社 | The method for preparing laminated ceramic electronic component |
| CN106158377A (en) * | 2015-03-25 | 2016-11-23 | 禾伸堂企业股份有限公司 | The manufacture method of laminated ceramic electronic building brick and device thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20120603 Granted publication date: 20030625 |