CN2472267Y

CN2472267Y - Chip Radiator

Info

Publication number: CN2472267Y
Application number: CN 01209875
Authority: CN
Inventors: 叶哲辅; 蔡垂儒
Original assignee: DAZHONG COMPUTER Co Ltd
Current assignee: DAZHONG COMPUTER Co Ltd
Priority date: 2001-02-26
Filing date: 2001-02-26
Publication date: 2002-01-16
Anticipated expiration: 2011-02-26

Abstract

The utility model relates to an improved wafer heat-dissipation device, which comprises a heat dissipation base and a fan device; wherein, a plurality of heat dissipation fins and the fan device are arranged on the heat dissipation base; an inclined plane is arranged at a hollow casing and a fan is arranged at the top of the casing, while an opening hole is arranged on the higher side of the top of the inclined plane on the casing; a chip cooling device is arranged on the computer mainboard, and mainly on the wafers to be cooled (e.g. North bridge wafer); the heat dissipation fins of the heat dissipation base can assist in the radiation of the wafer, while the fan can facilitate the radiation of the heat dissipation base. While the opening hole of the radiator can be arranged directly facing the secondary wafers to be cooled (e.g. VRM). The cold air coming from the fan is blown to the secondary wafers to be cooled from the opening hole to assist the radiation of the chip. Two wafers can be cooled at the same time by the radiator, and the opening hole direction can be changed according to the choices of users.

Description

The wafer heat abstractor

The utility model relates to a kind of wafer heat abstractor, and its main member is a heat dissipation base and a fan assembly; This heat dissipation base is provided with a plurality of radiating fins, and this fan assembly is arranged on this heat dissipation base, it is that a hollow and this top are the housing on an inclined-plane, have a fan to be arranged at the top of this housing, and this housing is a tapping in the side of this top, inclined-plane upper side.

In the PC industry, this bridge wafer has added the function of integrating figure in recent years, so can cause north bridge wafer heat dissipation problem; Again, CPU speed is more and more faster, causes the loading current of motherboard increasing, especially, be L10SFET, the Capacitor in VRM zone and Choke often temperature is too high, so can cause VRM zone heat dissipation problem.

Again, see also the 1st figure, be the schematic perspective view of traditional heat-dissipating device structure; As shown in the figure, a base 1 which is provided with a plurality of radiating fins 10, and this heating radiator is installed on the heater element, can utilize these a plurality of radiating fins 10 to make this heater element heat radiation; But only use the effect of radiating fin 10 heat radiations limited,, so can increase the radiating effect of this heating radiator so on this base 1, establish a fan 2 (seeing also the 2nd figure):

The heater element but this traditional heat-dissipating device can only dispel the heat, two heater elements that can't dispel the heat simultaneously if will dispel the heat two heater elements (as this north bridge and the VRM zone of dispelling the heat simultaneously), then need two heat radiations to clamor, so not only take up space, and more power consumption.

The purpose of utility model provides a kind of wafer heat abstractor of improvement, not only can make this heating radiator two heater elements that can dispel the heat simultaneously, again good radiating efficiency can be arranged; Wherein the top be an inclined-plane housing can make fan with wind to this wafer over against tapping, so can make this heating radiator can dispel the heat simultaneously two places heater element (as, north bridge wafer and VRM zone).

Another purpose of the present utility model provides a kind of wafer heat abstractor of improvement, and it can be furnished the tapping of this heat abstractor in different directions according to need, and so set-up mode can be used on the different motherboards.

The another purpose of the utility model provides a kind of wafer heat abstractor of improvement, and it can utilize a heating radiator two heater elements that go to dispel the heat, and so can not influence under the heat sinking benefit, uses two heating radiators more to save the required electric power that expends and saves the motherboard space.

The wafer heat abstractor of improvement provided by the utility model comprises: a housing, and it is that hollow and top are the housing on an inclined-plane, and is provided with a tapping in the side of this case top upper side; With a fan, be arranged at case top.

The utility model also comprises a heat dissipation base, is arranged under this housing, and has a plurality of heat radiation heat sheets to be arranged at this heat dissipation base to take.

Below in conjunction with accompanying drawing the utility model is described in detail, this description will make above-mentioned purpose of the present utility model, advantage become clearer.

Fig. 1 is the schematic perspective view that traditional heating radiator is constructed;

Fig. 2 is the schematic perspective view that another traditional heating radiator is constructed;

Fig. 3 is the utility model one preferred embodiment schematic perspective view;

Fig. 4 is the vertical view of the utility model one preferred embodiment;

Synoptic diagram when Fig. 5 is the utility model one preferred embodiment enforcement;

Fig. 6 is the synoptic diagram of the utility model one preferred embodiment when implementing on motherboard.

Fig. 3 and Fig. 4 are the schematic perspective view and the vertical views of the utility model one preferred embodiment.As shown in the figure, this heat dissipation base 4 is provided with a plurality of radiating fins 42; This fan assembly 3 is that a hollow and this top are the housing 32 on an inclined-plane, there is a fan 30 to be arranged at this case top, and this housing 32 is a tapping 36 in the side that this sloped roof is closed upper side, and four jiaos of these housing 32 bottoms are respectively equipped with a junction surface 34, and this housing 32 fixing using can be provided.

Fig. 5 and Fig. 6 are that the synoptic diagram of the utility model one preferred embodiment reaches the synoptic diagram when implementing on motherboard; As shown in the figure, this wafer heating radiator can be fixed on the motherboard, and the fan 30 of this fan assembly 3 can make air-flow flow along directions X and suck, and air-flow is blown out along the Y direction from tapping 36 again; So this wafer heating radiator do not utilize only 42 pairs of a plurality of radiating fins on this heat dissipation base 4 be arranged at the following wafer of this wafer heating radiator (as, north bridge wafer 5) heat radiation, can make again this air-flow air cooling that blows out from tapping 36 place wafer over against this tapping 36 (as, VRM zone 6): so, this heat abstractor just has the effect of the two place's wafers that can dispel the heat simultaneously.

The utility model can utilize a plurality of radiating fins 42 heat radiations on this heat dissipation base 4 to be located at the following wafer of this wafer heating radiator; Yet, the air-flow that the fan 30 of this fan assembly 3 is sucked not only can blow out with cooling from tapping 36 and place over against the wafer of this tapping 36, also can help to place the following wafer of this heating radiator to cool off, so can share the heat radiation work of a plurality of radiating fins 42 on this heat dissipation base 4, to increase its cooling effectiveness; And this heating radiator can have the setting of four different directions, and the user can select different directions that this heating radiator is set according to the direction difference of the wafer position of the difference of motherboard and institute's desire cooling.

In sum, the utility model is improved relevant for a kind of wafer heat abstractor, and it mainly is made up of a heat dissipation base and a fan assembly; This heat dissipation base is provided with a plurality of radiating fins, and this fan assembly is arranged on this heat dissipation base, it is that a hollow and this top are the housing on an inclined-plane, have a fan to be arranged at the top of this housing, and this housing is a tapping in the side of this top, inclined-plane upper side; This radiating fin can be opposite to the heat radiation of the beneath wafer of this heating radiator, but and the air-flow air cooling that blows out of fan place wafer over against tapping; And this heating radiator can be with the needing conversion it be provided with the position of user, to change the air-flow blow-off direction, so applicable to various motherboards.

The foregoing description is one of a utility model preferred embodiments only, is not to be used for limiting the utility model protection domain.The utility model protection domain is determined by claim of the present utility model.

Claims

1, a kind of wafer heat abstractor of improvement, it is characterized in that comprising:

One housing is that hollow and top are the housing on an inclined-plane, and is provided with a tapping in the side of this case top upper side; And

One fan is arranged at case top.

2, wafer heat abstractor as claimed in claim 1 is characterized in that also comprising a heat dissipation base, is to be arranged under this housing, and has a plurality of heat radiation heat sheets to be arranged at this heat dissipation base to take.

3,, it is characterized in that fan is a tubeaxial fan as claim 1 a described wafer heat abstractor.

4, wafer heat abstractor as claimed in claim 1 is characterized in that four jiaos of housing bottom are respectively equipped with a junction surface, and engaging of this housing and motherboard can be provided.