CN2519414Y - Radiating fin device for heating electron element - Google Patents

Radiating fin device for heating electron element Download PDF

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Publication number
CN2519414Y
CN2519414Y CN 02218299 CN02218299U CN2519414Y CN 2519414 Y CN2519414 Y CN 2519414Y CN 02218299 CN02218299 CN 02218299 CN 02218299 U CN02218299 U CN 02218299U CN 2519414 Y CN2519414 Y CN 2519414Y
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CN
China
Prior art keywords
heat radiation
heat
lamellar body
work
fin device
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Expired - Fee Related
Application number
CN 02218299
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Chinese (zh)
Inventor
林裕森
林倍庆
施纯铭
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Individual
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Individual
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Priority to CN 02218299 priority Critical patent/CN2519414Y/en
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Publication of CN2519414Y publication Critical patent/CN2519414Y/en
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Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a thermal fin device used in the electronic heating component. A horizontal through hole goes through the vertical thermal fins in the upper part of the heat radiation seat, thus forming another horizontal passage relative to the vertical groove shaped structure to guide air current from different directions, increasing the technology means of the guide effect and the heat radiation effect of the air current and improving the whole radiation efficiency.

Description

Fin device for the heat-generating electronic elements use
Technical field
The utility model relates to a kind of fin device for the heat-generating electronic elements use.
Background technology
At present, the development of integrated circuit processing procedure is maked rapid progress, not only computer central authorities handle the volume miniaturization more of wafer, arithmetic speed also promotes and more and more fast to some extent, this progress makes computer significantly shorten operation time, service efficiency is better, so, accelerate because central authorities handle the arithmetic speed of wafer, the lifting of its clock pulse is to produce bigger heat energy, cause higher temperature, need quick heat radiating, so central authorities handle the volume of wafer, speed is after miniaturization and accelerating, and its heat abstractor that must cooperate is promptly healed and become important, otherwise, have fast throughput even if central authorities handle wafer, once temperature raises and has little time heat radiation, it is rather unstable that central authorities handle wafer, easily cause computer to work as machine, make a futile effort; The base this, the central authorities of general computer handle wafer and promptly can the heat energy guiding of its generation be dissipated in conjunction with the utilization radiator, make its temperature height that more rises gradually and constantly promote because of the clock pulse that central authorities handle wafer, this promptly must employ the heat dissipation problem that the better heat abstractor of radiating efficiency solves high temperature, handles the stable running of wafer with auxiliary centre.
With regard to common heat abstractor, as shown in Figure 7, mainly be to be set as a radiating seat B that can paste to wafer A end face with the good aluminum metal of a thermal conductivity, its pedestal top be moulding at interval from radiating fin B1 and form relative groove columnar structure, and use a mini fan C to be arranged at radiating fin B1 top, during use, promptly use subsides and support the pedestal of wafer A the radiating fin B1 of thermal energy conduction to top, the vast area that utilizes radiating fin B1 to contact again with air, the thermolysis that tool one is basic, and the wind-force forced heat radiation of the mini fan C of mat is promoted radiating effect.
And at the above-mentioned heat abstractor of commonly using, heat conduction, flow-guiding structure design based on radiator are two big important documents of decision heat abstractor heat dissipation, this commonly use radiating seat B top at interval from radiating fin B1 be the arrangement of single direction, and form not connected cannelure columnar structure, therefore, a single direction is only had in the guiding of its air-flow, with regard to the efficient of flow-guiding radiation, the situation of its single water conservancy diversion direction has promptly limited the lifting of radiating efficiency, generally speaking, the excellent design of non-genus one.
The utility model content
The purpose of this utility model provides a kind of heat abstractor for the heat-generating electronic elements use, mainly promotes radiating efficiency in the mode of promoting guide functions.
For achieving the above object, solution of the present utility model is: be provided with in heat radiation pedestal top one group at interval from the heat radiation lamellar body that stands, wherein the lamellar body that respectively dispels the heat on this heat radiation pedestal top is equipped with horizontal open-work.
The horizontal open-work that described heat radiation lamellar body wears utilizes the punching out mode and forms protruding wall in peritreme one side in the lump.
The horizontal open-work that described heat radiation lamellar body wears is positioned at the lamellar body tip side and forms opening.
After adopting such scheme, the utility model is the means that the lamellar body that respectively dispels the heat that utilizes heat radiation pedestal top to stand wears horizontal open-work, and relative its vertical horizontal columnar structure of the heat radiation lamellar body that makes file forms another horizontal passage, increased the guide functions of guiding different directions air-flow, promote the radiating effect of air-flow, promote integral heat sink efficient.
Description of drawings
Fig. 1 is a structural representation of the present utility model;
Fig. 2 is the external view of the utility model user mode;
Fig. 3 is the section and the airflow direction schematic diagram of the utility model user mode;
Fig. 4 is the heat radiation lamellar body open-work of the present utility model example schematic of deriving;
Fig. 5 is a heat radiation lamellar body open-work variation instance schematic diagram of the present utility model;
Fig. 6 is the intention of illustration in addition that heat radiation lamellar body of the present utility model connects the heat radiation pedestal;
Fig. 7 is a composition structural representation of commonly using heat abstractor.
Embodiment
Consult shown in Figure 1, heat abstractor of the present utility model be provided with in heat radiation pedestal 1 top number at interval from the pedestal 2 that dispels the heat that stands, its heat radiation lamellar body 2 is fixed in the means of heat radiation pedestal 1, the one feasible pattern is shown in legend, be dovetail block 21 by the heat radiation lamellar body 2 lower ends dovetail groove 11 that is embedded in heat radiation pedestal 1 being connected, and main feature is:
The lamellar body 2 that respectively dispels the heat on this heat radiation pedestal 1 top is equipped with some horizontal open-works 22, forms another horizontal passage with relative its cannelure columnar structure, and the air-flow of the guiding different directions of energy mat.
When being arranged at the 3 enforcement heat radiations of central authorities' processing wafer by above-mentioned radiator structure, shown in Fig. 2,3, it is the top that the mini fan 4 of a forced heat radiation is placed heat radiation lamellar body 2, and utilize the bolt 5 of wearing the mini fan of knot to be screwed between adjacent two heat radiation lamellar bodies 2, sting mode tool one fixation of lamellar body and make mini fan 4 location with mat bolt 5 spiral shells; And work as mini fan 4 once running, its forced heat radiation wind-force of upwards blowing by attracting down just forms an air-flow effect, its air-flow is except that originally being taken away the heat energy heat radiation by the file formed vertical horizontal columnar structures circulation of lamellar body 2 of dispelling the heat, use the horizontal open-work 22 that is worn on the lamellar body 2 that respectively dispels the heat, these interconnections of its relative cannelure columnar structure institute form, also guide the air-flow of different directions, promote the scope of air-flow heat radiation, thereby promote the heat dissipation of single unit system.
In addition, as shown in Figure 4, be that the horizontal open-work 22 that makes these heat radiation lamellar bodies 2 wear must utilize the punching out mode and form protruding wall 23 in peritreme one side in the lump, the protruding wall 23 of Yan Shening is fitted and is given the area that increase contacts with air, and more increases radiating effect by this.
In addition, heat radiation lamellar body 2 of the present utility model has a variation instance again, as shown in Figure 5, be order peritreme has the horizontal open-work 22A of protruding wall 23A and must be positioned at the lamellar body tip side with the moulding of punching out mode, and form the form that a top is opening.
And for example shown in Figure 6, the heat radiation lamellar body 2 of the horizontal open-work 22 of the utility model tool is fixed in the means of heat radiation pedestal 1, it can form a horizontally extending bond end 24 in heat radiation lamellar body 2 lower ends in addition, make things convenient for the pedestal top surface of butt heat radiation pedestal 1 with mat bond end 24, and the multiple processing mode that utilizes welding makes its both to be connected, the non-genus of the design of this bond end 24 is necessary, when also the directly straight lower end of order heat radiation lamellar body 2 pedestal 1 end face and the in addition solid welding of dispelling the heat of joining.
Horizontal open- work 22,22A among aforementioned each embodiment, its shape is not exceeded with the shape shown in graphic, and the open-work of all other any geometric modelings all belongs to the feasible embodiment of this case.

Claims (3)

1, the fin device that uses for heat-generating electronic elements, be provided with in heat radiation pedestal top one group at interval from the heat radiation lamellar body that stands, it is characterized in that: the lamellar body that respectively dispels the heat on this heat radiation pedestal top is equipped with horizontal open-work.
2, the fin device for the heat-generating electronic elements use as claimed in claim 1, it is characterized in that: the horizontal open-work that this heat radiation lamellar body wears utilizes the punching out mode and forms protruding wall in peritreme one side in the lump.
3, the fin device for the heat-generating electronic elements use as claimed in claim 1, it is characterized in that: the horizontal open-work that this heat radiation lamellar body wears is positioned at the lamellar body tip side and forms opening.
CN 02218299 2002-01-08 2002-01-08 Radiating fin device for heating electron element Expired - Fee Related CN2519414Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 02218299 CN2519414Y (en) 2002-01-08 2002-01-08 Radiating fin device for heating electron element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 02218299 CN2519414Y (en) 2002-01-08 2002-01-08 Radiating fin device for heating electron element

Publications (1)

Publication Number Publication Date
CN2519414Y true CN2519414Y (en) 2002-10-30

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN 02218299 Expired - Fee Related CN2519414Y (en) 2002-01-08 2002-01-08 Radiating fin device for heating electron element

Country Status (1)

Country Link
CN (1) CN2519414Y (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100342529C (en) * 2005-11-10 2007-10-10 上海交通大学 Micropassage type radiator based on diamond film
CN101267724B (en) * 2007-03-16 2010-09-29 富准精密工业(深圳)有限公司 Heat radiation device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100342529C (en) * 2005-11-10 2007-10-10 上海交通大学 Micropassage type radiator based on diamond film
CN101267724B (en) * 2007-03-16 2010-09-29 富准精密工业(深圳)有限公司 Heat radiation device

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C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20021030