CN2532661Y - Spring medium unit for fixing packaged device on printed circuit board - Google Patents
Spring medium unit for fixing packaged device on printed circuit board Download PDFInfo
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- CN2532661Y CN2532661Y CN 02207631 CN02207631U CN2532661Y CN 2532661 Y CN2532661 Y CN 2532661Y CN 02207631 CN02207631 CN 02207631 CN 02207631 U CN02207631 U CN 02207631U CN 2532661 Y CN2532661 Y CN 2532661Y
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- packaging part
- fluid body
- elastic fluid
- elastic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Abstract
The utility model relates to an elastic medium body which is used to connect encapsulation part on printing circuit board fixedly, the elastic medium body comprises an elastic body, a plurality of conductors, copper foils, several welding-proof insulation layers and several nickel/golden welding mats, wherein the elastic body is provided with two surfaces, the conductors are arranged in the elastic body, each conductor is parallel and equidistant each other, moreover one surface of the elastic body forms an inclined angle, in addition, the copper foil is arranged on the two surfaces of the elastic body, the welding-proof insulation layers are arranged between each copper foil on the two surfaces, the copper foils are electrically connected with the corresponding conductors, moreover the nickel/golden welding mat is arranged on the copper foil one to one.
Description
Technical field
The utility model relates to a kind of elastic fluid body that supplies packaging part to be fixed in printed circuit board (PCB), particularly relates to a kind of elastic fluid body that prevents that the tin ball from rupturing after temperature cycles.
Background technology
Integrated circuit (Integrated Circuit; IC) encapsulate (Packaging) and form packaging part (packaged IC); and the purpose that IC encapsulates; utilize all kinds of encapsulating materials from outer protection IC exactly; so that make IC be fixedly connected on printed circuit board (PCB) (Printed Circuit Board; PCB) on, and reach the function of signal transmission and heat radiation.Therefore, in order to cooperate the juncture of IC and PCB, so produced the various forms packaging part, its form is from pin insert type (Pin ThroughHole, be called for short PTH) past significantly surface adhesion type (the Surface Mount Technology of encapsulation, being called for short SMT) encapsulation changes setting out exhibition, with the demand of the packaging part that satisfies modern each electronic product and the packaging efficiency of raising electronic component.
The encapsulation of so-called PTH type promptly is the mode that the pin of IC outside must prolong and utilize plug-in unit, could utilize the pin that be prolonged to be inserted among the PCB IC and be welded on the PCB, the encapsulation of PTH type can be double pin encapsulation (Dual Inline Package, DIP); So-called SMT type encapsulation promptly is to utilize tin ball or other metal solder in the PCB surface IC when high temperature, need not utilize the pin that prolongs to come plug-in unit as the encapsulation of PTH type.Because under the area of same packaging part, the encapsulation of SMT type can obtain than the many number of pins of PTH type encapsulation, to allow packaging part reach compact purpose, reduces production cost and improves the encapsulation qualification rate.So, make the SMT type be encapsulated into the packing forms that has development potentiality at present, and the encapsulation of SMT type can be latticed array (Grid Array, GA) encapsulation, and the GA encapsulation also includes the latticed array of pin (Pin Grid Array, PGA) encapsulation, ball lattice type array (Ball Grid Array, BGA) encapsulation and flat trellis array (Land Grid Array, LGA) encapsulation.
Please refer to Figure 1A, it is the profile of LGA packaging part.In Figure 1A, packaging part 102 comprises IC104, substrate 106, colloid (Molding Compound) 108, gold thread 110a and 110b, and the IC bottom surface 104b of IC 104 utilizes elargol (Silver Epoxy) 112 to be bonded on the substrate top surface 106a of substrate 106, and gold thread 110a and 110b make that respectively IC104's contains I/O (Input/Output, I/O) the IC end face 104a of contact and pedestal 106 electrically connect, it is opening part (electronickelling/gold (Ni/Au) on it that gold thread 110a and 110b are connected to welding resisting layer (Solder Resistant Layer) 118a, be the routing golden finger, Bonding Fingers).Wherein, substrate 106 comprises via (Via) 114, nickel/gold solder pad (Pad) 116, welding resisting layer 118a and 118b again, and welding resisting layer 118a and 118b lay respectively at base top surface 106a and base bottom surface 106b.And nickel/gold solder pad 116 is disposed at the recessed place of welding resisting layer 118b, be used for strengthening electrically connecting effect, and also have the cabling design in welding resisting layer 118a and the 118b respectively, be used to electrically connect cabling, nickel/gold solder pad 116, gold thread 110a and 110b in the via 114.In addition, vertically between welding resisting layer 118a and welding resisting layer 118b, design of cabling can be used for electrically connecting nickel/gold solder pad 116 and gold thread 110a and 110b to via 114 in it, plays the part of the bridge that transmits the signal of telecommunication.And colloid 108 is to be positioned on the pedestal 106 and to coat IC 104, gold thread 110a and 110b, be used for IC 104, gold thread 110a and 110b are hedged off from the outer world, avoid IC 104, gold thread 110a and 110b destroyed, also can prevent simultaneously the outside moisture from entering in the IC 104 and produce corrosion, so can avoid unnecessary destruction.
Nickel/gold solder pad 116 is arranged in the recessed place of welding resisting layer 118b regularly, promptly forms so-called LGA packaging part 102.If again nickel/gold solder pad 116 is planted the tin ball, promptly under welding resisting layer 118b, form the tin ball 120 of projection.So-called BGA packaging part 122 is shown in Figure 1B.Wherein, Figure 1B illustrates and plants the outward appearance end view of tin ball in the BGA packaging part of nickel/gold solder pad 116 of Figure 1A, and its internal structure is identical with Figure 1A, this no longer accompanying drawing give unnecessary details.In addition, if when the material of the substrate 106 of packaging part 122 and colloid 108 is plastic cement (Plastics), then form so-called plastic cement sphere grid array (PlasticBall Grid Array, PBGA) packaging part; If when the material of the substrate 106 of packaging part 122 and colloid 108 is pottery (Ceramics), then form so-called ceramic sphere grid array (Ceramic BallGrid Array, CBGA) packaging part.
Please refer to Fig. 2, it is the decomposition side view of CBGA packaging part and PCB.In Fig. 2, packaging part 202 comprises ceramic substrate 204 and ceramic cap 206, and ceramic cap 206 is to dispose on the opening of the substrate top surface 204a that is adhered to ceramic substrate 204, be used to remain potted the good sealing (Hermetic Seal) of part 202, the substrate bottom surface 204b that tin ball 208 is disposed at ceramic substrate 204 carries out high-temperature soldering down and along the direction of the arrow 220 of Fig. 2 and the weld pad 212 of PCB 210.Wherein, (Coefficient of Thermal Expansion CTE) be about 8ppm/ ℃, and the CTE of PCB 210 is about 18ppm/ ℃ to the thermal coefficient of expansion of ceramic substrate 204.Because the CTE of PCB 210 is greater than the CTE of ceramic substrate 204, when high-temperature soldering, make the thermal expansion effects of PCB 210 greater than the thermal expansion effects of ceramic substrate 204.Therefore the cooling back produces two strands of hot shears stress (ThermalStress) that vary in size to tin ball 208, causes easily the rupture phenomenon of (Cracking) of tin ball 208, can't allow packaging part 202 be fixed in reliably on the PCB 210.
Please refer to Fig. 3, it is the decomposition side view of the PCB of PBGA packaging part and low CTE.In Fig. 3, packaging part 302 comprises plastic substrate 304 and colloid 306, and colloid 306 is to dispose to be adhered on the substrate top surface 304a of plastic cement base stage 304, is to be used to keep IC to be connected with the excellent electrical property of plastic substrate 304.And tin ball 308 is to be disposed under the substrate bottom surface 304b of plastic substrate 304, is to carry out high-temperature soldering along the direction of the arrow 320 of Fig. 3 and the weld pad 312 of PCB 310.Wherein, the CTE of plastic substrate 304 is about 18ppm/ ℃, and the CTE of the PCB 310 of low CTE is about 5-10ppm/ ℃, because the CTE of plastic substrate 304 is greater than the CTE of PCB 310, when high-temperature soldering, make the thermal expansion effects of plastic substrate 304 greater than the thermal expansion effects of PCB 310.Therefore the cooling back produces two strands of hot shears stress that vary in size to tin ball 308, causes tin ball 308 that the phenomenon of fracture easily takes place, and can't allow packaging part 302 be fixed in reliably on the PCB 310.
At Liang-Choo Hsia, Mastic Beach, N.Y.; Thomas P.McAndrew, Macungie, Pa.; Fred E.Stuebner and La Grangeville, N.Y. among the United States Patent (USP) case No.4932883, mention that relevant IC utilizes nonrigid connector (ElastomericConnector) to be disposed on the test base, with test I C performance, as shown in Figure 4, it is the combination of side view of IC, nonrigid connector and test base.In Fig. 4, nonrigid connector 402 comprises elastic body 406, metallic conductor 408 and metal gasket 410, elastic body 402 is disposed on the substrate top surface 404a of test base 404, and metallic conductor 408 be disposed in the elastic body 402 and arranged perpendicular in substrate top surface 404a, metallic conductor 408 is to electrically connect with the cabling of test base 404, and metal gasket 410 is to be connected and to be disposed on the elastic body 402 with metallic conductor 408 is vertical.Wherein, because clamping plate 416a and 416b utilize screw 418a and 418b to live in IC 412, nonrigid connector 402 and test base 404 with the mode embedding that can load and unload decomposition, metallic conductor 408 directly is not subjected to longitudinal pressure and modification not, and metal gasket 410 is subjected to longitudinal pressure and reluctantly a little toward sagging.And the elastic body 406 under metal gasket 410 bears vertical folder force deformation of clamping plate 416a and 416b, produces longitudinally that elastic force becomes support force, makes the I/O tin ball 414 of IC 412 can closely electrically connect with metal gasket 410.
I/O tin ball 414 is to contact with metal gasket 410; Be not to weld together, so, when IC 412, nonrigid connector 402 and test base 404 face temperature change and expand with heat and contract with cold, I/O tin ball 414 still can continue to keep the situation of electric connection with metal gasket 410, be not subjected to the influence of the thermal expansion coefficient difference of IC 412, nonrigid connector 402 and test base 404, avoid I/O tin ball 414 to produce the phenomenon of fracture because of hot shears stress.
It should be noted that metal gasket 414 is to electrically connect with metallic conductor 408 one to one, the quantity that makes metallic conductor 408 and metal gasket 414 distribute in nonrigid connector 402 is limited to.And allow nonrigid connector 402 more can't electrically connect, the chance of the more kinds of IC that vary in size of forfeiture test with another IC of the more or less I/O tin of tool ball 414.In addition, though elastic body 406 provides elastic force partially, and the part that in fact can bear vertical folder power has only the narrow and small zone of the elastic body 406 under the metal gasket 414, and metallic conductor 408 and metal gasket 414 are not have elasticity, so the amplitude of its stressed swing has to greatest extent again.If the power of vertically pressing from both sides is excessive or be subjected to external force when bang, metallic conductor 408 and metal gasket 414 be because of bearing the situation that incessantly produces damage, even relatedly tear elastic body 406.
In addition, because elastic body 406 end face just disposes metal gasket 410, and bottom surface 404a does not have another metal gasket connection, and occupation mode and scope are limited to.Very inconvenient.Even the outer more naked layers of the nonrigid connector 402 adjacent metal pad 414 that can be used for insulating avoided taking place electrical short circuit phenomenon, and is used for isolated extraneous moisture, with protection metallic conductor 408 and metal gasket 414.
The utility model content
The purpose of this utility model is exactly to be fixed in the elastic fluid body of printed circuit board (PCB) for packaging part providing a kind of, and the design of its elastic body and lead more can the tamper seal piece installing can be born external force and do not destroyed by external force.And when temperature change, the elastic fluid body also can produce corresponding distortion, avoids its affixed effect between the two of rising-heat contracting-cold function influence of packaging part and PCB, prevents that the tin ball from producing crack conditions.Wherein, packaging part more can utilize the elastic fluid body to connect with the tin ball bonding or the protruding grain of conducting polymer touches mode and PCB electrically connect, and its compound mode can be selected according to the character of packaging part and PCB, and is very convenient.
According to the purpose of this utility model, a kind of elastic fluid body is proposed, be used for being fixed in printed circuit board (PCB) for packaging part, the elastic fluid body comprises elastic body, a plurality of lead, a plurality of Copper Foil and a plurality of Copper Foil down, a plurality of anti-welding insulating barrier and a plurality of anti-welding insulating barrier down, a plurality of upward nickel/gold solder pad and a plurality of nickel/gold solder pad down gone up, and the elastic body has upper surface and lower surface.Lead is to be positioned at the elastic body, and is equidistant parallel between each lead, and lead is to form the angle of inclination with lower surface.Wherein, Copper Foil was to be disposed at upper surface and lower surface respectively under last Copper Foil reached, and was to have one at interval between the Copper Foil on each, and was down to have this at interval between the Copper Foil, and upward Copper Foil is that the corresponding lead of utilization is electrically connected at down Copper Foil.In addition, going up anti-welding insulating barrier is to be staggered in upper surface with last Copper Foil, and anti-welding insulating barrier is to be staggered in lower surface with following Copper Foil down, and nickel/gold solder pad was that the outer surface that is disposed at Copper Foil one to one respectively reaches the outer surface of Copper Foil down under upward nickel/gold solder pad reached.
For above-mentioned purpose of the present utility model, feature and advantage can be become apparent, a preferred embodiment cited below particularly, and conjunction with figs. are described in detail below.
Description of drawings
Figure 1A is the profile of LGA packaging part;
Figure 1B plants the outward appearance end view of tin ball in the BGA packaging part of nickel/gold solder pad of Figure 1A;
Fig. 2 is the decomposition side view of CBGA packaging part and PCB;
Fig. 3 is the decomposition side view of the PCB of PBGA packaging part and low CTE;
Fig. 4 is the combination of side view of IC, nonrigid connector and test base;
Fig. 5 A is that the packaging part that supplies of embodiment one of the present utility model is fixed in the profile of the elastic fluid body of printed circuit board (PCB);
Fig. 5 B dwindles figure for the overlooking of elastic fluid body of Fig. 5 A;
Fig. 5 C dwindles figure for the overlooking of elastic fluid body of the nickel/gold solder pad of the tool hollow square formation arrangement mode of embodiment one;
Fig. 6 A-Fig. 6 E is the flow chart of the elastic fluid body of Fig. 5 A;
Fig. 7 is the combination of side view of CBGA packaging part, elastic fluid body and the PCB of first application examples of embodiment one;
Fig. 8 is PBGA packaging part, the elastic fluid body of second application examples of embodiment one and the combination of side view that hangs down the PCB of CTE;
Fig. 9 is the combination of side view of LGA packaging part, elastic fluid body and the PCB of the 3rd application examples of embodiment one;
Figure 10 is to utilize the protruding grain of conducting polymer of elastic fluid body and both sides thereof and the combination of side view of PCB electric connection for the LGA packaging part of the 4th application examples of embodiment one;
Figure 11 is the combination of side view of CGA packaging part, elastic fluid body and the PCB of the 5th application examples of embodiment one;
Figure 12 A is that the packaging part that supplies of embodiment two of the present utility model is fixed in the profile of the elastic fluid body of printed circuit board (PCB);
Figure 12 B dwindles figure for the overlooking of elastic fluid body of Figure 12 A;
Figure 12 C dwindles figure for the overlooking of elastic fluid body of the nickel/gold solder pad of the tool hollow square formation arrangement mode of embodiment two;
Figure 13 A-Figure 13 F is the flow chart of the elastic fluid body of Figure 12 A.
Embodiment
The utility model is design one an elastic fluid body (Elastomer Interposer), be used for for packaging part (Package) be fixed in printed circuit board (PCB) (printed Circuit Board, PCB), trellis array (Grid Array, GA) packaging part especially.And the thermal coefficient of expansion of packaging part (Coefficient of Thermal Expansion, CTE) be different with the CTE of PCB, and the elastic fluid body is when accepting the degree of expanding with heat and contract with cold of different packaging parts and PCB, the elastic fluid body produces corresponding deformation, avoids packaging part to produce the situation of fracture because of different hot shears stress with the combining structure of PCB.Wherein, the collocation design of tin ball (Solder Ball) and the protruding grain of conducting polymer (Conductive Polymer Bump) also can be made in two surfaces of elastic fluid body, and is so that various different packaging parts can be combined with corresponding PCB, quite convenient.
In addition, the GA packaging part includes stitch trellis array (Pin Grid Array, PGA) packaging part, suspension column trellis array (Column Grid Array, CGA) packaging part, sphere grid array (BallGrid Array, BGA) packaging part and flat lattice array (Land Grid Array, LGA) packaging part.And the differentiation of BGA packaging part has ceramic sphere grid array (Ceramic Ball Grid Array, CBGA) packaging part and plastic cement sphere grid array (Plastic Ball Grid Array, PBGA) packaging part, and the CGA packaging part can include ceramic stitch trellis array (Ceramic Pin Grid Array, CPGA) packaging part and ceramic suspension column trellis array-like (Ceramic Column Grid Array, CCGA) packaging part.Will be as follows as for elastic fluid body of the present utility model with embodiment one and embodiment two description of drawings.
Embodiment one
Please refer to Fig. 5 A, its supply encapsulation, part for embodiment one of the present utility model is fixed in the profile of the elastic fluid body of printed circuit board (PCB).In Fig. 5 A, elastic fluid body 502 comprises elastic body (Elastolner) 504, anti-welding insulating barrier (Solder Resistant and InsulatingLayer) 506a and 506b, a plurality of lead (Conductive Wires) 508, a plurality of conducting strip and a plurality of weld pad (Pads), and conducting strip can be respectively Copper Foil 510a and 510b, weld pad can be respectively nickel/gold (Ni/Au) weld pad 512a and 512b on its outer surface, be used for strengthening electrically connecting effect, and elastic body 504 provides the elasticity of elastic fluid body 502.Wherein, elastic body 504 has parallel each other end face 505a and bottom surface 505b again, anti-welding insulating barrier 506a and nickel/gold solder pad 512a is that staggered compartment of terrain is disposed at end face 505a, and anti-welding insulating barrier 506b and nickel/gold solder pad 512b to be staggered compartment of terrain be disposed at bottom surface 505b, and Copper Foil 510a is disposed at the inner surface of nickel/gold solder pad 512a and electrically connects with nickel/gold solder pad 512a.
In addition, Copper Foil 510b is disposed at the inner surface of nickel/gold solder pad 512b and electrically connects with nickel/gold solder pad 512b, make that the structure of end face 505a and bottom surface 505b is identical, and anti-welding insulating barrier 506a is used to insulate between adjacent nickel/gold solder pad 512a and the adjacent Copper Foil 510a.And anti-welding insulating barrier 506b is used to insulate between adjacent nickel/gold solder pad 512b and the adjacent Copper Foil 510b, makes anti-welding insulating barrier 506a and 506b can protect the structure in the elastic fluid body 502.Wherein, the material of anti-welding insulating barrier 506a and 506b is to be selected from the group that any organic printing ink and water-repellent material form any, even, anti-welding insulating barrier 506a and 506b are to be the anti-burning of high temperature (High Temperature Endurance) of carrying out under 250 ℃ of situations 30 seconds in temperature, to smear (Coating) on elastic body 504.
The interface and the end face 505a that it should be noted that Copper Foil 510a and nickel/gold solder pad 512a are the same horizontal planes of summary, and the interface of Copper Foil 510b and nickel/gold solder pad 512b and bottom surface 505b are that summary is with another horizontal plane.Be uniformly-spaced at a distance of and parallel to each other between each lead 508, and lead 508 is all to form a tilt angle theta with bottom surface 505b, make lead 508 obliquely proper alignment in elastic body 504.Copper Foil 510a utilizes corresponding lead 508 and Copper Foil 510b to electrically connect, and common 1 Copper Foil 510a utilizes 3-6 lead 508 and 1 Copper Foil 510b to electrically connect.In addition, elastic body 504 material is to be selected from the group that silicone rubber compound (silicone Rubber Conlpound), polyamine base Ethyl formate compound (Polyurethane Compound), polyvinyl (Polyethyl eneCompound), synthetic rubber (Synthetic Rubber), silicone resin (Polysiloxaneresin Compound), acyclic compound (Acrylic Compound), polyolefin compound (Polyolefins Compound) formed any one.
Please refer to Fig. 5 B, it dwindles figure for the overlooking of elastic fluid body of Fig. 5 A.In Fig. 5 B, nickel/gold solder pad 512a forms square formation on the opening of welding resisting layer 506a, and in like manner, nickel/gold solder pad 512b also can form the square formation shown in Fig. 5 B on the opening of welding resisting layer 506b.Certainly, but the utility model also the surperficial central authorities of design flexibility dielectric 532 do not dispose nickel/gold solder pad 536, shown in Fig. 5 C, make nickel/gold solder pad 536 be arranged as the square formation of hollow.
Please refer to 6A-Fig. 6 E, it is the flow chart of the elastic fluid body of Fig. 5 A.At first, please refer to Fig. 6 A, provide one to have the elastic body 604 of a plurality of leads 508, and allow elastic body 604 carry out surface etching (Surface Etching), make the two ends of lead 508 expose outside elastic body 604 the end face 505a and bottom surface 505b.Wherein, between each lead 508 be with uniformly-spaced at a distance of and parallel to each other, lead 508 is all to form a tilt angle theta and proper alignment in elastic body 504 with bottom surface 505b.In addition, the utility model is cleaning surfaces (Surface Clean) work that can carry out elastic body 604, to residue in the material on the elastic body 604 after the removal etching.
Then, please refer to Fig. 6 B, elastic body 604 is carried out electroless plating (Chemical Plating), to form copper foil layer 612a and 612b respectively in end face 505a and bottom surface 505b, even, copper foil layer 612a and 612b interlink and are integral outside elastic body 604, and coating elastic body 604, and copper foil layer 612a and 612b all electrically connect with lead 508.
Then, please refer to Fig. 6 C, copper foil layer 612a and 612b are carried out little shadow, on copper foil layer 612a and 612b, define Copper Foil zone 618a and 618b respectively.And photoresist 620a exposure, development are formed at Copper Foil zone 618a, and photoresist 620b exposes, developing is formed at the regional 618b of Copper Foil, and the elastic body 604 of photoresist 620a that will expose, develop and 620b carries out etched action.
Then, please refer to Fig. 6 D, photoresist 620a and 620b that elastic body 604 is outer remove, make each Copper Foil 510a each other with uniformly-spaced at a distance of and be disposed at end face 505a, and each Copper Foil 510b each other with uniformly-spaced at a distance of and be disposed at bottom surface 505b.Copper Foil 510a and 510b all electrically connect with lead partly 508, and common 1 steel foil 510a utilizes 3-6 lead and 1 Copper Foil 510b to electrically connect.In addition, in the anti-welding insulating regions 622a of the section definition of Copper Foil 510a, and the anti-welding insulating regions 622b of section definition of Copper Foil 510b, make anti-welding insulating barrier 506a be formed at anti-welding insulating regions 622a, and anti-welding insulating barrier 506b is formed at anti-welding insulating regions 622b.It should be noted that Copper Foil 510a is disposed at end face 505a with anti-welding insulating barrier 506a with being staggered, and Copper Foil 510b is disposed at bottom surface 505b with anti-welding insulating barrier 506b with being staggered.
Then, please refer to Fig. 6 E, electroplate, also form a continuous uncut elastic fluid body 602 to form nickel/ gold solder pad 512a and 512b respectively in the outer surface of Copper Foil 510a and the outer surface of Copper Foil 510b.And make nickel/gold solder pad 512a be electrically connected at Copper Foil 510a, nickel/gold solder pad 512b is electrically connected at Copper Foil 510b.Wherein, elastic fluid body 602 cut list (Singulation) after, can form the elastic fluid body 502 shown in Fig. 5 A.
It should be noted that the design of the lead 508 of the flexible elastic body 504 of tool of elastic fluid body 502 and oblique arrangement, make elastic fluid body 502 can support the packaging part on it.In case and packaging part is unfortunate when suffering external force pressure, the buffering role when elastic fluid body 502 can be used as packaging part in the face of external force to do corresponding distortion, avoids the structure of outside destroy packaging part.As for the elastic fluid body of embodiment one range of application will description of drawings be as follows respectively with first application examples, second application examples, the 3rd application examples, the 4th application examples and the 5th application examples.
First application examples
Please refer to Fig. 7, it is the combination of side view of CBGGA packaging part, elastic fluid body and the PCB of first application examples of embodiment one.In Fig. 7, packaging part 652 comprises ceramic substrate 654 and ceramic cap 656, and ceramic cap 656 is to dispose to be adhered on the substrate top surface 654a of ceramic substrate 654, is the good sealing (Hermetic Seal) that is used to keep IC and ceramic substrate 654.And tin ball 658 is to be disposed under the substrate bottom surface 654b of ceramic substrate 654, tin ball 658 be high-temperature soldering on the nickel/gold solder pad 512a of elastic fluid body 502, make packaging part 652 be and elastic fluid body 502 electrically connects.Wherein, the nickel of elastic fluid body 502/gold solder pad 512b plants tin ball 660, and tin ball 660 is to be welded on the weld pad 664 of PCB 662, and elastic fluid body 502 is to electrically connect with PCB 662.
Wherein, the CTE of ceramic substrate 654 is about 8ppm/ ℃, and the CTE of PCB 662 is about 18ppm/ ℃, and the degree of expanding with heat and contract with cold of PCB 662 is than the degree of expanding with heat and contract with cold greater than ceramic substrate 654.When packaging part 654 and elastic fluid body 502 after carrying out high-temperature soldering on the PCB 662, tin ball 658 and 660 is subjected to the compressing of the different hot shears stress that thermal expansion caused of ceramic substrate 654 and PCB 662.Cause elastic fluid body 502 also to be subjected to two bursts of hot shears stress compressings that vary in size simultaneously, allow elastic fluid body 502 be deformed into trapezoidal outward appearance, reduce the stress of tin ball 658 and 660, so that packaging part 654 still can be fixedly welded on the PCB 662 by square appearance.So the practice can be avoided tin ball 658 and 660 phenomenon of (Cracking) that ruptures, and influences the combination of packaging part 654 and PCB 662.
Second application examples
Please refer to Fig. 8, it is PSGA packaging part, the elastic fluid body of second application examples of embodiment one and the combination of side view that hangs down the PCB of CTE.In Fig. 8, packaging part 702 comprises plastic substrate 704 and colloid 706, and colloid 706 is to dispose to be adhered on the substrate top surface 704a of plastic substrate 704, and tin ball 708 is to be disposed under the substrate bottom surface 704b of plastic substrate 704.And tin ball 708 be high-temperature soldering on the nickel/gold solder pad 512a of elastic fluid body 502, make packaging part 702 be and elastic fluid body 502 electrically connects.Wherein, the nickel of elastic fluid body 502/gold solder pad 512b plants tin ball 710, and tin ball 710 is to be welded on the weld pad 714 of PCB 712, and elastic fluid body 502 is to electrically connect with PCB 712.
Wherein, the CTE of plastic substrate 704 is about 18ppm/ ℃, and the CTE of the PCB 712 of low CTE is about 5-10ppm/ ℃, and the degree of expanding with heat and contract with cold of PCB 712 is smaller than the hot swollen shrinkage degree of plastic substrate 704.When packaging part 704 carries out high-temperature soldering on PCB 712, tin ball 708 and 714 is subjected to the compressing of the different hot shears stress that thermal expansion caused of plastic substrate 704 and PCB 712, and causes elastic fluid body 502 also to be subjected to two bursts of hot shears stress compressings that vary in size simultaneously.Allow elastic fluid body 502 be deformed into trapezoidal outward appearance, reduce the stress of tin ball 708 and 710, so that packaging part 704 still can be welded because of on PCB 712 by square appearance.So the practice can avoid tin ball 708 and 710 to rupture, and influences the combination of packaging part 704 and PCB 712.
Other GA packaging parts, for example CPGA packaging part and CCGA packaging part, the mode that also can the tin ball bonding connects utilizes elastic fluid body 502 and PCB 712 affixed.
The 3rd application examples
Please refer to Fig. 9, it is the combination of side view of LGA packaging part, elastic fluid body and the PCB of the 3rd application examples of embodiment one.In Fig. 9, packaging part 802 comprises substrate 804 and colloid 806, and colloid 806 is to dispose to be adhered on the substrate top surface 804a of substrate 804, and substrate bottom surface 804b has a plurality of nickel/gold solder pad 808.Wherein, be to form tin ball 811 under the nickel/gold solder pad 512b of elastic fluid body 502, and tin ball 811 is to be welded on the weld pad 814 of PCB 812, and elastic fluid body 502 is to electrically connect with PCB812.In addition, be to form the protruding grain 810 of conducting polymer on the nickel/gold solder pad 512a of elastic fluid body 502, be used for touching and electrically connecting with the nickel/gold solder pad 808 of packaging part 802, packaging part 802, elastic fluid body 502 and PCB 812 are lived in embedding about more can utilizing extra trip or screw, to promote the contact effect between packaging part 802, elastic fluid body 502 and the PCB 812.This kind practice can be disposed at packaging part 802 the electrical slot (E1ectrical Socket) of tool LGA form, to allow packaging part 802 directly be electrically connected at electrical slot; Also packaging part 802 can be placed on the test trough (Test Socket), to do the performance test of packaging part 802.Because packaging part 802 is not to weld together with elastic fluid body 502, makes packaging part 802 be electrically connected at elastic fluid body 502 and PCB 812 in mobilizable mode, assembles very convenient.
The 4th application examples
Please refer to Figure 10, its LGA packaging part for the 4th application examples of embodiment one is to utilize the protruding grain of conducting polymer of elastic fluid body and both sides thereof and the combination of side view of PCB electric connection.In Figure 10, nickel/gold solder pad the 512b that is in elastic fluid body 502 of different Fig. 8 forms the protruding grain 910 of conducting polymer down, be to be used for touching and electrically connecting with the weld pad 814 of PCB 812, elastic fluid body 502 that needn't image pattern 8 utilizes tin ball 811 to be welded on the PCB 812, make elastic fluid body 502 be electrically connected at PCB 812, assemble very convenient in mobilizable mode.Packaging part 802, elastic fluid body 502 and PCB 812 are lived in embedding about more can utilizing extra trip or screw, with the contact effect between enhancement packaging part 802, elastic fluid body 502 and PCB 812.This kind practice can be disposed at packaging part 802 the electrical slot of tool LGA form, to allow packaging part 802 directly be electrically connected at electrical slot; Also packaging part 802 can be placed on the test trough, to do the performance test of packaging part 802.
The 5th application examples
Please refer to Figure 11, it is the combination of side view of CGA packaging part, elastic fluid body and the PCB of the 5th application examples of embodiment one.In Figure 11, packaging part 930 comprises substrate 932 and colloid 934, and colloid 934 is to dispose to be adhered on the substrate top surface 932a of substrate 932, and conductive pole 936 is to be disposed under the substrate bottom surface 932b of substrate 932.And conductive pole 936 be high-temperature soldering on the nickel/gold solder pad 512a of elastic fluid body 502, make packaging part 932 be and elastic fluid body 502 electrically connects.Wherein, the nickel of elastic fluid body 502/gold solder pad 512b forms the protruding grain 938 of conducting polymer, is that the weld pad 814 with PCB 812 touches and electrically connects, and makes elastic fluid body 502 be and PCB 812 electrically connects.Even, more can utilize extra trip or screw up and down embedding live packaging part 930, elastic fluid body 502 and PCB812, to promote the effect that contacts between elastic fluid body 502 and the PCB 812.CGA packaging part 930 also can conductive pole the mode of 936 contact nickel/gold solder pad 512a utilize elastic fluid body 502 and PCB 812 to electrically connect.
So, the mode that elastic fluid body 502 of the present utility model can supply the GA packaging part to connect with the tin ball bonding, or in protruding mode of touching of conducting polymer, or the mode of touching or welding with conductive pole and elastic fluid body 502 and PCB electrically connect, make the assembling mode of packaging part and PCB more tend to diversification, very convenient.
Embodiment two
Please refer to Figure 12 A, its packaging part that supplies for embodiment two of the present utility model is fixed in the profile of the elastic fluid body of printed circuit board (PCB).In Figure 12 A, elastic fluid body 942 comprises elastic body 944, anti-welding insulating barrier 946a and 946b, lead 948, conducting strip and weld pad, and conducting strip and weld pad can be respectively Copper Foil 950a and 950b, nickel/gold solder pad 952a and 952b, and elastic body 944 provides the elasticity of elastic fluid body 942.Wherein, elastic body 944 has parallel each other end face 945a and bottom surface 945b again, anti-welding insulating barrier 946a and nickel/gold solder pad 952a is that staggered compartment of terrain is disposed on the end face 945a, and anti-welding insulating barrier 946b and nickel/gold solder pad 952b to be staggered compartment of terrain be disposed under the 945b of bottom surface, Copper Foil 950a is disposed at nickel/gold solder pad 952a inner surface and electrically connects with nickel/gold solder pad 952a.In addition, Copper Foil 950b is disposed at nickel/gold solder pad 952b inner surface and electrically connects with nickel/gold solder pad 952b, make that the structure of end face 945a and bottom surface 9456 is identical, and anti-welding insulating barrier 946a is used to insulate between adjacent nickel/gold solder pad 952a and the adjacent Copper Foil 950a.And anti-welding insulating barrier 946b is used to insulate between adjacent nickel/gold solder pad 952b and the adjacent Copper Foil 950b, makes anti-welding insulating barrier 952a and 950b can protect the structure in the elastic fluid body 942.
Wherein, the material of anti-welding insulating barrier 946a and 946b is to be selected from the group that any organic printing ink and water-repellent material form any, even anti-welding insulating barrier 946a and 946b are to be the anti-burning of high temperature of carrying out under 250 ℃ of situations 30 seconds in temperature, heavily to smear on elastic body 944.
It should be noted that, the elastic fluid body 942 of present embodiment and the elastic fluid body of embodiment one 502 be different be in, the summary that the interface of the Copper Foil 950a of present embodiment and nickel/gold solder pad 952a is etc. is higher than anti-welding insulating barrier 946a and end face 945a, and the interface of Copper Foil 950b and nickel/gold solder pad 952b is protected anti-welding insulating barrier 946b and the bottom surface 945b of being higher than such as rough.Between each lead 948 be with uniformly-spaced at a distance of and parallel to each other, and lead 948 is to form an inclination angle beta with bottom surface 945b, make lead 948 obliquely proper alignment in elastic body 944.Copper Foil 950a utilizes corresponding lead 948 and Copper Foil 950b to electrically connect, and common 1 Copper Foil 950a utilizes 3-6 lead 948 and 1 Copper Foil 950b to electrically connect.In addition, elastic body 944 material is protected and can be selected from the group that silicone rubber compound, polyamine base Ethyl formate compound, polyvinyl, synthetic rubber, silicone resin, acyclic compound, polyolefin compound form any one.
Please refer to Figure 12 B, it dwindles figure for the overlooking of elastic fluid body of Figure 12 A.In Figure 12 B, nickel/gold solder pad 952a forms square formation on the opening of welding resisting layer 946a, and in like manner, nickel/gold solder pad 952b also can form the square formation shown in Fig. 1 2B on the opening of welding resisting layer 946b.Certainly, but the utility model also the surperficial central authorities of design flexibility dielectric 943 do not dispose nickel/gold solder pad 947, shown in Figure 12 C, make nickel/gold solder pad 947 be arranged as the square formation of hollow.
Please refer to Figure 13 A-Figure 13 F, it is the flow chart of the elastic fluid body of Figure 12 A.At first, please be earlier with reference to Figure 13 A, an elastic body 974 with a plurality of leads 948 is provided, and defines anti-welding insulating regions 976a and 976b respectively in elastic body 974 end face 945a and bottom surface 945b.Wherein, the anti-welding insulating regions 976a of photoresist 978a collocation method, and photoresist 978b is disposed at anti-welding insulating regions 976b, and expose, development and etching.
Then, please refer to Figure 13 B, carry out chemical etching, be used for removing a little not by the elastic body's 974 of photoresist 978a and 978b coating end face 945a and bottom surface 945b, the elastic body's 974 who is for example removed thickness is about 50 (μ m), makes the lead 948 of part expose two ends a little outside elastic body 974.Afterwards, the utility model can carry out surface treatment (Surface Clean) or pre-treatment (Pre-Treatment), is used to remove organic substance or oxide layer outside elastic body 974 and the lead 948.
Then, please refer to Figure 13 C, elastic body 974 is electroplated, in elastic body 974 outer rim formation copper foil layer 980a and 980b, and photoresist 978a and end face 945a in copper foil layer 980a coating.Photoresist 978b and bottom surface 945b in copper foil layer 980b coating, and copper foil layer 980a and 980b all electrically connect with lead 948.
Then, please refer to Figure 13 D, remove photoresist 978a and 978b, related removal is covered in outer copper foil layer 980a of photoresist 978a and the outer 980b of photoresist 978b respectively, to form Copper Foil 952a and 952b in end face 945a and bottom surface 945b.Wherein, be equidistantly to be electrically connected at corresponding lead 948 between each Copper Foil 950a, and be equidistantly to be electrically connected at corresponding lead 948 between each Copper Foil 950b that common 1 Copper Foil 950a utilizes 3 leads 948 and 1 Copper Foil 950b to electrically connect.
Then, please refer to Figure 13 E, the anti-welding regional 976a of definition insulation between Copper Foil 950a, and between Copper Foil 950b, define the anti-welding regional 976b of insulation, to form insulation welding resisting layer 946a and 946b respectively.Copper Foil 950a is disposed at end face 945a with anti-welding insulating barrier 946a with being staggered, and Copper Foil 950b is disposed at bottom surface 945b with anti-welding insulating barrier 946b with being staggered.Wherein, the utility model utilizes stencil printing (Stencil Printing) or other modes in the dry process of the universe liquid printing ink heavily to be smeared on elastic body 974, to form anti-welding insulating barrier 946a and 946b respectively.
Then, please refer to Figure 13 F, electroplate, to form nickel/gold solder pad 952a and 952b respectively in Copper Foil 950a and 950b, also form an elastic fluid body 982 that comes cutting section continuously, and make nickel/gold solder pad 952a be electrically connected at copper, paper tinsel 950a, nickel/gold solder pad 952b is electric connection method Copper Foil 950b.Wherein, elastic fluid body 982 is cut list (Singulation), to form the elastic fluid body 942 shown in Figure 12 A.
It should be noted that, the design of the lead 948 of flexible elastic body 944 of the tool of elastic fluid body 942 and oblique arrangement, make elastic fluid body 942 can support the packaging part on it, in case and packaging part is unfortunate when suffering external force pressure, buffering role when elastic fluid body 942 can be used as packaging part in the face of external force, to do corresponding distortion, avoid the structure of outside destroy packaging part.Wherein, on practical ranges, the mode that the elastic fluid body 942 of present embodiment also can supply the GA packaging part to connect with the tin ball bonding as the elastic fluid body 502 of embodiment one, or in protruding mode of touching of conducting polymer, or the mode of touching or welding with conductive pole and elastic fluid body 942 and PCB electrically connect, its compound mode tends to diversification as Fig. 7-shown in Figure 11, can select compound mode according to the character of packaging part and PCB, and is very convenient.So this no longer accompanying drawing praise and state.
By embodiment one and embodiment two as can be known; elastic fluid body of the present utility model can help the easier and PCB electric connection of packaging part; and the design of the elastic body of its resiliency supported and inclination lead more can the tamper seal piece installing can be born external force and do not destroyed by external force.In addition, when temperature change, also can produce corresponding distortion, avoid its affixed effect between the two of different rising-heat contracting-cold function influences of packaging part and PCB, prevent that the tin ball from producing crack conditions.In addition,, make the elastic fluid body to design various packaging part and electrically connect, fully allow packaging part electrically connect and to bring into play its effect with PCB with cabling because last Copper Foil is to utilize a plurality of leads and following Copper Foil to electrically connect.In addition, packaging part more can utilize the elastic fluid body to connect with the tin ball bonding or the protruding grain of conducting polymer touches mode and PCB electrically connect, its compound mode can be selected according to the character of packaging part and PCB, and electrically slot and test trough all can be followed technology of the present utility model and be designed the compound mode of itself and packaging part, be further used for testing the performance in the village, very convenient.
The utility model the foregoing description is disclosed to be fixed in the elastic fluid body of printed circuit board (PCB) for packaging part, and the design of its elastic body and lead more can the tamper seal piece installing can be born external force and do not destroyed by external force.And when temperature change, the elastic fluid body also can produce corresponding distortion, avoids its affixed effect between the two of rising-heat contracting-cold function influence of packaging part and PCB, prevents that the tin ball from producing crack conditions.Wherein, packaging part more can utilize the elastic fluid body to connect with the tin ball bonding or the protruding grain of conducting polymer touches mode and PCB electrically connect, and its compound mode can be selected according to the character of packaging part and PCB, and is very convenient.
In sum; though the utility model with a preferred embodiment openly as above; so it is not to be used to limit the utility model; anyly have the knack of this skill person; in not breaking away from spirit and scope of the present utility model; when being used for a variety of modifications and variations, therefore protection range of the present utility model is as the criterion with claim.
Claims (22)
1. an elastic fluid body (Elastomer Interposer), be used for for a packaging part (Packaged IC) be fixed in a printed circuit board (PCB) (Printed Circuit Board PCB), is characterized in that, this elastic fluid body comprises:
One elastic body is to have a first surface and a second surface;
A plurality of leads are to be positioned at this elastic body, and are equidistant parallels between each these lead, and these leads are to form an angle of inclination with this second surface;
A plurality of first Copper Foils are to be disposed at this first surface, between each these first Copper Foil of face be have together every, and these first Copper Foils customs and these corresponding leads electric connections;
A plurality of second Copper Foils are to be disposed at this second surface, and are to have this interval between each these second Copper Foil, and these second Copper Foils are to electrically connect with these corresponding leads;
The a plurality of first anti-welding insulating barrier is to be staggered in this first surface with these first Copper Foils;
The a plurality of second anti-welding insulating barrier is to be staggered in this second surface with these second Copper Foils;
A plurality of first nickel/gold solder pad are the outer surfaces that is disposed at these first Copper Foils one to one; And
A plurality of second nickel/gold solder pad are the outer surfaces that is disposed at these second Copper Foils one to one.
2. elastic fluid body as claimed in claim 1 is characterized in that, also comprises:
The protruding grain of a plurality of first conducting polymers is the surface that is disposed at these first nickel/gold solder pad.
3. elastic fluid body as claimed in claim 2 is characterized in that, is to utilize the protruding grain of these first conducting polymers to touch this PCB, makes this elastic fluid body be electrically connected at this PCB.
4. elastic fluid body as claimed in claim 3, it is characterized in that, described packaging part is a sphere grid array (Bail Grid Array, BGA) packaging part, and this BGA packaging part is to utilize a plurality of first tin ball bondings to be connected to the surface of these second nickel/gold solder pad, make this BGA packaging part be electrically connected at this elastic fluid body.
5. elastic fluid body as claimed in claim 3, it is characterized in that, described packaging part is a suspension column trellis array (Column Grid Array, CGA) packaging part, and this CGA packaging part is to utilize a plurality of first conductive poles to be welded in the surface of these second nickel/gold solder pad, makes this CGA packaging part be electrically connected at this elastic fluid body.
6. elastic fluid body as claimed in claim 2, it is characterized in that, described packaging part is one first flat lattice array (Land Grid Array, LGA) packaging part, and a LGA packaging part is to touch the protruding grain of these first conducting polymers, and this LGA packaging part is to be electrically connected at this elastic fluid body.
7. elastic fluid body as claimed in claim 6 is characterized in that, described second nickel/gold solder pad is to utilize a plurality of the 3rd tin ball bondings to be connected to this PCB, and this elastic fluid body is electrically connected at this PCB.
8. elastic fluid body as claimed in claim 2 is characterized in that, also comprises:
The protruding grain of a plurality of second conducting polymers is the surface that is disposed at these second nickel/word weld pad.
9. elastic fluid body as claimed in claim 8, it is characterized in that, described packaging part is one second flat lattice array (Land Grid Array, LGA) packaging part and the 2nd LGA packaging part are to touch the protruding grain of these first conducting polymers, and this LGA packaging part is to be electrically connected at this elastic fluid body.
10. elastic fluid body as claimed in claim 8 is characterized in that, is to utilize the protruding grain of these second conducting polymers to touch this PCB, makes this elastic fluid body be electrically connected at this PCB.
11. elastic fluid body as claimed in claim 1 is characterized in that, comprises again:
A plurality of the 4th tin balls are disposed at the surface of these first nickel/gold solder pad.
12. elastic fluid body as claimed in claim 11 is characterized in that, is to utilize these the 4th tin ball bondings to be connected on this PCB, this elastic fluid body is electrically connected at this PCB.
13. elastic fluid body as claimed in claim 12, it is characterized in that, described packaging part is a ceramic sphere grid array (Ceramic Ball Grid Array, CBGA) packaging part, and this CBGA packaging part is to utilize a plurality of the 5th tin ball bondings to be connected to the surface of these second nickel/gold solder pad, makes this CBGA packaging part be electrically connected at this elastic fluid body.
14. elastic fluid body as claimed in claim 13 is characterized in that, (Coefficient of Thermal Expansion CTE) be about 8ppm/ ℃, and the CTE of this PCB is about 18ppm/ ℃ to the thermal coefficient of expansion of described CBGA packaging part.
15. elastic fluid body as claimed in claim 12, it is characterized in that, described packaging part is a plastic cement sphere grid array (Plastic Ball Grid Array, PBGA) packaging part, and this PBGA packaging part is to utilize a plurality of the 6th tin ball bondings to be connected to the surface of these second nickel/gold solder pad, and this PBGA packaging part is electrically connected at this elastic fluid body.
16. elastic fluid body as claimed in claim 15 is characterized in that the CTE of described PBGA packaging part is about 18ppm/ ℃, and the CTE of this PCB is about 5-10ppm/ ℃.
17. elastic fluid body as claimed in claim 1, it is characterized in that described elastic body's material is to be selected from silicone rubber compound (Silicone Rubber Compound), polyamine base Ethyl formate compound (Polyurethane Compound), polyvinyl (PolyethyleneCompound), synthetic rubber (Synthetic Rubber), silicone resin (Polysiloxaneresin Compound), acyclic compound (Acrylic Compound) and polyolefin compound (Polyolefins Compound) are formed any one in the group.
18. an elastic fluid body, this elastic fluid body are used for being fixed in a PCB for a packaging part, it is characterized in that, comprising:
One elastic body has a first surface, a second surface and a plurality of lead in this elastic body, be equidistant parallel between its each these leads, and these leads and this second surface form an angle of inclination;
The two ends of these leads expose this first surface and this second surface;
One copper foil layer coats this elastic body;
A plurality of first Copper Foils and a plurality of second Copper Foil are in this first surface and this second surface, wherein, have one between these first Copper Foils at interval, and also have this interval between these second Copper Foils, these first Copper Foils utilize these corresponding leads and these second Copper Foils to electrically connect;
The a plurality of first anti-welding insulating barrier and a plurality of this second anti-welding insulating barrier are in this first surface and this second surface, and these first anti-welding insulating barriers are to be staggered with these first Copper Foils, and these second anti-welding insulating barriers are to be staggered with these second Copper Foils; And
A plurality of first nickel/gold solder pad and a plurality of second nickel/gold solder pad is in the outer surface of these first Copper Foils and the outer surface of these second Copper Foils.
19. elastic fluid body as claimed in claim 11, it is characterized in that described packaging part is a plastic cement sphere grid array (Plastic Ball Grid Array, PBGA) packaging part, and this PBGA packaging part is to utilize a plurality of the 6th tin ball bondings to be connected to the surface of these second nickel/gold solder pad, and this PBGA packaging part is electrically connected at this elastic fluid body.
20. elastic fluid body as claimed in claim 19 it is characterized in that the CTE of described PBGA packaging part is about 18ppm/ ℃, and the CTE of this PCB is about 5-10ppm/ ℃.
21. elastic fluid body as claimed in claim 18 is characterized in that described bullet, the material of property body is to be selected from silicone rubber compound (Silicone Rubber Compound), polyamine base Ethyl formate compound (Polyurethane Compound), polyvinyl (PolyethyleneCompound), synthetic rubber (Synthetic Rubber), silicone resin (Polysiloxaneresin Compound), acyclic compound (Acrylic Compound) and polyolefin compound (Polyolefins Compound) are formed any one in the group.
22. an elastic fluid body is characterized in that, comprising:
One elastic body has a first surface, a second surface and a plurality of lead in this elastic body, be equidistant parallel between its each these leads, and these leads and this second surface form an angle of inclination;
A plurality of first photoresist layers and a plurality of second photoresist layer are in this first surface and this second surface, and wherein, these first photoresist layers are to have an interval in exposure, development between the back, and these second photoresist layers also have this interval in exposure, development between the back;
The two ends of these leads expose this interval;
One copper foil layer coats this elastic body;
A plurality of first Copper Foils and a plurality of second Copper Foil are in this first surface and this second surface, wherein, be to have one at interval between these first Copper Foils, and also have this interval between these second Copper Foils that these first Copper Foils are to utilize these corresponding leads and these second Copper Foils to electrically connect;
The a plurality of first anti-welding insulating barrier and a plurality of this second anti-welding insulating barrier are in this first surface and this second surface, and these first anti-welding insulating barriers are to be staggered with these first Copper Foils, and these second anti-welding insulating barriers are to be staggered with these second Copper Foils; And
A plurality of first nickel/gold solder pad and a plurality of second nickel/gold solder pad is in the outer surface of these first Copper Foils and the outer surface of these second Copper Foils.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02207631 CN2532661Y (en) | 2002-03-12 | 2002-03-12 | Spring medium unit for fixing packaged device on printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02207631 CN2532661Y (en) | 2002-03-12 | 2002-03-12 | Spring medium unit for fixing packaged device on printed circuit board |
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| CN2532661Y true CN2532661Y (en) | 2003-01-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 02207631 Expired - Lifetime CN2532661Y (en) | 2002-03-12 | 2002-03-12 | Spring medium unit for fixing packaged device on printed circuit board |
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Cited By (5)
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| CN100338624C (en) * | 2003-03-11 | 2007-09-19 | 威刚科技股份有限公司 | Memory card substrate for solving line interference by using space dislocation |
| US7615706B2 (en) | 2006-08-21 | 2009-11-10 | Tpo Displays Corp. | Layout of a printed circuit board |
| CN101267713B (en) * | 2008-04-30 | 2011-04-06 | 陈国富 | Making method of electric nickel and golden circuit board for saving nickel and gold dosage |
| CN102327955A (en) * | 2011-06-23 | 2012-01-25 | 苏州旭创精密模具有限公司 | Stamping method for improving elasticity of spring piece |
| CN103426845A (en) * | 2013-07-30 | 2013-12-04 | 陕西华经微电子股份有限公司 | Two-sided independent multi-pin self-locking circuit terminals |
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2002
- 2002-03-12 CN CN 02207631 patent/CN2532661Y/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100338624C (en) * | 2003-03-11 | 2007-09-19 | 威刚科技股份有限公司 | Memory card substrate for solving line interference by using space dislocation |
| US7615706B2 (en) | 2006-08-21 | 2009-11-10 | Tpo Displays Corp. | Layout of a printed circuit board |
| CN101267713B (en) * | 2008-04-30 | 2011-04-06 | 陈国富 | Making method of electric nickel and golden circuit board for saving nickel and gold dosage |
| CN102327955A (en) * | 2011-06-23 | 2012-01-25 | 苏州旭创精密模具有限公司 | Stamping method for improving elasticity of spring piece |
| CN103426845A (en) * | 2013-07-30 | 2013-12-04 | 陕西华经微电子股份有限公司 | Two-sided independent multi-pin self-locking circuit terminals |
| CN103426845B (en) * | 2013-07-30 | 2016-01-13 | 陕西华经微电子股份有限公司 | Two-sided independence many pins band latching circuit terminal |
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