CN2552164Y - Ball check array type IC element testing assembly - Google Patents
Ball check array type IC element testing assembly Download PDFInfo
- Publication number
- CN2552164Y CN2552164Y CN 02236502 CN02236502U CN2552164Y CN 2552164 Y CN2552164 Y CN 2552164Y CN 02236502 CN02236502 CN 02236502 CN 02236502 U CN02236502 U CN 02236502U CN 2552164 Y CN2552164 Y CN 2552164Y
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- China
- Prior art keywords
- integrated circuit
- test
- array type
- circuit component
- grid array
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- Expired - Lifetime
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- Measuring Leads Or Probes (AREA)
Abstract
The utility model provides a ball check array type IC element testing assembly, including a detecting circuit board and a detecting socket, wherein, the detecting socket includes a plurality of detachable fixing components capable of fixing the detecting socket on the detecting circuit board in a way allowing disassembly and installation; a socket body can receive an integrated circuit component awaiting to be tested; an upper cover is articulated on one end of the socket body; a plurality of conductive probes are arranged on the socket body. The upper cover is provided with an upper fastening component which is buttoned with a lower fastening component on the socket body, thereby the integrated circuit component awaiting to be tested can be fixed on the socket body, and the connecting pins on the integrated circuit component awaiting to be tested are connected with relative conductive probes tightly.
Description
Technical field
The utility model relates to a kind of test suite of integrated circuit component, particularly a kind of test suite of sphere grid array type integrated circuit component.
Background technology
Generally speaking, sphere grid array type integrated circuit (BGA IC) element after finishing encapsulation, all can be on tester table advanced units stage test (component level test), to filter out defective products, guarantee the shipment quality.But this single element test can not be guaranteed to be complementary and operate as normal with the other parts of system after this element is installed on the computer system.In each computer manufacturer for the requirement of quality more and more higher today, can match and operate as normal after being installed on the computer system in order to ensure integrated circuit component, so element manufacturer after the test of element stage, also can carry out the test of system's stage.Whether so-called system's stage test promptly is that this sphere grid array type integrated circuit component is installed in the computer system, normal to test its function; Because this computer system is to use the specialized designs for test except the connector of testing with circuit board, other parts are just the same with general computer system, therefore can guarantee to mate and normal operation with computer system by the integrated circuit component after this computer system test.
As shown in Figure 4, the test suite of known sphere grid array type integrated circuit component comprises a jack body 100 and a test circuit board 200.And this jack body comprises an integrated circuit component bearing groove 101 and a plurality of metal pin 102.Wherein, this integrated circuit component bearing groove 101 is used for accepting to-be-measured integrated circuit element (not shown); And this metal pin 102 is directly welded in test with on the circuit board 200, and so that to-be-measured integrated circuit element and this test communication channel with 200 of circuit boards to be provided, this jack body 100 is to be fixed in this test with on the circuit board 200.
Yet, because known jack body 100 is to be directly welded in to test with on the circuit board 200,, or arbitrary metal pin 102 and test circuit board 200 loose contacts are arranged if this socket breaks down, then this socket and test all must be scrapped with circuit board 200, therefore can cause the waste of resource.Moreover, when desire is surveyed an integrated circuit component, must this integrated circuit component is pressed into and be fixed in this integrated circuit component bearing groove 101 with hand, and the pin of this integrated circuit component can be sticked on this metal pin 102, so operate in and easily cause finger injuries when carrying out substantive test.
As from the foregoing, the test suite of above-mentioned known sphere grid array type integrated circuit component on reality is used, obviously has inconvenience and exists with defective, and can be improved.The above-mentioned defective of the utility model people thoughts through concentrating on studies and cooperating the utilization of scientific principle, has proposed a kind of reasonable in design and can effectively improve the utility model of above-mentioned defective.
The utility model content
The technical problems to be solved in the utility model provides a kind of test jack of sphere grid array type integrated circuit component, this test jack can repeat dismounting on testing with circuit board, and must this integrated circuit component can be pressed into this integrated circuit component bearing groove, point vulnerable problem during with the solution manual testing with hand.
In order to achieve the above object, the utility model provides a kind of test jack of sphere grid array type integrated circuit component, comprise a jack body, can accept a to-be-measured integrated circuit element, it is characterized in that: also comprise a loam cake, be articulated in an end of described jack body, and can fasten with described jack body, this loam cake presses under buckling state on the described to-be-measured integrated circuit element; At least one removable formula retaining element utilizes this removable formula retaining element described jack body can be fixed in a test with on the circuit board, also it can be removed from this circuit board; A plurality of conducting probes are located on the described jack body, are electrically connected on described test with the circuit of circuit board and the pin of described to-be-measured integrated circuit element, with the passage that provides described test to be electrically connected with circuit board and to-be-measured integrated circuit interelement.
In the such scheme, its characteristics are that described jack body is provided with at least one perforation, cooperate with described removable formula retaining element to wear, and this removable formula retaining element can be bolt.
In the such scheme, its characteristics are that described jack body is provided with an integrated circuit component bearing groove, be arranged at described a plurality of conducting probes around.
In the such scheme, its characteristics are that described a plurality of probe is an elastic probe.
In the such scheme, its characteristics are that described jack body is provided with fastener components, described loam cake is provided with corresponding to this time fastener components position that fastener components cooperates snapping with this time fastener components on one, need not use hand whereby, the to-be-measured integrated circuit element can be fixed on this jack body, and make the pin on this to-be-measured integrated circuit element be engaged in the conducting probe corresponding closely with it.
In the such scheme, its characteristics are to be covered with an opening or a plurality of opening on described.
As from the foregoing, the test jack of sphere grid array type integrated circuit component of the present utility model has following advantage:
(1) dismounting easily makes test jack and test can keep in repair respectively or change with circuit board, so can reduce the waste of resource on testing with circuit board.
(2) can change the to-be-measured integrated circuit element easily, the user must not be pressed into described integrated circuit component in the integrated circuit component bearing groove with hand, thereby can avoid finger injuries.
Another technical problem to be solved in the utility model provides a kind of test suite of sphere grid array type integrated circuit component, test jack wherein can repeat dismounting in this test with circuit board on so that test jack and the test can keep in repair respectively and change with circuit board.
In order to achieve the above object, the utility model provides a kind of test suite of sphere grid array type integrated circuit component, comprise that one tests with a circuit board and a test jack, it is characterized in that: described test jack comprises at least one removable formula retaining element, so that described test jack is connected and fixed on described test with on the circuit board;
In the above-mentioned design, the test jack that various scheme limited that described test jack can adopt the utility model before to provide is provided its characteristics.
In the above-mentioned design, its characteristics are that described test is provided with and the mutual corresponding a plurality of conductive junction points of described a plurality of probe locations with circuit board, can establish a Gold plated Layer on these a plurality of conductive junction points, form by the chemistry gold that is applied on described a plurality of conductive junction point, the preferred thickness of described Gold plated Layer is 5 μ～50 μ inches, these a plurality of conductive junction points also can be coated with a kind of noble metal, and this noble metal can be silver or platinum.
In the above-mentioned design, its characteristics are that described test is provided with coupling hole corresponding mutually with the punch position of described test jack and that mate with described removable formula retaining element with circuit board.
As from the foregoing, the test suite of sphere grid array type integrated circuit component of the present utility model also has following advantage except that all advantages with aforementioned test jack:
(1) gold-plated test circuit board life-span prolongation, the stability of making increases, and then reduces cost.
(2) test still can be installed integrated circuit component by general fashion with circuit board after test jack removes.
Description of drawings
Fig. 1 is the stereogram of the utility model embodiment.
Fig. 2 is the exploded view of the utility model embodiment.
Fig. 3 is the test schematic diagram of the utility model embodiment.
Fig. 4 is the stereogram of known test jack
Embodiment
For further understanding the utility model is to reach technological means, characteristics and the effect that predetermined purpose is taked, and described in detail below in conjunction with specific embodiments and the drawings, yet accompanying drawing is not to be used for the utility model is limited.
As Fig. 1, Fig. 2 and shown in Figure 3, the test suite of the utility model sphere grid array type integrated circuit component, comprise test a circuit board 50 and a test jack 1, and this test jack 1 has a plurality of removable formula retaining elements 40, makes it can be fixed in this test with on circuit board 50 or can be not impaired with circuit board 50 dismountings from this test.
Wherein, this test jack 1 also comprises a jack body 10, a plurality of conducting probe 20, reaches a loam cake 30.Wherein, this loam cake 30 is articulated in an end of this jack body 10, and it can be fixed in an integrated circuit component 60 on this jack body 10 when fastening.
And these a plurality of probes 20 are located on this jack body 10, so that the communication channel of 60 of test usefulness circuit board 50 and integrated circuit components to be provided.
Shown in Figure 1 is stereogram of the present utility model.Wherein, this jack body 10 has an integrated circuit component bearing groove 11, once fastener components 12, a plurality of perforation 13 and a hinge 14; This loam cake 30 has fastener components 32 on pair of openings 31 and; One side of this loam cake 30 is articulated in a side of jack body 10 with hinge 14.Wherein, the number of this opening 31 can be one or more.These a plurality of probes 20 are located in this integrated circuit component bearing groove 11, and these a plurality of retaining elements 40 are arranged in these a plurality of perforation 13, and jack body 10 is fixed in this test with on circuit board 50.
Can be interlocked with following fastener components 12 and should go up fastener components 32, so that having an end of last fastener components 32, loam cake 30 can be fixed on this jack body 10, and compress a to-be-measured integrated circuit element 60, this to-be-measured integrated circuit element 60 is fixed on this jack body 10, and makes the pin on this to-be-measured integrated circuit element 60 be engaged in its corresponding probe 20 closely.
Shown in Figure 2 is exploded view of the present utility model.This test is with having a plurality of conductive junction points 51 and a plurality of coupling hole 52 on the circuit board 50, these a plurality of retaining elements 40 are fixed in this test with on the circuit board 50 by coupling hole 52 with this jack body 10, these a plurality of retaining elements 40 can adopt bolt, and these a plurality of coupling holes 52 can be the screw that is complementary with these a plurality of retaining elements 40.
And these a plurality of conductive junction points 51 are corresponding with this a plurality of probe 20, make this test can be by the electric connection of these a plurality of conductive junction points 51 with this a plurality of probes 20 with circuit board 50, form the transmission electric signal or the path of power supply is provided.
Moreover, for the hardness that makes these a plurality of conductive junction points 51 strengthens, and make it have lower impedance rate of change, and can on these a plurality of conductive junction points 51, a Gold plated Layer (not shown) be set, this Gold plated Layer can be finished by smear chemical gold on these a plurality of conductive junction points 51.The preferred thickness of this Gold plated Layer is about 5 μ～50 μ inches.So, the stability in the time of not only can increasing high frequency, high temperature test also can improve life-span and the nonexpondable stability of test with circuit board 50.In another embodiment, gold-plated other noble metal (precious metal) that adopts of this layer, for example silver, platinum etc. reach aforementioned purpose.
Shown in Figure 3 is test schematic diagram of the present utility model.When desire is tested an integrated circuit component 60, must earlier this integrated circuit component 60 be placed this integrated circuit component bearing groove 11, pin on this integrated circuit component 60 is connected with pairing probe 20, should go up fastener components 32 then fastens with this time fastener components 12, need not go into hand, this integrated circuit component 60 is fixed on this jack body 10, and make the pin on this integrated circuit component 60 be engaged in its corresponding probe closely, make this integrated circuit component 60 can by these a plurality of probes 20 import into or outgoing signal and/or power supply to conductive junction point 51, and reach and this test with the purpose of circuit board 50 communications.
When implementing, these a plurality of probes 20 of the present utility model can be elastic probe (pogo pin), can stretch in response to suffered strength size, thereby improve the effect that contacts with the tin ball than mistake on the tin ball height of tolerable sphere grid array type integrated circuit, to improve the correctness of testing.
In the embodiment of Fig. 1 ~ shown in Figure 3, though test is to be example with a motherboard with circuit board 50, yet the utility model is not limited to use motherboard.For example, when tested integrated circuit component was used on the additional card (add-on card), test of the present utility model was this additional card with 50 of circuit boards.
The above only is the explanation and the accompanying drawing of the utility model preferred embodiment; feature of the present utility model is not limited thereto; anyly be familiar with this operator in field of the present utility model; can think easily and variation or modify all should be included within the protection range of the present utility model, therefore protection range of the present utility model should be as the criterion with claims.
Claims (10)
1, a kind of test suite of sphere grid array type integrated circuit component, comprise that one tests with a circuit board and a test jack, it is characterized in that: described test jack comprises a removable formula retaining element at least, and this removable formula retaining element is connected and fixed on described test with on the circuit board with described test jack.
2, the test suite of sphere grid array type integrated circuit component as claimed in claim 1 is characterized in that described test jack comprises:
One jack body can be accepted a to-be-measured integrated circuit element;
One loam cake is articulated in an end of described jack body, and can fastens with described jack body, and this loam cake presses under buckling state on the described to-be-measured integrated circuit element; And
A plurality of conducting probes are located on the described jack body, are electrically connected on described the test circuit of circuit board and the pin of described to-be-measured integrated circuit element.
3, the test suite of sphere grid array type integrated circuit component as claimed in claim 2 is characterized in that described jack body is provided with at least one perforation, and described removable formula retaining element can penetrate this perforation.
4, the test suite of sphere grid array type integrated circuit component as claimed in claim 3 is characterized in that described test is provided with coupling hole mutually corresponding with described punch position and that mate with described removable formula retaining element with circuit board.
5, the test suite of sphere grid array type integrated circuit component as claimed in claim 2 is characterized in that described test is provided with and the mutual corresponding a plurality of conductive junction points of described a plurality of probe locations with circuit board.
6, the test suite of sphere grid array type integrated circuit component as claimed in claim 5 is characterized in that described a plurality of conductive junction point is provided with a Gold plated Layer.
7, the test suite of sphere grid array type integrated circuit component as claimed in claim 6, the thickness that it is characterized in that described Gold plated Layer are 5 μ～50 μ inches.
8, the test suite of sphere grid array type integrated circuit component as claimed in claim 2 is characterized in that described a plurality of conducting probe is an elastic probe.
9, the test suite of sphere grid array type integrated circuit component as claimed in claim 2 is characterized in that being covered with an opening on described.
10, the test suite of sphere grid array type integrated circuit component as claimed in claim 2 is characterized in that being covered with a plurality of openings on described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02236502 CN2552164Y (en) | 2002-05-27 | 2002-05-27 | Ball check array type IC element testing assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02236502 CN2552164Y (en) | 2002-05-27 | 2002-05-27 | Ball check array type IC element testing assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2552164Y true CN2552164Y (en) | 2003-05-21 |
Family
ID=33710743
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02236502 Expired - Lifetime CN2552164Y (en) | 2002-05-27 | 2002-05-27 | Ball check array type IC element testing assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2552164Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100437130C (en) * | 2005-04-06 | 2008-11-26 | 华硕电脑股份有限公司 | Manufacture defect analysis system and detection method thereof |
| CN101236761B (en) * | 2007-01-30 | 2011-06-22 | 富士通株式会社 | Apparatus, method for protecting accommodated item such as cartridge |
-
2002
- 2002-05-27 CN CN 02236502 patent/CN2552164Y/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100437130C (en) * | 2005-04-06 | 2008-11-26 | 华硕电脑股份有限公司 | Manufacture defect analysis system and detection method thereof |
| CN101236761B (en) * | 2007-01-30 | 2011-06-22 | 富士通株式会社 | Apparatus, method for protecting accommodated item such as cartridge |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20120527 Granted publication date: 20030521 |