CN2410677Y - Radiator for microprocessor - Google Patents
Radiator for microprocessor Download PDFInfo
- Publication number
- CN2410677Y CN2410677Y CN 99214288 CN99214288U CN2410677Y CN 2410677 Y CN2410677 Y CN 2410677Y CN 99214288 CN99214288 CN 99214288 CN 99214288 U CN99214288 U CN 99214288U CN 2410677 Y CN2410677 Y CN 2410677Y
- Authority
- CN
- China
- Prior art keywords
- microprocessor
- fan
- air port
- heat radiator
- bellows
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model provides a radiator for microprocessors. The length of radiation fins of a microprocessor is properly lengthened to the vicinity of a casing of a host machine, a blowing fan is vertically arranged in a funnel-shaped air box for directly extracting the air outside of the casing of a host machine or exhausting the high temperature air in the casing, and the high temperature produced by microprocessors are reduced through mixing low temperature air with the high temperature air, so that the heat radiation effect of the microprocessors can be better.
Description
The utility model relates to a kind of heat abstractor, particularly a kind of heat abstractor of microprocessor.
Fig. 1 is common microprocessor heat abstractor perspective exploded view.Common microprocessor heat abstractor is an affixed heat radiator A above microprocessor D mainly, with plurality of fixed bolt C fan 3 is locked between the two fin A1 of heat radiator A formed in the chute A2 along the screw B1 of fan B.
The shortcoming of common microprocessor heat abstractor is: when the host computer entry into service, temperature in the main case is higher than the outer temperature of housing, therefore no matter fan B takes exhausting formula radiating mode, still take the blast type radiating mode, this microprocessor D all is under the condition of high temperature, and its radiating effect is poor.Therefore, microprocessor D works for a long time in this state, diminishes the normal serviceable life of microprocessor D.
Known microprocessor heat abstractor can't be effectively and the high temperature that promptly reduces microprocessor and given out.
The purpose of this utility model provides a kind of good heat dissipation effect, can guarantee the microprocessor microprocessor heat abstractor in serviceable life.
For achieving the above object, the utility model is taked following design proposal: a kind of microprocessor heat abstractor, constitute by heat radiator, fan, bellows, and it is characterized in that:
Described heat radiator is positioned over the top of microprocessor, and two corresponding side surface are open surface about it, and all the other are closed on four sides, and is provided with the plural groups fin along the vertical direction of contact base, between two fins for leave appropriate gap to chute;
But described fan is the fan of an exhausting formula or air draught type;
Described bellows are one can transmit the body of air-flow, the one opening port is outer air port, and in this air port, be provided with one for the fan putting groove of placing fan, the other end is interior air port, one end socket of interior air port and heat radiator, outer air port upper and lower is extended with a location baffle plate, and respectively offers some positioning screw holes in the appropriate location of positioning baffle;
Described heat radiator is fixed in the top of microprocessor; Described fan is pressed in the fan putting groove by the outer air port of described bellows; The interior air port of described bellows is socketed in an end of heat radiator, and the positioning screw hole of positioning baffle was fixed in fan mouth and fixing threaded hole place on the host computer housing by set bolt locking about the outer air port of bellows reached.
The utility model is by extending the total length of heat radiator, and with the bellows socket that can transmit air-flow on end of heat radiator and the host shell, directly that host shell is outer air is introduced or the high-temperature gas that microprocessor produces is discharged outside the host shell, the high temperature that microprocessor is produced is able to rapid reduction, improved the cooling-down effect of microprocessor, and guaranteed the serviceable life of element.
The utility model is described in further detail below in conjunction with the drawings and specific embodiments.
Fig. 1 is common microprocessor heat abstractor perspective exploded view
Fig. 2 is the perspective exploded view of the utility model microprocessor heat abstractor
Fig. 3 is the utility model microprocessor heat abstractor schematic perspective view
Fig. 4 is the side view of the utility model microprocessor heat abstractor
Fig. 5 is the vertical view of the utility model microprocessor heat abstractor
Fig. 6 is the perspective exploded view of the utility model microprocessor heat abstractor second embodiment
Fig. 7 is the perspective exploded view of the utility model microprocessor heat abstractor the 3rd embodiment
As shown in Figure 2, the utility model microprocessor heat abstractor mainly is made of heat radiator 2, fan 3 and bellows 4.
But fan 3 is the fan of an exhausting formula or air draught type.
Bellows 4 are one can transmit the body of air-flow, the opening port of one end is outer air port 41, and in this air port, be provided with one for the fan putting groove 43 of placing fan 3, the other end is interior air port 42, one end socket of this mouthful and heat radiator 2, and outer air port 41 upper and lowers are extended with a location baffle plate 44, and respectively offer a location screw 45 in the appropriate location of this positioning baffle.
During combination, earlier heat radiator 2 is fixed in the top of microprocessor, again the outer air port 41 of fan 3 by bellows 4 is pressed in the fan putting groove 43, again the interior air port 42 of bellows 4 is socketed on the end of heat radiator 2, last again with the outer air port 41 of bellows 4 and up and down the positioning screw hole 45 of positioning baffle 44 aim at the fan mouth 62 and the fixing threaded hole 61 of host shell 6, it is affixed to utilize set bolt 5 that both are locked.
Fig. 3 is the schematic perspective view of the utility model microprocessor heat abstractor.Can find that special character of the present utility model is from diagram, the length of heat radiator 2 gives the prolongation of appropriateness, makes it carry out socket with bellows 4.Make heat radiator 2 not only have heat sinking function, and can have the function of heat radiation airduct concurrently.Therefore, the high temperature that produced of microprocessor 1 will be discharged outside the host shell 6 rapidly and directly by the utility model.
In addition, heat radiator 2 has the prolongation of appropriateness because of length, and then whole area of dissipation is enlarged, and the heat radiation function of heat radiator 2 is better.
As Fig. 4, shown in Figure 5, the entire heat dissipation area of the utility model heat radiator 2 increases greatly, but whole height does not increase counter falling, and this is the quantum jump in the design; And the size of fan 3 also escape the profile of fan 3 must be similar with the profile of microprocessor 1 restriction, make the scope of the size of fan 3 and power designs more broad.
Fig. 6 is the perspective exploded view of the utility model microprocessor heat abstractor second embodiment.Embodiment 2 is with the difference of embodiment 1: fin 22 set in the heat radiator only is located on the vertical plane of microprocessor 1, and the part of extending is the gas channel of hollow.
Fig. 7 is microprocessor heat abstractor the 3rd an embodiment perspective exploded view.Embodiment 3 is with the difference of embodiment 1: direct punching press one bellows 63 on host shell 6 make microprocessor heat abstractor and host shell 6 one-body molded.
The utility model has carried out traditional microprocessor heat abstractor to transform.Microprocessor is equivalent to the nervous centralis of human body in computer, therefore whether a computation is smooth and easy, and microprocessor plays considerable effect, and institute thinks the operate as normal of maintenance microprocessor, make it can not have the heat sinking function of strengthening its heat abstractor only because of the overheated corrupted that causes.Because in the host computer, the element that can distribute high temperature in the use is quite a lot of, and known microprocessor heat abstractor is worked in a high temperature housing all the time, therefore no matter how the power of fan strengthens, the working environment of microprocessor is under the condition of high temperature all the time, how to take out, blow again, still belong to a high temperature circulation, so can't reduce the temperature of microprocessor effectively.
Disclosed technical scheme of the utility model and means, the bottleneck problem that can solve common heat abstractor fully and run into, not only increase area of dissipation, more will accumulate in microprocessor high temperature on every side and discharge in the housing room temperature introducing host shell outer or housing is lower outward, and make it more effectively reduce the temperature of microprocessor.
The utility model is by extending heat radiator length, extend to host shell, and utilize the bellows that can transmit air-flow, directly extract the outer air of host shell or discharge high temperature air in the housing by fan, high Cryogenic air is mixed, thereby reduce the high temperature that microprocessor itself produces, make its better heat-radiation effect.The utility model has overcome the shortcoming of common microprocessor heat abstractor.
In sum, the utility model microprocessor heat abstractor can effectively increase area of dissipation, is easier to discharge high temperature air, makes microprocessor reach better radiating effect.
The above only is preferred embodiment of the present utility model, and any equivalent transformation based on technical solutions of the utility model all belongs within the utility model protection domain.
Claims (3)
1, a kind of microprocessor heat abstractor is made of heat radiator, fan, bellows, it is characterized in that:
Described heat radiator is positioned over the top of microprocessor, and two corresponding side surface are open surface about it, and all the other are closed on four sides, and is provided with the fin of plural groups along the vertical direction of contact base, between two fins for leave appropriate gap to chute;
But described fan is the fan of an exhausting formula or air draught type;
Described bellows are one can transmit the body of air-flow, the one opening port is outer air port, and in this air port, be provided with one for the fan putting groove of placing fan, the other end is interior air port, one end socket of interior air port and heat radiator, outer air port upper and lower is extended with a location baffle plate, and respectively offers some positioning screw holes in the appropriate location of positioning baffle;
Described heat radiator is fixed in the top of microprocessor; Described fan is pressed in the fan putting groove by the outer air port of described bellows; The interior air port of described bellows is socketed in an end of heat radiator, and the positioning screw hole of positioning baffle was fixed in fan mouth and fixing threaded hole place on the host computer housing by set bolt locking about the outer air port of bellows reached.
2, microprocessor heat abstractor according to claim 1 is characterized in that: the fin in the described heat radiator only is located on the vertical plane of microprocessor, and the part of extending is the gas channel of hollow.
3, the heat abstractor of microprocessor according to claim 1 is characterized in that: the direct punching press of described bellows makes itself and host computer housing one-body molded on the host computer housing.
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 99214288 CN2410677Y (en) | 1999-06-21 | 1999-06-21 | Radiator for microprocessor |
| JP2001503594A JP2003502749A (en) | 1999-06-11 | 2000-06-09 | Heat dissipation device for CPU of portable computer |
| PCT/CN2000/000150 WO2000077601A1 (en) | 1999-06-11 | 2000-06-09 | The heat-radiator of a portable computer's cpu |
| KR1020017015956A KR100561328B1 (en) | 1999-06-11 | 2000-06-09 | The Heat-Radiatior Of A Portable Computer's CPU |
| EP00936595A EP1239359A4 (en) | 1999-06-11 | 2000-06-09 | The heat-radiator of a portable computer's cpu |
| AU52052/00A AU5205200A (en) | 1999-06-11 | 2000-06-09 | The heat-radiator of a portable computer's cpu |
| US09/926,473 US6570760B1 (en) | 1999-06-11 | 2000-06-09 | CPU cooling arrangement for portable computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 99214288 CN2410677Y (en) | 1999-06-21 | 1999-06-21 | Radiator for microprocessor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2410677Y true CN2410677Y (en) | 2000-12-13 |
Family
ID=34006505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 99214288 Expired - Lifetime CN2410677Y (en) | 1999-06-11 | 1999-06-21 | Radiator for microprocessor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2410677Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103744497A (en) * | 2014-01-24 | 2014-04-23 | 华北电力大学 | Cooling system |
| CN106793627A (en) * | 2017-02-08 | 2017-05-31 | 广东霍德韦信息技术有限公司 | A kind of network equipment |
-
1999
- 1999-06-21 CN CN 99214288 patent/CN2410677Y/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103744497A (en) * | 2014-01-24 | 2014-04-23 | 华北电力大学 | Cooling system |
| CN103744497B (en) * | 2014-01-24 | 2017-09-19 | 华北电力大学 | A kind of cooling system |
| CN106793627A (en) * | 2017-02-08 | 2017-05-31 | 广东霍德韦信息技术有限公司 | A kind of network equipment |
| CN106793627B (en) * | 2017-02-08 | 2022-08-05 | 广东霍德韦信息技术有限公司 | Network equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |