CN210348403U - Intelligent heat dissipation device for computer case - Google Patents

Intelligent heat dissipation device for computer case Download PDF

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Publication number
CN210348403U
CN210348403U CN201921881860.5U CN201921881860U CN210348403U CN 210348403 U CN210348403 U CN 210348403U CN 201921881860 U CN201921881860 U CN 201921881860U CN 210348403 U CN210348403 U CN 210348403U
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CN
China
Prior art keywords
heat dissipation
case
quick
dissipation device
heat abstractor
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Expired - Fee Related
Application number
CN201921881860.5U
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Chinese (zh)
Inventor
轩春青
轩志伟
张晓冬
高昂
王婷婷
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Zhengzhou Business University
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Zhengzhou Business University
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Priority to CN201921881860.5U priority Critical patent/CN210348403U/en
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Publication of CN210348403U publication Critical patent/CN210348403U/en
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

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Abstract

The utility model provides an intelligence heat abstractor for computer machine case, including quick-witted case, the both ends of machine case all are equipped with the ventilation mesh, one side and the curb plate fixed connection of machine case, the opposite side of machine case is connected with the cover, installs second grade heat abstractor on the cover, and one-level heat abstractor is installed at machine roof portion, and the dust screen is installed on machine case upper portion, and one-level heat abstractor is linked together with the dust screen, and quick-witted incasement installs temperature sensor, quick-witted case lower part and a supporting bench fixed connection, a supporting bench internally mounted have a control box, and the control box is connected with one-level heat abstractor, second grade. The utility model discloses overall structure designs compactly, and it is little to occupy quick-witted incasement space to start heat abstractor through stage and cool down the refrigeration step by step to quick-witted incasement, reduce the consumption of the energy to a certain extent, improve whole radiating effect, and the convenience is to quick-witted incasement portion maintenance.

Description

Intelligent heat dissipation device for computer case
Technical Field
The utility model relates to a radiating technical field of computer especially relates to an intelligent heat abstractor for computer machine case.
Background
The computer is often in long-time operation, the internal electrical elements of the computer run for a long time, a large amount of heat energy is accumulated in the host, the temperature in the host is too high, certain influence can be generated on the operation of a main board and a CPU in the host, particularly in summer, the computer is very easy to jam, the computer is seriously in blue screen restarting, the normal operation and use are influenced, the requirement of cooling the host cannot be met only by a heat dissipation fan arranged in the host, many users can select to install water cooling in the host case, although the water cooling effect is good, the installation cost of the water cooling is high, and the computer is not suitable for common users.
SUMMERY OF THE UTILITY MODEL
The inside heat dissipation fan that only relies on the host computer from taking can't satisfy the demand of host computer cooling to present host computer inside, and water-cooled installation cost is expensive, the technical problem that is unsuitable ordinary user to use, the utility model provides an intelligent heat abstractor for computer machine case.
In order to solve the above problem, the technical scheme of the utility model is so realized:
the utility model provides an intelligent heat abstractor for computer machine case, includes quick-witted case, and the both ends of quick-witted case all are equipped with the ventilation mesh, one side and curb plate fixed connection of quick-witted case, the opposite side of quick-witted case is connected with the cover, installs second grade heat abstractor on the cover, and one-level heat abstractor is installed at machine roof portion, and the dust screen is installed on quick-witted case upper portion, and one-level heat abstractor is linked together with the dust screen, and quick-witted incasement installs temperature sensor, quick-witted case lower part and a supporting bench fixed connection, a supporting bench internally mounted have a control box, and the.
Preferably, the one end of cover has seted up the connecting hole through connecting pin and quick-witted case swing joint and the other end of cover on, has reserved the shrinkage pool on the quick-witted case, and the connecting hole passes through the screw and can dismantle with the shrinkage pool and be connected.
Preferably, the primary heat dissipation device comprises a heat dissipation fan, the heat dissipation fan is fixed at the top of the case and communicated with the dust screen, and the heat dissipation fan is connected with the control box.
Preferably, the second-stage heat dissipation device comprises a refrigeration box, the refrigeration box is fixed on the cover, a semiconductor refrigeration piece is installed in the refrigeration box, the heat dissipation end of the semiconductor refrigeration piece is communicated with the outside, the refrigeration end of the semiconductor refrigeration piece is communicated with the inside of the case, and the semiconductor refrigeration piece is connected with the control box.
Preferably, a power converter is arranged in the control box, the power converter is respectively connected with an external power supply and a controller, and the controller is respectively connected with a heat dissipation fan in the first-stage heat dissipation device, a semiconductor refrigeration piece in the second-stage heat dissipation device and a temperature sensor.
Preferably, the number of the heat radiation fans is at least two.
The utility model has the advantages that: the utility model has compact integral structure design, occupies small space inside the case, utilizes the temperature sensor to monitor the temperature change inside the case in real time, when the temperature inside the case reaches a set initial value, the controller controls the starting of the heat dissipation fan, the heat dissipation fan starts to ventilate the inside of the case, the air flows from top to bottom and blows out from the ventilation meshes at the two ends of the case, thereby greatly improving the heat dissipation area of the electric elements inside the case, when the temperature inside the case continues to rise to reach an alert value, the controller controls the semiconductor refrigeration sheets to start simultaneously to refrigerate the inside of the case, the semiconductor refrigeration sheets refrigerate the air inside the case, simultaneously the heat dissipation fan is matched to accelerate the air flow, thereby realizing the rapid refrigeration and cooling inside the case, gradually cool the inside of the case by starting the heat dissipation device stage by stage, reduce the, and the cover can be detached to conveniently maintain and replace the assembly inside the case.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic view of the internal structure of the present invention.
Fig. 2 is a schematic view of the usage state of fig. 1.
In the figure, 1 is a machine cover, 2 is a refrigeration box, 3 is a threading hole, 4 is a dustproof net, 5 is a heat dissipation fan, 6 is a case, 7 is a temperature sensor, and 8 is a supporting table.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without any creative effort belong to the protection scope of the present invention.
As shown in fig. 1, an intelligent heat dissipation device for a computer case comprises a case 6, wherein both ends of the case 6 are provided with ventilation mesh holes, one side of the case 6 is fixedly connected with a side plate, the other side of the case 6 is connected with a cover 1, one end of the cover 1 is movably connected with the case 6 through a connecting pin, and the other end of the cover 1 is provided with a connecting hole; the lower part of the case 6 is fixedly connected with a support table 8, a control box is arranged in the support table 8, and a threading hole 3 is formed in the support table and used for the control box to penetrate through each signal wire; the control box is respectively connected with the primary heat dissipation device, the secondary heat dissipation device and the temperature sensor 7.
The top of the case 6 is provided with a primary heat dissipation device, the upper part of the case 6 is provided with a dust screen 4, the primary heat dissipation device is communicated with the dust screen 4, the primary heat dissipation device comprises at least two groups of heat dissipation fans 5, the heat dissipation fans are 8025-S0 axial fans, the heat dissipation fans 5 are fixed at the top of the case 6, the heat dissipation fans 5 are communicated with the dust screen 4, the heat dissipation fans 5 are connected with a control box, a power supply converter is arranged in the control box, the power supply converter is respectively connected with an external power supply and a controller, the controller adopts an STM8S208MBT6B single chip microcomputer, the controller is connected with the heat dissipation fans 5 in the primary heat dissipation device through relays, when the temperature in the case reaches a set initial value, the controller controls the heat dissipation fan to be started, the heat dissipation fan is used for accelerating the air in the case to flow from top to bottom, and the air is blown out from the ventilation mesh holes at the two ends of the case, so that the heat dissipation area of the electrical elements in the whole case is greatly increased.
As shown in fig. 2, a second-stage heat dissipation device is installed on the machine cover 1, the second-stage heat dissipation device includes a refrigeration box 2, the refrigeration box is integrally similar to a refrigerator, the refrigeration box 2 is fixed on the machine cover 1, a semiconductor refrigeration sheet is installed in the refrigeration box 2, the semiconductor refrigeration sheet adopts a TC1-06303 semiconductor refrigeration sheet, the heat dissipation end of the semiconductor refrigeration sheet is communicated with the outside through a self-contained heat dissipation fan to dissipate heat outwards, the refrigeration end of the semiconductor refrigeration sheet is communicated with the inside of the machine case, the semiconductor refrigeration sheet is connected with the control box, a temperature sensor 7 is installed in the machine case 6, the controller is respectively connected with the semiconductor refrigeration sheet and the temperature sensor 7 in the second-stage heat dissipation device, the controller is connected with the semiconductor refrigeration sheet through a relay, the controller is connected with the temperature sensor 7 through an a/D signal converter, and the temperature sensor 7 can adopt.
Utilize temperature sensor real-time supervision quick-witted incasement portion temperature variation, when the inside temperature of quick-witted case reaches the settlement initial value, the start-up of controller control heat dissipation fan, heat dissipation fan starts to ventilate quick-witted incasement portion, air top-down flows and blows off from the ventilation mesh at quick-witted case both ends, improve whole quick-witted incasement portion electric elements heat radiating area greatly, when the inside temperature of machine case continues to rise and reaches the alert value, the start-up simultaneously of controller control semiconductor refrigeration piece begins to refrigerate quick-witted incasement portion, semiconductor refrigeration piece refrigerates quick-witted incasement portion air, cooperate heat dissipation fan to accelerate the air flow simultaneously, realize quick refrigeration cooling of quick-witted incasement portion, through start heat abstractor step by step cooling refrigeration to quick-witted incasement.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (6)

1. The utility model provides an intelligent heat abstractor for computer machine case, includes quick-witted case (6), and the both ends of quick-witted case (6) all are equipped with the ventilation mesh, one side and curb plate fixed connection of quick-witted case (6), a serial communication port, the opposite side of quick-witted case (6) is connected with cover (1), installs second grade heat abstractor on cover (1), and one-level heat abstractor is installed at quick-witted case (6) top, and dust screen (4) are installed on quick-witted case (6) upper portion, and one-level heat abstractor is linked together with dust screen (4), installs temperature sensor (7) in quick-witted case (6), and quick-witted case (6) lower part and brace table (8) fixed connection, brace table (8) internally mounted have a control box, and the control box is connected with one-level heat.
2. The intelligent heat dissipation device for the computer case as claimed in claim 1, wherein one end of the cover (1) is movably connected with the case (6) through a connecting pin, and a connecting hole is formed in the other end of the cover (1), a concave hole is reserved in the case (6), and the connecting hole is detachably connected with the concave hole through a screw.
3. The intelligent heat dissipation device for computer cases as claimed in claim 1, wherein the primary heat dissipation device comprises a heat dissipation fan (5), the heat dissipation fan (5) is fixed on the top of the case (6), the heat dissipation fan (5) is communicated with the dust screen (4), and the heat dissipation fan (5) is connected with the control box.
4. The intelligent heat dissipation device for the computer case as claimed in claim 1, wherein the secondary heat dissipation device comprises a refrigeration box (2), the refrigeration box (2) is fixed on the cover (1), a semiconductor refrigeration sheet is installed in the refrigeration box (2), a heat dissipation end of the semiconductor refrigeration sheet is communicated with the outside, a refrigeration end of the semiconductor refrigeration sheet is communicated with the inside of the computer case, and the semiconductor refrigeration sheet is connected with the control box.
5. The intelligent heat dissipation device for computer cases as claimed in claim 1, 3 or 4, wherein a power converter is disposed in the control box, the power converter is respectively connected to an external power supply and a controller, and the controller is respectively connected to the heat dissipation fan (5) in the primary heat dissipation device, the semiconductor cooling plate in the secondary heat dissipation device, and the temperature sensor (7).
6. The intelligent heat sink for computer cases according to claim 5, wherein the number of the heat dissipating fans (5) installed is at least two groups.
CN201921881860.5U 2019-11-04 2019-11-04 Intelligent heat dissipation device for computer case Expired - Fee Related CN210348403U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921881860.5U CN210348403U (en) 2019-11-04 2019-11-04 Intelligent heat dissipation device for computer case

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921881860.5U CN210348403U (en) 2019-11-04 2019-11-04 Intelligent heat dissipation device for computer case

Publications (1)

Publication Number Publication Date
CN210348403U true CN210348403U (en) 2020-04-17

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921881860.5U Expired - Fee Related CN210348403U (en) 2019-11-04 2019-11-04 Intelligent heat dissipation device for computer case

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CN (1) CN210348403U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112306202A (en) * 2020-11-07 2021-02-02 江西环境工程职业学院 Heat radiator suitable for inside computer machine case
CN113692203A (en) * 2021-09-07 2021-11-23 广东电网有限责任公司 Heat dissipation device for FTU on column

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112306202A (en) * 2020-11-07 2021-02-02 江西环境工程职业学院 Heat radiator suitable for inside computer machine case
CN113692203A (en) * 2021-09-07 2021-11-23 广东电网有限责任公司 Heat dissipation device for FTU on column
CN113692203B (en) * 2021-09-07 2023-11-24 广东电网有限责任公司 Heat abstractor for post FTU

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Granted publication date: 20200417

Termination date: 20201104