CN2460634Y - Thermal insulation compound external wallboard with resin and facing layer - Google Patents
Thermal insulation compound external wallboard with resin and facing layer Download PDFInfo
- Publication number
- CN2460634Y CN2460634Y CN 01201106 CN01201106U CN2460634Y CN 2460634 Y CN2460634 Y CN 2460634Y CN 01201106 CN01201106 CN 01201106 CN 01201106 U CN01201106 U CN 01201106U CN 2460634 Y CN2460634 Y CN 2460634Y
- Authority
- CN
- China
- Prior art keywords
- resin
- keel
- layer
- thermal
- facing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011347 resin Substances 0.000 title claims abstract description 21
- 229920005989 resin Polymers 0.000 title claims abstract description 21
- 238000009413 insulation Methods 0.000 title claims abstract description 18
- 150000001875 compounds Chemical class 0.000 title abstract description 3
- 239000002131 composite material Substances 0.000 claims description 7
- 238000004321 preservation Methods 0.000 claims description 6
- 239000004567 concrete Substances 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 239000008393 encapsulating agent Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 230000003014 reinforcing effect Effects 0.000 abstract description 5
- 239000004570 mortar (masonry) Substances 0.000 abstract description 4
- 238000009434 installation Methods 0.000 abstract description 2
- 230000002349 favourable effect Effects 0.000 abstract 1
- 230000035939 shock Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 12
- 238000010276 construction Methods 0.000 description 10
- 238000010923 batch production Methods 0.000 description 6
- 210000003195 fascia Anatomy 0.000 description 6
- 229910000831 Steel Inorganic materials 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000013475 authorization Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011150 reinforced concrete Substances 0.000 description 1
- 230000001932 seasonal effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
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Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 01201106 CN2460634Y (en) | 2001-01-12 | 2001-01-12 | Thermal insulation compound external wallboard with resin and facing layer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 01201106 CN2460634Y (en) | 2001-01-12 | 2001-01-12 | Thermal insulation compound external wallboard with resin and facing layer |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2460634Y true CN2460634Y (en) | 2001-11-21 |
Family
ID=33623237
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 01201106 Expired - Fee Related CN2460634Y (en) | 2001-01-12 | 2001-01-12 | Thermal insulation compound external wallboard with resin and facing layer |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN2460634Y (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101429790B (en) * | 2008-12-20 | 2011-04-20 | 宫海西 | Shock-absorbing thermal-insulation decoration type wall structure |
CN105113709A (en) * | 2015-09-10 | 2015-12-02 | 河南万道捷建股份有限公司 | Novel wallboard convenient to install |
CN105298062A (en) * | 2015-10-30 | 2016-02-03 | 中汇建筑集团有限公司 | Assembly type self-thermal-insulation light-weight concrete wall hanging panel and installation method |
-
2001
- 2001-01-12 CN CN 01201106 patent/CN2460634Y/en not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101429790B (en) * | 2008-12-20 | 2011-04-20 | 宫海西 | Shock-absorbing thermal-insulation decoration type wall structure |
CN105113709A (en) * | 2015-09-10 | 2015-12-02 | 河南万道捷建股份有限公司 | Novel wallboard convenient to install |
CN105298062A (en) * | 2015-10-30 | 2016-02-03 | 中汇建筑集团有限公司 | Assembly type self-thermal-insulation light-weight concrete wall hanging panel and installation method |
CN105298062B (en) * | 2015-10-30 | 2018-01-12 | 中汇建筑集团有限公司 | A kind of installation method of Assembled self-insulating lightweight concrete wall-mounted panel |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: BEIJING JULE TECHNOLOGY CO., LTD Free format text: FORMER OWNER: DAI ZHE Effective date: 20041224 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20041224 Address after: 100102 Wang Haibo, 36 middle third ring road, Haidian District, Beijing Patentee after: Beijing happy Technology Co., Ltd. Address before: 100086 Beijing Haidian District City West Shuangyushu Building No. 3, No. 1109 Patentee before: Dai Zhe |
|
C57 | Notification of unclear or unknown address | ||
DD01 | Delivery of document by public notice |
Addressee: Beijing happy Technology Co., Ltd. Document name: Notice of conformity |
|
C57 | Notification of unclear or unknown address | ||
DD01 | Delivery of document by public notice |
Addressee: Beijing happy Technology Co., Ltd. Document name: Notification of Termination of Patent Right |
|
C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |