CN212034627U

CN212034627U - AI server that heat dispersion is good

Info

Publication number: CN212034627U
Application number: CN202020770434.0U
Authority: CN
Inventors: 覃碧玉; 覃超宝; 蒋飞虎; 覃超剑; 韦秀玲
Original assignee: Shenzhen Beiliande Industrial Co ltd
Current assignee: Shenzhen Beiliande Industrial Co ltd
Priority date: 2020-05-11
Filing date: 2020-05-11
Publication date: 2020-11-27
Anticipated expiration: 2030-05-11

Abstract

The utility model relates to a network equipment technical field specifically is an AI server that heat dispersion is good, including housing structure, the bottom fixed mounting of housing structure one side has the connecting plate, housing structure is through setting up connecting plate and the heat dissipation mechanism fixed mounting in one side bottom thereof, housing structure's inside sliding connection has CPU module and GPU module, housing structure's top fixed mounting has a closing cap mechanism. This AI server that heat dispersion is good, set up the inlet port in the bottom of casing, the louvre sets up the top at the apron, make the heat distribute to the top from the bottom of casing, avoid steam gathering at the top of CPU module and GPU module, thereby the radiating effect has been optimized, through with CPU module and GPU module sliding connection in the slide rail of casing, CPU module or GPU module damage maintenance, take out the fastening bolt in the fixed plate, the apron is pulled down, alright take out CPU module or GPU module from the slide rail in the casing, easy dismounting, the maintenance is convenient.

Description

AI server that heat dispersion is good

Technical Field

The utility model relates to a network equipment technical field specifically is a AI server that heat dispersion is good.

Background

AI (artificial intelligence) has gained increasing attention in the computer field. And the method is applied to robots, economic and political decisions, control systems and simulation systems. The AI server is used as one of artificial intelligence carriers, the AI server is widely applied along with the development of artificial intelligence, the AI server generally comprises a plurality of GPU modules, the TDP of the GPU modules is higher, the heat dissipation requirement on the GPU modules is higher, and the heat dissipation of the AI server determines the service life and the fluency of the AI server. However, the conventional AI server has the following disadvantages when used:

in the conventional AI server, heat dissipation devices are usually arranged on two sides of the server, and heat can be upwards dissipated, so that hot air is gathered at the top of the server, and the heat dissipation effect is influenced.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

Not enough to prior art, the utility model provides a AI server that heat dispersion is good, through setting up the inlet port in the bottom of casing, the louvre setting is at the top of apron, makes the heat distribute to the top from the bottom of casing, has solved the problem that proposes among the above-mentioned background art.

(II) technical scheme

In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: an AI server with good heat dissipation performance comprises a shell mechanism, wherein a connecting plate is fixedly arranged at the bottom of one side of the shell mechanism, the shell mechanism is fixedly arranged with a heat dissipation mechanism through the connecting plate arranged at the bottom of one side of the shell mechanism, a CPU module and a GPU module are connected in the shell mechanism in a sliding manner, and a cover sealing mechanism is fixedly arranged at the top of the shell mechanism;

the shell mechanism comprises a shell, an air inlet hole, a first threaded hole, a sliding rail and a second threaded hole, the air inlet hole is formed in the bottom of the shell, the first threaded hole is formed in the bottom of one side of the shell, the sliding rail is fixedly connected inside the shell, and the second threaded hole is formed in the top of one side of the shell;

the heat dissipation mechanism comprises a heat dissipation fan, a third threaded hole, a threaded cylinder, a screw rod and a base, wherein the third threaded hole is formed in one side of the heat dissipation fan, the threaded cylinder is fixedly connected to four corners of the bottom of the heat dissipation fan, the screw rod is connected to the inner threads of the threaded cylinder, and one end, away from the threaded cylinder, of the screw rod is fixedly connected with the base;

the capping mechanism comprises a cover plate, a fixing plate and heat dissipation holes, wherein the fixing plate is fixedly connected to one side of the cover plate, and the heat dissipation holes are formed in the top of the cover plate.

Optionally, the casing is fixedly mounted to the connecting plate through a first threaded hole formed in the bottom of one side of the casing, and the heat dissipation fan is fixedly mounted to the connecting plate through a third threaded hole formed in one side of the heat dissipation fan.

Optionally, the casing is fixedly mounted with the fixing plate arranged on one side of the cover plate through a second threaded hole formed in the top of one side of the casing.

Optionally, sliding plates are fixedly connected to two sides of the CPU module and the GPU module.

Optionally, the CPU module and the GPU module are slidably connected to a slide rail provided in the housing through slide plates disposed on both sides of the CPU module and the GPU module.

Optionally, the bottom of the base is fixedly connected with a rubber pad.

(III) advantageous effects

The utility model provides a AI server that heat dispersion is good possesses following beneficial effect:

1. this AI server that heat dispersion is good, through setting up the inlet port in the bottom of casing, the louvre sets up the top at the apron, the heat dissipation fan blows in the casing with the air current through the inlet port of bottom of the case portion, then the air current rises in the casing, give off from the louvre at apron top, thereby reach radiating purpose, because steam has the characteristics of initiative evaporation that makes progress, in addition the heat dissipation fan blows the top to the casing with the air current from the bottom of casing, accelerate giving off of steam, avoid the steam gathering at the top of CPU module and GPU module, thereby the radiating effect has been optimized.

2. This AI server that heat dispersion is good through with CPU module and GPU module sliding connection in the slide rail in the casing, if CPU module or GPU module damage needs the maintenance, take out the fastening bolt in the fixed plate, pull down the apron, alright take out CPU module or GPU module from the slide rail in the casing in, fixed establishment is simple, easy dismounting has made things convenient for the maintenance in later stage.

Drawings

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the exploded structure of the present invention;

fig. 3 is a schematic structural diagram of the housing mechanism of the present invention;

fig. 4 is a schematic structural view of the heat dissipation mechanism of the present invention;

fig. 5 is a schematic structural diagram of the capping mechanism of the present invention.

In the figure: 1-shell mechanism, 101-machine shell, 102-air inlet hole, 103-first threaded hole, 104-sliding rail, 105-second threaded hole, 2-connecting plate, 3-heat dissipation mechanism, 301-heat dissipation fan, 302-third threaded hole, 303-threaded barrel, 304-screw, 305-base, 4-CPU module, 5-GPU module, 6-cover mechanism, 601-cover plate, 602-fixing plate, 603-heat dissipation hole and 7-sliding plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 1 to 5, the present invention provides a technical solution: an AI server with good heat dissipation performance comprises a shell mechanism 1, wherein a connecting plate 2 is fixedly installed at the bottom of one side of the shell mechanism 1, the shell mechanism 1 is fixedly installed with a heat dissipation mechanism 3 through the connecting plate 2 arranged at the bottom of one side of the shell mechanism 1, a CPU module 4 and a GPU module 5 are connected in the shell mechanism 1 in a sliding mode, and a sealing cover mechanism 6 is fixedly installed at the top of the shell mechanism 1;

the shell mechanism 1 comprises a shell 101, an air inlet 102, a first threaded hole 103, a sliding rail 104 and a second threaded hole 105, wherein the air inlet 102 is formed in the bottom of the shell 101, air enters the shell 101 from the air inlet 102, the first threaded hole 103 is formed in the bottom of one side of the shell 101, the sliding rail 104 is fixedly connected in the shell 101, and the second threaded hole 105 is formed in the top of one side of the shell 101;

the heat dissipation mechanism 3 comprises a heat dissipation fan 301, a third threaded hole 302, a threaded cylinder 303, a screw 304 and a base 305, wherein the third threaded hole 302 is formed in one side of the heat dissipation fan 301, the threaded cylinder 303 is fixedly connected to four corners of the bottom of the heat dissipation fan 301, the screw 304 is in threaded connection with the inside of the threaded cylinder 303, the screw 304 is in forward rotation or reverse rotation, the total length of the threaded cylinder 303 and the screw 304 can be adjusted, so that the multiple bases 305 are ensured to be in contact with the ground on the uneven ground by adjusting the total length of the threaded cylinder 303 and the screw 304, and one end, far away from the threaded cylinder 303, of the screw 304 is fixedly connected;

the cover closing mechanism 6 comprises a cover plate 601, a fixing plate 602 and heat dissipation holes 603, wherein the fixing plate 602 is fixedly connected to one side of the cover plate 601, the heat dissipation holes 603 are formed in the top of the cover plate 601, and hot air is volatilized from the heat dissipation holes 603.

The case 101 is fixedly installed with the connecting plate 2 through the first threaded hole 103 arranged at the bottom of one side of the case 101, one end of the connecting plate 2 is threaded with the first threaded hole 103 by using a fastening bolt to penetrate through the connecting plate, so that the connecting plate 2 is fixed on the case 101, the heat dissipation fan 301 is fixedly installed with the connecting plate 2 through the third threaded hole 302 arranged at one side of the heat dissipation fan, one end of the connecting plate 2 is threaded with the third threaded hole 302 by using a fastening bolt, so that the connecting plate 2 is fixed on the heat dissipation fan 301, the case 101 is fixedly installed with the fixing plate 602 arranged at one side of the cover plate 601 through the second threaded hole 105 arranged at the top of one side of the case 101, the through hole on the fixing plate 602 is threaded with the second threaded hole 105 by using a fastening bolt, so that the case mechanism 1 and the cover mechanism 6 are fixed together, the sliding plates 7 are fixedly connected to both sides of the CPU module 4 and the GPU module 5, the CPU module Make things convenient for the dismouting, the bottom fixedly connected with rubber pad of base 305, the frictional force of increase base 305 and ground improves stability.

When using, heat dissipation fan 301 blows in the casing 101 with the air current through the inlet port 102 of casing 101 bottom in, then the air current rises in casing 101, give off from the louvre 603 at apron 601 top, thereby reach radiating purpose, because steam has the characteristics of the evaporation that makes progress voluntarily, in addition heat dissipation fan 301 blows the top to casing 101 with the air current from the bottom of casing 101, accelerate giving off of steam, thereby radiating efficiency has been improved, if CPU module 4 or GPU module 5 damage needs the maintenance, take out the fastening bolt in the fixed plate 602, pull down apron 601, alright take out in CPU module 4 or GPU module 5 follow slide rail 104 in the casing 101 alright, fixing mechanism is simple, and easy dismounting, the maintenance in later stage has been made things convenient for.

In summary, when the AI server with good heat dissipation performance is used, the air inlet holes 102 are arranged at the bottom of the casing 101, the heat dissipation holes 603 are arranged at the top of the cover plate 601, the heat dissipation fan 301 blows air flow into the casing 101 through the air inlet holes 102 at the bottom of the casing 101, then the air flow rises in the casing 101 and is dissipated from the heat dissipation holes 603 at the top of the cover plate 601, so that the heat dissipation purpose is achieved, because the heat has the characteristic of active upward evaporation, and the heat dissipation fan 301 blows air flow from the bottom of the casing 101 to the top of the casing 101, so as to accelerate the dissipation of the heat flow, thereby preventing the heat flow from being gathered at the tops of the CPU module 4 and the GPU module 5, so as to optimize the heat dissipation effect, the CPU module 4 and the GPU module 5 are slidably connected in the slide rails 104 in the casing 101, if the CPU module 4 or the GPU module 5 is damaged and needs, the CPU module 4 or the GPU module 5 can be taken out of the slide rail 10 in the shell 101, the fixing mechanism is simple, the assembly and disassembly are convenient, and the later maintenance is facilitated.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. The utility model provides an AI server that heat dispersion is good, includes housing mechanism (1), its characterized in that: the bottom of one side of the shell mechanism (1) is fixedly provided with a connecting plate (2), the shell mechanism (1) is fixedly installed with a heat dissipation mechanism (3) through the connecting plate (2) arranged at the bottom of one side of the shell mechanism, a CPU module (4) and a GPU module (5) are connected to the interior of the shell mechanism (1) in a sliding mode, and the top of the shell mechanism (1) is fixedly provided with a cover sealing mechanism (6);

the shell mechanism (1) comprises a shell (101), an air inlet (102), a first threaded hole (103), a sliding rail (104) and a second threaded hole (105), wherein the air inlet (102) is formed in the bottom of the shell (101), the first threaded hole (103) is formed in the bottom of one side of the shell (101), the sliding rail (104) is fixedly connected inside the shell (101), and the second threaded hole (105) is formed in the top of one side of the shell (101);

the heat dissipation mechanism (3) comprises a heat dissipation fan (301), a third threaded hole (302), a threaded cylinder (303), a screw rod (304) and a base (305), the third threaded hole (302) is formed in one side of the heat dissipation fan (301), the threaded cylinders (303) are fixedly connected to four corners of the bottom of the heat dissipation fan (301), the screw rod (304) is connected to the inner threads of the threaded cylinder (303), and the base (305) is fixedly connected to one end, far away from the threaded cylinder (303), of the screw rod (304);

the capping mechanism (6) comprises a cover plate (601), a fixing plate (602) and heat dissipation holes (603), wherein the fixing plate (602) is fixedly connected to one side of the cover plate (601), and the heat dissipation holes (603) are formed in the top of the cover plate (601).

2. The AI server of claim 1, wherein the AI server comprises: the machine shell (101) is fixedly installed with the connecting plate (2) through a first threaded hole (103) formed in the bottom of one side of the machine shell, and the heat dissipation fan (301) is fixedly installed with the connecting plate (2) through a third threaded hole (302) formed in one side of the heat dissipation fan.

3. The AI server of claim 1, wherein the AI server comprises: the shell (101) is fixedly installed with a fixing plate (602) arranged on one side of the cover plate (601) through a second threaded hole (105) arranged on the top of one side of the shell.

4. The AI server of claim 1, wherein the AI server comprises: and sliding plates (7) are fixedly connected to the two sides of the CPU module (4) and the GPU module (5).

5. The AI server with good heat dissipation performance according to claim 4, wherein: the CPU module (4) and the GPU module (5) are connected with a sliding rail (104) arranged in the shell (101) in a sliding mode through sliding plates (7) arranged on two sides of the CPU module and the GPU module.

6. The AI server of claim 1, wherein the AI server comprises: the bottom of the base (305) is fixedly connected with a rubber pad.