CN2458660Y - CPU phase converting radiator for notebook computer - Google Patents
CPU phase converting radiator for notebook computer Download PDFInfo
- Publication number
- CN2458660Y CN2458660Y CN 00261904 CN00261904U CN2458660Y CN 2458660 Y CN2458660 Y CN 2458660Y CN 00261904 CN00261904 CN 00261904 CN 00261904 U CN00261904 U CN 00261904U CN 2458660 Y CN2458660 Y CN 2458660Y
- Authority
- CN
- China
- Prior art keywords
- metal fiber
- notebook computer
- heat sink
- change heat
- computer cpu
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a CPU phase converting radiator for a notebook computer, which comprises a sealed vacuum casing. The casing is filled with working liquid; the external surface of the casing made of oxygen free copper material is coated with a layer of silver film; the interior of the casing is provided with a plurality of strip silk-shaped metal fiber silks; the center of the metal fiber silks is provided with a spiral steam passage; the metal fiber silks are evenly covered on the periphery of the spiral passage. Capillary pumping force generated by capillary spaces between the metal fiber silks and the spiral passage and between the metal fiber silks and the inner surface of the casing forms a main liquid return passage.
Description
The utility model relates to a kind of notebook computer cpu heat, is in particular a kind of notebook computer CPU phase-change heat sink.
Because it is ultrathin that existing notebook is pursued, therefore the heating radiator of CPU is pursued thin, thin.The U.S., Japan, Korea S have all adopted micro heat pipe (essence is small heat pipe) at present, as the heating radiator of notebook computer.The heat pipe of heating radiator can be that circle also can be pressed into platypelloid type with round tube.The micro heat pipe internal heat transfer mechanism of various countries is identical, but concrete structure difference mainly is the difference of imbibition core.The U.S. adopts sintered copper powder imbibition core, and the electrician of Furukawa Electronic adopts carbon fiber as the imbibition core, and another company adopts silk screen to make the imbibition core, has formed patent separately.The skin of micro heat pipe is plating not generally, nickel plating is also arranged as protective seam.
The purpose of this utility model is exactly to provide a kind of notebook computer CPU phase-change heat sink for the above-mentioned defective that solves prior art.
The purpose of this utility model realizes by following technical solution:
A kind of notebook computer CPU phase-change heat sink, it comprises Packed vaccum case, hydraulic fluid is housed in the housing, outside surface at its oxygen-free copper mass shell body is coated with one deck silverskin, some thread metal fiber wires are arranged in the inside of housing, one spiral steam channel is arranged at the center of metal fiber wire, metal fiber wire evenly covers the periphery of helical duct, and the capillary suction force that fine gap produced between metal fiber wire and helical duct and metal fiber wire and the shell inner surface has constituted main liquid reflux channel.
The purpose of this utility model also can further realize by following technology solution:
Aforesaid a kind of notebook computer CPU phase-change heat sink, wherein said vapor stream is through the annular central passage, and liquid refluxes in fibrous bundle.
Aforesaid a kind of notebook computer CPU phase-change heat sink, wherein said hull shape can be circle, pancake, rectangle or ellipse.
Aforesaid a kind of notebook computer CPU phase-change heat sink, wherein said housing can bend to 90 ° or U type.
Aforesaid a kind of notebook computer CPU phase-change heat sink, it can be single, also can many parallel connections.
Hydraulic fluid in the aforesaid a kind of notebook computer CPU phase-change heat sink, wherein said housing can be water, acetone, alcohol or F113 and other organic working medium.
When advantage of the present utility model was its work, the heat that can rapidly CPU be produced in small space passes loose to a draughty place, or has on the radiator of open radiating surface.Because it is to rely on the Liquid-Vapor Phase Transition of inner hydraulic fluid to transmit heat, so internal thermal resistance is minimum.Be in inside different with it of the present invention adopted numerous copper wire bundle (diameter is less than 7 microns), in order not influence flowing of steam, the spiral pipe passage of a circle arranged at the center of copper wire bundle.These are different with the notion of arterial highway in the general heat pipe wicks, and the pipe passage (title arterial highway) in the general heat pipe is as steam channel.It mainly is that the capillary force that produces by filaments bundles impels liquid to reflux that liquid refluxes.It is compared with the liquid sucting core structure that the above reaches, and has good isothermal, big through-put power, more cheap processing cost.Outside surface has adopted silver-plated processing, both can prevent that the oxidation of copper from strengthening heat transmission resistance, again appearance attractive in appearance can be arranged.
The utility model will be further described below in conjunction with accompanying drawing:
Fig. 1 is the utility model structural representation.
Fig. 2 is the A-A sectional view of Fig. 1.
As shown in Figure 1 and Figure 2, it comprises Packed vaccum case 2 the utility model, hydraulic fluid 6 is housed in the housing 2, outside surface at its oxygen-free copper mass shell body 2 is coated with one deck silverskin 11, some thread metal fiber wires 5 are arranged in the inside of housing 2, one spiral steam channel 8 is arranged at the center of metal fiber wire 5, metal fiber wire 5 evenly covers the periphery of helical duct 8, and the capillary suction force that fine gap produced between metal fiber wire 5 and helical duct 8 and metal fiber wire 5 and the shell inner surface 3 has constituted main liquid reflux channel.Electroplate layer 11 can prevent the copper surface oxidation, reduces thermal conduction resistance, and clean and tidy outward appearance is arranged; Adopt fine and closely woven helical duct 8, steam 7 is passed through in helical duct 8 central authorities, reduced the resistance that shearing takes place with withdrawing fluid 6; The outside of thin helical duct 8 and the minim gap between metal fiber wire 5 and the shell inside surface 3 will produce the backflow that additional capillary force helps liquid 6.Wherein said vapor stream is through the annular central passage, and liquid refluxes in fibrous bundle.The utlity model has multiple shape, as: flat stripe shape, circular bar shape or oval bar shaped etc., and 90 ° of flexible one-tenth or U type; Hydraulic fluid 6 of the present utility model can be water, acetone, alcohol or F113 (a kind of freon medium) and other organic working medium; The utlity model has very high vacuum tightness and few filling amount, it can singlely use, also can many in parallel uses.
As shown in Figure 1, 2, the utility model can be flat strip shaped, and thickness is not more than 2mm, and width is decided by the power of required transmission, can reach 9mm.It includes the copper shell 2 of a pancake two ends sealing, and the outside surface of housing 2 is coated with the very thin silver of one deck 11.The inside of shell has many (nearly hundred) thread metal fiber wire 5.During its work, extraneous heat 1 is from CPU, the shell wall of the copper shell 2 of process heating radiator arrives shell inner surface 3, the liquid 6 that a holds in the heating of metal filament 5 also makes it to become steam bubble 4, steam bubble 4 continues to be heated to grow up to break and forms steam 7, steam 7 enters in the cold junction b of metal fiber wire 5 along the inner chamber 9 of thin helical duct 8, be subjected to the influence of the outer cold environment of housing, emitting vaporization and arranging heat to pass shell wall to reach the outer cold flow 10 of passing to of pipe, being sent to mission in the surrounding environment with regard to having finished heat with the CPU generation like this.In order to finish this task continuously, the liquid 6 of condensation must flow back into heating end and go to continue to accept the heat vaporization.The power that this liquid returns is to be finished by the capillary suction force that minim gap produced that fine fibre and circular passage outer shroud and fiber and shell wall form.All these processes all are to produce under the condition of housing inner height vacuum and finish.
Claims (6)
1. notebook computer CPU phase-change heat sink, it comprises Packed housing, hydraulic fluid is housed in the housing, it is characterized in that being coated with one deck silverskin at the outside surface of its oxygen-free copper mass shell body, some thread metal fiber wires are arranged in the inside of housing, one spiral steam channel is arranged at the center of metal fiber wire, metal fiber wire evenly covers the periphery of helical duct, and the capillary suction force that fine gap produced between metal fiber wire and helical duct and metal fiber wire and the shell inner surface has constituted main liquid reflux channel.
2. a kind of notebook computer CPU phase-change heat sink according to claim 1 is characterized in that vapor stream through the annular central passage, and liquid refluxes in fibrous bundle.
3. a kind of notebook computer CPU phase-change heat sink according to claim 1 is characterized in that hull shape can be circle, pancake, rectangle or ellipse.
4. a kind of notebook computer CPU phase-change heat sink according to claim 1 is characterized in that 90 ° of flexible one-tenth of its housing or U type.
5. a kind of notebook computer CPU phase-change heat sink according to claim 1 is characterized in that it can be single, also can many parallel connections.
6. a kind of notebook computer CPU phase-change heat sink according to claim 1 is characterized in that the hydraulic fluid in the described housing can be water, acetone, alcohol or F113 and other organic working medium.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 00261904 CN2458660Y (en) | 2000-12-14 | 2000-12-14 | CPU phase converting radiator for notebook computer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 00261904 CN2458660Y (en) | 2000-12-14 | 2000-12-14 | CPU phase converting radiator for notebook computer |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2458660Y true CN2458660Y (en) | 2001-11-07 |
Family
ID=33617299
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 00261904 Expired - Lifetime CN2458660Y (en) | 2000-12-14 | 2000-12-14 | CPU phase converting radiator for notebook computer |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN2458660Y (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100453955C (en) * | 2005-01-07 | 2009-01-21 | 鸿富锦精密工业(深圳)有限公司 | Heat pipe and manufacturing method thereof |
CN101336067B (en) * | 2007-06-29 | 2010-06-02 | 奇鋐科技股份有限公司 | Mechanism of media for vacuum sealed radiating and method thereof |
CN105224016A (en) * | 2015-09-02 | 2016-01-06 | 联想(北京)有限公司 | A kind of electronic equipment |
-
2000
- 2000-12-14 CN CN 00261904 patent/CN2458660Y/en not_active Expired - Lifetime
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100453955C (en) * | 2005-01-07 | 2009-01-21 | 鸿富锦精密工业(深圳)有限公司 | Heat pipe and manufacturing method thereof |
US7694726B2 (en) | 2005-01-07 | 2010-04-13 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation system |
CN101336067B (en) * | 2007-06-29 | 2010-06-02 | 奇鋐科技股份有限公司 | Mechanism of media for vacuum sealed radiating and method thereof |
CN105224016A (en) * | 2015-09-02 | 2016-01-06 | 联想(北京)有限公司 | A kind of electronic equipment |
CN105224016B (en) * | 2015-09-02 | 2019-03-29 | 联想(北京)有限公司 | A kind of electronic equipment |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CX01 | Expiry of patent term |
Expiration termination date: 20101214 Granted publication date: 20011107 |