CN2541951Y - Fan-free radiator of CPU - Google Patents

Fan-free radiator of CPU Download PDF

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Publication number
CN2541951Y
CN2541951Y CN 02206374 CN02206374U CN2541951Y CN 2541951 Y CN2541951 Y CN 2541951Y CN 02206374 CN02206374 CN 02206374 CN 02206374 U CN02206374 U CN 02206374U CN 2541951 Y CN2541951 Y CN 2541951Y
Authority
CN
China
Prior art keywords
radiator
fan
processing unit
substrate
central processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 02206374
Other languages
Chinese (zh)
Inventor
李飞
高峥
皋占林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lenovo Beijing Ltd
Original Assignee
Lenovo Beijing Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lenovo Beijing Ltd filed Critical Lenovo Beijing Ltd
Priority to CN 02206374 priority Critical patent/CN2541951Y/en
Application granted granted Critical
Publication of CN2541951Y publication Critical patent/CN2541951Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to a radiator of a non-ventilated central processing unit, and comprises a basal plate and a plurality of fins which are fixedly arranged on the basal plate. The utility model is characterized in that the cross-section of the fin is taken in the rectangle shape, the height is 42 to 48 mm, and the transverse gap and the longitudinal gap of the fin are 4.5-5.5 mm. The radiator of the non-ventilated central processing unit of the utility model does not need the fan, thereby the occupying space in a cabinet is small and the production cost of the set can be lowered.

Description

The radiator of the central processing unit of no fan
[technical field]
The utility model relates to a kind of radiator of central processing unit of computer, refers to a kind of radiator that does not have the central processing unit of fan especially.
[background technology]
The radiating mode of the central processing unit (CPU) of computer employing at present, it all is the active heat removal mode, promptly radiator is set in the CPU top, again in the radiator top or the side fan is installed, such radiator is because have distinguished and admirable pressure by having certain radiating effect, and its shortcoming is that to take the cabinet inside space bigger.
[utility model content]
The purpose of this utility model provides a kind of radiator that does not have the central processing unit of fan, can not use fan, thereby the space that takies cabinet inside is less, and can reduces the production cost of complete machine.
The utility model provides a kind of radiator that does not have the central processing unit of fan, comprises substrate and is fixedly arranged on the fin that the majority on the substrate is arranged, and it is characterized in that:
This fin cross section is rectangular, and it highly is 42-48mm, and the lateral clearance of this fin and axial clearance are 4.5-5.5mm.
The radiator of the central processing unit of described no fan is characterized in that:
One side one of this substrate is extended an auxiliary substrate, and this auxiliary substrate and this substrate have a difference in height, also is provided with most fins of arranging on this auxiliary substrate.
The radiator of the central processing unit of no fan of the present utility model, heat radiation applicable to lower-powered mainboard, for example mainboard is provided with central processing unit about 11W and the north bridge chips about 3W, the utility model is not because of using fan, thereby the space that takies cabinet inside is less, and can reduce the quantity of parts, reduce the complete machine production cost.
The no fan radiator of central processing unit of the present utility model is through the design data that calorifics theory is derived and numerical simulation calculation obtains, and can get a desired effect through test.In the test at system comprise the no fan power supply of a mainboard and a power 50W, this mainboard comprises that a heating is the central processing unit about 11W, heating is the north bridge chips about 3W, the TC allowable limit value of the CPU that uses is 85 degree, with no fan radiator of the present utility model, ambient temperature is that the TC value of 36 CPU that record when spending is 76 degree, less than allowable limit value, thereby has realized the heat dissipation problem of the central processing unit of a no fan.
[description of drawings]
Fig. 1 is the perspective view of preferred embodiment of the present utility model.
Fig. 2 is the front view of preferred embodiment of the present utility model.
Fig. 3 is the vertical view of preferred embodiment of the present utility model.
[embodiment]
With reference to Fig. 1,2,3, the radiator of the central processing unit of no fan of the present utility model, comprise the substrate 10 that is attached on the central processing unit 1 and be fixedly arranged on the fin 20 that the majority on the substrate is arranged, the about 7mm of the thickness of this substrate, these fin 20 cross sections are rectangular, its height h can be 42-48mm, and height h is 45mm in present embodiment, and the lateral clearance d1 and the axial clearance d2 of this fin 20 can be 4.5-5.5mm.Lateral clearance d1 and axial clearance d2 are 5mm in present embodiment.
Fin 20 height can not be too high, and the too high heat of bottom that will cause can not shed in the mode of convection current, and stays on the radiator, causes heat not loose very soon in air, causes the radiator heat to continue to raise.Fin 20 height can not be too short, and too short meeting causes area of dissipation not enough.The lateral clearance d1 and the axial clearance d2 of this fin 20 are extremely important in utilizing heat loss through convection, and too little gap causes thermal current to produce turbulent flow in the bottom, looses less than in the air, and too big gap causes the minimizing of number of fins, also can cause the rising of CPU heat.Above-mentioned numerical value all is through computer simulation analysis, relatively obtains repeatedly.
An auxiliary substrate 30 is established in the one side one extension of this substrate 10, and this auxiliary substrate 30 has a difference in height k with this substrate 10, also is provided with most fins of arranging 31 on this auxiliary substrate 30.This auxiliary substrate 30 is the spaces that are used for utilizing as much as possible in the cabinet, enlarges area of dissipation.

Claims (2)

1, a kind of radiator that does not have the central processing unit of fan comprises substrate and is fixedly arranged on the fin that the majority on the substrate is arranged, and it is characterized in that:
This fin cross section is rectangular, and it highly is 42-48mm, and the lateral clearance of this fin and axial clearance are 4.5-5.5mm.
2, the radiator of the central processing unit of no fan as claimed in claim 1 is characterized in that: an auxiliary substrate is established in the side one extension of this substrate, and this auxiliary substrate and this substrate have a difference in height, also is provided with most fins of arranging on this auxiliary substrate.
CN 02206374 2002-03-05 2002-03-05 Fan-free radiator of CPU Expired - Fee Related CN2541951Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 02206374 CN2541951Y (en) 2002-03-05 2002-03-05 Fan-free radiator of CPU

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 02206374 CN2541951Y (en) 2002-03-05 2002-03-05 Fan-free radiator of CPU

Publications (1)

Publication Number Publication Date
CN2541951Y true CN2541951Y (en) 2003-03-26

Family

ID=33687746

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 02206374 Expired - Fee Related CN2541951Y (en) 2002-03-05 2002-03-05 Fan-free radiator of CPU

Country Status (1)

Country Link
CN (1) CN2541951Y (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1314111C (en) * 2003-07-01 2007-05-02 广达电脑股份有限公司 Functional module with built-in radiating fin
CN102184900A (en) * 2011-04-15 2011-09-14 太仓市兴港金属材料有限公司 Radiating fin

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1314111C (en) * 2003-07-01 2007-05-02 广达电脑股份有限公司 Functional module with built-in radiating fin
CN102184900A (en) * 2011-04-15 2011-09-14 太仓市兴港金属材料有限公司 Radiating fin

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee