CN2499974Y

CN2499974Y - Chip radiation assembly

Info

Publication number: CN2499974Y
Application number: CN 01232219
Authority: CN
Inventors: 徐瑞源; 游承谕
Original assignee: Delta Electronics Inc
Current assignee: Taida Electronic Industry Co Ltd; Delta Electronics Inc
Priority date: 2001-07-26
Filing date: 2001-07-26
Publication date: 2002-07-10
Anticipated expiration: 2011-07-26

Abstract

A chip heat-dissipating assembly is applied to removing part of heat from chips, comprising a fan which has a plurality of holes, and a radiator which has a heat-conducting bottom board and a plurality of heat-dissipating fins, wherein corresponding to each hole, a protruding plate is formed by the heat-dissipating fin of the radiator protruding upwards, the protruding plate comprises a base part and a clamp part, and the height of the base part of the protruding plate is essentially equal to that of the fan, wherein the protruding plate passes through the corresponding hole and the clamp part is folded to have contact with the upper surface of the fan.

Description

The chip cooling assembly

Technical field

The utility model relates to a kind of chip cooling assembly, refers to a kind of chip cooling assembly that is applied to remove from cpu chip the part heat especially.

Background technology

Current chip (Integrated circuit devices) is widely used in the computer system; with CPU (CPU) is example; can produce a large amount of heat under normal operation, if the overheated shutdown that just is easy to cause system, it is unstable to make operation go up.Take place for fear of overheated situation, these chips need to remove excessive heat with heat abstractor.Chip heat radiator commonly used at present, tie up to radiator top and establish a fan, contact by fan suction surrounding air (ambient air) and with radiating fin, move in the surrounding air by radiating fin, to promote the radiating effect of radiator with forced convertion mode accelerated heat.Wherein, radiator (heat sink) adopts usually and makes such as tool high heat transfer coefficient materials such as aluminium, has several radiating fins (fin) to improve the surface area of radiator.

Fig. 1 is the assembly drawing of conventional chip radiating subassembly, radiator 12 is made of a conductive sole plate 120 and several radiating fins 121, radiating fin 121 is vertical with conductive sole plate 120, its shape is generally parallel channel form (channel-shaped) or needle-like (pin-shaped), and 120 of conductive sole plate place on the cpu chip 11.In order to promote heat transferred, above radiator 12, place a fan 13.

For fan 13 is positioned on the radiator 12, way commonly used is two sides of radiator 12 end plates 123 of pegging graft respectively, and its end plates 123 is bent upwards and forms perpendicular cover plate 124.Screw 125 is established with respect to 131 places, the aperture on the fan 13 in cover plate 124 tops.By the aperture 131 that makes screw 16 by fan 13, and be locked in screw 125, can reach the purpose that fan 13 is connected with radiator 12.

Said fans 13 is with the shortcoming of the connected mode of radiator 12:

1, the process that end plate 123 is inserted in radiator 12, end plate 123 is bent into cover plate 124 and forms screw 125 at cover plate 124 quite consumes the worker;

2, must utilize four screws 16, so the material cost height;

3, four screws 16 being locked in four screws 125 can't carry out simultaneously, must lock individually, so need four locking actions at least, built-up time is long.

Summary of the invention

The present invention's purpose is to propose a kind of chip cooling assembly, combines required built-up time with radiator to reduce fan.

Another object of the present invention is to propose a kind of chip cooling assembly, combines required material with radiator to reduce fan.

The chip cooling assembly that the utility model provided, in order to remove the part heat from a chip, it comprises:

One fan has several apertures; And

One radiator has a conductive sole plate and several radiating fins, wherein corresponding to each aperture, the radiating fin of this radiator projects upwards and forms a tab, this tab comprises a base portion and a holding division, and the height of the base portion of this tab substantially with highly the equating of this fan

Wherein, the aperture of correspondence is passed by this tab system, and this holding division bending contacts with surface on this fan.

Chip cooling assembly as described, wherein this chip be the operation among Central Processing Unit (CPU) chip.

Chip cooling assembly as described, wherein this tab and this radiator are one-body molded.

Chip cooling assembly as described, wherein the maximum crosscut length of this base portion is slightly less than the diameter in this aperture.

Chip cooling assembly as described wherein is positioned at this base portion and this holding division junction, and this tab is further established two relative breach.

The chip cooling assembly of the utility model and the main difference and the progressive of common technology are:

1, for fan is combined with radiator, need first plant end plate 123 on the radiator 12 of conventional chip radiating subassembly, again end plate 123 is bent into cover plate 124, then form screw 125 at cover plate 124, this kind process not only consumes the worker and Master Cost is also high.The tab 23 and the radiator 2 of the chip cooling assembly of the utility model are one-body molded, so the cost of manufacture of radiator is low far beyond what use always.

2, Chang Yong chip cooling assembly must utilize four screws 16 to be locked in four screws 125 of correspondence in regular turn respectively, so assemble time-consuming.After the assembling of the chip cooling assembly of the utility model only need make the tab 23 of radiator 2 pass the aperture 31 of fan 3 and exposes holding division 312, the bending holding division 312 again, reach the fixing and the locating effect of fan, the more important thing is, can utilize machine with several holding divisions 312 of action bending simultaneously, so the chip cooling assembly of the utility model is assembled on the production line of automation very easily and be rapid.

3, the assembling of the chip cooling assembly of the utility model need not used screw, and assembly is few than known technology, so very have advantage in the handling of goods and materials.

Description of drawings

Fig. 1 is the assembly drawing of conventional chip radiating subassembly;

Fig. 2 a is the decomposing schematic representation of the chip cooling assembly of the utility model preferred embodiment;

Fig. 2 b is the utility model chip cooling component groups process of assembling schematic diagram;

Fig. 2 c is the utility model chip cooling assembly assembling schematic diagram.

Embodiment

Fig. 2 a, b and c are decomposing schematic representation, assembling process schematic diagram and the assembly drawing of the chip cooling assembly of expression the utility model preferred embodiment, and the chip cooling assembly of the utility model mainly is made of a radiator 2 and a fan 3.Wherein fan 3 has four apertures 31.Radiator 2 is made for having high thermal conductivity material (for example aluminium), comprise a conductive sole plate 20 and several are the radiating fin 21 of parallel groove shape (channel-shaped), wherein the radiating fin 22 corresponding to 31 places, aperture projects upwards formation tab 23, and tab 23 is one-body molded with radiator 2.Tab 23 comprises a base portion 231 and a holding division 232, and base portion 231 is established two relative breach 233,233 ' with holding division 232 junctions.The height of base portion 231 substantially with highly the equating of fan 3, and the maximum crosscut length of base portion 231 is slightly less than the diameter in aperture 31.

Below the step of the utility model chip cooling assembly is assembled in explanation:

(1) (Fig. 2 a) at first four apertures 31 of fan 3 to be placed on tab 23 tops of radiator 2 of correspondence;

(2) make each tab 23 pass each corresponding aperture 31, and expose holding division 232 (Fig. 2 b).

(3) with about 90 degree of holding division 232 bendings, make it be close to fan 3 upper surfaces, can reach the effect (Fig. 2 c) that makes fan 3 be fixed in radiator 2.

Being characterised in that of said chip radiating subassembly and since the height of the base portion 231 of tab 23 substantially with fan 3 equate that highly therefore, tab 23 can expose holding division 232 after passing aperture 31 so that further bending.Two breach 233,233 ' design then can make the bending of holding division 232 more laborsaving.Holding division 232 after the bending can avoid fan 3 to move up and down, and reaches the effect that makes fan 3 vertical direction location; And because the maximum crosscut length of base portion 231 is slightly less than the diameter in aperture 31, therefore, the fan move left and right can be avoided or reduce to base portion 231, reaches the effect that makes fan 3 horizontal location.

In sum, that the chip cooling assembly that the utility model provided has is easy to assembly, component count reduces and locate good advantage, and can exempt the shortcoming that runs in the known technology, has novelty, creativeness and practicality.

Any those of ordinary skill in the art, improvement and the modification done in not breaking away from spirit and scope of the present utility model all are considered as belonging in the appended claim scope of the utility model.

Claims

1. a chip cooling assembly is used for removing the part heat from a chip, it is characterized in that comprising:

One fan has several apertures; And

Wherein, this tab passes corresponding aperture, and this holding division bending contacts with surface on this fan.

2. chip cooling assembly as claimed in claim 1, it is characterized in that this chip for the operation among Central Processing Unit (CPU) chip.

3. chip cooling assembly as claimed in claim 1 is characterized in that this tab and this radiator are one-body molded.

4. chip cooling assembly as claimed in claim 1 is characterized in that the maximum crosscut length of this base portion is slightly less than this orifice diameter.

5. chip cooling assembly as claimed in claim 1 is characterized in that being positioned at this base portion and this holding division junction, and this tab is further established two relative breach.