CN2408572Y

CN2408572Y - Laser cooler for large integrated circuit cooling

Info

Publication number: CN2408572Y
Application number: CN 99258552
Authority: CN
Inventors: 秦伟平
Original assignee: Changchun Institute of Optics Fine Mechanics and Physics of CAS
Current assignee: Changchun Institute of Optics Fine Mechanics and Physics of CAS
Priority date: 1999-12-23
Filing date: 1999-12-23
Publication date: 2000-11-29
Anticipated expiration: 2009-12-23

Abstract

The utility model belongs to the technical field of laser refrigeration, which uses the anti-Stokes fluorescent refrigerating principle to provide a refrigerating device for heat radiation of large integrated circuits. The utility model is mainly composed of a heat conducting and reflecting layer, a refrigerating medium, a laser device, a reflecting film with a high reflectivity, an optical lens group, etc. For the heat radiation of large integrated circuits, the laser refrigerating medium is made into a waveguide, to cause the refrigerating medium to have limited function to pump laser, and to improve the absorption of the pump laser. The refrigerating device for heat radiation of large integrated circuits has the advantages of small volume, light weight, no electromagnetic radiation, no vibration, no noise, etc.

Description

The laser refrigerator that is used for the large scale integrated circuit cooling

The utility model belongs to the laser cooling technical field, according to the anti-stokes fluorescent cooling principle, designs a kind of brand-new laser refrigerator that is used for the large scale integrated circuit heat radiation.

In order to dispel the heat the in the past methods that adopt fans of people to large scale integrated circuit more.Because fan vibration is bigger, service time is long can be stained with dust again and to send very big shortcomings such as noise, has determined that it is not desirable radiator.

Serviceability temperature is an important indicator of fluorescence refrigeration device, at low temperatures owing to the population number that is in high level is very little, realizes that therefore laser cooling is just comparatively difficult.But we can infer by the characteristics of laser cooling, and the high more realization fluorescence refrigeration of serviceability temperature is easy more, and obtainable refrigerating efficiency is also just big more.

Often be not to pursue temperature simply to fall low more well more when people use Refrigeration Technique, but seek an acceptable equilibrium temperature, just passable as long as the heat that heat that system produces and refrigerator absorb is issued to balance in this temperature.Cooling to large scale integrated circuit comes to this, as long as the temperature of chip is no more than 85 ℃, purpose has just reached.And we know, the refrigerating efficiency that the high more fluorescence refrigeration of temperature can reach is also just high more.Therefore when carrying out constant temperature for the device of similar integrated circuit, laser cooling is very desirable selection.At present, what use on the microcomputer is that fan can produce very big vibration and noise, if use such refrigeration modes on the sharp military technology of height, can reduce the level of concealing of this military technology undoubtedly.If introduce the laser cooling technology, will solve such problem.Therefore we we can say that the application of fluorescence Refrigeration Technique will have prospect widely under the high temperature.

The utility model to the sunken effect of the office of pumping laser, absorbs more pump light by refrigerant, and purpose provides a kind of laser refrigerator that is used for the large scale integrated circuit heat radiation.

The anti-stokes fluorescent cooling technology is applied to refrigeration with laser technology, for new approach has been opened up in the cooling of large scale integrated circuit.This technology has full photosensitiveness, its refrigerator has characteristics such as volume is little, in light weight, electromagnetic-radiation-free, friction, noiseless, therefore also just had very tempting application prospect and met the specific (special) requirements in fields such as military affairs, space, integrated optics, microelectronics, medical science, and paid attention to by the foreign study person.As a basic fundamental, the breakthrough of laser cooling research will inevitably cause many temperature being had the high-tech practicability of specific (special) requirements, promotes those fields and advances.

For extensive, very lagre scale integrated circuit (VLSIC), because inner number of electronic components is huge, often heating is very serious.When not freezing measure, they can reach the high temperature of several Baidu Celsius usually, perhaps burn out or can't normally use.After its refrigeration, it can be 85 ℃ of following operate as normal, and therefore the working temperature of refrigeration is comparatively speaking than higher.And higher working temperature means than higher refrigerating efficiency for laser cooling.When the temperature of refrigerant was higher than ambient temperature, the thermal radiation of environment just can not produce serious influence to refrigerating efficiency again, because the thermal radiation that this moment, refrigerant sent is greater than the thermal radiation that absorbs from environment.Consideration is made waveguide with the laser cooling medium, so that refrigerant has office to fall into effect to pumping laser, increases the absorption to pump light.

Below in conjunction with drawings and Examples the utility model is described in further detail.

Fig. 1 is a schematic diagram of the present utility model.Among the figure, the 1-large scale integrated circuit; 2-heat conduction reflector; 3-laser cooling medium, laser cooling medium can be the materials of heterogeneity and state, as long as it has the laser cooling effect.Present embodiment adopts ZBLANP:Yb ³⁺Glass is as the laser cooling medium, and its shape and structure is slab guide; 4, the reflectance coating of 5-high reflectance; 6-pumping laser light beam entrance port; 7-pumping laser, 8-assembles and the collimating optics set of lenses; 9-pumping laser bundle, the wavelength of laser beam is 1015 nanometers in the present embodiment; 10-outgoing fluorescence.

The concrete work of present embodiment is as follows: inject pumping laser light beam entrance port 6 after the 1015 nanometer pumping lasers 9 that send from diode pump laser 7 are assembled and collimated by optical lens group 8, pumping laser 9 is done straight line and reflections propagate in the refrigerant 3 of planar waveguide-type, reflect when pumping laser bundle 9 is radiated on the

reflectance coating

4,5 of high reflectance.Yb when pumping laser bundle 9 is propagated in laser cooling medium 3 in the cooled medium 3 ³⁺Ion absorbs, Yb ³⁺Emission of ions goes out anti-Stokes fluorescence, and promptly 10 emitted fluorescence of outgoing fluorescence penetrate from the upper surface of refrigerant 3, and have taken away energy, has reached the purpose of refrigeration.It is heat conduction reflector 2 that the upper surface of large scale integrated circuit 10 adheres to one deck heat-conducting medium, and it can be with the 10 heat transferred laser cooling media 3 that sent, and takes out of outside the system by the anti-Stokes fluorescence emission.This heat-conducting layer should have higher reflection to anti-Stokes fluorescence in addition, to reduce the absorption again to fluorescence.Pumping laser is from the aperture input of refrigerant one side, and the both sides of medium are coated with high anti-layer, is reflected to and fro in medium to increase the absorption of medium to it to guarantee pump light.The profile of the refrigerant shape that fries batter in a thin layer makes most anti-Stokes fluorescences just leave refrigerant behind the very short light path of having advanced.

The utility model is designed a kind of for extensive collection according to the anti-Stokes refrigeration principle Become the device of circuit heat radiation, with existing heat dissipating method relatively, it is little, in light weight to have a volume, Friction, the characteristics such as noiseless.

Claims

1, a kind of laser refrigerator that is used for the large scale integrated circuit cooling, it is characterized in that adhering to one deck heat conduction reflector (2) at large scale integrated circuit (1) upper surface, the refrigerant of planar waveguide-type (3) is on heat conduction reflector (2), refrigerant (3) profile makes laminar, the side is coated with reflectance coating (4), (5) of high reflectance, and wherein a side has aperture as laser beam entrance port (6); The pumping laser bundle (9) that laser (7) sends is injected laser beam entrance port (6) after being assembled and collimated by optical lens group (8); The pumping laser that enters laser beam entrance port (6) is done straight line and reflections propagate in refrigerant (3).

2, the laser refrigerator that is used for the large scale integrated circuit cooling according to claim 1 is characterized in that used laser (7) is the diode pump laser.

3, the laser refrigerator that is used for the large scale integrated circuit cooling according to claim 2 is characterized in that diode pump laser wavelength is 1015 nanometers.