CN2396512Y - Improvement in cup base of LED - Google Patents
Improvement in cup base of LED Download PDFInfo
- Publication number
- CN2396512Y CN2396512Y CN99249157U CN99249157U CN2396512Y CN 2396512 Y CN2396512 Y CN 2396512Y CN 99249157 U CN99249157 U CN 99249157U CN 99249157 U CN99249157 U CN 99249157U CN 2396512 Y CN2396512 Y CN 2396512Y
- Authority
- CN
- China
- Prior art keywords
- cup
- improvement
- utility
- model
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 101100327917 Caenorhabditis elegans chup-1 gene Proteins 0.000 description 4
- 239000012141 concentrate Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000008034 disappearance Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 208000019901 Anxiety disease Diseases 0.000 description 1
- 230000036506 anxiety Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- NHDHVHZZCFYRSB-UHFFFAOYSA-N pyriproxyfen Chemical compound C=1C=CC=NC=1OC(C)COC(C=C1)=CC=C1OC1=CC=CC=C1 NHDHVHZZCFYRSB-UHFFFAOYSA-N 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model relates to the improvement of a cup base of a mounted frame of an LED. The utility model is formed by that the inner wall at the periphery of the cup base is integrally protruded towards a centre in an arc shape to form a wall arc in order that light beam can be reflected via the wall arc to be concentrated to form the light beam.
Description
The utility model provides a kind of improvement of light-emitting diode wafer cup base.
Press for a long time the electronic component of diode for row, when especially being used on the light-emitting diode, can glimmer, with the effect that reaches caution or decorate with it, power consumption is little its moment in addition, so in the power supply supply, do not have the anxiety of scarcity, therefore, even to this day, it extensively is used in the traffic safety baton, automobile the 3rd stop lamp, and even Christmas lamp and other relevant light-emitting devices.
And the principle of light-emitting diode, normally with a conducting metal strip, forming with two pins through punching press is one group semi-finished product, again wafer or wafer are welded on the cup (Bowl) of a pin, and it is linked to the contact of another pin with bonding wire, then, continuous the holding in addition of two pins blocked, and made the length of this pin different.Suitably, than the usefulness of elder as negative electrode, the shorter one is an anode then, and wafer gives sealing to form after inserting cup, is that the someone is referred to as material with, the support body of this length pin, also practises being called LED lead frame.
Before oneself person of addressing, the upper end of one of this lead frame, in order to put wafer, so generally be to be bowl-shape that opening makes progress, its in weld and sealing after, admittedly can reach luminous function, only its disappearance is the scattering and the diffusion of light, thus in brightness, shortcoming to some extent.
In view of this, the applicant is this in engaging in the experience of LED lead frame research and development with production and marketing all the year round, concentrates on studies, and the phase can overcome above-mentioned disappearance, through experiment repeatedly, firstly appears and makes " improvement of light-emitting diode cup " of the present utility model.
The purpose of this utility model is to provide a kind of improvement of light-emitting diode wafer cup base, and it can change the scattering and the diffusion of light, improves brightness.
The improvement of a kind of LED lead frame cup of the utility model is characterized in that, is that one forms the wall arc to central arc-shaped protrusions between cup periphery inwall, so that light can form light beam to concentrate through the reflection of wall arc.
Cup holder bottom wherein is the end face of flat face.
Cup wherein is to be taper shape.
Cup wherein is to be oval taper.
Effect for further disclosing concrete technology contents of the present utility model and can reach is described in further detail the utility model below in conjunction with accompanying drawing, wherein:
Fig. 1 is the schematic diagram of the utility model cup;
Fig. 2 is that the utility model is through actual measurement light distribution map.
As shown in the figure, wafer cup base 1 of the present utility model is the upper end of being located at one of LED lead frame, and it is the oblique cone shape space that makes progress for opening, and in the bottom of cup 1, at the bottom of one glass of the tool 11,11 upper surface is to be straight end face 12 at the bottom of this glass, for the usefulness of ccontaining wafer or wafer A.
And of the present utility modelly differ from known person, be between tapered wall, toward the outstanding wall arc 13 of arc, be with, make cup 1 volume inside, form horn-like that opening makes progress.
Please consult diagram again, after cup 1 of the present utility model was inserted wafer or wafer A and location, then its light that sends owing to be subjected to the reflection of aforesaid wall arc 13, therefore, formed integrated light beam one, that is, because concentrating of light makes luminosity improve.
And as shown in Figure 2, be for the utility model when reality is implemented, its distribution of light figure, as known in the figure, be to concentrate on the center to go out with the vertical direction irradiation, therefore, also provable the utility model is put event for wafer or wafer A, its illumination performance is to the utmost point imitated, and this cup institute for known LED lead frame can't the person of reaching.
In addition, be non-for circular cone in cup 1, and be the occasion of oval taper that it is the wall arc projection of tool arc between inwall in the same manner, also can reach the effect that light is concentrated and brightness is strengthened, only this is the application of equivalence, so do not intend giving unnecessary details.
The utility model those disclosed herein are a kind of of preferred embodiment, and patent right category of the present utility model is not all taken off in Ju Bu change or modification and come from technological thought of the present utility model and be easy to the person of knowing by inference by the people who has the knack of this skill such as.
To sum up institute is old, no matter the utility model is with regard to purpose, means and effect, showing that it is totally different in known technical characterictic, and it is at first created and closes in practicality, also meeting the patent requirement of utility model, earnestly asking your juror and perceive, and pray and vouchsafe patent early, so that Jiahui society, the true feeling moral just.
Claims (4)
1. the improvement of a LED lead frame cup is characterized in that, is that one forms the wall arc to central arc-shaped protrusions between cup periphery inwall.
2. the improvement of LED lead frame cup according to claim 1 is characterized in that, cup holder bottom wherein is the end face of flat face.
3. the improvement of LED lead frame cup according to claim 1 is characterized in that, cup wherein is to be taper shape.
4. the improvement of LED lead frame cup according to claim 1 is characterized in that, cup wherein is to be oval taper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN99249157U CN2396512Y (en) | 1999-11-02 | 1999-11-02 | Improvement in cup base of LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN99249157U CN2396512Y (en) | 1999-11-02 | 1999-11-02 | Improvement in cup base of LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2396512Y true CN2396512Y (en) | 2000-09-13 |
Family
ID=34034183
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN99249157U Expired - Lifetime CN2396512Y (en) | 1999-11-02 | 1999-11-02 | Improvement in cup base of LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2396512Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009132508A1 (en) * | 2008-04-30 | 2009-11-05 | Lou Mane | White light led and lamp of the white light led |
| CN101436632B (en) * | 2007-11-12 | 2010-11-03 | 良峰塑胶机械股份有限公司 | LED chip component with heat-dissipating substrate and preparation method thereof |
-
1999
- 1999-11-02 CN CN99249157U patent/CN2396512Y/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101436632B (en) * | 2007-11-12 | 2010-11-03 | 良峰塑胶机械股份有限公司 | LED chip component with heat-dissipating substrate and preparation method thereof |
| WO2009132508A1 (en) * | 2008-04-30 | 2009-11-05 | Lou Mane | White light led and lamp of the white light led |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SANMEI PHOTOELECTRIC TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: YOU MUJIN Effective date: 20070907 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20070907 Address after: Mauritius Yibineisaiboshi No. 35 Alexander house 3 Patentee after: Mitsumi photoelectric Polytron Technologies Inc Address before: Tucheng City Taiwan County of Taipei province Edward Road four lane two of No. seven Patentee before: You Mujin |
|
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |