CN210348403U - An intelligent cooling device for computer case - Google Patents
An intelligent cooling device for computer case Download PDFInfo
- Publication number
- CN210348403U CN210348403U CN201921881860.5U CN201921881860U CN210348403U CN 210348403 U CN210348403 U CN 210348403U CN 201921881860 U CN201921881860 U CN 201921881860U CN 210348403 U CN210348403 U CN 210348403U
- Authority
- CN
- China
- Prior art keywords
- case
- heat dissipation
- cooling device
- heat sink
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 25
- 230000017525 heat dissipation Effects 0.000 claims abstract description 48
- 238000009423 ventilation Methods 0.000 claims abstract description 7
- 238000005057 refrigeration Methods 0.000 claims description 37
- 239000004065 semiconductor Substances 0.000 claims description 22
- 239000000428 dust Substances 0.000 claims description 9
- 230000000694 effects Effects 0.000 abstract description 2
- 238000005265 energy consumption Methods 0.000 abstract 1
- 238000012423 maintenance Methods 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本实用新型提出了一种用于计算机机箱的智能散热装置，包括机箱，机箱的两端均设有通风网孔，机箱的一侧与侧板固定连接，所述机箱的另一侧与机盖相连接，机盖上安装有二级散热装置，机箱顶部安装有一级散热装置，机箱上部安装有防尘网，一级散热装置与防尘网相连通，机箱内安装有温度传感器，机箱下部与支撑台固定连接，支撑台内部安装有控制盒，控制盒分别与一级散热装置、二级散热装置和温度传感器相连接。本实用新型整体结构设计紧凑，占用机箱内部空间小，并且通过分阶段启动散热装置对机箱内进行逐级降温制冷，在一定程度上减少能源的消耗，提高整体散热效果，并且方便对机箱内部维修。
The utility model proposes an intelligent heat dissipation device for a computer case, comprising a case, ventilation mesh holes are arranged at both ends of the case, one side of the case is fixedly connected with a side plate, and the other side of the case is connected with a cover A secondary heat sink is installed on the cover, a primary heat sink is installed on the top of the chassis, an air filter is installed on the upper part of the chassis, the primary heat sink is connected to the air filter, a temperature sensor is installed in the chassis, and the lower part of the chassis is connected to the air filter. The support table is fixedly connected, a control box is installed inside the support table, and the control box is respectively connected with the primary heat sink, the secondary heat sink and the temperature sensor. The overall structure of the utility model is compact in design, occupies little space inside the case, and the cooling device is activated in stages to cool down and refrigerate the inside of the case step by step, thereby reducing energy consumption to a certain extent, improving the overall heat dissipation effect, and facilitating the maintenance of the interior of the case. .
Description
Technical Field
The utility model relates to a radiating technical field of computer especially relates to an intelligent heat abstractor for computer machine case.
Background
The computer is often in long-time operation, the internal electrical elements of the computer run for a long time, a large amount of heat energy is accumulated in the host, the temperature in the host is too high, certain influence can be generated on the operation of a main board and a CPU in the host, particularly in summer, the computer is very easy to jam, the computer is seriously in blue screen restarting, the normal operation and use are influenced, the requirement of cooling the host cannot be met only by a heat dissipation fan arranged in the host, many users can select to install water cooling in the host case, although the water cooling effect is good, the installation cost of the water cooling is high, and the computer is not suitable for common users.
SUMMERY OF THE UTILITY MODEL
The inside heat dissipation fan that only relies on the host computer from taking can't satisfy the demand of host computer cooling to present host computer inside, and water-cooled installation cost is expensive, the technical problem that is unsuitable ordinary user to use, the utility model provides an intelligent heat abstractor for computer machine case.
In order to solve the above problem, the technical scheme of the utility model is so realized:
the utility model provides an intelligent heat abstractor for computer machine case, includes quick-witted case, and the both ends of quick-witted case all are equipped with the ventilation mesh, one side and curb plate fixed connection of quick-witted case, the opposite side of quick-witted case is connected with the cover, installs second grade heat abstractor on the cover, and one-level heat abstractor is installed at machine roof portion, and the dust screen is installed on quick-witted case upper portion, and one-level heat abstractor is linked together with the dust screen, and quick-witted incasement installs temperature sensor, quick-witted case lower part and a supporting bench fixed connection, a supporting bench internally mounted have a control box, and the.
Preferably, the one end of cover has seted up the connecting hole through connecting pin and quick-witted case swing joint and the other end of cover on, has reserved the shrinkage pool on the quick-witted case, and the connecting hole passes through the screw and can dismantle with the shrinkage pool and be connected.
Preferably, the primary heat dissipation device comprises a heat dissipation fan, the heat dissipation fan is fixed at the top of the case and communicated with the dust screen, and the heat dissipation fan is connected with the control box.
Preferably, the second-stage heat dissipation device comprises a refrigeration box, the refrigeration box is fixed on the cover, a semiconductor refrigeration piece is installed in the refrigeration box, the heat dissipation end of the semiconductor refrigeration piece is communicated with the outside, the refrigeration end of the semiconductor refrigeration piece is communicated with the inside of the case, and the semiconductor refrigeration piece is connected with the control box.
Preferably, a power converter is arranged in the control box, the power converter is respectively connected with an external power supply and a controller, and the controller is respectively connected with a heat dissipation fan in the first-stage heat dissipation device, a semiconductor refrigeration piece in the second-stage heat dissipation device and a temperature sensor.
Preferably, the number of the heat radiation fans is at least two.
The utility model has the advantages that: the utility model has compact integral structure design, occupies small space inside the case, utilizes the temperature sensor to monitor the temperature change inside the case in real time, when the temperature inside the case reaches a set initial value, the controller controls the starting of the heat dissipation fan, the heat dissipation fan starts to ventilate the inside of the case, the air flows from top to bottom and blows out from the ventilation meshes at the two ends of the case, thereby greatly improving the heat dissipation area of the electric elements inside the case, when the temperature inside the case continues to rise to reach an alert value, the controller controls the semiconductor refrigeration sheets to start simultaneously to refrigerate the inside of the case, the semiconductor refrigeration sheets refrigerate the air inside the case, simultaneously the heat dissipation fan is matched to accelerate the air flow, thereby realizing the rapid refrigeration and cooling inside the case, gradually cool the inside of the case by starting the heat dissipation device stage by stage, reduce the, and the cover can be detached to conveniently maintain and replace the assembly inside the case.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic view of the internal structure of the present invention.
Fig. 2 is a schematic view of the usage state of fig. 1.
In the figure, 1 is a machine cover, 2 is a refrigeration box, 3 is a threading hole, 4 is a dustproof net, 5 is a heat dissipation fan, 6 is a case, 7 is a temperature sensor, and 8 is a supporting table.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without any creative effort belong to the protection scope of the present invention.
As shown in fig. 1, an intelligent heat dissipation device for a computer case comprises a case 6, wherein both ends of the case 6 are provided with ventilation mesh holes, one side of the case 6 is fixedly connected with a side plate, the other side of the case 6 is connected with a cover 1, one end of the cover 1 is movably connected with the case 6 through a connecting pin, and the other end of the cover 1 is provided with a connecting hole; the lower part of the case 6 is fixedly connected with a support table 8, a control box is arranged in the support table 8, and a threading hole 3 is formed in the support table and used for the control box to penetrate through each signal wire; the control box is respectively connected with the primary heat dissipation device, the secondary heat dissipation device and the temperature sensor 7.
The top of the case 6 is provided with a primary heat dissipation device, the upper part of the case 6 is provided with a dust screen 4, the primary heat dissipation device is communicated with the dust screen 4, the primary heat dissipation device comprises at least two groups of heat dissipation fans 5, the heat dissipation fans are 8025-S0 axial fans, the heat dissipation fans 5 are fixed at the top of the case 6, the heat dissipation fans 5 are communicated with the dust screen 4, the heat dissipation fans 5 are connected with a control box, a power supply converter is arranged in the control box, the power supply converter is respectively connected with an external power supply and a controller, the controller adopts an STM8S208MBT6B single chip microcomputer, the controller is connected with the heat dissipation fans 5 in the primary heat dissipation device through relays, when the temperature in the case reaches a set initial value, the controller controls the heat dissipation fan to be started, the heat dissipation fan is used for accelerating the air in the case to flow from top to bottom, and the air is blown out from the ventilation mesh holes at the two ends of the case, so that the heat dissipation area of the electrical elements in the whole case is greatly increased.
As shown in fig. 2, a second-stage heat dissipation device is installed on the machine cover 1, the second-stage heat dissipation device includes a refrigeration box 2, the refrigeration box is integrally similar to a refrigerator, the refrigeration box 2 is fixed on the machine cover 1, a semiconductor refrigeration sheet is installed in the refrigeration box 2, the semiconductor refrigeration sheet adopts a TC1-06303 semiconductor refrigeration sheet, the heat dissipation end of the semiconductor refrigeration sheet is communicated with the outside through a self-contained heat dissipation fan to dissipate heat outwards, the refrigeration end of the semiconductor refrigeration sheet is communicated with the inside of the machine case, the semiconductor refrigeration sheet is connected with the control box, a temperature sensor 7 is installed in the machine case 6, the controller is respectively connected with the semiconductor refrigeration sheet and the temperature sensor 7 in the second-stage heat dissipation device, the controller is connected with the semiconductor refrigeration sheet through a relay, the controller is connected with the temperature sensor 7 through an a/D signal converter, and the temperature sensor 7 can adopt.
Utilize temperature sensor real-time supervision quick-witted incasement portion temperature variation, when the inside temperature of quick-witted case reaches the settlement initial value, the start-up of controller control heat dissipation fan, heat dissipation fan starts to ventilate quick-witted incasement portion, air top-down flows and blows off from the ventilation mesh at quick-witted case both ends, improve whole quick-witted incasement portion electric elements heat radiating area greatly, when the inside temperature of machine case continues to rise and reaches the alert value, the start-up simultaneously of controller control semiconductor refrigeration piece begins to refrigerate quick-witted incasement portion, semiconductor refrigeration piece refrigerates quick-witted incasement portion air, cooperate heat dissipation fan to accelerate the air flow simultaneously, realize quick refrigeration cooling of quick-witted incasement portion, through start heat abstractor step by step cooling refrigeration to quick-witted incasement.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921881860.5U CN210348403U (en) | 2019-11-04 | 2019-11-04 | An intelligent cooling device for computer case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921881860.5U CN210348403U (en) | 2019-11-04 | 2019-11-04 | An intelligent cooling device for computer case |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210348403U true CN210348403U (en) | 2020-04-17 |
Family
ID=70179207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921881860.5U Expired - Fee Related CN210348403U (en) | 2019-11-04 | 2019-11-04 | An intelligent cooling device for computer case |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210348403U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112306202A (en) * | 2020-11-07 | 2021-02-02 | 江西环境工程职业学院 | Heat radiator suitable for inside computer machine case |
| CN113692203A (en) * | 2021-09-07 | 2021-11-23 | 广东电网有限责任公司 | Heat dissipation device for FTU on column |
-
2019
- 2019-11-04 CN CN201921881860.5U patent/CN210348403U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112306202A (en) * | 2020-11-07 | 2021-02-02 | 江西环境工程职业学院 | Heat radiator suitable for inside computer machine case |
| CN113692203A (en) * | 2021-09-07 | 2021-11-23 | 广东电网有限责任公司 | Heat dissipation device for FTU on column |
| CN113692203B (en) * | 2021-09-07 | 2023-11-24 | 广东电网有限责任公司 | A cooling device for column-mounted FTU |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200417 Termination date: 20201104 |
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| CF01 | Termination of patent right due to non-payment of annual fee |