CN1243298C - Detachable heat dissipating for internal memory module of computer - Google Patents
Detachable heat dissipating for internal memory module of computer Download PDFInfo
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- CN1243298C CN1243298C CN 03100341 CN03100341A CN1243298C CN 1243298 C CN1243298 C CN 1243298C CN 03100341 CN03100341 CN 03100341 CN 03100341 A CN03100341 A CN 03100341A CN 1243298 C CN1243298 C CN 1243298C
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- heat
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- internal memory
- fan
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Abstract
The present invention relates to a detachable heat radiator applying to a memory module in a computer, which comprises a radiating plate module and a radiator module, wherein the radiating plate module is composed of two groups of involution radiating fins made of heat-conductive material, the radiating plate module is assembled on or covers a memory module by locking screw positioning or clamping and tenoning positioning, and a heat source generated by the memory module is conducted to an upper extension part of two groups of involution radiating fins to carry out heat exchange; the radiator module can be used as a heat radiation module of a fan frame or a heat radiation module of a heat conduction pipe, the heat radiation module of the fan frame can be assembled and buckled on an embedment groove base of a memory to make the upper extension part of the two groups of involution radiating fins absorb the heat source of the memory module to carry out heat exchange, and the heat radiation module of the heat conduction pipe is butted with and attached to the upper extension part of the two groups of involution radiating fins in a locking or clamping manner to make the upper extension part of the two groups of involution radiating fins absorb the heat source of the memory module to carry out heat exchange. Consequently, the present invention provides heat radiation for the memory module to ensure the execution efficiency of the memory module.
Description
Technical field
The present invention relates to a kind of heat abstractor, particularly a kind of removable jew heat abstractor that is applied to the computer-internal memory member.
Background technology
Computing machine is being carried out between operational stage, its inner many electronic packages and memory part can produce many thermals source, the required memory part of looking for novelty of particularly high-speed computing machine more can produce thermal source, the heat source temperature of this memory part continues to rise can influence its execution usefulness, serious even cause memory part to lose efficacy, and the heat abstractor that designs at this memory part heat dissipation problem is not arranged at present.
Summary of the invention
The purpose of this invention is to provide a kind of removable jew heat abstractor that is applied to the computer-internal memory member, before the PC motherboard, not needing to change just can be mounted on the memory part, include heat sink parts and heat sink assembly, these heat sink parts are made up of the involutory heat radiator of two groups of heat-conductings, and adopt with locking screw location or clamping trip location and group is established and is coated on the memory part, the top extension that is provided with thermal source that memory part produces is conducted to two groups of involutory heat radiator is done heat interchange, this heat sink assembly is the thermal component of fan frame body or the thermal component of heat pipe, the thermal component of this fan frame body can be organized and be buckled on the internal memory caulking groove seat, make the top extension of two groups of involutory heat radiator absorb the memory part thermal source, the thermal component of this heat pipe is with locking or clamping mode and against the extension top that is attached at two groups of involutory heat radiator, absorb the memory part thermal source with top extension and do heat interchange two groups of involutory heat radiator, and then the heat radiation of memory part is provided, with the usefulness of guaranteeing that memory part is carried out.
The present invention is described in detail with instantiation below in conjunction with accompanying drawing.
Description of drawings
Fig. 1 is a preferred embodiment schematic perspective view of removable jew heat abstractor of the present invention;
Fig. 2 is the heat sink parts associated components decomposing schematic representation of removable jew heat abstractor of the present invention;
Fig. 3 is that heat sink parts of the present invention are coated on the diagrammatic cross-section on the memory part;
Fig. 4 is that heat sink parts of the present invention are coated on the diagrammatic cross-section with the heat conduction of heat radiation interface of inner space on the memory part;
Fig. 5 is that another pattern heat sink parts of the present invention are coated on the associated components decomposing schematic representation on the memory part;
Fig. 6 is a preferred embodiment associated components perspective exploded view of removable jew heat abstractor of the present invention;
Fig. 7 is the group structure view of fan frame body button group of the present invention in internal memory caulking groove seat top;
Fig. 8 is the enforcement cross-ventilation view of fan frame body button group of the present invention in internal memory caulking groove seat top;
Fig. 9 is another preferred embodiment synoptic diagram of removable jew heat abstractor of the present invention.
Drawing reference numeral explanation: 1 heat sink parts; 111 concave groove; 113 extensions; 115 ventilative slotted eyes; 21 fan frame bodies; 212 frame grooves; 214 draw-in grooves; 23 heat pipes; 3 memory parts; 32. perforation; 5 screws; 7 internal memory caulking groove seats; 11 involutory heat radiator; 112 perforation; 114 radiating fins; 2 heat sink assemblies; 211 top frames; 213 frame pin; 215 oblique angle faces; 231 radiating fins; 31 chips; 4 heat conducting interfaces; 6 trips; 71 groups of fasteners.
Embodiment
See also Fig. 1, the invention provides a kind of removable jew heat abstractor that is applied to the computer-internal memory member, mainly include heat sink parts 1 and a heat sink assembly 2, wherein these heat sink parts 1 are divided into the involutory heat radiator 11 of two groups of heat-conductings, group is established and is coated on the memory part 3, be respectively equipped with concave groove 111 on the involutory surface of these two groups of involutory heat radiator 11, can do to cover to the outstanding chip 31 in two outsides of memory part 3 respectively and cover and the heat conduction (as shown in Figure 3) of directly conflicting, or utilize chip 31 and concave groove 111 clearance spaces, do thermal source conduction (as shown in Figure 4) by a heat conducting interface 4, and this heat conducting interface 4 can be thermal grease or heat radiation adhesive tape, and these two groups involutory heat radiator 11 plural groups on corresponding to memory part 3 32 positions of boring a hole also are drilled with perforation 112, so corresponding perforation 112,32 can adopt with locking screw 5 locator meamss (as shown in Figure 2) or clamping trip 6 locator meamss (as shown in Figure 5), establish involutory location so that two groups of involutory heat radiator 11 must firmly be organized on memory part 3, these two groups involutory heat radiator 11 are provided with radiating fin 114 (as shown in Figure 2) or ventilative slotted eye 115 (as shown in Figure 5) disperses for circulation of air and thermal source in top extension 113 again.
See also Fig. 6, the radiating frame parts that above-mentioned heat sink assembly 2 is fan-types, it is made up of a fan frame body 21 and at least one group of fan 22 (being two groups of fans 22 in the legend), this fan frame body 21 is for being the flexible ㄇ shape of both sides flexible framework, it is to hollow out two groups of frame grooves 212 that extended to both sides by the surface, top in top frame 211, and these two groups of frame grooves 212 up or different angles such as below or side organize respectively and establish a fan 22 (among the figure for above frame groove 212), this fan frame body 21 is respectively equipped with a draw-in groove 214 in two side frame pin, 213 inner face side bottom again, and two side frame pin, 213 inner face side root edges are for being an oblique angle face 215.
See also Fig. 6 to Fig. 8 again, plural groups memory part 3 is inserted respectively and is embedded on the internal memory caulking groove seat 7 of motherboard, being subjected to dial fastener 71 locatees as clip, so 21 liang of side frame pin of fan frame body 213 are outwards dialled and are pushed away, and the oblique angle face 215 that utilizes its two side frames pin, 213 inner face side root edges dial towards both sides, internal memory caulking groove seat 7 top fastener 71 do guiding against, can detain respectively to pull with the draw-in groove 214 that makes two side frame pin, 213 inner face side bottoms and dial on the fastener 71 in both sides, internal memory caulking groove seat 7 top, allow fan frame body 21 firm pincer attacks be positioned internal memory caulking groove seat 7 tops, and make the top frame 211 of fan frame body 21 and fan 22 bolsters in extension 113 tops of two groups of involutory heat radiator 11, the thermal source that the chip 31 of respectively organizing memory part 3 like this is sent can conduct on the extension 113 through coating two groups of involutory heat radiator 11 on it do heat conduction, the adsorbed air in fan 22 tops this moment can disperse in extension 113 enterprising line space air communication and thermal source in delivery, and then reach the heat radiation purpose of memory part 3, with the usefulness of guaranteeing that memory part 3 is carried out.
As shown in Figure 9, heat sink assembly 2 of the present invention is the thermal component kenels that may further be a kind of heat pipe, it is made up of a heat pipe 23 and one group of fan 22, this heat pipe 23 is with locking or clamping mode and stretching out against extension 113 tops that are attached at two groups of involutory heat radiator 11, its extending end also is provided with radiating fin 231, for thermal source that extension 113 absorbs can be sent on the terminal radiating fin 231 through heat pipe 23, fan 22 then is arranged at radiating fin 231 1 sides, fan 22 adsorbed air can be blowed on radiating fin 231 do heat interchange, equally also can reach the heat radiation purpose of memory part 3, with the usefulness of guaranteeing that memory part 3 is carried out.
Claims (8)
1. removable jew heat abstractor that is applied to the computer-internal memory member comprises:
The heat sink parts, involutory heat radiator by two groups of heat-conductings is formed, and adopt with locking screw location or clamping trip location and group is established and is coated on the memory part, be provided with that thermal source that memory part produces is conducted to the top extension and do heat interchange, wherein, be respectively equipped with concave groove on the involutory surface of two groups of involutory heat radiator, covering the outstanding chip in covering memory parts two outsides respectively, and be provided with radiating fin from the aduncate extension of described concave groove;
Heat sink assembly, the radiating frame parts of forming by a fan frame body and at least one group of fan, this fan frame body is that both sides have the flexible frame pin of flexible, and hollow out two groups of frame grooves that extend to two side frame pin by the surface, top in the top of fan frame body frame, for cross-ventilation, and can organize respectively on these two groups of frame grooves and establish a fan to strengthen cross-ventilation;
Wherein, the array memory part is inserted respectively and is embedded on the internal memory caulking groove seat of motherboard, fan frame body utilizes two side frame pin to stretch button and organize in dialling fastener and do the clip location to extending out, make the top frame of fan frame body and fan bolster in the extension position of two groups of involutory heat radiator, produce convection current with blow air, top extension to two groups of involutory heat radiator is done heat interchange, and then the heat radiation of memory part is provided.
2. be applied to the removable jew heat abstractor of computer-internal memory member according to claim 1, wherein this fan frame body is respectively equipped with a draw-in groove in two side frame pin inner face side bottom, and two side frame pin inner face side root edges are an oblique angle face.
3. as being applied to the removable jew heat abstractor of computer-internal memory member as described in the claim 2, wherein this fan frame body is at the oblique angle face of two side frame pin, for dial towards both sides, internal memory caulking groove seat top fastener do guiding against, can detain respectively with the draw-in groove that makes two side frame pin inner face side bottoms and to pull, make the firm pincer attack of fan frame body be positioned internal memory caulking groove seat top in dialling on the fastener.
4. as being applied to the removable jew heat abstractor of computer-internal memory member as described in the claim 3, wherein the chip of this memory part and concave groove clearance space are done the thermal source conduction by a heat conducting interface, and this heat conducting interface is thermal grease or heat radiation adhesive tape.
5. be applied to the removable jew heat abstractor of computer-internal memory member according to claim 1, wherein these two groups of involutory heat radiator are drilled with perforation corresponding to plural groups punch position on the memory part, utilize this perforation to adopt, establish involutory location on memory part so that two groups of involutory heat radiator must firmly be organized with locking screw location or clamping trip location.
6. be applied to the removable jew heat abstractor of computer-internal memory member according to claim 1, wherein these two groups involutory heat radiator top extensions are provided with ventilative slotted eye, disperse for circulation of air and thermal source.
7. be applied to the removable jew heat abstractor of computer-internal memory member according to claim 1, wherein the fan that assembles of fan frame body can be above or below the frame groove or different angles such as side assemble, to strengthen cross-ventilation.
8. be applied to the removable jew heat abstractor of computer-internal memory member according to claim 1, the extension of two groups of involutory heat radiator top fixing heat pipe also wherein, the set radiating fin of the outward extending end of this heat pipe is arranged at a side of described fan.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 03100341 CN1243298C (en) | 2003-01-14 | 2003-01-14 | Detachable heat dissipating for internal memory module of computer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 03100341 CN1243298C (en) | 2003-01-14 | 2003-01-14 | Detachable heat dissipating for internal memory module of computer |
Publications (2)
Publication Number | Publication Date |
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CN1517830A CN1517830A (en) | 2004-08-04 |
CN1243298C true CN1243298C (en) | 2006-02-22 |
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CN 03100341 Expired - Fee Related CN1243298C (en) | 2003-01-14 | 2003-01-14 | Detachable heat dissipating for internal memory module of computer |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8059403B2 (en) | 2009-01-23 | 2011-11-15 | Asustek Computer Inc. | Heat dissipation device |
Families Citing this family (14)
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KR100650122B1 (en) * | 2004-09-20 | 2006-11-27 | 잘만테크 주식회사 | Heat sink |
US8837139B2 (en) * | 2007-09-29 | 2014-09-16 | Biao Qin | Flat heat pipe radiator and application thereof |
CN101661314B (en) * | 2008-08-27 | 2011-10-12 | 四零四科技股份有限公司 | Radiating structure for expanding laminated plate framework |
CN101661317B (en) * | 2008-08-29 | 2013-03-13 | 富准精密工业(深圳)有限公司 | Heat radiation device |
CN101997194B (en) * | 2009-08-11 | 2013-11-13 | 冯林 | Memory protection device and computer |
CN102289267A (en) * | 2010-06-18 | 2011-12-21 | 鸿富锦精密工业(深圳)有限公司 | Heat radiation device of memory |
CN102340969B (en) * | 2010-07-19 | 2015-11-25 | 技嘉科技股份有限公司 | There is the heat abstractor of tilting double fan |
CN102375504B (en) * | 2010-08-09 | 2016-09-07 | 国家电网公司 | Electronic equipment and memory bar clamping device thereof |
CN102541218A (en) * | 2010-12-25 | 2012-07-04 | 鸿富锦精密工业(深圳)有限公司 | Heat radiator for memory module |
CN102595849A (en) * | 2011-01-12 | 2012-07-18 | 鸿富锦精密工业(深圳)有限公司 | Heat radiating device |
CN103926987A (en) * | 2013-01-11 | 2014-07-16 | 鸿富锦精密工业(深圳)有限公司 | Memory bank cooling device |
CN104914945A (en) * | 2015-05-19 | 2015-09-16 | 铜陵宏正网络科技有限公司 | Portable computer heat dissipation assembly heat conduction structure |
CN104952817A (en) * | 2015-05-20 | 2015-09-30 | 铜陵宏正网络科技有限公司 | Tower-type heat radiating component for computer CPU (central processing unit) |
CN114758681B (en) * | 2022-04-22 | 2023-07-18 | 李贺 | Data storage device based on computer technology makes things convenient for dismouting to overhaul |
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2003
- 2003-01-14 CN CN 03100341 patent/CN1243298C/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8059403B2 (en) | 2009-01-23 | 2011-11-15 | Asustek Computer Inc. | Heat dissipation device |
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CN1517830A (en) | 2004-08-04 |
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