CN2421670Y - Optical pre-alighment apparatus for submicron photoetching device - Google Patents
Optical pre-alighment apparatus for submicron photoetching device Download PDFInfo
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- CN2421670Y CN2421670Y CN 99241688 CN99241688U CN2421670Y CN 2421670 Y CN2421670 Y CN 2421670Y CN 99241688 CN99241688 CN 99241688 CN 99241688 U CN99241688 U CN 99241688U CN 2421670 Y CN2421670 Y CN 2421670Y
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- alignment
- prealignment
- prism
- optics
- mark
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Abstract
The utility model discloses an optical pre-alignment apparatus for submicron photoetching machines. The apparatus comprises a lighting system of silicon wafer alignment marks, an imaging light path, a four-quadrant detector for receiving marks, an amplifying circuit connected with the four-quadrant detector, an A/D converter, a computer, and a work piece table control system of a photoetching machine for finishing pre-alignment. Two ways of alignment marks are imaged onto a CCD detector via an imaging prism; a display displays raster mark images of imaging alignment in separated view fields. The apparatus has no need of being added with an especially-arranged high-precision optical pre-alignment servo working table, also no need of a high-precision gas shaft manipulator, and only has need of a general-precision transmission manipulator.
Description
The utility model is a kind of optics prealignment device of lithography machine of submicron, belongs to the self-aligning prealignment technical field of litho machine.
The specialized equipment lithography machine of submicron of microelectronics industry, when the photoetching silicon chip, have relatively high expectations because of alignment precision, generally all adopt the optical grating diffraction details in a play not acted out on stage, but told through dialogues direct fine registration of coaxial mask silicon chip (hereinafter to be referred as fine alignment), the scope of this fine alignment system acquisition alignment mark is at ± 20 μ m, greatest limit is no more than ± 40 μ m, this error that just requires silicon chip to load onto wafer-supporting platform will be controlled within this scope, otherwise can catch less than mark fine alignment is failed.Existing litho machine generally adopts the prealignment structure, as 6300 types, 8000 types of U.S. GCA company, the transport tape of this class litho machine takes out silicon chip from silicon box, imports mechanical prealignment platform into, behind mechanical prealignment, be transferred on the litho machine wafer-supporting platform by mechanical arm again.This prealignment structure exists mechanical prealignment and the very high shortcoming of transmission manipulator accuracy requirement.In order to overcome these shortcomings, the litho machine that has has adopted behind the first mechanical prealignment structure of optics prealignment again, 2000 types, 5000 type litho machines as Dutch ASML company, silicon chip is after finishing prealignment on the mechanical registeration platform, carry out the optics prealignment in the ad hoc servo work stage of high-precision optical prealignment again, by high-precision gas axis robot silicon chip is sent on the litho machine wafer-supporting platform then.This litho machine still exists the shortcoming that needs high precision gas axis robot, and has increased the ad hoc servo work stage of high-precision optical prealignment.
The purpose of this utility model is to overcome the deficiency of above-mentioned prior art, and provide a kind of not high mechanical arm of precision that both can adopt, can also save the higher servo work stage of optics prealignment of precision, improve litho machine alignment precision and alignment reliability simultaneously, satisfy the optics prealignment device that the lithography machine of submicron of needs is produced in photoetching.
The purpose of this utility model can realize by following technical measures: near the optics prealignment device of litho machine light projection photoetching objective lens right front, form silicon chip alignment mark W by optical fiber, condenser, spectroscope, object lens, cutting board
1And W
2Illuminator, cutting board, object lens, Amici prism and catoptron are formed silicon chip alignment mark W
1And W
2Imaging optical path, light by this imaging optical path is divided into reflection and transmission two tunnel by semi-permeable and semi-reflecting mirror, the output that receives catoptrical 4 quadrant detector is connected to computing machine through processing and amplifying and A/D conversion, is connected to the control system of control photo-etching machine work-piece platform motion.The servo work stage of the prealignment of optics prealignment device is saved high precision gas axis robot by the photo-etching machine work-piece platform dual-purpose.Aim at phase grating mark W
1And W
2Coincidence prism, graticule, catoptron and lens constitute mark W
1And W
2Half transmitting light close the picture imaging optical path, receive ccd detector that two marks close picture back image and be connected to and show that division line and two mark split fields close the display of picture alignment image.
The purpose of this utility model also can realize by following technical measures: become alignment mark W with cutting board, object lens, reflector group
1And W
2The Amici prism of mechanical reflections photoimaging light path be the mineral crystal polarization splitting prism.
The utility model is compared prior art and is had the following advantages:
The servo work stage of optics prealignment is by the photo-etching machine work-piece platform dual-purpose, saved the elaborate servo work stage of optics prealignment special use, also saved high precision gas axis robot, reduced equipment cost, compact litho machine structure, simultaneously since silicon chip by behind the optics prealignment, with the wafer-supporting platform direct motion to the fine alignment position, fine alignment is easy to capture mark, helps improving the fine alignment precision.
Because the catching range of the optics prealignment alignment mark that adopts is very big, therefore greatest limit can reduce mechanical prealignment and transmission manipulator accuracy requirement significantly greatly to 500 μ m.
Optics prealignment and silicon chip fine alignment use same set of phase grating markers align, improve the utilization factor of silicon wafer to manufacture chip, and have avoided transmission error between two marks.
The two-way of optics prealignment device is aimed at detection system, by beam split with close picture, is monitored handled easily person observation by the alignment case of a monitor to the optics prealignment.
The utility model is described in further detail below in conjunction with drawings and Examples.
Fig. 1 is the structural drawing of optics prealignment device embodiment.
Fig. 2 is prealignment signal Processing control principle figure.
As shown in Figure 1: litho machine wafer-supporting platform 3 is positioned on the work stage 2, and work stage 2 can be made xy with respect to following base station 1 by the litho machine host computer control
1y
2Three-dimensional precision positioning campaign, the silicon chip 4 in the silicon box are grabbed on the litho machine wafer-supporting platform 3 by the transmission manipulator of general precision, at this moment the left and right sides alignment mark W of silicon chip 4 after being sent into mechanical prealignment platform and finished mechanical prealignment by travelling belt
1, W
2The two-way that just in time is positioned at optics prealignment system is aimed at visual field, alignment mark W
1, W
2Vertically evenly throw light on by the illuminator that optical fiber 5, condenser 6, Amici prism 9, object lens 8, cutting board 7 are formed.Silicon chip mark W
1, W
2Be phase grating mark, W
1, W
2The light that reflects, because reflected light path difference λ/2, light polarization direction has been rotated 90 °, can be all by polarization splitting prism 9, and by cutting board 7, object lens 8, Amici prism 9, behind the imaging optical path that catoptron 10 constitutes, be divided into reflection and transmission two tunnel by semi-transparent semi-reflecting lens 12 again, wherein the half reflection photoimaging is on 4 quadrant detector 11 and 18, the output signal of 4 quadrant detector is after late-class circuit and computing machine 23 processing, reach the requirement of optics prealignment by 2 motions of control system 24 control work stage, the servo work stage of the prealignment of optics prealignment device is by photo-etching machine work-piece platform 2 dual-purposes.Silicon chip to the fine alignment position, need not to transmit by high precision gas axis robot with the wafer-supporting platform direct motion by behind the optics prealignment again, and the error of optics prealignment is generally less than 10 μ m, and fine alignment is easy to capture mark.Optics prealignment and litho machine fine alignment use same set of phase grating mark W
1And W
2, the light that the non-marked face of silicon chip reflects contains parasitic light, and the polarization direction is constant, all is polarized Amici prism 9 and stops, and prism 9 is the mineral crystal polarization splitting prism.Other one tunnel semi-transparent light excessively, they close picture by coincidence prism 15, image on the graticule 13, image on the target surface of ccd detector 19 with the division line of graticule by catoptron 14, lens 17 again, show division line and alignment mark W by the display 20 that is connected to ccd detector 19
1And W
2The grating marker image that picture is aimed at closes in split field.
As shown in Figure 2: by A, B, C, D four road signals of 4 quadrant detector 11 receptions, and 18 E, F, G, H four road signals that receive, through processing and amplifying 21, send into A/D conversion 22, send into computing machine 23 again, the computing machine basis:
x=[(A+C)+(E+G)]-[(B+D)+(F+H)]
y
1=(A+B)-(C+D)
y
2=(E+F)-(G+H)
Calculate the error amount on the three-dimensional, instruction work stage control system 24 control work stage 2 are made xy
1y
2Three-dimensional motion is zero up to error, reaches till the requirement of prealignment.
Claims (2)
1, a kind of optics prealignment device of lithography machine of submicron is formed silicon chip alignment mark W by optical fiber (5), condenser (6), Amici prism (9), object lens (8) and cutting board (7)
1And W
2Illuminator, cutting board (7), object lens (8), Amici prism (9) are formed alignment mark W with catoptron (10)
1And W
2Imaging optical path, light by this imaging optical path is divided into reflection and transmitted light by semi-transparent semi-reflecting lens (12), the output that receives catoptrical 4 quadrant detector (11) and (18) is sent into computing machine (23) through processing and amplifying (21) and A/D conversion (22), be connected to the control system (24) of control photo-etching machine work-piece platform (2) motion, it is characterized in that: the servo work stage of the prealignment of optics prealignment device has been saved high precision gas axis robot by photo-etching machine work-piece platform (2) dual-purpose; Prism (15) is as phase grating mark W
1And W
2Coincidence prism, constitute mark W with graticule (13), catoptron (14), lens (17)
1And W
2The transmitted light imaging optical path, receive the ccd detector (19) of this index path picture, be connected to show tags W
1And W
2The monitor (20) of picture alignment image closes in split field.
2, lithography machine of submicron optics prealignment device as claimed in claim 1 is characterized in that: form alignment mark W with cutting board (7), object lens (8), catoptron (10)
1And W
2The Amici prism (9) of imaging optical path be the mineral crystal polarization spectroscope.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 99241688 CN2421670Y (en) | 1999-11-30 | 1999-11-30 | Optical pre-alighment apparatus for submicron photoetching device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 99241688 CN2421670Y (en) | 1999-11-30 | 1999-11-30 | Optical pre-alighment apparatus for submicron photoetching device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2421670Y true CN2421670Y (en) | 2001-02-28 |
Family
ID=34028501
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 99241688 Expired - Fee Related CN2421670Y (en) | 1999-11-30 | 1999-11-30 | Optical pre-alighment apparatus for submicron photoetching device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2421670Y (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100478789C (en) * | 2005-09-28 | 2009-04-15 | 中国科学院自动化研究所 | Four-quadrant aligning device of mask transmission system |
| CN100524026C (en) * | 2002-10-25 | 2009-08-05 | 迈普尔平版印刷Ip有限公司 | Lithography system |
| CN1800991B (en) * | 2002-06-28 | 2010-06-09 | 佳能株式会社 | Scanning exposure method and scanning exposure apparatus manufacture method |
| CN102096349A (en) * | 2010-12-31 | 2011-06-15 | 中国科学院光电技术研究所 | System for automatic dual-grating alignment in proximity nanometer lithography |
| CN101738881B (en) * | 2008-11-13 | 2011-06-22 | 财团法人金属工业研究发展中心 | Two-stage image precise contraposition method for upper plate and lower plate, and device thereof |
| CN104317170A (en) * | 2014-11-14 | 2015-01-28 | 四川飞阳科技有限公司 | Method and device for measuring alignment precision and photoetching method |
| CN105487351A (en) * | 2007-07-18 | 2016-04-13 | 株式会社尼康 | Measuring method, stage apparatus, and exposure apparatus |
| CN105717751A (en) * | 2014-12-04 | 2016-06-29 | 上海微电子装备有限公司 | Mask loading device and calibration method thereof |
-
1999
- 1999-11-30 CN CN 99241688 patent/CN2421670Y/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1800991B (en) * | 2002-06-28 | 2010-06-09 | 佳能株式会社 | Scanning exposure method and scanning exposure apparatus manufacture method |
| CN100524026C (en) * | 2002-10-25 | 2009-08-05 | 迈普尔平版印刷Ip有限公司 | Lithography system |
| CN100478789C (en) * | 2005-09-28 | 2009-04-15 | 中国科学院自动化研究所 | Four-quadrant aligning device of mask transmission system |
| CN105487351A (en) * | 2007-07-18 | 2016-04-13 | 株式会社尼康 | Measuring method, stage apparatus, and exposure apparatus |
| CN101738881B (en) * | 2008-11-13 | 2011-06-22 | 财团法人金属工业研究发展中心 | Two-stage image precise contraposition method for upper plate and lower plate, and device thereof |
| CN102096349A (en) * | 2010-12-31 | 2011-06-15 | 中国科学院光电技术研究所 | System for automatic dual-grating alignment in proximity nanometer lithography |
| CN102096349B (en) * | 2010-12-31 | 2012-05-30 | 中国科学院光电技术研究所 | System for automatic dual-grating alignment in proximity nanometer lithography |
| CN104317170A (en) * | 2014-11-14 | 2015-01-28 | 四川飞阳科技有限公司 | Method and device for measuring alignment precision and photoetching method |
| CN104317170B (en) * | 2014-11-14 | 2016-08-17 | 四川飞阳科技有限公司 | Measure the method and device of alignment precision, photoetching method |
| CN105717751A (en) * | 2014-12-04 | 2016-06-29 | 上海微电子装备有限公司 | Mask loading device and calibration method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |